Transcript
Page 1: Thermal Analysis of an Icy IC

Thermal Analysis of anIcy IC

Shiree BurtCryogenic Electronics Group

San Francisco State UniversityPresented October 2, 2006Revised October 18, 2010

Page 2: Thermal Analysis of an Icy IC

Page 1

Page 3: Thermal Analysis of an Icy IC

Page 2

Page 4: Thermal Analysis of an Icy IC

Two processes for releasing the silicon nitride membrane:

Thin PolySiRemoved by XeF2

Page 3

Page 5: Thermal Analysis of an Icy IC

Without Etch Stop With Etch Stop

Confinement of XeF2 etch by SiO2 etch stop “tub”

Page 4

Page 6: Thermal Analysis of an Icy IC

Membrane Undercutting

Test Structure

Page 5

Page 7: Thermal Analysis of an Icy IC

Page 6

Page 8: Thermal Analysis of an Icy IC

Page 7

Page 9: Thermal Analysis of an Icy IC

Page 8

Page 10: Thermal Analysis of an Icy IC

Page 9

Page 11: Thermal Analysis of an Icy IC

Page 10

Page 12: Thermal Analysis of an Icy IC

Page 11

Page 13: Thermal Analysis of an Icy IC

Page 12

Page 14: Thermal Analysis of an Icy IC

Page 13

Page 15: Thermal Analysis of an Icy IC

Page 14

Page 16: Thermal Analysis of an Icy IC

Page 15


Recommended