Session 1Chair: D. Cadman
Speakers:
1. Harrison: Development of Textiles for Electrical EnergyGeneration and Storage
2. Li: Resistance switching device with applications insensors and adaptable circuits
3. Somjit: 3D Microwave and Millimetre-waveSystem-on-Substrate using RF MEMS Components
4. Hutt: Copper Filled Adhesive Pastes for PrintedElectronics Applications
5. Dhadyalla: Complex Electrical Systems Research at WMG
6. Zhu: Computer Simulation on Electromigration
R2i – Connecting Research to Industry
Fulian Qiu, David Harrison, John Fyson, Yanmeng
Xu, Rui Zhang, School of Engineering and Design
Brunel University Darren Southee (Lboro)
Development of Textiles for Electrical Energy
Generation and Storage.
R2i – Connecting Research to Industry
• Powerweave ,13 European members from 7 countries, coordinated by TWI.
• Objective of the project is a fabric to generate (10W/m2) and store (10Wh/m2) energy within a totally fibrous matrix through:
• photovoltaic fibres based on the dye sensitized solar cell • rechargeable energy storage fibres based on supercapacitors • textile design to ensure reliability and most efficient operation • reliable interface and interconnection methods to integrate the
generation and storage fibres • demonstration in technical large area applications
• Fibres will be combined together by weaving into a textile, with
benefits of reduced weight, an unobtrusive appearance, flexibility, conformability, easier storage and transportation.
R2i – Connecting Research to Industry
Market opportunity for the research • New applications and design opportunities in
smart clothing (e.g. biomedical diagnostics and monitoring, sensing and display),
• telecoms (e.g. power for mobile devices and base stations),
• transport and safety (e.g. integrated power in inflatable rafts, safety clothing),
• disaster relief (e.g. smart energy generating tents, rescue gear) and
• leisure wear (e.g. sports goods incorporating sensors, telecoms and wearable portable devices).
R2i – Connecting Research to Industry
Current Status of research:
Initial results for the energy storage fibre have been published online in Phys. Chem. Chem. Phys., 2013, DOI: 10.1039/C3CP52036F Title: Coaxial single fibre supercapacitor for energy storage
CL= 0.2 mF/cm
R2i – Connecting Research to Industry
Next steps • What is being sought? • Brunel has an interest in developing our expertise in supercapacitor
materials into other application areas, including printed supercapacitors.
• What sort of collaboration is needed? • Partners who can provide support in kind for UK research
applications to complement the Powerweave project. • What type of partners are we looking for? –those that can provide
an industrial context for our R+D work
Summary • Thread supercapacitors with uniform coatings have been fabricated
successfully using a dip coating method • Electrochemically stable with specific length capacitance > 0.2 mF/cm,
and resistance ~ 2 Ohms/cm • Flexible and weavable,
R2i – Connecting Research to Industry
Resistance switching device
with applications in sensors and
adaptable circuits
Dr Lijie Li
College of Engineering, Swansea University [email protected]
Key points of our research: • Ultra low cost for making discrete resistive switching / varying devices •Interesting resistive switching performance
R2i – Connecting Research to Industry
• Background: Usually sophisticated equipments and expensive
materials are required to fabricate resistive switching /varying devices. These devices are still thought to have mainly on memory applications.
• Our research capability: Our team at Swansea has expertise in MEMS,
NEMS, sensors and actuators. We can innovatively produce resistive switching devices using low cost process based on printed circuit boards.
R2i – Connecting Research to Industry
• What is memristor? Memristors are considered as ‘the future of computing
storage and memory’. Currently Hewlett Packard has invested heavily on this technology.
• Application: Discrete memristors can have promising applications in
sensors, and adaptable analog circuits. The device can also be used as varistor, a device protects
electronic components and equipments from voltage surge. • Potential business case: production of discrete resistive switching devices for sale on
component catalogue. (currently none on the market).
R2i – Connecting Research to Industry
• Current status of our research: Prototype produced using printed circuit boards plus ZnO nanowires.
Fig. 1a, Schematic graph of the device, effective area is around 1000 µm x 1000 µm. Fig. 1b, Scanning electron photograph of ZnO nanowires on copper. Fig. 1c, photograph of a fabricated device.
(a) (b)
(c)
R2i – Connecting Research to Industry
R2i – Connecting Research to Industry
• Our aim: Develop a process that can yield highly reliable devices. Idea of such process has already been generated, funding
is needed to realize it. Collaboration with printed circuit board (PCB) company will be appreciated, and will boost the research to industry speed.
• How to collaborate: We design the process, the company implements the
process, and we do the device characterization. • What do we need: We are looking for partners that will be involved in R&D,
and early stage research funding is needed from research council or other alternative funding resources.
R2i – Connecting Research to Industry
3D Microwave & Millimetre-wave System-on-Substrate using RF MEMS Components
N. Somjit, R.M. Lee, A. Sunday, I. D. RobertsonUniversity of Leeds
M. D’Auria, S. LucyszynImperial College London
D.N. Rathnayake-Arachchige, David Hutt, Paul ConwayLoughborough University
• 3D RF components for 10 GHz to 300 GHz - integrated into packages
• Aiming to make sophisticated communications and sensing systemsmore affordable
R2i – Connecting Research to Industry
The frequency range 30-300 GHz is of increasing interest for communicationsand sensing applications
Traditional millimetre-wave waveguides are extremely low loss and cannoteasily be replaced by planar transmission lines.
An approach where 3D structures – including hollow waveguides – can beintegrated into LTCC modules is sought
94 GHz Sub-System for Medical Research www.hxi.com
Waveguides integrated into a“system-on-substrate” solution
Traditional millimetre-wavewaveguide system
Ke Wu et al.
R2i – Connecting Research to Industry
• LTCC prototyping technology @Leeds
• Particular interest for harsh environments (auto, aerospace, military, medical)
R2i – Connecting Research to Industry
Standard lumped elements
Excellent progress on fabricating prototype 3D structures (examples)
LTCC integrated waveguides to 40 GHz
Novel cantilevers and bridges
30 GHz waveguide antenna array(for plating using novel process @Loughborough)
R2i – Connecting Research to Industry
• Next steps on our projectMake the LTCC in-house prototyping process more stable and
repeatableDemonstrate novel metallisation techniqueInvestigate moving parts (MEMS)Design a full range of demonstrators
• What sort of industry collaboration is neededUser-led Demonstrator applications and specificationsDemonstrate use of new materials and processesCommercial fabrication opportunities
• Interested to develop the work further in partnership withIndustry through TSB and EU projects, KTPs, EPSRC CASEawards, etc
R2i2 – Connecting Research to Industry 1
Copper Filled Adhesive Pastes for Printed Electronics Applications
D.A. Hutt1, S. Qi2, B. Vaidhyanathan2
1Wolfson School of Mechanical and Manufacturing Engineering 2Department of Materials
Loughborough University [email protected]
• Increasing demand for direct printing of
electronic circuits on a range of low cost substrates e.g. RFID, packaging
• Low cost materials and methods required
R2i2 – Connecting Research to Industry 2
Electrically Conductive Adhesives / Inks Electrically conductive adhesives
and inks used for interconnect Combine a metal (conductive)
filler and adhesive resin Stencil or screen
print as a “paste” Resin shrinks /
hardens during cure Metal particles
pressed together
Silver filled adhesives provide good conductivity, but with high cost
Copper replacement of silver is difficult due to the non-conducting copper oxide
Curing
e.g. 80 OC –150 OC
adhesive
Conductive particle
Cu substrate
adhesive
component
Component attachment Printed
tracks
R2i2 – Connecting Research to Industry 3
Copper Filled Adhesive Development Copper powder treatment method developed Remove oxide and apply protective coating (SAM) Coating breaks down during thermal cure
Protected copper powder mixed with resin
to make a conductive adhesive Resistivity comparable to silver filled
materials is achieved after curing Using copper provides raw metal cost saving Silver >100x more expensive than copper
CuCu
Cu oxide
coatingCu
SAM
etch
Adhesive
Cu
SAM coating
Bare Cu
Cured Adhesive
R2i2 – Connecting Research to Industry 4
Functional Printed Copper Circuits Conductive adhesive enables
combined circuit fabrication and component attachment
Functional test circuits have been demonstrated Stencil printing Surface mount component
placement Thermal cure (150oC,
Argon atmosphere) Low curing temperature of
resin enables low cost plastic substrate usage
Glass substrate
Thermal Cure
Stencil print copper paste on substrate
Place components into uncured paste
Functional circuit
stencil
blade
pasteCu paste deposit
R2i2 – Connecting Research to Industry 5
Conclusion
Proof of concept has been demonstrated Repeatable powder preparation method developed Seeking partners to scale up
We are seeking collaborations with: Adhesive suppliers / ink / paste formulation experts End users of the printed electronics technology Applications, testing, trials
Thank you for your attention [email protected]
R2i – Connecting Research to Industry
Complex Electrical Systems Research at WMG
Gunwant Dhadyalla
The University of Warwick
+44(0) 2476 575940
Promoting capability and track record in the area of Automotive Complex Electrical Systems research
R2i – Connecting Research to Industry
The Challenge – System Complexity
• Complexity at many different levels
• 80% to 90% of vehicle innovations via embedded systems
• 50% to 70% of development costs embedded systems related
• Wiring
– 50kg+
– 750+ wires
– 1.5km long
Premium car 100 million lines of code
Boeing 787 6.5 million lines of code
Boeing 777 4 million lines of code
F-35 Joint Strike 5.7 million lines of code
F-22 Raptor 1.7 million lines of code
R2i – Connecting Research to Industry
• Robustness of Electrical and Embedded systems – hardware and software
– Design
– Validation
• The future - Smart and Connected
– Communication and control
• Intra-vehicle
• Inter-vehicle
• Vehicle to ‘X’
– Contactless power transfer for HEV / EV (charging)
Research facilities and opportunities
R2i – Connecting Research to Industry
Track record, capability and research fit
EVoCS (2005 – 2010)
£10M Electrical project (TSB)
JLR, Qinetiq, add2
HVM Catapult (2011 – )
Self Healing Vehicle (2009 – 2011)
£600k (EPSRC)
JLR, IBM, Autotext
Non-Functional Testing (2011 – )
Industry funded
Low voltage testing
Automated testing
Hardware-in-the-loop
Automated data analysis
High voltage architectures
Hardware-in-the-loop
Wireless networks & charging
Classification Trees
Combinatorial Testing
Sequence Testing
Statistical data analysis
Expert systems
DNA Sequencing
TRL 9
TRL 1
Catapult Driven Collaborative R&D
TSB, ERDF, FP7, RGF
50% Industry Funding
3-24 month
University Driven Basic Research
RCUK
0-50% Industry Funding
24-60 month
Industry Driven Consultancy
Direct Funding
50-100% Industry Funding
0-3 month
PI Led Research Fellow
EngD/PhD
PM Led Project Engineer
Research Fellow
Basic Technology Research
Feasibility Study
Technology Development
Technology Demonstration
System Development
System Test
WMG/Catapult Operations
TRL 7
TRL 5
TRL 3
WMG Staffing Technology Readiness Level
R2i – Connecting Research to Industry
• WMG driven by impact to industry and academic excellence
• Real world usage / conditions
• Industry / academic collaboration
– One to one
– One to many
– Many to many
• Transferrable capabilities - Automotive, Aerospace, Rail, Marine, Yellow Goods
• UK – TSB, AMSCI, EPSRC
• Directly funded research
• Invitations to join EU consortiums
– Horizon 2020 announced
What is being sought?
R2i – Connecting Research to Industry
Computer Simulation on Electromigration
Xiaoxin Zhu
PhD student
University of GreenwichSchool of Computing and Mathematical Sciences, University of Greenwich, 30
Park Row, London SE10 9LS, UK
Email: [email protected]
Telephone: +44 (0)20 8331 8761
• Mass migration in electronic component structures
• Design for Reliability
• Multi-disciplinary research
R2i – Connecting Research to Industry
� Electro-migration (EM): EM causes void generation or open circuit at the
cathode and extrusion or hillock at the anode.
� Research Objectives:
� Develop a tool to numerically simulate EM
� Understand influences of Electro-Migration, Thermo-Migration and Stress-
Migration on void formation
� Use tool to optimize design of electronics devices and prolong their life
Research Challenges
R2i – Connecting Research to Industry
Business Case
• ITRS Roadmap– Electromigration of solder joints will
become a more limiting factor.– must be addressed through
materials changes together with modeling.
R2i – Connecting Research to Industry
Current Status of Research• EM modelling is at TRL2-3
– Multi-physics models developed
– Number of papers published
– Best paper at ICEPT in China
R2i – Connecting Research to Industry
Future Work
• Complete PhD thesis (4th year)
• Future Research Funding
– Exploit modelling capability within Industry/Academia research project
– Bids being considered with EU and Asia partners
• Provide expertise to industry
– Ability to predict risk of mass migration for new device designs
– Support design for reliability methodology
Thank you for your attentionAny Questions?
Speakers:
1. Harrison: Development of Textiles for Electrical EnergyGeneration and Storage
2. Li: Resistance switching device with applications insensors and adaptable circuits
3. Somjit: 3D Microwave and Millimetre-waveSystem-on-Substrate using RF MEMS Components
4. Hutt: Copper Filled Adhesive Pastes for PrintedElectronics Applications
5. Dhadyalla: Complex Electrical Systems Research at WMG
6. Zhu: Computer Simulation on Electromigration