Fraunhofer IPMS
Dr. Uwe [email protected]
Technology Trend and Application of OLED-on-CMOS (OLEDoS)
Center for Organic Materials and Electronic Devices Dresden (COMEDD)Fraunhofer Institute for Photonic Microsystems (IPMS), Dresden, D-01109, Germany
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Fraunhofer IPMS
Dr. Uwe [email protected]
time
com
plex
ity
Monochrome PM-Display
MulticolorPM-Display
Full colorPM-Display
Full colorAM-Display
Microdisplay See-throughMicrodisplay
MobileProjection
Display
MobileFlexibleDisplay
i AR
Mobile display driving forces: Multimedia content information navigation
by user interaction (touch screen,...)
augmented-reality (AR)
Mobile Display Dilemma micro-displays (
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Fraunhofer IPMS
Dr. Uwe [email protected]
Definition
Physically very small, but
High information content (TV quality)
Active matrix substrate (often CMOS)
Low power consumption
Enlarged image viewed through magnifying optics
Applications
Projection
Rear projection
Front projection
Micro projection
Near-to-Eye (NTE)
Electronic Viewfinder (EVF)
Hand-held
Head Mounted Display (HMD)
Professional
Consumer
Microdisplays: Definition, Application (general)
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Fraunhofer IPMS
Dr. Uwe [email protected]
OLED-on-CMOS(OLED-on-Silicon/OLEDoS)
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Fraunhofer IPMS
Dr. Uwe [email protected]
Key features
highly-efficient OLED light source in/on CMOS
extremely thin (~100nm)
small-molecules/vapor phase (SM-OLED)
polymers/ liquid phase (P-LED)
arbitrary shapes
all colors monochrome, white, NIR
excellent current/power efficiency (low-voltage, low-power)
good/improving lifetime (several 10kh)
self-emissive
fast response time (MHz)
electronics feature integration
driving, acqusition, processing, control
sensor co-integration
CMOS-compatible sensors
embedded photodetectors
temperature
magnetic (Hall)
M(O)EMS,...
Light emission +_
top-emitting
intransparent substrate
transparent conductororganic layersmetal cathodesubstrate
(Silicon CMOS wafer)
CMOS cross-section with OLED on top
Introduction OLED-on-CMOS
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Fraunhofer IPMS
Dr. Uwe [email protected]
-5 -4 -3 -2 -1 0 1 2 3 4 510-610-510-410-310-210-1100101102
101
102
103
104
105
orange emitter red emitter white emitter system
Cur
rent
den
sity
[mA
/cm
]
Voltage [V]
Lum
inan
ce [c
d/m
]
Top-emitting p-i-n OLED
based on small molecules(NOVALED AG)
evaporated on Si-wafer
intransparent bottomelectrode (Si-CMOSsubstrate)
transparent top electrode
high transparency
low sheet resistivity
Ag, Al or Yb
Doped charge transport layers
yield better OLED performance
reduce operating voltage
avoid CMOS HV devices
lower power dissipation atequivalent radiance
5.7
11.6
14.1
Currentefficiency
[Cd/A] @100cd/m
4.73.2white
12.0003.22.5ora
3.12.4red
@1000cd/m
@100cd/m
lifetime
@1000cd/m
Voltage [V]
Introduction OLED-on-CMOS
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Fraunhofer IPMS
Dr. Uwe [email protected]
OLED post-processing SUNICEL plus200 by Sunic System, Ltd.
(Korea) Silicon and quartz wafer: 150 mm/6,
200 mm/8, thickness: 0.6 to 0.8 mm Configuration
7 process chambers 12 organic sources 5 inorganic sources 2 PVD sources Ar/O2 plasma activitation
Cycle time: ~ 60 min Pilot capacity: ~ 6000 wafers/a
CMOS (so far) 1.0, 0.6, 0.35, 0.18m
processes integrated, mixed-signal circuit design
by IPMS/COMEDD wafers contract-manufactured at
silicon foundry providers (e.g., X-FAB)
OLED-on-CMOS: Device Manufacturing/SM-OLED
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Fraunhofer IPMS
Dr. Uwe [email protected]
PLED R&D and production line Si-wafer 200 mm Etching / Sputtering Clustex 200 | Leybold
Optics Spin coating EVG120 | EVG Nitrogen oven MB-OV | MBraun Etching, deposition by thermal evaporation
and Barix thinfilm encapsulation Helisys | ANS Korea Full-automated wafer bonding system
Hercules | EVG Wafer prober Pegasus PA200 | Wentworth Microscopes Eclipse L200 | Nikon Ellipsometer M-2000U | J. A. Woollam Particle scanner Surfscan 7700 | KLA Tencor former microdisplay production line of
MicroEmissive Displays Germany GmbH (MED) installed by MED at IPMS premises in
E/2006..B/2007 original product: MED eyescreen
ME3204 (QVGA, RGB) acquired by IPMS E/2009
OLED-on-CMOS: Device Manufacturing/P-LED
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Fraunhofer IPMS
Dr. Uwe [email protected]
microdisplays microdisplay
HMD, mobile/micro-projection, HUD, electronic viewfinder (EVF),...
bi-directional microdisplay (display + embedded camera) interactive HMD, optical inspection,...
sensors optical sensors
fluorescence, color, flowmetry, photoplethysmography,...
embedded illumination for image sensors patterned illumination possible optical finger-print, lab-on-chip,...
light barriers (reflective) opto-coupler
autostereoscopic 3D displays mobile devices (single user, single/multi
view)
objectsurface
OLED CMOS detectorCMOS substrate (wafer) CMOS circuit
encapsulation
organic-opto-micro-system
micro-optics
OLED-on-CMOS: Applications
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Fraunhofer IPMS
Dr. Uwe [email protected]
OLED micro-displays
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Fraunhofer IPMS
Dr. Uwe [email protected]
colour VGA (640x480) OLED micro-display for HMD and micro-projection
24 bit parallel video interface
color options
monochrome (8 bit)
full colour (24 bit)
digital pixel cell
luminance control by pulse width (PWM)
color, contrast and gamma correction control via IC
0.18m CMOS foundry process
core supply 1.8V
digital 1.8V I/O interfaces
negative OLED cathode voltage (max. -5.5V)
active area 7.68x5.76mm
chip size 12x11mm
High brightness
up to 10,000 nits for monochrome green (micro-projection)
1,000 nits for RGB colour (HMD)
IC interface (configuration)
50/60Hz frame rate7.7mm
5.8m
m
OLED microdisplay: HYPOLED
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Fraunhofer IPMS
Dr. Uwe [email protected]
Demonstrator
Full-color VGA microdisplay
MediaBox (DVB-T, DVB-H, WLAN)
Full-color VGA microdisplay
MediaBox
HYPOLED: System integration
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Fraunhofer IPMS
Dr. Uwe [email protected]
OLED m
icrodisp
lay head-mounted display (HMD)
micro-projection optics (MPU)
MediaBox (DVB-T, DVB-H, WLAN)
MPU (3-panel)
MediaBox
HYPOLED: System integration
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Fraunhofer IPMS
Dr. Uwe [email protected]
embedded photodetectors CMOS photodiodes
lower level than OLED side-by-side with active
electronics devices emission and detection can
be operated in parallel orsequentially
possibly shaping of OLED emissioncharacteristics (angular, spectralwidth)
OLED-on-CMOS: photodetector integration
OLED CMOS detectorCMOS substrate(wafer) CMOS circuit
encapsulationmicro-optics
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Fraunhofer IPMS
Dr. Uwe [email protected]
OLED-Microdisplay
320 x 240 (QVGA)
Embedded image sensor
160x120 (QQVGA)
Embedded Computersystem
OLED micro-display mode
image sensor mode
inverted camera image
system setup
feedback-mode demonstrator
Bi-directional OLED micro-display
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Fraunhofer IPMS
Dr. Uwe [email protected]
Bi-directional OLED microdisplay Feedback-mode demonstrator
no imaging optics so far
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Fraunhofer IPMS
Dr. Uwe [email protected]
Head-mounted display (HMD) application: aimed at tracking the eye movement with respect to user's sight (consciously and unconsciously) user's (situation) awareness (unconsciously)
gaze-based human-display-interaction visual Input-/Output-Device (I/O) for personal
information management (PIM) interactive augmented-reality (AR) applications
see-through optics
real view
virtual image virtualzoom-inbutton
virtualzoom-outbutton
virtual street map
interaction object
53 km/h Radio
Navi
Men
Display off
-1
30
60
www.lumusvision.com
HMD carrier
bi-directionalOLED microdisplay
mobile hostplatform
Bi-directional OLED micro-display: HMD application
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Fraunhofer IPMS
Dr. Uwe [email protected]
iSTAR: Bi-directional OLED micro-display
i AR
See-through view, display on
Near-to-eye projection optics attached to commercial sports goggles
ST-Prism and IR sources (eye scene illumination)
Interactive see-through augmented-reality displays (iSTAR)
Fraunhofer-internal collaborative project (WISA)
Display: VGA 640x480, full-color
embedded camera
128x96 pixel
frame camera
1280x80 pixel
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Fraunhofer IPMS
Dr. Uwe [email protected]
Consumer head-mounted
Displays fr Smartphones, mobile TV (3D)
electronic viewfinder (EVF)
Industrial HMD Optical Inspection
Medizin HMD, lab-on-chip,
functionalmicroscopy
Automotive HMD, opto-
coupler MIL
ST-HMD
ThermocouplesPart No. 467-854
More Information
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Markets
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Fraunhofer IPMS
Dr. Uwe [email protected]
Outlook
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Fraunhofer IPMS
Dr. Uwe [email protected]
Organics Micro-Patterning
OLED Microdisplay Fabrication by Orthogonal Photolithography (OLITH)
Aims
full-color OLED micro-displays w/o color-filter (CF)
high-resolution (90%)
fast, parallel processing
scaleable onto 8 wafers and beyond
Advantages
high OLED efficiency (10x)
better stability (via color-specificstack design)
widened color gamut
no color diffusionWater solutionFluorous solution
Octadecenesolution
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Fraunhofer IPMS
Dr. Uwe [email protected]
color-by-color OLED microdisplays color gamut current/power efficiency , power consumption
Enhanced hardware/circuitry integration additional, non-optical CMOS sensorics (e.g. magnetic) additional system features
e.g., embedded eye-tracking high-luminance OLED microdisplays (>1000cd/m)
ST-HMD outdoor micro-projection (ultra-flat optical module)
micro-signs no active CMOS small die size cost-effective
passive, i.e., external drive/control very fine patterning of emission areas e.g., signs, 7-segment displays,...
micro-optics integration (in cover glass) beam steering, shaping
high-temperature OLED-on-CMOS (lifetime) ..+85..105..125C
NIR-OLED integration 750..900nm
3D+ high-res, high-speed emissive image source
new applications sensors
1.3 mm
2 m
4 m
~60 mm
Outlook
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Fraunhofer IPMS
Dr. Uwe [email protected]
Tool extension to combine SM-OLED & P-LED Extension of 8 P-LED tool by SM-OLED
add 2 organic evaporationchambers
liquid and vapor phaseprocesses in single clustertool
hybrid OLED (small-molecules + polymers)
eBeam, sputter chamber and etcher allow new processesfor SM-OLED
attractive for 8 wafercustomers due to uniquelarge variety of processes
etcher, eBeam, Vitex-TFE, metal evaporation, sputter, organicsevaporation
FAT Q1..2/13
further extension feasible
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Fraunhofer IPMS
Dr. Uwe [email protected]
R&D and pilot-fabrication of OLED Microdisplays & Sensors
design, process development/integration, system integration
OLED micro-displays (QVGA..XGA), bi-directional (display and imager in singledevice, QVGA..SVGA)
backplane CMOS IC design (in silicon foundryprocess, 0.11..0.6m)
proprietary OLED module @ silicon foundry
OLED processing (SM-OLED & P-LED)
system design (e.g., multimedia controller)
applications (e.g., head-mounted display)
pilot fabrication lines
pilot line OLED-on-CMOS (8 Si wafer)
pilot line PLED-on-CMOS (ex MicroEmissiveDisplays production line, 8 Si wafer)
- Confidential -
COMEDD: Business Unit OLED Microdisplay & Sensors
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Fraunhofer IPMS
Dr. Uwe [email protected]
Dr. Uwe Vogel Business Unit Manager OLED Microdisplays and Sensors Center for Organic Materials & Electronic Devices Dresden (COMEDD) Fraunhofer Institut fr Photonische Mikrosysteme (IPMS)
Maria-Reiche-Strasse 2 D-01109 Dresden
phone:+49-351-8823-282 email: [email protected]
Thanks to collaborative partners: X-FAB Semiconductor Foundries; Novaled, Fraunhofer IOF, IOSB, IGD; TU Dresden
Work was in parts sponsored by European Commission within the HYPOLED project (High-Performance OLED-Microdisplays for Mobile Multimedia HMD and
Projection Applications, ICT-2007.3.2-217067) Federal Ministry for Education and Research of the German government (Bundesministerium fr Bildung und Forschung),
BMBF 01 BK 916-919, 16SV2283/"ZOOM", 16SV3682/"ISEMO" Schsische Aufbaubank (SAB) of the State of Saxony (11107/1733) Fraunhofer Internal Programs iSTAR, Grant No. WISA 817 805 (Industry-focused strategic alliance)
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