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Isola
Technology and Product Update
June 2005
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Isola Product Technology Roadmap
Isola Lead Free, FR4 Replacement Product Solutions
Isola High Speed, Signal Integrity Product Solutions
Reliability
Overview of Isola Test Capabilities
Isola Technology Agenda
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Isola Technology Overview
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High Speed Digital- High Gbps Data rates.- High Clock speeds
Optical Solutions- 5-10 Gbps data rates and beyond
Lead free and Thermal Reliability Higher Thermals Higher Thermal Cycling resistance
Miniaturization- Thinner Dielectrics- Embedded passives- Packaging
Thermal Management- Thermal conductive Substrates
Environmental- Halogen Free
Manufacturing and Process Technology
Emerging Trends
Signal Integrity
Lead Free
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**Laminate Data- IST performance is a function of Hole dia/board thickness,plating parameters and laminate attributes.
Isola’s Product offering- High Tg High performance
IS420IS420
Th
erm
al Perf
orm
an
ce T
26
0/
Deco
mp
./IS
T
Electrical Performance Loss /DK
FR406 High Tg 170° Epoxy
FR406 High Tg 170° Epoxy
IS410 180° TgIS410
180° TgFR408 180Tg Low
Dk & DfFR408 180Tg Low
Dk & DfIS640 Next Generation
Low Loss-.005IS640 Next Generation
Low Loss-.005
P96 260 Tg Polyimide V0/V1
P96 260 Tg Polyimide V0/V1
G200 BT EpoxyLaminate
G200 BT EpoxyLaminate
P95 260 Tg Polyimide HBP95 260 Tg
Polyimide HB
Telecom
Higher Reliability
High Speed Digital / Base stations/Routers/Servers/Burn
in
Military/Computers/drilling
1 -1.5Gbps *
1.5-2.0 Gbps *
Low Freq and speed
T260 -10 Mins/Td.300*
*
T260 -60 Mins/Td.350*
*
High Speed /High Frequency
2.5-10 Gbps*
T288 -60 Mins/Td.400*
*
IS415IS415
L e a d Free
IS620 Tg 215 Low Loss.008 @10 Ghz LaminateIS620 Tg 215 Low Loss.008 @10 Ghz Laminate
IS625IS625
IS500IS500
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Pe
rfo
rman
ce Isola Product Offering
ApplicationFR-4FR-4ED130
Tg 130 FR-4 Multifunctional
Tg 130 FR-4 MultifunctionalED130UV
Tg 140Multifunctional
Tg 140Multifunctional
FR402/DE114
Tg 150 HalogenFree Laminate
Tg 150 HalogenFree LaminateDE156
High Tg 170° Epoxy
High Tg 170° Epoxy
FR406/DE117
High Tg Lead free Signal Integrity
High Tg Lead free Signal Integrity
FR408
IS640
Tg 180 LowDk & Df
Tg 180 LowDk & Df
Tg 215 Low Loss.008 @10 Ghz Laminate
Tg 215 Low Loss.008 @10 Ghz Laminate
Next Gen Low Loss -.0035 @10GHz-
Next Gen Low Loss -.0035 @10GHz-
P95Tg 260 Polyimide
Laminate HBTg 260 Polyimide
Laminate HB
BT / EpoxyLaminate
BT / EpoxyLaminate
IS415
G200
FR406BCIS410 BCFR408 BC
Buried CapacitanceApplications
Buried CapacitanceApplications
IS620
Low Flow No FlowLow Flow No FlowFR406 NF/A11
Tg 260 PolyimideLaminate V0/V1
Tg 260 PolyimideLaminate V0/V1P96
Chip Packaging Chip Packaging
IS420/IS410
Thermal ConductiveThermal ConductiveIS450
High Tg 180° Halogen free
High Tg 180° Halogen free
IS500
High Tg Lead freeHigh Reliability
High Tg Lead freeHigh Reliability
IS420
IS640-300 Low LossIS640-300 Low Loss
IS640-320 Low LossIS640-320 Low Loss
IS640-325 Low LossIS640-325 Low Loss
IS640-338 Low LossIS640-338 Low Loss
IS640-345 Low LossIS640-345 Low Loss
RF
&M
IC
RO
WA
VE
Tg 150 Lead Free High Reliability
Tg 150 Lead Free High Reliability
IS400
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Signal Integrity- Overview
• Drivers• Overview of Technical issues
– High Speed Basics– Key definitions– Measurements– Time domain measurements
• Losses– Dielectric losses– Conductor losses– Conductor roughness losses
• Frequency domain measurements• Isola offering• Product selection criteria
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Enterprise applications- OC-48 (~2.5Gbps),OC-96(~5 Gbps)
High End MultiGigabit and Terabit RoutersFast Edge rates
Moore’s Law -HighEnd Servers, HighEnd Computers
Low Dk, Low DfProducts
Wireless and RF applications- 3 G base stations,Bluetooth, 802.11, Automotive electronics,
Collision avoidance systems
Drivers - High Speed and High Frequency
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High Speed digital communication involves sending bits of information coded on Trapezoidal waveforms.
The Information - Zeros and ones are coded on the rise time or on both the rise time and fall time. High Voltage is 1 and Low voltage is zero The conductive paths between a chip that sends a signal to the chip that receives a signal are called
interconnects, A group of interconnects represents a bus
The sharper the Rise time the faster the signal
To achieve faster rise times Sinusoidal wave forms are superimposed on one another.
The range of frequencies used is called bandwidth
The bandwidth is given as =0.35/Rise time
Example a 2.5 Gbps signal with a rise time of 70 Ps will have a fundamental frequency = 1.25 Ghz and a second cut off frequency of 4.5 Ghz and a 2.5 Gbps signal with a rise time of 125 Ps will have a fundamental frequency equal to 1.25 Ghz and a bandwidth or second cut off frequency = 2.5 Ghz.
Frequency is a function of Data rate and bandwidth is a function of Rise Time
High Speed Digital basics
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Time-domain definition of a periodic digital clock signal with analog definitions of rise time, fall time, and duty cycle.
From Practical RF circuit Design for Modern Wireless systems Vol1 – Les Besser and Rowan Gilmore
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Digital detector output signal - eye diagram - shows the effect of random jitter. A large eye amplitude and small difference between bit window and eye duration are necessary
for low bit error rate.
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• Height of the central eye opening measures noise margin in the received signal
• Width of the signal band at the corner of the eye measures the jitter
• Thickness of the signal line at the top and bottom of the eye is proportional to noise and distortion in the receiver output
• Transitions between the top and bottom of the eye show the rise and fall times of the signal
The “Eye”
One Bit Length
Signal withNoise
Good Sampling Period
NoiseMargin
Jitter
Noise
Eye Pattern Analysis
Reference: Handbook of Fiber Optics
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0 2000 4000 60006400Time (ps)
Unbalanced stripline Vtime source
0
100
200
300
400
500Vtime[PORT_2,1,1] (mV)Unbalanced Stripline
After 40 inches through 406
A 10 Gbps signal at source
0 2000 4000 60006400Time (ps)
Unbalanced stripline Vtime source
-200
0
200
400
600Vtime[PORT_1,1,1] (mV)Unbalanced Stripline
0 2000 4000 60006400Time (ps)
Unbalanced stripline Vtime source
0
100
200
300
400
500Vtime[PORT_2,1,1] (mV)Unbalanced Stripline
After 40 inches through IS640
The effect of Laminate substrate on Signal integrity
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Isola Products and Signal integrity in time domainSimulated Eye Diagrams @ 5 Gbps -1 M -50 Ohms impedance 5 Mil Track width PRBS 35 PS Rise
time At Source Zero Dielectric Loss IS640 Df =.004
IS620 DF=.008 FR408 DF=.012 FR4 Df =.020
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- 2.00 4.00 6.00 8.00 10.00
Data Rates on PCB's Gbps
OC-3 Fast Ethernet
Fibre Channel
Gigabit Ethernet
OC-48
OC-96
OC-192
App
licat
ions
High Speed Digital Drivers
•Trends Trends •Rising Bandwidths- Bandwidth Approx.=0.35/Rise timeRising Bandwidths- Bandwidth Approx.=0.35/Rise time
•Faster edge rates ----> 35 PS and lowerFaster edge rates ----> 35 PS and lower
•High Data rates 10 Gbps/ 4 Channels at 3.125 GbpsHigh Data rates 10 Gbps/ 4 Channels at 3.125 Gbps
•Longer Lines up to 1 M longLonger Lines up to 1 M long
•Narrower lines with higher conductor lossNarrower lines with higher conductor loss
Rise Time Vs Bandwidth and Data rates
0.200.62
1.20
2.50
5.00
-
1.00
2.00
3.00
4.00
5.00
6.00
7.00
600 350 200 100 50
Rise Time PS
Date
Rat
e G
bps
and
Band
wid
th G
hz
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Lossy transmission line Model
Characterisitic impedance Zo = √(R+JwL)/(G+JwC)
R and G are not negligible
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What is attenuation (loss)?
20 Log Vout / Vin = Loss in dB
γ=α+ iβWhere α is the attenuation co-efficient and β is the phase related co-
efficient
• The Voltage of a signal drops exponentially as the energy is absorbed in the dielectric medium, dissipated
as conductor loss and radiated
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The effect of Df on Loss db/m simulated on a 5 mil line
-35
-30
-25
-20
-15
-10
-5
0
0.0250 0.0200 0.0140 0.0100 0.0080 0.0050 0.0020
Dissipation factor
Lo
ss d
B/m
Dielectric loss
αDieletric
(in dB) approx =2.3 *f(In Ghz) *df* √Dk
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Conductor loss
The Effect of Line width on overall loss for Dash-13 and IS620
(20.4)
(16.7)
(14.4)(13.3)
(11.54)(12.45)
(18.61)
(14.92)
(25.000)
(20.000)
(15.000)
(10.000)
(5.000)
-
3 Mils 5 Mils 8 Mils 10 Mils
Line Width Mils
Lo
ss
s d
B/m
Dash-13
IS620
•Wider lines are less lossier due to reduced skin effectWider lines are less lossier due to reduced skin effect•A lower loss product like IS620 allows the designer to use thinner lines. A lower loss product like IS620 allows the designer to use thinner lines.
αConductor
(in dB/inch) approx =36/(w(line width in mils)*Z0(impedance) )* √ f(In Ghz)
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Effect of Conductor RoughnessSkin Depth Microns vs Frequency GHz Copper
-
0.500
1.000
1.500
2.000
2.500
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15
Frequency GHz
Ski
n D
epth
Mic
ron
s
Surace roughness vs Conductor loss at 10 GHz -5 Mil Stripline
-
0.100
0.200
0.300
0.400
0.500
0 1 2 3 4 5 6
Roughness Microns
dB
/In
ch
Conductivity S/ M Copper vs surface roughness
0.00E+001.00E+072.00E+073.00E+074.00E+075.00E+076.00E+077.00E+07
0 1 2 3 4 5 6
Roughness Rms Microns
Co
nd
uct
ivit
y S
/M
Surface roughness difference between 1 and 5 Microns = Dielectric loss tangent of 0.0028 –approx - 28-30 % of the dielectric loss
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High Speed Products- Microstrip 8 mil dB/Inch Loss
0.000
0.100
0.200
0.300
0.400
0.500
Frequency GHz
Lo
ss
dB
/Inc
h
IS620 GETEK I N4000-13 N4000-13SI PCL-LD-621
IS620 0.075 0.100 0.122 0.144 0.161 0.181 0.198 0.217 0.234
GETEK I 0.096 0.132 0.170 0.204 0.238 0.272 0.300 0.328 0.360
N4000-13 0.085 0.121 0.156 0.190 0.225 0.258 0.290 0.319 0.349
N4000-13SI 0.084 0.128 0.164 0.200 0.236 0.269 0.303 0.338 0.372
P CL-LD-621 0.092 0.131 0.170 0.209 0.248 0.288 0.325 0.363 0.404
1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0
• IS620 is the best in class product for dissipation factor
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High Tg Standard Products- Microstrip 8 mil dB/Inch Loss
0.0000.100
0.2000.300
0.4000.500
0.6000.700
0.800
Frequency GHz
Lo
ss
dB
/Inc
h
FR406 IS410 IS415 IS500 PCL-370HR
FR406 0.113 0.147 0.185 0.218 0.249 0.281 0.313 0.344 0.379
IS410 0.145 0.201 0.260 0.318 0.372 0.429 0.484 0.538 0.592
IS415 0.107 0.147 0.182 0.218 0.250 0.281 0.310 0.340 0.369
IS500 0.111 0.155 0.197 0.238 0.278 0.316 0.355 0.395 0.433
P CL-370HR 0.154 0.222 0.293 0.365 0.436 0.506 0.577 0.645 0.708
1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0
• FR406 and IS415 are best in class - Loss close to Getek type products• PCL 370 HR is the highest loss product in this category
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Loss dB/m 50 Ohm Striplines at Various Line widths 70 Ps rise time-5 Ghz. - Calculated data
(35.000)
(30.000)
(25.000)
(20.000)
(15.000)
(10.000)
(5.000)
-
IS 410 FR406 Getek Dash-13 IS 620 IS 640 PTFE
3 Mils Db/m 5 Mils Db/m 8 Mils Db/m 10 Mils Db/m
•Line Lengths and widths dictate the use of materialsLine Lengths and widths dictate the use of materials•More & More Standard materials will be used More & More Standard materials will be used •Focus on equalization technologiesFocus on equalization technologies•Key factors will be the ability to predict accurately P.U.L characterisitcs Key factors will be the ability to predict accurately P.U.L characterisitcs •While Dielectric losses dominate at higher speedsWhile Dielectric losses dominate at higher speeds•Copper losses are not insignificant- Focus on Lower tooth profileCopper losses are not insignificant- Focus on Lower tooth profile
Material Challenges
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Isola Roadmap High Speed/High Frequency
• Enabling High Speed Digital Speeds beyond 10 GbpsEnabling High Speed Digital Speeds beyond 10 Gbps• Low Dk / Df Solutions with Conventional Process Friendly TechnologiesLow Dk / Df Solutions with Conventional Process Friendly Technologies• Flat Df Response vs. Frequency for Higher Signal IntegrityFlat Df Response vs. Frequency for Higher Signal Integrity
ID High Speed and High Frequency Development and Launch2002 2003 2004 2005
Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3
1 FR408 Low DK Mid Loss
2 IS620 Low DK Low Loss -.008 @ 10 Ghz.
3IS640 Low DK Very Low Loss Df-.0045@ 10 GHz for RF andvery High speed Digital applications
4IS625 Very Low Loss Very High Tg Product for very highspeed
5 Very Low Loss Low DK product -0.0025 @ 10 GHz
Isola Product Applications *IS410 Short and wide lines suitable for low Gb/s FR406 Longer lines suitable for low Gb/s- Have seen designs upto 3 Gb/s -20 Inch linesIS500 Halogen Free Product suitable for Mid Gb/s FR408 Low DK DF suitable for Medium to High Gb/s upto 40 InchesIS620 Low Dk Lower DF product suitable for High Gb/s upto and beyond 40 inchesIS625 Very High Tg product suitable for high to very High Gb/s long linesIS640 Very Low Loss Porduct suitable for very high Hig Gb/s and RF Microwave apps.IS6-- RF applications, long Antenna
* Highly Design dependent
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Selection –High speed products
• Key design factors in selecting products for very high speed applications
– Data rates• Higher data rates require the use of Lower DF products
– Faster Rise times• Lower DF
– Higher Frequency range or bandwidth• Stable Dissipation factor over frequency and lower DF
– Thinner packages• Narrower Lines- Lower DK and Lower Dissipation factor
– Large Backplanes • Longer lines- Lower dissipation factors
– Error correction- Predictable PUL properties• Equalization-• Pre emphasis
– Reliability• Higher CAF, Thermal Cycling and Lead free assembly compatibility
– Cost – Extendibility and scalability
• Lower dissipation factor
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• Overview Lead free assembly
• Overview Thermal Analysis
• Thermal Resistance
• Thermal Cycling Resistance
• Isola Lead free product offering
• Product selection for Lead free assembly
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Overview
• Restriction of Hazardous Substances• Legislation bans the following Six substances for
shipment to EU countries – effective July 1 -2006– Lead– Mercury– Hexavalent Chromium( Cr6+)– Polybrominated biphenyl– Polybrominated diphenyl ether
– Cadmium
• High End Networking companies exempt
Max Conc. By Wt. < 0.1 %
Max Conc. By Wt.< 0.01 %
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Liquidus and Reflow Temperatures of Candidate Lead-Free Solder alloys for Replacing Eutectic Tin-Lead Solder
Alloy CompositionLiquidus Temp. (ºC) Reflow Temp (ºC) Melting Range (ºC)
Sn-2Ag 221-226Sn-3.5Ag 221 240 – 250Sn-0.7Cu 227 245 – 255Sn-3.0Ag-0.5Cu* 220** 238 – 248Sn-3.2Ag-0.5Cu 218 238 – 248 217-218Sn-3.5Ag-0.75Cu* 218 238 – 248Sn-3.8Ag-0.7Cu 220** 238 – 248 217-210Sn-4.0Ag-0.5Cu 217-219Sn-4.0Ag-1.0Cu* 220** 238 – 248 217-220Sn-4.7Ag-1.7Cu* 244** 237 – 247
Sn-5Sb 232-240Sn-0.2Ag-2Cu-0.8Sb* 285** 246 - 256 226-228%
Sn-2.5Ag-0.8Cu-0.5Sb* 225 233 – 243
Sn-2Ag-7.5Bi* 216** 220 – 230Sn-3Ag-3Bi* 218** 233 – 243Sn-3Ag-5Bi* 216** 230 – 240Sn-3.4Ag-4.8Bi* 215** 225 – 235 200-216Sn-3.5Ag-3Bi* 217** 230 – 240
Sn-58Bi 138Sn-3.2Ag-1.1Cu-3Bi* 240** 230 – 240Sn-3.5Ag-3In-0.5Bi* 215** 230 – 240Sn-3Bi-8Zn 189-199
Patented compositions; may require licensing or royalty agreements before use. **For more information see: Phase Diagrams & Computational Thermodynamics, Metallurgy Division of Materials Science and Engineering Laboratory, NIST.
Source : NIST Website
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Property DefinitionMinimum Acceptance
Level
Liquidus temperatureTemperature at which solder alloy is completely molten
Pasty RangeRange of temperature between solidus and liquidus, where alloy is part solid and part liquid. < 30 (ºC)
Wettability
Assessed by force required to wet a copper wire with molten solder. A large force indicates good wetting, as does short duration t0 at zero wetting force and time t2/3 to reach two thirds of maximum wetting force.
Fmax > 300 uN t0 < 0.6 s t2/3 < 1 s
Area of Coverage Measures coverage of copper test piece by solder > 85 %
Drossing
Measured by amount of oxide formed in air on surface of molten solder after a fix duration at soldering temperature Qualitative
TMF
Lifetime at a given failure rate compared to that of (eutectic) Sn/37Pb, for a specific configuration of board and solder joint
> 75 %
Thermal Mismatch
Difference in coefficients of thermal expansion that causes unacceptable thermal stress < 29 ppm/ºC
CreepStress load to failure at room temperature, in 10,000 minutes (~167 hours) > 500 psi
Yield Strength >2000 psi
ElongationRelative elongation of material under uniaxial tension at room temperature > 10 %
Criteria for Down-Selection of Alloys
Source : NIST Website
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Thermal Resistance Drivers - Lead Free
Legislation driven < 1000 PPM of lead. Lead Free Solders
- Ternary alloys of Tin/Silver /Copper- Average reflow temperature 20-40 Deg C higher
Melting Points and reflow temperature Lead free Vs Tin-lead
183
218
227
218
227
215
243
250
243
250
150 170 190 210 230 250 270
Sn/37Pb
Sn/3.5Ag/0.75 Cu
Sn/0.75Cu
Sn/3.2Ag/0.5 Cu
Sn/0.7Cu
Mp Deg C Reflow Temp Deg C
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Lead Free Laminate Attributes
Sn/Pb37 Reflow
Lead Free ~Reflow
Time to delam based on Arhennius plot
1
10
100
1,000
10,000
225 235 245 255 265 275
Temp Deg C
Tim
e M
ins
IS620 IS410/IS415 FR406
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Thermal Analysis Overview
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Overview DSC / TMA / DMA /TGA
• Isola ASL equipment • Dual cell DSC with autosampler• Dual Cell DSC• Pressurized DSC/Dual cell DSC with autosampler• TMA• TGA• DMA• Test Method• DSC
– IPC-TM-650 2.4.25 Glass Transition and Cure Factor by DSC
• TMA– IPC-TN-650 2.4.24 Glass Transition and Z-axis Thermal Expansion by TMA
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DSC: Differential Scanning Calorimetry Definitions
• DSC measures the temperatures and heat flows associated with transitions in materials as a function of time and temperature in a controlled atmosphere.
• These measurements provide quantitative and qualitative information about physical and chemical changes that involve endothermic and exothermic processes, or changes in heat capacity.
• A DSC measures the heat into or out of a sample relative to a reference while heating the sample and reference with a linear temperature ramp.
• Endothermic: Heat flows into the sample.• Exothermic: Heat flows out of the sample.• What is happening to the sample?• As the sample is heated, it absorbs energy
in order to change the temperature of the sample
• Energy units (W/g) Watts per gram of sample.
Principle of Operation
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Glass Transition
• A sample goes through the Glass Transition when the amorphous or not crosslinked areas change to (or from) a viscous or rubbery condition to (or from) a hard and relatively brittle condition
• This is a fully reversible change• The glass transition takes place over a
temperature range.• The glass transition temperature (Tg)
is a temperature chosen to represent the temperature range over which the glass transition takes place.
• NOTE: FIRST AND SECOND RUNS ARE DONE ON THE SAME PIECE OF SAMPLE
• Delta Tg = Tg(run 2) - Tg(run 1)• What does a Delta Tg tell us?• Degree of Cure of the Laminate or
Printed Wiring Board• Printed Wiring Board
– All parts are cured equally
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DSC:Interpretation
181.18°C
-0.4
-0.2
0.0
0.2
0.4
De
riv.
He
at
Flo
w (
W/g
/°C
)
-13
-12
-11
-10
-9
-8
He
at
Flo
w (
W/g
)
100 120 140 160 180 200 220
Temperature (°C)
Sample: 00-03-1699-15 FR-406Size: 1.0000 mgMethod: METHOD7-3Comment: T-102 20c/MIN
DSCFile: C:\TA\Data\DSC\.3-1699.015Operator: CASSIERun Date: 27-Aug-00 10:22
Exo Up Universal V2.5H TA Instruments
Selection of TG – First derivative
179.45°C(H)
-13
-12
-11
-10
-9
-8
Heat F
low
(W
/g)
120 140 160 180 200 220
Temperature (°C)
Sample: 00-03-1699-15 FR-406Size: 1.0000 mgMethod: METHOD7-3Comment: T-102 20c/MIN
DSCFile: A:\DerivOperator: CASSIERun Date: 27-Aug-00 10:22
Exo Up Universal V2.5H TA Instruments
Selection of TG – Half height -Isola
155.87°C(I)
-13.0
-12.5
-12.0
-11.5
-11.0
-10.5
-10.0
He
at
Flo
w (
W/g
)
100 120 140 160 180 200
Temperature (°C)
Sample: 00-03-1698-41 FR-404Size: 1.0000 mgMethod: METHOD12-13Comment: T-102 20c/MIN
DSCFile: C:\TA\Data\DSC\.3-1698.013Operator: CASSIERun Date: 26-Aug-00 10:07
Exo Up Universal V2.5H TA Instruments
Selection of Tg - Inflection
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TMA – Thermo Mechanical Analysis • TMA measures linear or volumetric changes in the dimensions of a sample as a
function of time, temperature, and force in a controlled environment.• As the sample is heated, the material expands according to it’s Coefficient of
Thermal Expansion (CTE)• Upon reaching its decomposition temperature (Td) delamination occurs• TMA: Measurements
– Glass Transition Temperature (Tg)– Temperature of Decomposition (Td)– Time to Decomposition at 260C (T-260)– Time to Decomposition at 288C (T-288)– Coefficient of Thermal Expansion (CTE)
• X, Y & Z Axis• Below Tg, Above Tg & Overall (20 - 288C)
• Tg measurement• Materials exhibit a dramatic increase in CTE as it goes through the Tg region.• Measurement of the onset of the change determines the Tg• Temperature at which delamination of the sample occurs• Analysis can be obtained from 2nd scan Tg• Decomposition temperature• Measurement of onset of the dramatic change in probe position determines the Td
• Similar onset analysis to T-260 T-288
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TMATMA : Typical 1 St Run Chart
TMA : Typical 2nd Run chart
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Sample time at temperature before delamination occurs
Typical temperatures are 260C and 288C
Sample is heated at 100C/min to the desired temperature and quickly equilibrated
Sample is then held isothermally at the desired temperature until delamination occurs
T-260(288) = Time(delam) - Time(temp equilib)
TMA T-260 T-288 Method variations Other laboratories heat sample
at 10C/min Side by side testing of
100C/min v 10C/min shows no measurable difference between the two methods
TMA: T-260 & T-288Typical TMA Decomp Curves
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TGA Thermogravimetrical Analysis
• TGA measures the amount and rate of change in the weight of a material as a function of temperature or time in a controlled atmosphere.
• Instrument made up of extremely sensitive balance within a controlled atmosphere
• TGA: What is happening to the sample?
• As the sample is heated, volatiles escape causing a loss of weight in the sample.
• Upon decomposition, a dramatic weight change occurs.
• TGA Measurements• Temperature at which x percent of
weight is lost• Decomposition Temperature (Td)
TGA Typical Curve
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DMA-Dynamic Mechanical Analysis
• The periodic application of stress and strain to the material as the temperature is varied.• Measurement of the modulii of the material provides important physical information for the
material as well as the Tg• Storage modulus: Measurement of the materials ability to store energy• Loss modulus: Measurement of the materials ability to dissipate energy• Tan Delta: Ratio of the storage modulus to the loss modulus• What is happening when the sample is being heated?• While the sample is being heated, it is physically displaced from parallel by a set force, to a set
amplitude at a set frequency• The instrument measures the samples resistance to displacement and its ability to return to its
original position.• These properties change as the temperature of the sample is changed
– Sample becomes more elastic as it goes through the glass transition range– If cross-linking is occurring during the temperature increase, the sample becomes more rigid.
• Measurements• Glass Transition Temperature (Tg)• Delta Tg• Modulus information• Two most common methods for selecting the glass transition temperature
– Onset of the Storage Modulus– Peak of the Tan Delta
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DMA: Transitions
12000
14000
16000
18000
20000
22000
24000
Sto
rag
e M
od
ulu
s (
MP
a)
0.00
0.01
0.02
0.03
0.04
0.05
0.06
Ta
n D
elta
60 80 100 120 140 160 180 200 220
Temperature (°C)
Sample: 00-01-0373-01 FR-408Size: 14.5500 x 8.7700 x 0.3100 mmMethod: 70 TO 220 @3Comment: T-098
DMAFile: C:\TA\Data\DMA\1-373.001Operator: CASSIERun Date: 1-Sep-00 14:19
Universal V2.5H TA Instruments
Broad Transition
186.63°C
170.92°C
20000
40000
60000
80000
100000
120000
140000
160000
Sto
rag
e M
od
ulu
s (
MP
a)
0.0
0.1
0.2
0.3
Ta
n D
elta
60 80 100 120 140 160 180 200 220
Temperature (°C)
Sample: 00-01-0370-02 fr-408aSize: 14.5500 x 10.6750 x 0.2720 mmMethod: 70 TO 220 @3Comment: T-098
DMAFile: C:\TA\Data\DMA\1-370.002Operator: CASSIERun Date: 31-Aug-00 08:22
Universal V2.5H TA Instruments
Typical DMA curve
7000
8000
9000
10000
11000
12000S
tora
ge
Mo
du
lus (
MP
a)
0.00
0.02
0.04
0.06
0.08
Ta
n D
elta
60 80 100 120 140 160 180 200 220
Temperature (°C)
Sample: 00-01-0373-01FR-408Size: 14.5500 x 8.5200 x 0.4600 mmMethod: 70 TO 220 @3Comment: T-098
DMAFile: C:\TA\Data\DMA\1-373.101Operator: CASSIERun Date: 5-Sep-00 07:57
Universal V2.5H TA Instruments
Increasing Cure
93.35°C
135.03°C
145.08°C
0
5000
10000
15000
20000
25000
Sto
rag
e M
od
ulu
s (
MP
a)
0.02
0.04
0.06
0.08
0.10
0.12
0.14
0.16
Ta
n D
elta
40 60 80 100 120 140 160 180
Temperature (°C)
Sample: 00-08-1244-01.0058 65MG2T C1/00Size: 26.6000 x 10.1900 x 1.4800 mmMethod: 50 TO 180 @3Comment: T-098
DMAFile: C:\TA\Data\DMA\8-1244.001Operator: CASSIERun Date: 22-Aug-00 09:06
Universal V2.5H TA Instruments
Multiple Transitions
www.isola-group.com
Thermal Resistance and Lead-Free
www.isola-group.com
Thermal Resistance- Drivers
Drivers
Process conditions
Lead Free
OEM reliability requirements.
Failure mechanism - Matrix Decomposition and De-lamination
www.isola-group.com
Laminate factors
Td- Decomposition temperature of laminate measured by weight loss by TGA. Function of Resin Chemistry
T-260,T-288 - Resistance to De-lamination at elevated temperatures. This follows a Power law. Function of Resin Chemistry and board design.
Tg - Marginal effect
Thermal Resistance - Laminate factors
www.isola-group.com
Thermal Cycling Resistance
www.isola-group.com
• Drivers
• OEM reliability requirements due to harsh service conditions
• Failure mechanism - Mainly metal Fatigue
Thermal Cycling Resistance-Drivers
www.isola-group.com
• Tests - Simulated tests such as
• IST – Electrically heating interconnects in cycles of 3 minutes and cooling
• HATS-Air to Air
• Liquid to liquid and other cycling tests
Thermal Cycling Resistance -Tests
www.isola-group.com
• Laminate factors– CTE Z axis - Lower CTE reduces Stresses
on the interconnect – Modulus in the Z-direction, Poisson ratio,
Lower Modulus helps reduce the Stress. – Tg (TMA) - Higher Tg – Thermal resistance - Higher Thermal
resistance avoids degradation during pre conditioning or actual process. May over ride other factors
Thermal Cycling Resistance-Laminate Factors
www.isola-group.com
• Board design factors– Ductility of the copper - Higher is better – Thickness of the board – Hole diameter- Smaller holes and higher
aspect ratio reduce cycles to failure.– Plating Thickness and quality
Thermal Cycling Resistance-Fabrication Factors
www.isola-group.com
A Typical S-N diagram
0
100
200
300
400
500
600
700
800
900
1.0E+00 1.0E+01 1.0E+02 1.0E+03 1.0E+04 1.0E+05 1.0E+06 1.0E+07
Cycles to failure
Fa
tig
ue
Str
en
gth
Low Cycle fatigue
Finite life
Infinite life
Reliability Roadmap - Thermal Cycling - Drivers
Average thermal cycling conditions may not push copper into plastic range
Higher strains during preconditioning IST change the failure mechanism
www.isola-group.com
100 1000
1
2
3
5
10
20
30
40 50 60 70 80
90 95
99
Time to Failure
Per
cent
Probability Plot for 9.8 milWeibull Distribution - ML Estimates - 95.0% CI
Complete Data
ShapeScale
MTTFStDev
MedianIQR
FailureCensor
AD*
5.2506 353.32
325.33 71.258
329.50 97.313
17 0
0.8697
efficient -co strength fatigue the is F
efficient -coductility fatigue the is F
σ'
ε'
Where
strain Plastic strain elastic
cNbN
equationMansonCoffin
FF )^2(')^2('2/
Thermal Cycling Resistance-Data presentation
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Typical Stress Strain Curve
Copper has a modulus = 17.6 E6 Psi and a Yield strength of 30Ksi which means it reaches its Yield point at < 0.2 % elongation or 35 Deg C excursion on a board
www.isola-group.com
• Cu Layer – Elastic/Plastic
ECu = 15.6x106 psi, y,Cu = 20,000 psi, CTECu=17x10-6/oC
• Composite Substrate – Linear Elastic
Esubstrate=15 GPa, CTEsubstrate=80x10-6/oC (RT-180oC), CTEsubstrate=320x10-6/oC (180-288oC)
Material Properties of Cu Layer and Composite Substrate
21oC
260oC
Time
Temperature
150oC
Simulated Thermal Cycles
www.isola-group.com
What attributes do we need for Thermal cycling resistance?
• Laminate factors
– CTE Z axis - Lower CTE reduces Stresses on the interconnect
– Modulus in the Z-direction, Poisson ratio, Lower Modulus helps reduce the Stress.
– Tg (TMA) - Higher Tg
– Thermal resistance - Higher Thermal resistance avoids degradation during pre conditioning or actual process. May over ride other factors
Relative IST performance Isola Products
IS620 IS420 IS400 IS410 FR402 FR406 FR408Cy
cles
to fa
ilure
Modeling results show that the Overall Expansion, CTE and Preconditioning are biggest factors governing the IST performance
Isola’s Low expansion and High TMA Tg products such as IS620,IS420,IS400 perform better on Thermal cycling
IS400IS410 DE117FR408
www.isola-group.com
Higher Decomposition temperature
Higher than 340 Deg C
Higher T-260 performance
Higher than 60 minutes
Higher T-288 performance
Lower overall Z axis expansion
Less than 3.5 %
Low Wt loss at elevated temperature (Lower vols.)
What attributes do we need in a lead free product?
Isola Products and Reflow temps
FR406 FR402 G200 IS620 IS640 IS400 IS410 IS420 IS415 P95
Re
flo
w T
em
pe
ratu
re
Lead free reflow >=260 Deg C
Lead free reflow >=240 Deg C
FR408 IS625
Isola Products and Reflow temps
FR406 FR402 G200 IS620 IS640 IS400 IS410 IS420 IS415 P95
Re
flo
w T
em
pe
ratu
re
Lead free reflow >=260 Deg C
Lead free reflow >=240 Deg C
FR408 IS625
www.isola-group.com
Precondition: 6x - 260C; 0.010” PTH; 0.100” MLB Thickness
0
200
400
600
800
1000
Ave
rage
Cyc
les-
To-
Fai
lure
IS400 IS410 IS415 IS420 FR408 IS620
IST Performance by Isola Product
Acceptable service life
*Based on Published papers and discussions with fabs and OEM’s
High Performance
Very High performance
Very High Thermal strains
www.isola-group.com
Isola Lead Free Compatible Laminate Product Offering
I S400 DE156 I S410 I S420 I S415 I S500 FR408 I S620 I S640-D P95 P96/ P97*
Description150 Tg Filled
non dicyHalogen Free
150 TgPhenolic
Cured 170 Tg
Phenolic Cured Filled
170 Tg
Non Phenolic, Non Dicy-190
Tg170 Tg
Halogen Free180 Tg, Low DK Low Loss
215 Tg Low DK, Very Low
Loss
Very Low DK very Low
Loss>250 Tg
Polyimide HB
>250 Tg Polyimide V-
0/ V-1
ApplicationsAuto &
consumer Halogen Free High Rel.lead
freeVery High
Thermal rel.
High Speed, High
reliability
High Speed, High rel,
halogen freeHigh Speed Digital apps
Very High Speed Digital
Apps.
Very High Speed Digital
Apps.
Military/ Computers, Down Hole Drilling
Military/ Computers,
Lead Free Compatible Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes
Halogen Free No Yes No No No Yes No No No No NoCAF resistant Chemistry Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes
ROHS and WEEE Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes YesThermal Cycling rating-I ST/ TCT/ HATS Very High Very High High Very High Very High Very High High Very High High Very High Very High
Tg-DSC Deg C 150 150 175 170 190 170 180 215 225 >250 >250
X CTE PPm/ C below Tg 13 13 13 13 13 13 13 13 11 14 14
Y CTE PPm/ c below Tg 14 14 14 14 14 14 14 14 10 17 17
Z Alpha 1 CTE PPm/ C 45 45 60 40 55 50 65 55 NA 55 60
Overall expansion 20-288 Deg C Percent 3.00% 3.00% 3.50% 2.80% 2.90% 2.80% 3.50% 2.80% 3.60% 1.50% 1.50%
Decomposition temp Deg C Onset 330 380 350 340 370 400 360 353 350 416 382
T-260 Minutes 60 60 60 60 60 60 60 60 60 60 60
T-288 Minutes >5 >5 >15 >15 >20 >15 >15 >15 >10 60 60
Peel Strength lb/ inch >7.4 >6.3 >6.3 >6.3 >6.3 >6.3 >5.5 >6.3 >5.5 >6.3 >6.3
Peel Strength N/ mm >1.3 >1.1 >1.1 >1.1 >1.1 >1.1 >1.1 >1.1 >1 >1.1 >1.1
Dk -2 Ghz 4.00 4.00 4.00 4.00 3.90 3.90 3.60 3.60 3.0-3.6 3.90 3.90
Df-2 Ghz 0.0200 0.0200 0.0210 0.0200 0.0160 0.0160 0.0110 0.0080 <.0045 0.0170 0.0170
Dk-10 Ghz 3.90 3.90 3.90 3.90 3.80 3.80 3.55 3.55 3.0-3.6 3.80 3.80
Df-10 Ghz 0.0220 0.0220 0.0230 0.0210 0.0170 0.0170 0.0125 0.0080 <.0045 0.0200 0.0200
* Only For Europe
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Isola Product Technology Roadmap
Isola Lead Free, FR4 Replacement Product Solutions
Isola High Speed, Signal Integrity Product Solutions
Reliability
Overview of Isola Test Capabilities
Isola Technology Agenda
www.isola-group.com
Lead-free solderable
IS410
+ Low CTE
IS400
Phenolic epoxy
Tg 180C
CAF resistant
CTE – 3.5 % amb – 288 C
Td – 350C
T288 > 15 min
UL Approved
Phenolic cured, filled
Tg 150C
CAF resistant
CTE – 3.00 % amb – 288 C
Td – 330C
T288 > 5 min
UL Approved
IS420
Phenolic cured, filled
Tg 170C
CAF resistant
CTE– 2.80 % amb -288 C
Td – 340C
T288 > 15 min
UL approved
+ Low Df
IS415
Non-dicy, Non phenolic
Tg 190C
CAF resistant
CTE – 2.90 % amb - 288 C
Td – 370C
T288 > 20 min
UL approved
Applications : 6 x solder float, lead-free soldering
Applications : Severe thermal cycling, lead-free soldering
Applications : High data rate; Severe TCT, lead-free solder,
Isola Thermal Reliability Products
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Isola Product Ad
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Isola Lead Free Compatible Products
www.isola-group.com
IS400
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Features- Better Thermal Reliability With Non-dicy Cured Chemistry
- Excellent Z-axis Thermal Expansion - Excellent Solder Heat Resistance & Low Moisture
Absorption
- Higher Tg 150oC (DSC) Than Standard Epoxies
- Standard FR-4 Epoxy Processing
- UV Blocking & AOI Compatible
Applications- Computers, Servers, Workstations, Telecommunications,
Consumer Electronics & Automotives
IS400 Product Strengths
www.isola-group.com* For 0.71mm (0.028 Laminate, 38% Weight Resin Content
Item FR402 IS400
Tg (oC)
DSC
TMA
DMA
140 ± 5
135 ± 5
150 ± 5
150 ± 5
145 ± 5
155 ± 5
Z-axis CTE (ppm/oC)
Room Temp to Tg
Tg to 288 oC
Room Temp to 288 oC
70-80
270-330
150-170
40-50
180-240
120-140
Solder Dip @288oC (sec) > 60 > 180
Decomposition Temp (oC, TGA) 300-310 325-335
Time to Delamination (min, TMA)
T288
T260
1-5
10-15
10-15
> 60
IS400 Laminate Thermal Properties
www.isola-group.com
Thickness :0.028
Property Unit Condition IS400 FR402
Peel Strength (1oz)
Flexural Strength Length Cross
Volume Resistivity
Surface Resistivity
Dielectric Constant (500MHz)
Dissipation Factor (500MHz)
Water Absorption
Solder Dip @288oC
Glass Transition Temp. (DSC)
Flammability
lb/in
psi
.cm
-
-
%
sec
oC
-
A
A
C-96/35/90
C-96/35/90
C-24/23/50
C-24/23/50
D-24/23
A
A
UL94
6~8
70000 ~ 8000060000 ~ 70000
5x1014~ 5x1015
1x1013~ 1x1014
4.3
0.015~0.018
0.12~0.18
> 180
150
V-0
9~11
70000 ~ 8000060000 ~ 70000
5x1014~ 5x1015
1x1013~ 1x1014
4.3
0.015~0.018
0.15~0.20
> 60
135~145
V-0
IS400 Laminate Physical Properties
www.isola-group.com
Result
Pass
Result
Pass
Test conditionTCT (-40oC to +125oC) 15 min/10 sec/15 min’ for 200 cycles, then microsection and E-testing.
Sample
8L MLB
Test conditionTCT (-40oC to +125oC) 15 min/10 sec/15 min’ for 200 cycles, then microsection and E-testing.
Sample
8L MLB
Current State
No delam, copper crack, resin recession been found.
IS400 Thermal Reliability Testing
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IS410
www.isola-group.com
IS420IS420
Th
erm
al P
erf
orm
an
ce T
26
0/
Decom
p./
IST
Electrical Performance Loss /DK
FR406 High Tg 170° Epoxy
FR406 High Tg 170° Epoxy
IS410 180° TgIS410
180° TgFR408 180Tg Low
Dk & DfFR408 180Tg Low
Dk & DfIS620 Tg 215 Low Loss.009 @10 Ghz LaminateIS620 Tg 215 Low Loss.009 @10 Ghz Laminate
IS640 Next Generation Low Loss-.005
IS640 Next Generation Low Loss-.005
P96 260 Tg Polyimide V0/V1
P96 260 Tg Polyimide V0/V1
G200 BT EpoxyLaminate
G200 BT EpoxyLaminate
P95 260 Tg Polyimide HBP95 260 Tg
Polyimide HB
Telecom
High Reliability - Lead Free
High Speed Digital / Base stations/Routers/Servers/Bur
n in
Military/Computers/drilling
1 -1.5Gbps *
1.5-2.0 Gbps *
Low Freq and speed
* Speeds a function of design such as line length etc.
T260 -10 Mins/Td.300*
*
T260 -60 Mins/Td.350*
*
High Speed /High Frequency
2.5-10 Gbps*
T288 -60 Mins/Td.400*
*
**Laminate Data- IST performance is a function of Hole dia/board thickness,plating parameters and laminate attributes.
IS415190TgIS415190Tg
IS500Halogen Free
180 Tg
IS500Halogen Free
180 Tg
www.isola-group.com
High Tg FR4 (180°C TMA)
Enhanced thermal stability High Decomposition Temperature
(350°C)
Superior PTH reliability due to very low z-axis CTE
Unique resin chemistry contributes to CAF Resistance
Lead-Free Compatible PCB substrate (6x peak 260°C reflow)
Un-filled resin matrix enhances Hi-pot resistance on thin cores
Enhanced drilling performance on high aspect ratio holes
Low Cost of ownership
Wide market acceptance and North American and Asia Pacific
manufacturing
IS410 Product Strengths
www.isola-group.com
As a substitute for Std. FR4 requiring lead-free performance
As an improvement over FR4 materials by achieving CAF resistance
An alternative to filled phenolic resin systems that are more
susceptible to insulation resistance failures
IS410 Product Positioning
www.isola-group.com
Property Units FR406 IS410 G200 FR408 IS620
Tg, (DSC) ºC 170 180 185 180 215
Td, (TGA) ºC 290 350 320 360 352
CTE
x-axis (amb - Tg) ppm/ºC 14 11 15 13 14
y-axis (amb - Tg) ppm/ºC 13 13 15 14 12
z-axis (amb - 288C) % 4.4 % 3.5 % 3.5 % 3.5% 2.8 %
Solder Float, 288C sec >220 >500 >1200 >500 > 800
T-260, (TMA) min 10 >60 20 >60 >60
T-288, (TMA) min <1 >15 8 20 >15
Material Tested: 0.008”, 44% Resin %
IS410 Laminate Thermal Properties
www.isola-group.com
> 6.37778lb/inPeels, 1 oz.
14001400117511001100volt/milElectrical Strength
94 V-094 V-094 V-094 V-094 V-0-Flammability
.15*.15*0.14*0.20*0.20*%Moisture Absorption
-
-
-
-
Units
GPYFR-4FR-4FR-4FR-4UL Recognition
.008.011.012.021.018DF, 2 GHz
N/AN/A.013.023.023DF, 1 MHz
3.63.73.73.93.9DK, 2 GHz
N/AN/A4.04.64.6DK, 1MHz
IS620FR408G200IS410FR406Property
Material Tested: 50% Resin Content*Material Tested: 0.008”, 44% Resin %
IS410 Laminate Physical Properties
www.isola-group.com
IS410 vs. High Tg FR4Immersion Silver Finish; 100 V Bias; 25 Coupons
0102030405060708090
100
B1 B2 B3 B4
High Tg FR4
IS410
Spacing - PTH to PTH
Fai
lure
%
B1 = 11 mil diagonal spacingB2 = 15 mil diagonal spacingB3 = 20 mil diagonal spacingB4 = 25 mil diagonal spacing
IS410 CAF Test Results
www.isola-group.com
Mean Time to Failure (MTTF) = 325 cycles
100 1000
1
2
3
5
10
20
30
40 50 60 70 80
90 95
99
Time to Failure
Per
cent
Probability Plot for 9.8 milWeibull Distribution - ML Estimates - 95.0% CI
Complete Data
ShapeScale
MTTF
StDev
Median
IQR
Failure
Censor
AD*
5.2506 353.32
325.33
71.258
329.50
97.313
17
0
0.8697
IS410 IST (9.8 mil PTH)
www.isola-group.com
IS410 Dk Matrix
IS410 High Performance Tg 180 CDk Phenolic Epoxy Td 350 C
CORE Standard Resin Content Dk @ 2.0 GHz Dk @ 5.0 Ghz Dk @ 10.0 GhzTHICKNESS
0.0025 1-1080 58 3.72 3.65 3.650.0030 1-2113 44 4.04 3.98 3.980.0035 2 - 106 65 3.58 3.50 3.500.0040 1-2116 45 4.02 3.96 3.960.0043 106/1080 60 3.68 3.60 3.600.0050 1-1652 42 4.10 4.04 4.040.0053 106/2113 56 3.76 3.69 3.690.0060 1080/2113 53 3.83 3.76 3.760.0070 1-7628 41 4.12 4.07 4.070.0080 2-2116 45 4.02 3.96 3.960.0095 2-2116 52 3.85 3.78 3.780.0100 2-1652 42 4.10 4.04 4.040.0120 2-1080/7628 47 3.97 3.91 3.910.0140 2-7628 41 4.12 4.07 4.070.0180 2-7628/2116 42 4.10 4.04 4.040.0210 3-7628 39 4.18 4.12 4.120.0240 3-7628/2113 41 4.12 4.07 4.070.0280 4-7628 40 4.15 4.09 4.090.0310 4-7628/2116 40 4.15 4.09 4.090.0340 5-7628 40 4.15 4.09 4.090.0350 5-7628 41 4.12 4.07 4.070.0390 6-7628 37 4.23 4.18 4.18
Note: All test performed at ambient conditions Tg - measured by DSCBased on the Bereskin Stripline Test Method Td - measured by TGA @ onset
CONSTRUCTION
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IS410 Df Matrix
IS410 High Performance Tg 180 C
Df Phenolic Epoxy Td 350 C
CORE Standard Resin Content Df @ 2.0 GHz Df @ 5.0 Ghz Df @ 10.0 Ghz
THICKNESS0.0025 1-1080 58 0.026 0.027 0.0270.0030 1-2113 44 0.021 0.022 0.0220.0035 2 - 106 65 0.028 0.029 0.0290.0040 1-2116 45 0.021 0.027 0.0270.0043 106/1080 60 0.026 0.028 0.0280.0050 1-1652 42 0.020 0.021 0.0210.0053 106/2113 56 0.025 0.026 0.0260.0060 1080/2113 53 0.024 0.025 0.0250.0070 1-7628 41 0.020 0.021 0.0210.0080 2-2116 45 0.021 0.027 0.0270.0095 2-2116 52 0.024 0.025 0.0250.0100 2-1652 42 0.020 0.021 0.0210.0120 2-1080/7628 47 0.022 0.023 0.0230.0140 2-7628 41 0.020 0.021 0.0210.0180 2-7628/2116 42 0.020 0.021 0.0210.0210 3-7628 39 0.019 0.020 0.0200.0240 3-7628/2113 41 0.020 0.021 0.0210.0280 4-7628 40 0.020 0.021 0.0210.0310 4-7628/2116 40 0.020 0.021 0.0210.0340 5-7628 40 0.020 0.021 0.0210.0350 5-7628 41 0.020 0.021 0.0210.0390 6-7628 37 0.019 0.020 0.020
Note: All test performed at ambient conditions Tg - measured by DSCBased on the Bereskin Stripline Test Method Td - measured by TGA @ onset
CONSTRUCTION
www.isola-group.com
FR406 IS410 IS415
Scaling See Scaling Table in Process Guide
Same as FR406 Similar to FR408
Oxide Multiple options available Same as FR406 Same as FR406/8
Lamination ROR = 8 - 12F/min
Cure = 360F (60 min)
Pressure = 250 - 300 psi
ROR = 8 - 12 F/min
Cure = 375F (50 min)
Pressure = 250 - 300 psi
ROR = 8 - 12 F/min
Cure = 375F (90 min)
Pressure = 250 - 300 psi
Drilling See Drilling Table in Process Guide
Same as FR406, longer drill life
Same as FR406 longer drill life
Desmear Chemical Desmear (single pass)
Same as FR406 Similar to FR408 (double pass cyclic amine)
IS410 Processing Cross Reference
www.isola-group.com
IS415Next Generation in Thermally Reliable
Laminate and Prepreg
www.isola-group.com
IS420IS420
Th
erm
al P
erf
orm
an
ce T
26
0/
Decom
p./
IST
Electrical Performance Loss /DK
FR406 High Tg 170° Epoxy
FR406 High Tg 170° Epoxy
IS410 180° TgIS410
180° TgFR408 180Tg Low
Dk & DfFR408 180Tg Low
Dk & DfIS620 Tg 215 Low Loss.009 @10 Ghz LaminateIS620 Tg 215 Low Loss.009 @10 Ghz Laminate
IS640 Next Generation Low Loss-.005
IS640 Next Generation Low Loss-.005
P96 260 Tg Polyimide V0/V1
P96 260 Tg Polyimide V0/V1
G200 BT EpoxyLaminate
G200 BT EpoxyLaminate
P95 260 Tg Polyimide HBP95 260 Tg
Polyimide HB
Telecom
High Reliability - Lead Free
High Speed Digital / Base stations/Routers/Servers/Bur
n in
Military/Computers/drilling
1 -1.5Gbps *
1.5-2.0 Gbps *
Low Freq and speed
* Speeds a function of design such as line length etc.
T260 -10 Mins/Td.300*
*
T260 -60 Mins/Td.350*
*
High Speed /High Frequency
2.5-10 Gbps*
T288 -60 Mins/Td.400*
*
**Laminate Data- IST performance is a function of Hole dia/board thickness,plating parameters and laminate attributes.
IS415190TgIS415190Tg
IS500Halogen Free
180 Tg
IS500Halogen Free
180 Tg
www.isola-group.com
Superior PTH reliability due to very low z-axis CTE Very high Tg (200°C by TMA) compared to FR4 (160ºC by TMA) Non-phenolic based resin system Very high decomposition temperature (375°C) suitable for Pb-free
assembly Dielectric constant comparable to Std High Tg FR4 Dissipation factor comparable to Std High Tg FR4 (20% lower than
phenolic resin systems) Low cost of ownership relative to modified epoxy systems with Mid-
Dk, mid-Df performance
IS415 Product Strengths
www.isola-group.com
The only low cost, non-phenolic, lead free substrate in the market
As a substitute for Std. FR4 requiring lead-free performance
without sacrificing electrical performance
An improvement over phenolic-based FR4 materials by providing
lower loss comparable to Std FR4 materials
An alternative to filled phenolic resin systems that are more
susceptible to insulation resistance failures
IS415 Product Positioning
www.isola-group.com
Property Units FR406 IS410 IS415 P95
Tg, (DSC) ºC 170 180 190 260*
Td, (TGA) ºC 290 350 375 416
CTE
α 1, z-axis (amb - Tg)
ppm/ºC 65 50 50 55
Solder Float, 288C sec >220 >500 >1000 >1200
T-260, (TMA) min 10 >60 >60 >60
T-288, (TMA) min <1 >10 >20 >60
Dk (2 GHz) 3.9 3.9 3.8 4.2
Df (2 GHz) .018 .023 .017 .014Isola Material Tested: 0.008”, 44% Resin Content
IS415 Laminate Thermal Properties
www.isola-group.com
IS415 Tg by TMA
196C (Better Thermal Performance)
IS415 Laminate Thermal Properties
www.isola-group.com
IS415 High Performance Tg 190 C
Dk Non-Dicy, Non=Phenolic Td 370 C
CORE Standard Resin Content Dk @ 2.0 GHz Dk @ 5.0 Ghz Dk @ 10.0 Ghz
THICKNESS0.0025 1-1080 58 3.68 3.67 3.650.0030 1-2113 44 4.01 4.00 3.990.0035 2 - 106 65 3.54 3.52 3.510.0040 1-2116 45 3.99 3.98 3.960.0043 106/1080 60 3.64 3.62 3.610.0050 1-1652 42 4.07 4.06 4.040.0053 106/2113 56 3.73 3.71 3.700.0060 1080/2113 53 3.79 3.78 3.770.0070 1-7628 41 4.09 4.08 4.070.0080 2-2116 45 3.99 3.98 3.960.0095 2-2116 52 3.82 3.80 3.790.0100 2-1652 42 4.07 4.06 4.040.0120 2-1080/7628 47 3.94 3.93 3.910.0140 2-7628 41 4.09 4.08 4.070.0180 2-7628/2116 42 4.07 4.06 4.040.0210 3-7628 39 4.15 4.14 4.130.0240 3-7628/2113 41 4.09 4.08 4.070.0280 4-7628 40 4.12 4.11 4.100.0310 4-7628/2116 40 4.12 4.11 4.100.0340 5-7628 40 4.12 4.11 4.100.0350 5-7628 41 4.09 4.08 4.070.0390 6-7628 37 4.20 4.19 4.18
Note: All test performed at ambient conditions Tg - tested by DSCBased on the Bereskin Stripline Test Method Td - tested by TGA @ onset
CONSTRUCTION
IS415 Dk Matrix
www.isola-group.com
IS415 High Performance Tg 190 C
Df Non-Dicy, Non-Phenolic Td 370 C
CORE Standard Resin Content Df @ 2.0 GHz Df @ 5.0 Ghz Df @ 10.0 Ghz
THICKNESS0.0025 1-1080 58 0.0155 0.0161 0.01670.0030 1-2113 44 0.0133 0.0138 0.01420.0035 2 - 106 65 0.0166 0.0173 0.01790.0040 1-2116 45 0.0135 0.0140 0.01440.0043 106/1080 60 0.0158 0.0164 0.01700.0050 1-1652 42 0.0130 0.0135 0.01390.0053 106/2113 56 0.0152 0.0158 0.01630.0060 1080/2113 53 0.0147 0.0153 0.01580.0070 1-7628 41 0.0129 0.0133 0.01370.0080 2-2116 45 0.0135 0.0140 0.01440.0095 2-2116 52 0.0146 0.0151 0.01560.0100 2-1652 42 0.0130 0.0135 0.01390.0120 2-1080/7628 47 0.0138 0.0143 0.01470.0140 2-7628 41 0.0129 0.0133 0.01370.0180 2-7628/2116 42 0.0130 0.0135 0.01390.0210 3-7628 39 0.0126 0.0130 0.01330.0240 3-7628/2113 41 0.0129 0.0133 0.01370.0280 4-7628 40 0.0127 0.0131 0.01350.0310 4-7628/2116 40 0.0127 0.0131 0.01350.0340 5-7628 40 0.0127 0.0131 0.01350.0350 5-7628 41 0.0129 0.0133 0.01370.0390 6-7628 37 0.0123 0.0126 0.0130
Note: All test performed at ambient conditions Tg - tested by DSCBased on the Bereskin Stripline Test Method Td - tested by TGA @ onset
CONSTRUCTION
IS415 Df Matrix
www.isola-group.com
High Tg Standard Products- Microstrip 8 mil dB/Inch Loss
0.0000.100
0.2000.300
0.4000.500
0.6000.700
0.800
Frequency GHz
Lo
ss
dB
/Inc
h
FR406 IS410 IS415 IS500 PCL-370HR
FR406 0.113 0.147 0.185 0.218 0.249 0.281 0.313 0.344 0.379
IS410 0.145 0.201 0.260 0.318 0.372 0.429 0.484 0.538 0.592
IS415 0.107 0.147 0.182 0.218 0.250 0.281 0.310 0.340 0.369
IS500 0.111 0.155 0.197 0.238 0.278 0.316 0.355 0.395 0.433
P CL-370HR 0.154 0.222 0.293 0.365 0.436 0.506 0.577 0.645 0.708
1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0
• FR406 and IS415 are best in class - Loss close to Getek type products
• PCL 370 HR is the highest loss product in this category
IS415 Attenuation Comparison
www.isola-group.com
FR406 IS410 IS415
Scaling See Scaling Table in Process Guide
Same as FR406 Similar to FR408
Oxide Multiple options available Same as FR406 Same as FR406/8
Lamination ROR = 8 - 12F/min
Cure = 360F (60 min)
Pressure = 250 - 300 psi
ROR = 8 - 12 F/min
Cure = 375F (50 min)
Pressure = 250 - 300 psi
ROR = 8 - 12 F/min
Cure = 375F (90 min)
Pressure = 250 - 300 psi
Drilling See Drilling Table in Process Guide
Same as FR406, longer drill life
Same as FR406 longer drill life
Desmear Chemical Desmear (single pass)
Same as FR406 Similar to FR408 (double pass cyclic amine)
IS415 Processing Cross Reference
www.isola-group.com
IS500
www.isola-group.com
IS420IS420
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Electrical Performance Loss /DK
FR406 High Tg 170° Epoxy
FR406 High Tg 170° Epoxy
IS410 180° TgIS410
180° TgFR408 180Tg Low
Dk & DfFR408 180Tg Low
Dk & DfIS620 Tg 215 Low Loss.009 @10 Ghz LaminateIS620 Tg 215 Low Loss.009 @10 Ghz Laminate
IS640 Next Generation Low Loss-.005
IS640 Next Generation Low Loss-.005
P96 260 Tg Polyimide V0/V1
P96 260 Tg Polyimide V0/V1
G200 BT EpoxyLaminate
G200 BT EpoxyLaminate
P95 260 Tg Polyimide HBP95 260 Tg
Polyimide HB
Telecom
High Reliability - Lead Free
High Speed Digital / Base stations/Routers/Servers/Bur
n in
Military/Computers/drilling
1 -1.5Gbps *
1.5-2.0 Gbps *
Low Freq and speed
* Speeds a function of design such as line length etc.
T260 -10 Mins/Td.300*
*
T260 -60 Mins/Td.350*
*
High Speed /High Frequency
2.5-10 Gbps*
T288 -60 Mins/Td.400*
*
**Laminate Data- IST performance is a function of Hole dia/board thickness,plating parameters and laminate attributes.
IS415190TgIS415190Tg
IS500Halogen Free
180 Tg
IS500Halogen Free
180 Tg
www.isola-group.com
High Tg (180°C) Halogen-Free PCB substrate
Superior Dk across frequency (3.8 - 4.3) closely matching High Tg FR4
Loss Tangent comparable to High Tg FR4 (.016 - .018)
Very Low z-axis CTE (2.3%), as compared to Std FR4 (4%)
Superior Thermal Reliability, capable of meeting lead-free requirements
(T260 and T288 >60 minutes)
Low moisture absorption (0.2%)
Very high copper peel strength 8 lb/in. (1.4KN/m) after thermal stress
Global product availability (N. America, Europe, Asia) by early 2005
IS500 Product Strengths
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Competitive Products: Hitachi E-67G(H), Hitachi E-679FG, Polyclad PCL-HF-571F, Nelco D1049 (beta)
Superior Dk relative to all currently available Halogen-Free substrates (3.8 vs. 4.5 - 5.0)
Globally manufactured High Tg, Halogen Free PCB Substrate
Low z-axis CTE, ideal for IST critical applications
40% higher peel strengths than competitive materials
Significant Cost Advantage
IS500 Product Positioning
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TG DSC - 180°CTMA - 170°CDMA - 210°C
CTE (z-axis, RT - 120 °C): < TG : 35 - 40 ppm/°C> TG : 180 ppm/°C
T260 (TMA): > 60 min
T288 (TMA): > 60 min
TD (TGA): 400°C
Thermal stress tests: Solder dip @ 288°C > 5 minutes: passed 10x 10 sec @ 288°C: passed
High Pressure Cooker Test: passed(30 min + solder dip 20 sec @ 260 °C)
IS500 Thermal Characteristics
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Flammability: V-0
Moisture uptake:(D24/23) 0.12 %
Dk @ 10 GHz: 4.0
Df @ 10 GHz: 0.0147 - 0.0154
Alkali Resistance: passed(D24/125, 20 min. @ 70°C 20 min. @ in 10 % NaOH)
CTI (Comparative Tracking Index) 300
Color Dark Yellow
Peel Strength > 7.0 lb/in. (1.4KN/m)
IS500 Physical Characteristics
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IS500 Halogen Free CAF Reistance Tg 180 C
Dk High Tg Td 400 C
CORE Standard Resin Content Dk @ 2.0 GHz Dk @ 5.0 Ghz Dk @ 10.0 Ghz
THICKNESS0.0020 1-106 70 3.60 3.57 3.570.0025 1-1080 57 3.78 3.76 3.760.0030 1-1080 63 3.66 3.63 3.630.0035 1-2113 51 3.92 3.89 3.890.0041 106/ 1080 60 3.72 3.69 3.690.0045 106/ 1080 63 3.66 3.63 3.630.0050 1-1652 42 4.14 4.11 4.110.0055 1080 / 2113 56 3.81 3.78 3.780.0060 2-1080 63 3.66 3.63 3.630.0070 7628 40 4.19 4.17 4.170.0080 2-2116 45 4.06 4.04 4.040.0090 2-2116 50 3.94 3.92 3.920.0100 2-1652 42 4.14 4.11 4.110.0120 2-1080 / 7628 47 4.01 3.99 3.990.0140 2-7628 40 4.19 4.17 4.170.0180 2-7628 / 2116 47 4.01 3.99 3.990.0200 2-2113 / 2-7628 42 4.14 4.11 4.110.0240 2-1652 / 2-7628 41 4.16 4.14 4.140.0280 4-7628 40 4.19 4.17 4.170.0310 2-1652 / 3-7628 40 4.19 4.17 4.170.0350 5-7628 40 4.19 4.17 4.170.0390 2116 / 5-7628 41 4.16 4.14 4.14
Note: All test performed at ambient conditions Tg - tested by DSCBased on the Bereskin Stripline Test Method Td - tested by TGA @ onset
CONSTRUCTION
IS500 – Dk matrix
www.isola-group.com
IS500 Halogen Free CAF resistant Tg 180 C
Df High Tg Td 400 C
CORE Standard Resin Content Df @ 2.0 GHz Df @ 5.0 Ghz Df @ 10.0 Ghz
THICKNESS0.0020 1-106 70 0.0180 0.0190 0.01910.0025 1-1080 57 0.0165 0.0170 0.01760.0030 1-1080 63 0.0175 0.0180 0.01870.0035 1-2113 51 0.0154 0.0159 0.01640.0041 106/ 1080 60 0.0170 0.0176 0.01820.0045 106/ 1080 63 0.0175 0.0179 0.01870.0050 1-1652 42 0.0139 0.0142 0.01460.0055 1080 / 2113 56 0.0163 0.0168 0.01740.0060 2-1080 63 0.0180 0.0181 0.01870.0070 7628 40 0.0135 0.0139 0.01430.0080 2-2116 45 0.0144 0.0148 0.01520.0090 2-2116 50 0.0153 0.0157 0.01620.0100 2-1652 42 0.0139 0.0142 0.01460.0120 2-1080 / 7628 47 0.0147 0.0152 0.01560.0140 2-7628 40 0.0135 0.0139 0.01430.0180 2-7628 / 2116 47 0.0147 0.0152 0.01560.0200 2-2113 / 2-7628 42 0.0139 0.0142 0.01460.0240 2-1652 / 2-7628 41 0.0137 0.0140 0.01450.0280 4-7628 40 0.0135 0.0139 0.01430.0310 2-1652 / 3-7628 40 0.0135 0.0139 0.01430.0350 5-7628 40 0.0135 0.0139 0.01430.0390 2116 / 5-7628 41 0.0137 0.0140 0.0145
Note: All test performed at ambient conditions Tg - tested by DSCBased on the Bereskin Stripline Test Method Td - tested by TGA @ onset
CONSTRUCTION
IS500 - Df matrix
www.isola-group.com
High Tg Standard Products- Microstrip 8 mil dB/Inch Loss
0.0000.100
0.2000.300
0.4000.500
0.6000.700
0.800
Frequency GHz
Lo
ss
dB
/Inc
h
FR406 IS410 IS415 IS500 PCL-370HR
FR406 0.113 0.147 0.185 0.218 0.249 0.281 0.313 0.344 0.379
IS410 0.145 0.201 0.260 0.318 0.372 0.429 0.484 0.538 0.592
IS415 0.107 0.147 0.182 0.218 0.250 0.281 0.310 0.340 0.369
IS500 0.111 0.155 0.197 0.238 0.278 0.316 0.355 0.395 0.433
P CL-370HR 0.154 0.222 0.293 0.365 0.436 0.506 0.577 0.645 0.708
1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0
• FR406 and IS415 are best in class - Loss close to Getek type products
• PCL 370 HR is the highest loss product in this category
IS500 Attenuation Comparison
www.isola-group.com
FR406 IS410 IS500
Scaling See Scaling Table in Process Guide
Same as FR406 Currently using FR406 scaling factors (additional characterization req’d)
Oxide Multiple options available Same as FR406 Same as FR406/8
Lamination ROR = 8 - 12F/min
Cure = 360F (60 min)
Pressure = 250 - 300 psi
ROR = 8 - 12 F/min
Cure = 375F (50 min)
Pressure = 250 - 300 psi
ROR = 8 - 12 F/min
Cure = 390F (90 min)
Pressure = 300 psi
Drilling See Drilling Table in Process Guide
Same as FR406, longer drill life
See Drilling table in following slides
Desmear Chemical Desmear (single pass)
Same as FR406 Similar to FR408 (double pass cyclic amine)
IS500 Processing Cross Reference
www.isola-group.com
Isola Product Technology Roadmap
Isola Lead Free, FR4 Replacement Product Solutions
Isola High Speed, Signal Integrity Product Solutions
Reliability
Overview of Isola Test Capabilities
Isola Technology Agenda
www.isola-group.com
FR408
www.isola-group.com
IS420IS420
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Electrical Performance Loss /DK
FR406 High Tg 170° Epoxy
FR406 High Tg 170° Epoxy
IS410 180° TgIS410
180° TgFR408 180Tg Low
Dk & DfFR408 180Tg Low
Dk & DfIS620 Tg 215 Low Loss.009 @10 Ghz LaminateIS620 Tg 215 Low Loss.009 @10 Ghz Laminate
IS640 Next Generation Low Loss-.005
IS640 Next Generation Low Loss-.005
P96 260 Tg Polyimide V0/V1
P96 260 Tg Polyimide V0/V1
G200 BT EpoxyLaminate
G200 BT EpoxyLaminate
P95 260 Tg Polyimide HBP95 260 Tg
Polyimide HB
Telecom
High Reliability - Lead Free
High Speed Digital / Base stations/Routers/Servers/Bur
n in
Military/Computers/drilling
1 -1.5Gbps *
1.5-2.0 Gbps *
Low Freq and speed
* Speeds a function of design such as line length etc.
T260 -10 Mins/Td.300*
*
T260 -60 Mins/Td.350*
*
High Speed /High Frequency
2.5-10 Gbps*
T288 -60 Mins/Td.400*
*
**Laminate Data- IST performance is a function of Hole dia/board thickness,plating parameters and laminate attributes.
IS415190TgIS415190Tg
IS500Halogen Free
180 Tg
IS500Halogen Free
180 Tg
www.isola-group.com
Positioning
FR408 is a high performance FR-4 epoxy laminate and prepreg system designed for advanced circuitry applications.
As an improvement over Std. FR4, FR408 offers improved electrical properties as well as Pb-Free compatibility.
As an alternative to PPO resin systems, FR408 offers lower signal loss improving electrical performance.
As an alternative to PPO resin systems, FR408 offers a 33% lower CTE improving PTH reliability As an alternative to modified epoxy systems with Cyanate Ester, FR408 offers better fracture
toughness making it the product of choice for high density designs and CAF resistance
Value Proposition
High thermal performance Tg of 180°C by DSC Very high decomposition temperature, Td of 360°C by TGA suitable for Pb-Free assembly Improved Dielectric Properties (Dk 3.3 – 3.8; Df 0.010 - 0.012) Superior Processing, closest to conventional FR-4 as compared to all high speed materials
FR408 Positioning and Value Proposition
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Property Units FR406 IS410 G200 FR408 IS620
Tg, (DSC) ºC 170 180 185 180 215
Td, (TGA) ºC 290 350 320 360 353
CTE
x-axis (amb - Tg) ppm/ºC 14 11 15 13 13
y-axis (amb - Tg) ppm/ºC 13 13 15 13 14
z-axis (amb - 288C) ppm/ºC 140 140 140 120 110-120
Solder Float, 288C sec >220 >500 >1200 >500 > 800
T-260, (TMA) min 10 >60 20 >60 >60
T-288, (TMA) min <1 >10 8 20 >15
Material Tested: 0.008”, 44% Resin %
FR408 Laminate Thermal Properties
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> 6.3778lb/inPeels, 1 oz.
1400140011751100volt/milElectrical Strength
94 V-094 V-094 V-094 V-0-Flammability
.15*.15*0.14*0.20*%Moisture Absorption
-
-
-
-
-
-
-
-
Units
GPYFR-4FR-4FR-4UL Recognition
.008.012.017.019DF, 10 GHz
.008.012-.019DF, 5 GHz
.008.011.012.018DF, 2 GHz
N/AN/A.013.023DF, 1 MHz
3.553.73.73.8DK, 10 GHz
3.553.7-3.9DK, 5 GHz
3.63.73.73.9DK, 2 GHz
N/AN/A4.04.6DK, 1MHz
IS620FR408G200FR406Property
Material Tested: 50% Resin Content*Material Tested: 0.008”, 44% Resin Content
FR408 Laminate Physical Properties
www.isola-group.com
FR408 High Performance Tg 180 C
Dk Mid Dk, Df High Tg Td 360 C
CORE Standard Resin Content Dk @ 2.0 GHz Dk @ 5.0 Ghz Dk @ 10.0 Ghz
THICKNESS0.0020 1-106 63 3.49 3.48 3.470.0025 1-1080 55 3.67 3.66 3.650.0030 1-2113 44 3.95 3.94 3.930.0035 1-2113 52 3.74 3.73 3.720.0035 2 - 106 65 3.45 3.43 3.430.0040 1-3070 48 3.84 3.83 3.820.0043 106/1080 58 3.60 3.59 3.580.0050 1-1652 42 4.00 3.99 3.990.0053 106/2113 56 3.65 3.63 3.630.0060 1080/2113 53 3.72 3.71 3.700.0070 2113/2116 45 3.92 3.91 3.900.0080 2-2116 45 3.92 3.91 3.900.0100 2-1652 42 4.00 3.99 3.990.0120 2-1080/7628 46 3.90 3.88 3.880.0140 2-7628 41 4.03 4.02 4.010.0180 2-7628/2116 42 4.00 3.99 3.990.0210 3-7628 39 4.09 4.08 4.070.0240 3-7628/2113 41 4.03 4.02 4.010.0280 4-7628 40 4.06 4.05 4.040.0310 4-7628/2113 40 4.06 4.05 4.040.0350 5-7628 41 4.03 4.02 4.010.0400 6-7628 37 4.15 4.13 4.130.0590 9-7628 37 4.15 4.13 4.13
Note: All test performed at ambient conditions Tg - tested by DSCBased on the Bereskin Stripline Test Method Td - tested by TGA @ onset
CONSTRUCTION
FR408 Dk matrix
www.isola-group.com
FR408 High Performance Tg 180 C
Df Mid Dk, Df High Tg Td 360 C
CORE Standard Resin Content Df @ 2.0 GHz Df @ 5.0 Ghz Df @ 10.0 Ghz
THICKNESS0.0020 1-106 63 0.0128 0.0136 0.01340.0025 1-1080 55 0.0120 0.0127 0.01250.0030 1-2113 44 0.0109 0.0114 0.01130.0035 1-2113 52 0.0112 0.0123 0.01220.0035 2 - 106 65 0.0131 0.0138 0.01360.0040 1-3070 48 0.0113 0.0119 0.01170.0043 106/1080 58 0.0123 0.0130 0.01280.0050 1-1652 42 0.0107 0.0112 0.01100.0053 106/2113 56 0.0121 0.0128 0.01260.0060 1080/2113 53 0.0118 0.0124 0.01230.0070 2113/2116 45 0.0110 0.0115 0.01140.0080 2-2116 45 0.0110 0.0115 0.01140.0100 2-1652 42 0.0107 0.0112 0.01100.0120 2-1080/7628 46 0.0111 0.0116 0.01150.0140 2-7628 41 0.0106 0.0111 0.01090.0180 2-7628/2116 42 0.0107 0.0112 0.01100.0210 3-7628 39 0.0104 0.0108 0.01070.0240 3-7628/2113 41 0.0106 0.0111 0.01090.0280 4-7628 40 0.0105 0.0110 0.01080.0310 4-7628/2113 40 0.0105 0.0110 0.01080.0350 5-7628 41 0.0106 0.0111 0.01090.0400 6-7628 37 0.0102 0.0106 0.01050.0590 9-7628 37 0.0102 0.0106 0.0105
Note: All test performed at ambient conditions Tg - tested by DSCBased on the Bereskin Stripline Test Method Td - tested by TGA @ onset.
CONSTRUCTION
FR408 Df matrix
www.isola-group.com
IS620
www.isola-group.com
IS420IS420
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Electrical Performance Loss /DK
FR406 High Tg 170° Epoxy
FR406 High Tg 170° Epoxy
IS410 180° TgIS410
180° TgFR408 180Tg Low
Dk & DfFR408 180Tg Low
Dk & DfIS620 Tg 215 Low Loss.009 @10 Ghz LaminateIS620 Tg 215 Low Loss.009 @10 Ghz Laminate
IS640 Next Generation Low Loss-.005
IS640 Next Generation Low Loss-.005
P96 260 Tg Polyimide V0/V1
P96 260 Tg Polyimide V0/V1
G200 BT EpoxyLaminate
G200 BT EpoxyLaminate
P95 260 Tg Polyimide HBP95 260 Tg
Polyimide HB
Telecom
High Reliability - Lead Free
High Speed Digital / Base stations/Routers/Servers/Bur
n in
Military/Computers/drilling
1 -1.5Gbps *
1.5-2.0 Gbps *
Low Freq and speed
* Speeds a function of design such as line length etc.
T260 -10 Mins/Td.300*
*
T260 -60 Mins/Td.350*
*
High Speed /High Frequency
2.5-10 Gbps*
T288 -60 Mins/Td.400*
*
**Laminate Data- IST performance is a function of Hole dia/board thickness,plating parameters and laminate attributes.
IS415190TgIS415190Tg
IS500Halogen Free
180 Tg
IS500Halogen Free
180 Tg
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IS620 Ad
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Superior Electrical Performance - The Loss With IS620 is Lower at Higher Frequencies and Stays Stable, the Response With APPE is Not Stable and it Increases With Frequency
IS620 is a Thermoset Resin, Unlike APPE Resins Which Are Thermoplastic Blends. The APPE Resin Conforms While IS620 Flows
IS620 Does Not Use Special Glass and is Therefore Available in Standard Sizes and is Not Subject to the Supply Issues
The Cost of Ownership vs. Performance is Very Favorable With IS620
Superior PTH reliability due to very low z-axis CTE
The Only Lead-Free Compatible Product in its Class
IS620 Product Strengths
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Appropriate for High Speed Digital applications up to 5 Gbps
As a performance upgrade replacement for Nelco N4000-13 Product due to its ease of processing and superior thermal and electrical attributes at a slightly lower cost of ownership
As a substitute for Nelco N4000-13SI Products due to its ease of processing, availability and lower cost of ownership
As a replacement for APPE resin systems due to its much lower cost of ownership and availability
As a replacement for Rogers 4350 in the lower to mid end designs due to its stable electrical performance at a substantially reduced cost
As a substitute for G-200/BT applications due to its better thermal and electrical performance at similar cost
As the lead-free low loss product
IS620 Product Positioning
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Property Units FR406 G200 IS415 IS500 IS620 IS640
Tg, (DSC) ºC 170 185 190 170 215 220
Td, (TGA) ºC 290 320 370 400 353 350
CTE
x-axis (amb - Tg) ppm/ºC 14 15 13 13 11 11
y-axis (amb - Tg) ppm/ºC 13 15 14 14 13 10
z-axis (amb - 288C)
% 4.4% 3.5% 2.9% 2.8% 2.8% 3.6%
Solder Float, 288C sec >220 >1200 >1200 TBD >800 TBD
T-260, (TMA) min 10 20 >60 >60 >60 >60
T-288, (TMA) min <1 8 >20 >15 >15 >10
Material Tested: 0.008”, 44% Resin %
IS620 Laminate Thermal Properties
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Property Units FR406 G200 IS415 IS500 IS620 IS640
Dk, 2 GHz 3.9 3.7 3.8 3.9 3.6 3.0-3.6
Dk, 10 GHz 3.8 - 3.7 3.8 3.55 3.0-3.6
Df, 2 GHz .018 .012 .016 .016 .008 <.0045
Df, 10 GHz .019 - .017 .017 .008 <.0045
Electrical Strength V/mil 1100 1175 >1000 1000 1400 TBD
Peels, 1oz lbs./in. 8 7 >6.3 >6.3 >6.3 >5.5
Flammability 94V-0 94V-0 94V-0 94V-0 94V-0 94V-0
Moisture Absorption
% 0.20 0.14 0.26 0.12 0.15 0.40*
UL Recognition FR-4 FR-4 FR-4 TBD GPY Non ANSI
*Material Tested: 0.030”(5-2116), 52% Resin %
IS620 Laminate Physical Properties
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IS620 Low Loss Low Dk Tg 215 C
Dk Lead Free Td 353 C
Core Standard Resin Dk Dk Dk
Thickness Construction Content 2.0 Ghz 5 Ghz 10 Ghz0.0020 1-106 70 3.33 3.31 3.300.0027 1-1080 60 3.54 3.53 3.520.0030 1-1080 63 3.47 3.46 3.450.0035 2-106 66 3.41 3.39 3.380.0035 1-2113 51 3.76 3.74 3.740.0040 2 x 106 70 3.33 3.31 3.300.0040 1-3070 50 3.78 3.77 3.760.0045 106/1080 63 3.47 3.46 3.450.0050 2 x 106 76 3.21 3.19 3.180.0050 106/2113 55 3.66 3.64 3.640.0060 1080/2113 54 3.68 3.67 3.660.0060 1080/ 106 70 3.33 3.31 3.30.0070 2-2113 52 3.73 3.72 3.710.0080 2-3070 50 3.78 3.77 3.760.0100 3 x 1080 66 3.41 3.39 3.380.0100 2-2116 54 3.68 3.67 3.660.0120 2-2113/ 1652 48 3.83 3.82 3.810.0140 2-2116/1652 47 3.86 3.85 3.840.0160 3-1652 46 3.89 3.87 3.870.0180 2-3070/2-1652 46 3.89 3.87 3.870.0210 2-2116/2-1652 50 3.78 3.77 3.760.0240 2-2116/3-1652 46 3.89 3.87 3.870.0280 2-3070/4-1652 45 3.91 3.90 3.890.0310 2-2116/4-1652 48 3.83 3.82 3.810.0350 7-1652 43 3.97 3.96 3.950.0400 8-1652 43 3.97 3.96 3.95
Note: All test performed at ambient conditions Tg - measured by DSCBased on the Bereskin Stripline Test Method Td - measured by TGA @ onset
IS620 Dk Matrix
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IS620 Low Loss, Low Dk Tg 215 CDf Lead Free Td 353 C
Core Standard Resin Df Df DfThickness Construction Content 2.0 Ghz 5 Ghz 10 Ghz
0.0020 1-106 70 0.0095 0.0098 0.00990.0027 1-1080 60 0.0090 0.0093 0.00940.0030 1-1080 63 0.0091 0.0094 0.00950.0035 2-106 66 0.0093 0.0096 0.00970.0035 1-2113 51 0.0086 0.0089 0.00890.0040 1-3070 50 0.0086 0.0088 0.00890.0040 2x106 70 0.0095 0.0098 0.00990.0045 106/1080 63 0.0092 0.0094 0.00950.0050 2 x 106 76 0.0097 0.0101 0.01020.0050 106/2113 55 0.0088 0.0091 0.00910.0060 106/1080 70 0.0095 0.0098 0.00980.0060 1080/2113 54 0.0088 0.0090 0.00910.0070 2-2113 52 0.0087 0.0089 0.00900.0080 2 x 3070 50 0.0086 0.0088 0.00890.0100 3 x 1080 66 0.0093 0.0096 0.00970.0100 2-2116 54 0.0088 0.0090 0.00910.0120 2-2113/ 1652 48 0.0085 0.0087 0.00880.0140 2-2116/1652 47 0.0087 0.0087 0.00870.0160 3-1652 46 0.0084 0.0086 0.00870.0180 2-3070/2-1652 46 0.0084 0.0086 0.00870.0210 2-2116/2-1652 50 0.0086 0.0088 0.00890.0240 2-2116/3-1652 46 0.0084 0.0086 0.00870.0280 2-3070/4-1652 45 0.0084 0.0086 0.00860.0310 2-2116/4-1652 48 0.0085 0.0087 0.00880.0350 7-1652 43 0.0083 0.0085 0.00850.0400 8-1652 43 0.0083 0.0085 0.0085
Note: All test performed at ambient conditions Tg - measured by DSCBased on the Bereskin Stripline Test Method Td - measured by TGA @ onset
IS640 Df matrix
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Frequency (GHz)Frequency (GHz)
12 Inch Trace 8 Inch Trace
IS620 vs. Modified Epoxy Special Glass
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Attenuation by Isola Grade
-35
-30
-25
-20
-15
-10
-5
0
0 2 4 6 8 10 12 14 16 18 20
Frequency (GHz)
Att
en
ua
tio
n (
dB
)
FR406 FR408 IS620 IS640
Data courtesy Northrup Grumman
IS620 Attenuation 16” Transmission Line
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High Speed Products- Microstrip 8 mil dB/Inch Loss
0.000
0.100
0.200
0.300
0.400
0.500
Frequency GHz
Lo
ss
dB
/Inc
h
IS620 GETEK I N4000-13 N4000-13SI PCL-LD-621
IS620 0.075 0.100 0.122 0.144 0.161 0.181 0.198 0.217 0.234
GETEK I 0.096 0.132 0.170 0.204 0.238 0.272 0.300 0.328 0.360
N4000-13 0.085 0.121 0.156 0.190 0.225 0.258 0.290 0.319 0.349
N4000-13SI 0.084 0.128 0.164 0.200 0.236 0.269 0.303 0.338 0.372
P CL-LD-621 0.092 0.131 0.170 0.209 0.248 0.288 0.325 0.363 0.404
1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0
• IS620 is the best in class product for dissipation factor
IS620 Attenuation Comparison
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Time / ns
Z / IS620
RO4350a) Time Domain Reflectometry
Figure a shows a TDR measurement of the impedance profile of a 1m conductor in layer HF 1. For comparisonpurposes TDR results of conductors in a board made from IS 620 and R04350 are confronted. The differenceof the impedance course can be basically attributed to 2 reasons:
1. Inevitable different geometrical dimensions (line width, height of chamber etc.) of the two boards2. Different dielectric figures for both materials
Due to different dielectric figures of different types of material there are varying delays of electrical signals. Also these delays can be taken from TDR measurements. The difference in time of the scarped flanks at the endof the effective range marks the double difference in delay (feed and return run of signal) of electrical signals.
IS620 TDR Measurements - Siemens
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TDR measurements allow a very precise determination of running time differences and thereof the differences of dielectric figures. However, in order to identify damping characteristics, gauging in the frequency range are more suitable. In order to do so scattering parameters S21 (transmisson damping) of both materials are compared. Figure b shows that there are no differences in damping features of both materials in a range of up to 15GHz. As a result of this it can be said that both materials hold nearly the same dissipation factors tan
Frequency / GHz
S21 / dB
RO4350
IS620
b) Frequency Domain
IS620 S21 Measurements - Siemens
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IS620Lead Free Assembly Testing
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IS620 Pb-Free Simulation – NEMI Parameters
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IS620 Lead-Free Assembly – European Customer A
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IS620 Lead-Free Assembly – European Customer B
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Plated-Thru Holes after 8x Reflow Process
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Samples of the finished test cards were sent to Isola for thermal analysis prior to reflow simulation. The results shown support the claim that the IS620 would perform as expected in the reflow simulation. Additional, samples were submitted to the Isola R&D lab after 8 reflow passes.
Before Reflow Simulation After Reflow SimulationCTE before Tg 61.2 ppm/C - 181CCTE after Tg 259.0 ppm/C - 181-269CCTE after Tg 786.0 ppm/C - 269-288COverall CTE 155.9 ppm/C - 20-288CTGA 350C 349CDSC Tg Cleave A 199-200C Delta 1CDSC Tg Cleave B 198-199C Delta 1CPeak Tan Delta 171C and 269CT-260 by TMA 60 minutes + 60 minutes+T-288 by TMA 2.8, 2.9, 3.0, 3.7 minutesWeight Loss % 0.4% to 260C 0.4% to 260C
IS620 Thermal Analysis (before and after 8x Reflow Simulation)
www.isola-group.comIS620 Lead Free is getting great traction in the market and we are already seeing a strong Ramp up. It is now the only Lead Free product
in its Class
IS620 Lead-Free Assembly Summary Feedback from the Market
IS620 Passes Lead-Free Assembly Testing 7x at Merix
IS620 Passes Lead-Free Assembly Testing 6x at PPC
Positive Results at all customers to date
Finished Board thermal analysis demonstrates T260 greater than 60 minutes
Finished Board decomposition temperature greater than 350 C
Joint Press-Release with Merix on Lead-Free Compatibility
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Isola Processing Cross Reference
FR408 IS620 IS640
Scaling 30% greater in Grain
Similar to FR408 in Fill
Currently evaluating* (using IS620 factors)
Oxide Same as FR406/8 Same as FR406/8 Same as FR406/8
Lamination ROR = 8 - 12 F/min
Cure = 375F (90 min)
Pressure = 275 - 350 psi
40 min soak – 200F
ROR = 4 F/min
Cure = 390F (120 min)
Pressure = 350 - 400 psi
ROR = 3 - 5 F/min
Cure = 390F (150 min)
Pressure = 200 - 250 psi
Drilling Similar to N4000-13 or N4000-13SI
Similar to N4000-13 or N4000-13SI
Similar to R4350 F&S
Drill life substantially better than R4350
Desmear Double Pass Desmear
Plasma Desmear
Similar to FR408 (prefer Plasma Desmear)
Similar to FR406
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Next Generation Low Loss
IS640
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IS640 Ad
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IS420IS420
Th
erm
al P
erf
orm
an
ce T
26
0/
Decom
p./
IST
Electrical Performance Loss /DK
FR406 High Tg 170° Epoxy
FR406 High Tg 170° Epoxy
IS410 180° TgIS410
180° TgFR408 180Tg Low
Dk & DfFR408 180Tg Low
Dk & DfIS620 Tg 215 Low Loss.009 @10 Ghz LaminateIS620 Tg 215 Low Loss.009 @10 Ghz Laminate
IS640 Next Generation Low Loss-.005
IS640 Next Generation Low Loss-.005
P96 260 Tg Polyimide V0/V1
P96 260 Tg Polyimide V0/V1
G200 BT EpoxyLaminate
G200 BT EpoxyLaminate
P95 260 Tg Polyimide HBP95 260 Tg
Polyimide HB
Telecom
High Reliability - Lead Free
High Speed Digital / Base stations/Routers/Servers/Bur
n in
Military/Computers/drilling
1 -1.5Gbps *
1.5-2.0 Gbps *
Low Freq and speed
* Speeds a function of design such as line length etc.
T260 -10 Mins/Td.300*
*
T260 -60 Mins/Td.350*
*
High Speed /High Frequency
2.5-10 Gbps*
T288 -60 Mins/Td.400*
*
**Laminate Data- IST performance is a function of Hole dia/board thickness,plating parameters and laminate attributes.
IS415190TgIS415190Tg
IS500Halogen Free
180 Tg
IS500Halogen Free
180 Tg
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IS640 Product Strengths
Superior Signal Integrity - flat Df from 2 to 15 GHz
Stable Dielectric Constant from 2 to 15 GHz
Customized Dk for different applications (ie.3.0, 3.20, 3.25, 3.38, 3.45)
Utilizes Standard E-Glass
Standard Thicknesses Available
Tack-free prepreg for ease in handling
Superior Drilling performance
Conventional FR-4 processing
Compatible with Isola IS410, FR406 & FR408
Lower Cost of Ownership
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Applicable for RF Microwave/High-Speed Digital Market (5+ Gbps)
Capable of meeting lead-free requirements
IS640 prepreg is non-tacky, unlike Rogers 4350
Significant Cost Advantage
Rogers 4350 has 60% ceramic filler in the resin, more difficult drilling
IS640 Product Positioning
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Electrical Properties ValuesDk @ 2 GHz 3.43Dk @ 5 GHz 3.43Dk @ 10 GHz 3.43Df @ 2 GHz 0.0037Df @ 5 GHz 0.0038Df @ 10 GHz 0.0038
Mechanical Properties ValuesPeel Strength - after thermal stress 4 lbs/in (1/2 oz)RTFlammability 94 V-0T- 260 > 60 minutesTg - DSC 220 Degrees C
*All tests run on 0.030” 2116 with 52 % retained resin % Electrical properties tested by Bereskin Stripline Method
IS640 Material Properties
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2.5
3
3.5
4
2 GHz 5 GHz 10 GHz
IS620 APPE IS640
55 % RESIN
IS640 Stripline Dk Comparison
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0.0035
0.0055
0.0075
0.0095
0.0115
2 GHz 5 GHz 10 GHz
IS 620 APPE IS640
55 % RESIN
IS640 Stripline Df Comparison
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IS640 Very Low Loss Tg 220 C
Dk Td 350 C
CORE Standard Resin Content Dk @ 2.0 GHz Dk @ 5.0 Ghz Dk @ 10.0 Ghz
THICKNESS Construction0.0030 1-1080 64 3.10 3.10 3.100.0040 1-3070 50 3.49 3.49 3.490.0050 1-2116 52 3.43 3.43 3.430.0060 1652 51 3.46 3.46 3.460.0060 2-1080 64 3.10 3.10 3.100.0080 2-3070 50 3.45 3.45 3.450.0100 2-2116 52 3.43 3.43 3.43
High Spped Digital
IS640 Dk matrix – High Speed Digtal
Electrical test data by Bereskin Stripline Method at ambient temp.
Tg tested by DSCTd tested by TGA @ onset
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IS640 Very Low Loss Tg 220 C
Df Td 350 C
CORE Standard Resin Content Df @ 2.0 GHz Df @ 5.0 Ghz Df @ 10.0 Ghz
THICKNESS0.0030 1-1080 64 0.0033 0.0034 0.00340.0040 1-3070 50 0.0038 0.0039 0.00390.0050 1-2116 52 0.0037 0.0038 0.00380.0060 1652 51 0.0038 0.0038 0.00380.0060 2-1080 64 0.0033 0.0034 0.00340.0080 2-3070 50 0.0038 0.0039 0.00390.0100 2-2116 52 0.0037 0.0038 0.0038
CONSTRUCTION
IS640 Df matrix – High Speed Digital
Electrical Data tested by Bereskin Stripline Method at ambient temp.
Tg – tested by DSCTd – tested by TGA @ onset
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IS640 Very Low Loss Tg 220 C
3.45 Td 350 C
DkThickness Dk @ 2.0 GHz Dk @ 5.0 Ghz Dk @ 10.0 Ghz
0.0200 3.45 3.45 3.450.0300 3.45 3.45 3.450.0600 3.45 3.45 3.45
IS640 Very Low Loss Tg 220 C
3.38 Td 350 C
DkThickness Dk @ 2.0 GHz Dk @ 5.0 Ghz Dk @ 10.0 Ghz
0.0200 3.38 3.38 3.380.0300 3.38 3.38 3.380.0600 3.38 3.38 3.38
RF/ Microwave
RF/ Microwave
IS640 RF/ Microwave – 3.45 and 3.38 Dk
Tested per IPC TM 650 2.5.5.5
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IS640 Very Low Loss Tg 220 C
3.45 Td 350 C
DkThickness Df @ 2.0 GHz Df @ 5.0 Ghz Df @ 10.0 Ghz
0.0200 0.0045 0.0045 0.00450.0300 0.0045 0.0045 0.00450.0600 0.0045 0.0045 0.0045
IS640 Very Low Loss Tg 220 C
3.38 Td 350 C
DkThickness Df @ 2.0 GHz Df @ 5.0 Ghz Df @ 10.0 Ghz
0.0200 0.0042 0.0042 0.00420.0300 0.0042 0.0042 0.00420.0600 0.0042 0.0042 0.0042
RF/ Microwave
RF/ Microwave
IS640 Rf/ Microwave Df matrix– 3.45 and 3.38 Dk
Tested per IPC TM 650 2.5.5.5
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IS640 Very Low Loss Tg 220 C
3.25 Td 350 C
DkThickness Dk @ 2.0 GHz Dk @ 5.0 Ghz Dk @ 10.0 Ghz
0.0200 3.25 3.25 3.250.0300 3.25 3.25 3.250.0600 3.25 3.25 3.25
IS640 Very Low Loss Tg 220 C
3.20 Td 350 C
DkThickness Dk @ 2.0 GHz Dk @ 5.0 Ghz Dk @ 10.0 Ghz
0.0200 3.20 3.20 3.200.0300 3.20 3.20 3.200.0600 3.20 3.20 3.20
RF/ Microwave
RF/ Microwave
IS640 RF/ Microwave – 3.25 & 3.20 Dk
Tested per IPC TM 650 2.5.5.5
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IS640 Very Low Loss Tg 220 C
3.25 Td 350 C
DkThickness Df @ 2.0 GHz Df @ 5.0 Ghz Df @ 10.0 Ghz
0.0200 0.0035 0.0035 0.00350.0300 0.0035 0.0035 0.00350.0600 0.0035 0.0035 0.0035
IS640 Very Low Loss Tg 220 C
3.20 Td 350 C
DkThickness Df @ 2.0 GHz Df @ 5.0 Ghz Df @ 10.0 Ghz
0.0200 0.0035 0.0035 0.00350.0300 0.0035 0.0035 0.00350.0600 0.0035 0.0035 0.0035
RF/ Microwave
RF/ Microwave
IS640 RF/ Microwave Df matrix – 3.25 & 3.20 Dk
Tested per IPC TM 650 2.5.5.5
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IS640 Very Low Loss Tg 220 C
3.00 Td 350 C
DkThickness Dk @ 2.0 GHz Dk @ 5.0 Ghz Dk @ 10.0 Ghz
0.0200 3.00 3.00 3.000.0300 3.00 3.00 3.000.0600 3.00 3.00 3.00
RF/ Microwave
IS640 RF/ Microwave - 3.00 Dk
Tested per IPC TM 650 2.5.5.5
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Isola Processing Cross Reference
FR408 IS620 IS640
Scaling 30% greater in Grain
Similar to FR408 in Fill
Currently evaluating* (using IS620 factors)
Oxide Same as FR406/8 Same as FR406/8 Same as FR406/8
Lamination ROR = 8 - 12 F/min
Cure = 375F (90 min)
Pressure = 275 - 350 psi
40 min soak – 200F
ROR = 4 F/min
Cure = 390F (120 min)
Pressure = 350 - 400 psi
ROR = 3 - 5 F/min
Cure = 390F (150 min)
Pressure = 200 - 250 psi
Drilling Similar to N4000-13 or N4000-13SI
Similar to N4000-13 or N4000-13SI
Similar to R4350 F&S
Drill life substantially better than R4350
Desmear Double Pass Desmear
Plasma Desmear
Similar to FR408 (prefer Plasma Desmear)
Similar to FR406
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Isola Product Technology Roadmap
Isola Lead Free, FR4 Replacement Product Solutions
Isola High Speed, Signal Integrity Product Solutions
Reliability
Overview of Isola Test Capabilities
Isola Technology Agenda
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PWB Reliability Test Methods
Interconnect Stress Testing (IST)
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IST is an accelerated stress test method
Creates uniform strain from within substrate
DC current is used to heat the PTH barrels and forced convection cooling to cycle PTH
Technique identifies and assesses the severity of post separation and barrel cracks
Interconnect Stress Testing (IST)
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Test Method Comparison
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Failure defined as resistance degradation
QUANTIFYING DEGREES OF POST SEPARATION (.050" GRID)
0
5
10
15
20
25
30
35
40
45
50
1 21 41 61 81 101 121 141 161 181 201 221 241 261 281 301 321 341 361 381 401 421 441 461 481
IST CYCLES
RE
SIS
TAN
CE
CH
AN
GE
IN M
ILL
IOH
MS GROSS
FINE LINE
GOOD
IST Data Analysis
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Benefits of Weibull Analysis method
Accounts for infant mortality
Requires few data points to fit data
Attributes of Weibull Distribution
- Good Fit of data: Shape parameter
(slope) > 3
- Number of cycles at 1% failure > 75
cycles
- MTTF (Mean Time to Failure) is a
meaningful summary of data100 1000
1
2
3
5
10
20
30
40 50 60 70 80
90 95
99
Time to Failure
Per
cent
Probability Plot for 9.8 milWeibull Distribution - ML Estimates - 95.0% CI
Complete Data
ShapeScale
MTTF
StDev
Median
IQR
Failure
Censor
AD*
5.2506 353.32
325.33
71.258
329.50
97.313
17
0
0.8697
IST Weibull Analysis
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PWB Reliability Test Methods
Hi-Pot Testing
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Hi-Pot testing is analogous to high voltage testing
Determine the state of the material’s electrical insulation
Synonymous terms: Voltage withstanding test Dielectric strength testing Insulation breakdown testing
Technique to test the insulation resistance of materials ZBC used in buried distributive
capacitance applications Reference: Buried Capacitance and thin laminates
Hi-Potential Testing (Hi-Pot)
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PWB Reliability Test Methods
Conductive Anodic Filament (CAF) Failure
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CAF formation was first reported in 1976, but field failures were identified later in the 1980s
Electrochemical failure Growth of copper containing filament along epoxy-glass
interface Bell Laboratories investigated mechanism of CAF
formation Physical degradation of glass/epoxy bond Moisture absorption occurs under high humidity conditions An electrochemical pathway develops and electrochemical
corrosion occurs Water acts as electrolyte, the copper circuitry becomes the
anode and cathode, and the operating voltages acts as the driving potential
Conductive Anodic Filament (CAF)
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CAF Pathways
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Sun Microsystems Test Board 10 Layer Board, .050” Single Ply 2116 Construction All Layers, B and C-Stage
D1 D2
A1A2A3A4
B1B2B3B4
C1C2
C3C4
A1 - A4 = Hole to Hole In Line with GlassB1 - B4 = Hole to Hole Diagonal to GlassC1 - C4 = Hole to Plane Clearance (antipad)D1 & D2 = Plane to Plane
CAF Test Vehicle
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PWB Reliability Test Methods
Registration
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Registration error composed of several different sources Types: Offset error, Compensation error, angle error, random noise Offset error
Related to tooling processes Punch, pinning, and drilling
Compensation error Related to scaling artwork Material movement or artwork movement
Angle error Related to a rotational misalignment Post-etch punch machines that are miscalibrated
Random noise
Registration Summary
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References
1. Ready, W. Jud, Turbini, Laura J., “Conductive Anodic Filament Failure: A Material Perspective” www.readymadeparties.com/jud/reprints/publications/PRICM_1998/materialsperspective_short.pdf
2. Biunno, Nicholas, Schroeder, Greg, “Buried Capacitance and Thin Laminates”. www.circuitree.com/CDA/ArticleInformation/coverstory/BNPCoverStoryItem/0,2135,119345,00.html
3. PCB reliability testing with Interconnect Stress Test. http://www.polarinstruments.com/support/reliability/ap301.html
4. McQuarrie, Wm. Gray, “Control of Key Registration Variables for Improved Process Yields on Dense MLBs”. www.isola-usa.com
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Isola Product Technology Roadmap
Isola Lead Free, FR4 Replacement Product Solutions
Isola High Speed, Signal Integrity Product Solutions
Reliability
Overview of Isola Test Capabilities
Isola Technology
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IsolaLaboratory Capabilities
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• Thermal Analysis– Differential Scanning
Calorimetry (DSC) • Tg, delta Tg
– Thermomechanical Analysis (TMA)
• X, Y, Z- CTE, Tg, T-260, T-288
– Dynamic Mechanical Analysis (DMA)
• Tg, Modulus – 4 Camera CTE (X and Y)– Rheometer
• Gel Window, Minimum Viscosity
• Microscopy– Scanning Electron Microscopy
(SEM)– Energy Dispersive
Spectroscopy (EDS)– Optical Microscopy
(Microsectioning including thermal stress)
– Fourier-Transform Infrared Spectroscopy (FTIR)
– Coulometric Titration (Moisture Content)
IPC-4101A Qualification and Conformance Testing
Isola Analytical lab Capabilities
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• Electrical Testing– Dielectric Constant/ Dissipation
Factor• 1 MHz (Two Fluid)• 100 MHz to 1.5 GHz (HP
4291A)• 1 GHz to 20 GHz (Bereskin
Method)• Network Analyzer and full
signal integrity bench– Electric Strength– Hi-Pot– Arc Resistance– Insulation Resistance– Conductive Anodic Filament
(CAF)
• Physical Testing– Dimensional Stability
• 4 Camera System– Peel Strength– UL Flammability– Oxygen Index– Flexural Strength– Compressive Strength– Bond Strength– Shear Strength– Warp and Twist– Surface Profilometry
Isola Analytical Lab Capabilities
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Agilent PNA/PLTS Signal Integrity Bench
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Signal Integrity with Eye Diagrams
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Mechanical Analysis
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Scanning Electron Microscopy (SEM)
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Development Methodology Modeling
Large IP Portfolio and Large Data base of Research Strong Development and Process Technology group
Neat Resin characterization and modeling Infrastructure
Pilot manufacturing facilities Best in class Analytical Labs Global footprint with Regional Centers of excellence Investment in new Technology
Focus on cost effective technologies Isola’s new Technologies based on unique formulas using components vs.
prepackaged value priced Technologies from Vendors
Leading Technology Player
Isola Competitive Advantage – Product Technology