R1114x SERIES
LOW NOISE 150mA LDO REGULATOR NO.EA-094-111026
1
OUTLINE The R1114x Series are CMOS-based voltage regulator ICs with high output voltage accuracy, low supply
current, low ON-resistance, and high ripple rejection. Each of these ICs consists of a voltage reference unit, an error amplifier, resistor-net for voltage setting, a current limit circuit, and a chip enable circuit.
These ICs perform with low dropout voltage and a chip enable function. The line transient response and load transient response of the R1114x Series are excellent, thus these ICs are very suitable for the power supply for hand-held communication equipment.
The output voltage of these ICs is fixed with high accuracy. Since the packages for these ICs are SOT-23-5, SC-82AB, and SON1612-6 therefore high density mounting of the ICs on boards is possible.
FEATURES • Supply Current ..................................................................... Typ. 75μA • Standby Mode ...................................................................... Typ. 0.1μA • Dropout Voltage ................................................................... Typ. 0.22V (IOUT=150mA 3.0V Output type) • Ripple Rejection................................................................... Typ. 70dB (f=1kHz 3.0V Output type)
Typ. 60dB (f=10kHz) • Temperature-Drift Coefficient of Output Voltage .................. Typ. ±100ppm/°C • Line Regulation .................................................................... Typ. 0.02%/V • Output Voltage Range.......................................................... 1.5V to 4.0V (0.1V steps) (For other voltages, please refer to MARK INFORMATIONS.) • Output Voltage Accuracy...................................................... ±2.0% • Packages ............................................................................ SON1612-6, SC-82AB, SOT-23-5
• Built-in Fold Back Protection Circuit .................................... Typ. 40mA (Current at short mode) • Ceramic capacitors are recommended to be used with this IC ... CIN=COUT=1μF (VOUT<2.5V) CIN=1μF, COUT=0.47μF (VOUT > = 2.5V)
APPLICATIONS • Power source for portable communication equipment. • Power source for electrical appliances such as cameras, VCRs and camcorders. • Power source for battery-powered equipment.
R1114x
2
BLOCK DIAGRAMS
R1114xxx1A R1114xxx1B
Vref
Current Limit
VDD
1 5
23
VOUT
GNDCE
VOUT
GND
VDD
CE
Vref
Current Limit
+
-
R1114xxx1D
VOUT
GND
VDD
CE
Vref
Current Limit
+
-
R1114x
3
SELECTION GUIDE The output voltage, auto discharge function, package, and the taping type, etc. for the ICs can be selected at
the user’s request.
Product Name Package Quantity per Reel Pb Free Halogen Free
R1114Dxx1∗-TR-FE SON1612-6 4,000 pcs Yes Yes
R1114Qxx1∗-TR-FE SC-82AB 3,000 pcs Yes Yes
R1114Nxx1∗-TR-FE SOT-23-5 3,000 pcs Yes Yes
xx : The output voltage can be designated in the range from 1.5V(15) to 4.0V(40) in 0.1V steps. (For other voltages, please refer to MARK INFORMATIONS.)
∗ : CE pin polarity and auto discharge function at off state are options as follows. (A) "L" active, without auto discharge function at off state (B) "H" active, without auto discharge function at off state (D) "H" active, with auto discharge function at off state
R1114x
4
PIN CONFIGURATION SON1612-6 SC-82AB SOT-23-5
1 2 3
6 5 4
1 2
34
(mark side)
1
4 5
2 3
(mark side)
PIN DESCRIPTIONS • R1114D
Pin No. Symbol Description 1 VDD Input Pin
2 GND Ground Pin
3 VOUT Output pin
4 NC No Connection
5 GND Ground Pin
6 CE or CE Chip Enable Pin
• R1114Q
Pin No. Symbol Description 1 CE or CE Chip Enable Pin
2 GND Ground Pin
3 VOUT Output pin
4 VDD Input Pin
• R1114N
Pin No. Symbol Description 1 VDD Input Pin
2 GND Ground Pin
3 CE or CE Chip Enable Pin
4 NC No Connection
5 VOUT Output pin
R1114x
5
ABSOLUTE MAXIMUM RATINGS
Symbol Item Rating Unit VIN Input Voltage 6.5 V
VCE Input Voltage ( CE or CE Pin) 6.5 V
VOUT Output Voltage −0.3~VIN+0.3 V
IOUT Output Current 200 mA
Power Dissipation (SON1612-6) ∗ 500
Power Dissipation (SC-82AB) ∗ 380 PD
Power Dissipation (SOT-23-5) ∗ 420
mW
Topt Operating Temperature Range −40~85 °C
Tstg Storage Temperature Range −55~125 °C ∗) For Power Dissipation, please refer to PACKAGE INFORMATION.
ABSOLUTE MAXIMUM RATINGS
Electronic and mechanical stress momentarily exceeded absolute maximum ratings may cause the permanent damages and may degrade the life time and safety for both device and system using the device in the field. The functional operation at or over these absolute maximum ratings is not assured.
RECOMMENDED OPERATING CONDITIONS (ELECTRICAL CHARACTERISTICS)
All of electronic equipment should be designed that the mounted semiconductor devices operate within the recommended operating conditions. The semiconductor devices cannot operate normally over the recommended operating conditions, even if when they are used over such conditions by momentary electronic noise or surge. And the semiconductor devices may receive serious damage when they continue to operate over the recommended operating conditions.
R1114x
6
ELECTRICAL CHARACTERISTICS • R1114xxx1A
Topt=25°C
Symbol Item Conditions Min. Typ. Max. Unit
VOUT Output Voltage VIN = Set VOUT+1V 1mA < = IOUT < = 30mA ×0.980 ×1.020 V
IOUT Output Current VIN−VOUT = 1.0V 150 mA
ΔVOUT/ΔIOUT Load Regulation VIN = Set VOUT+1V 1mA < = IOUT < = 150mA 22 40 mV
VDIF Dropout Voltage Refer to the ELECTRICAL CHARACTERISTICS by OUTPUT VOLTAGE
ISS Supply Current VIN = Set VOUT+1V, IOUT = 0mA 75 95 μA
Istandby Supply Current (Standby)
VIN = Set VOUT+1V VCE = VDD 0.1 1.0 μA
ΔVOUT/ΔVIN Line Regulation
VOUT > 1.7V, Set VOUT+0.5V < = VIN < = 6.0V (VOUT < = 1.7V, 2.2V ≤ VIN < = 6.0V) IOUT = 30mA
0.02 0.10 %/V
RR Ripple Rejection
f=1kHz f=10kHz Ripple 0.5Vp−p VOUT > 1.7V, VIN−VOUT = 1.0V VOUT < = 1.7, VIN−VOUT = 1.2V IOUT = 30mA
70 60
dB
VIN Input Voltage 2.0 6.0 V
ΔVOUT/ ΔTopt
Output Voltage Temperature Coefficient
IOUT = 30mA −40°C < = Topt < = 85°C ±100 ppm
/°C ISC Short Current Limit VOUT = 0V 40 mA
RPU CE Pull-up Resistance 0.7 2.0 8.0 MΩ
VCEH CE Input Voltage “H” 1.5 6.0 V
VCEL CE Input Voltage “L” 0.0 0.3 V
en Output Noise BW = 10Hz to 100kHz 30 μVrms
R1114x
7
• R1114xxx1B/D Topt=25°C
Symbol Item Conditions Min. Typ. Max. Unit
VOUT Output Voltage VIN = Set VOUT+1V 1mA < = IOUT < = 30mA ×0.980 ×1.020 V
IOUT Output Current VIN−VOUT = 1.0V 150 mA
ΔVOUT/ΔIOUT Load Regulation VIN = Set VOUT+1V 1mA < = IOUT < = 150mA 22 40 mV
VDIF Dropout Voltage Refer to the ELECTRICAL CHARACTERISTICS by OUTPUT VOLTAGE
ISS Supply Current VIN = Set VOUT+1V, IOUT = 0mA 75 95 μA
Istandby Supply Current (Standby) VIN = Set VOUT+1V VCE = GND 0.1 1.0 μA
ΔVOUT/ΔVIN Line Regulation
VOUT > 1.7V, Set VOUT+0.5V < = VIN < = 6.0V (VOUT < = 1.7V, 2.2V ≤ VIN < = 6.0V) IOUT = 30mA
0.02 0.10 %/V
RR Ripple Rejection
f=1kHz f=10kHz Ripple 0.5Vp−p VOUT > 1.7V, VIN−VOUT = 1.0V VOUT < = 1.7, VIN−VOUT = 1.2V IOUT = 30mA
70 60
dB
VIN Input Voltage 2.0 6.0 V
ΔVOUT/ ΔTopt
Output Voltage Temperature Coefficient
IOUT = 30mA −40°C < = Topt < = 85°C ±100 ppm
/°C ISC Short Current Limit VOUT = 0V 40 mA
RPD CE Pull-down Resistance 0.7 2.0 8.0 MΩ
VCEH CE Input Voltage “H” 1.5 6.0 V
VCEL CE Input Voltage “L” 0.0 0.3 V
en Output Noise BW = 10Hz to 100kHz 30 μVrms
RLOW On Resistance of Nch for auto-discharge (Only for D version)
VCE = 0V 60 Ω
R1114x
8
• ELECTRICAL CHARACTERISTICS by OUTPUT VOLTAGE Topt = 25°C
Dropout Voltage VDIF (V) Output Voltage VOUT (V)
Condition Typ. Max.
VOUT = 1.5 0.38 0.70
VOUT = 1.6 0.36 0.65
VOUT = 1.7 0.34 0.60
1.8 < = VOUT < = 2.0 0.32 0.55
2.1 < = VOUT < = 2.7 0.28 0.50
2.8 < = VOUT < = 4.0
IOUT = 150mA
0.22 0.35
TECHNICAL NOTES When using these ICs, consider the following points:
Phase Compensation In these ICs, phase compensation is made for securing stable operation even if the load current is varied. For
this purpose, use a capacitor COUT with good frequency characteristics and ESR (Equivalent Series Resistance). (Note: If additional ceramic capacitors are connected with parallel to the output pin with an output capacitor for phase compensation, the operation might be unstable. Because of this, test these ICs with as same external components as ones to be used on the PCB.)
PCB Layout Make VDD and GND lines sufficient. If their impedance is high, noise pickup or unstable operation may result.
Connect a capacitor with a capacitance value as much as 1.0μF or more between VDD and GND pin, and as close as possible to the pins.
Set external components, especially the output capacitor, as close as possible to the ICs, and make wiring as short as possible.
R1114x
9
TEST CIRCUITS
CE
VOUTOUT
GND
1.0μF 1.0μF
VDDIN R1114xxx1B/D
SERIESIOUT
CE
VOUTOUT
GND
1.0μF 1.0μF
VDDIN R1114xxx1B/D
SERIESISS
Fig.1 Standard test Circuit Fig.2 Supply Current Test Circuit
CE
VOUTOUT
GND
1.0μF
VDDIN R1114xxx1B/D
SERIESIOUT
P.G.
CE
VOUTOUT
GNDI1 I2
1.0�F 1.0μF
VDDIN R1114xxx1B/D
SERIES
Fig.3 Ripple Rejection, Line Transient Fig.4 Load Transient Response Test Circuit Response Test Circuit
R1114x
10
TYPICAL APPLICATIONS
R1114Nxx1ASERIES VOUT OUTIN VDD
GND
CE
Cap.Cap.
+ +
R1114xxx1BSERIES VOUT OUTIN VDD
GND
CE
Cap.Cap.
+ +
(External Components) Output Capacitor; Ceramic 0.47μF (Set Output Voltage in the range from 2.5 to 4.0V) Ceramic 1.0μF (Set Output Voltage in the range from 1.5 to 2.4V) Input Capacitor; Ceramic 1.0μF
TYPICAL CHARACTERISTICS 1) Output Voltage vs. Output Current (Topt=25°C)
R1114x151x R1114x281x
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0.0
Output Current IOUT(mA)
Out
put V
olta
ge V
OU
T(V
)
0 400300200100
2.5V
1.8V
2.0V
VIN=3.5V
3.0
2.5
2.0
1.5
1.0
0.5
0.0
Output Current IOUT(mA)
Out
put V
olta
ge V
OU
T(V
)
0 400300200100
3.5V3.8V
3.1V
VIN=4.8V
R1114x401x
4.5
3.5
4.0
3.0
2.0
2.5
1.5
1.00.5
0.0
Output Current IOUT(mA)
Out
put V
olta
ge V
OU
T(V
)
0 400300200100
4.5V5.0V
4.3V
VIN=6.0V
R1114x
11
2) Output Voltage vs. Input Voltage (Topt=25°C)
R1114x151x R1114x281x
1.7
1.3
1.4
1.5
1.6
1.1
1.2
1.0
Input Voltage VIN(V)
Out
put V
olta
ge V
OU
T(V)
1 64 532
IOUT=1mA
IOUT=30mA
IOUT=50mA
2.92.8
2.72.6
2.52.4
2.3
2.2
2.1
2.02 6543
Input Voltage VIN(V)
Out
put V
olta
ge V
OU
T(V)
IOUT=1mA
IOUT=30mA
IOUT=50mA
R1114x401x
4.2
4.0
3.6
3.2
3.8
3.4
3.021 6543
Input Voltage VIN(V)
Out
put V
olta
ge V
OU
T(V
) IOUT=1mA
IOUT=30mA
IOUT=50mA
3) Supply Current vs. Input Voltage (Topt=25°C)
R1114x151x R1114x281x
7060
90
80
5040
302010
0
Sup
ply
Cur
rent
ISS(μ
A)
210 6543
Input Voltage VIN(V)
70
60
90
80
50403020
10
0210 6543
Supp
ly C
urre
nt IS
S(μA
)
Input Voltage VIN(V)
R1114x
12
R1114x401x
70
60
90
80
50403020
10
0210 6543
Supp
ly C
urre
nt IS
S(μA
)
Input Voltage VIN(V) 4) Output Voltage vs. Temperature
R1114x151x R1114x281x
1.53
1.52
1.51
1.50
1.49
1.48
1.47
1.46
Temperature Topt(°C)
Out
put V
olta
ge V
OU
T(V)
10-15-40 856035
2.86
2.80
2.78
2.76
2.84
2.82
2.7410-15-40 856035
Temperature Topt(°C)
Out
put V
olta
ge V
OU
T(V)
R1114x401x
4.08
4.06
4.04
4.02
4.00
3.98
3.96
3.94
3.9210-15-40 856035
Temperature Topt(°C)
Out
put V
olta
ge V
OU
T(V)
R1114x
13
5) Supply Current vs. Temperature
R1114x151x R1114x281x
90
80
7060
5040
30
20
10
0
Temperature Topt(°C)
Supp
ly C
urre
nt IS
S(μA
)
10-15-40 856035
90
80
7060
5040
30
20
100
Supp
ly C
urre
nt IS
S(μA
)
10-15-40 856035
Temperature Topt(°C) R1114x401x
90
80
7060
5040
30
20
100
10-15-40 856035
Supp
ly C
urre
nt IS
S(μA
)
Temperature Topt(°C) 6) Dropout Voltage vs. Temperature
R1114x151x R1114x161x
0.6
0.5
0.4
0.3
0.2
0.1
0.0
Output Current IOUT(mA)
Dro
pout
Vol
tage
VD
IF(V
)
50250 15012510075
85°C 25°C-40°C
0.6
0.5
0.4
0.3
0.2
0.1
0.050250 15012510075
Output Current IOUT(mA)
Dro
pout
Vol
tage
VD
IF(V
) 85°C 25°C-40°C
R1114x
14
R1114x171x R1114x181x
0.6
0.5
0.4
0.3
0.2
0.1
0.050250 15012510075
Output Current IOUT(mA)
Dro
pout
Vol
tage
VD
IF(V
) 85°C 25°C-40°C
0.6
0.5
0.4
0.3
0.2
0.1
0.050250 15012510075
Output Current IOUT(mA)
Dro
pout
Vol
tage
VD
IF(V
) 85°C 25°C-40°C
R1114x211x R1114x281x
0.40
0.35
0.30
0.25
0.20
0.15
0.10
0.05
0.0050250 15012510075
Output Current IOUT(mA)
Dro
pout
Vol
tage
VD
IF(V
) 85°C 25°C-40°C
0.40
0.35
0.30
0.25
0.20
0.15
0.10
0.05
0.0050250 15012510075
Output Current IOUT(mA)
Dro
pout
Vol
tage
VD
IF(V
) 85°C 25°C-40°C
R1114x401x
0.40
0.35
0.30
0.25
0.20
0.15
0.10
0.05
0.0050250 15012510075
Output Current IOUT(mA)
Dro
pout
Vol
tage
VD
IF(V
) 85°C 25°C-40°C
R1114x
15
7) Dropout Voltage vs. Set Output Voltage (Topt=25°C)
0.60
0.40
0.50
0.20
0.10
0.30
0.00
Set Output Voltage VREG(V)
Dro
pout
Vol
tage
VD
IF(V
)
2.01.51.0 4.03.53.02.5
10mA30mA50mA150mA
8) Ripple Rejection vs. Input Bias Voltage (Topt=25°C, CIN=none, COUT=ceramic0.47μF)
R1114x281x R1114x281x
90
7080
5060
3040
1020
0
Input Voltage VIN(V)
Ripple 0.2Vp-p, IOUT=1mA
Rip
ple
Rej
ectio
n R
R(d
B)
3.02.9 3.33.23.1
f=1kHzf=10kHzf=100kHz
90
7080
5060
3040
1020
0
Ripple 0.5Vp-p, IOUT=1mA
3.02.9 3.33.23.1
Input Voltage VIN(V)
Rip
ple
Rej
ectio
n R
R(d
B)
f=1kHzf=10kHzf=100kHz
R1114x281x R1114x281x
90
7080
5060
3040
1020
0
Ripple 0.2Vp-p, IOUT=30mA
3.02.9 3.33.23.1
Input Voltage VIN(V)
Rip
ple
Rej
ectio
n R
R(d
B)
f=1kHzf=10kHzf=100kHz
90
7080
5060
3040
1020
0
Ripple 0.5Vp-p, IOUT=30mA
3.02.9 3.33.23.1
Input Voltage VIN(V)
Rip
ple
Rej
ectio
n R
R(d
B)
f=1kHzf=10kHzf=100kHz
R1114x
16
R1114x281x R1114x281x
90
7080
5060
3040
1020
0
Ripple 0.2Vp-p, IOUT=50mA
3.02.9 3.33.23.1
Input Voltage VIN(V)
Rip
ple
Rej
ectio
n R
R(d
B)
f=1kHzf=10kHzf=100kHz
90
7080
5060
3040
1020
0
Ripple 0.5Vp-p, IOUT=50mA
3.02.9 3.33.23.1
Input Voltage VIN(V)
Rip
ple
Rej
ectio
n R
R(d
B) f=1kHz
f=10kHzf=100kHz
9) Ripple Rejection vs. Frequency (CIN=none)
R1114x151x R1114x151x
90
7080
5060
3040
1020
0
Frequency f(kHz)
VIN=2.5VDC+0.5Vp-p,COUT=Ceramic 1.0μF
10.1 10010
Rip
ple
Rej
ectio
n R
R(d
B)
IOUT=1mAIOUT=30mAIOUT=50mA
90
7080
5060
3040
1020
0
VIN=2.5VDC+0.5Vp-p,COUT=Ceramic 2.2μF
10.1 10010Frequency f(kHz)
Rip
ple
Rej
ectio
n R
R(d
B)
IOUT=1mAIOUT=30mAIOUT=50mA
R1114x281x R1114x281x
90
7080
5060
3040
1020
0
VIN=3.8VDC+0.5Vp-p,COUT=Ceramic 0.47μF
10.1 10010Frequency f(kHz)
Rip
ple
Rej
ectio
n R
R(d
B)
IOUT=1mAIOUT=30mAIOUT=50mA
90
7080
5060
3040
1020
0
VIN=3.8VDC+0.5Vp-p,COUT=Ceramic 1.0μF
10.1 10010Frequency f(kHz)
Rip
ple
Rej
ectio
n R
R(d
B)
IOUT=1mAIOUT=30mAIOUT=50mA
R1114x
17
R1114x401x R1114x401x
90
7080
5060
3040
1020
0
VIN=5.0VDC+0.5Vp-p,COUT=Ceramic 0.47μF
10.1 10010Frequency f(kHz)
Rip
ple
Rej
ectio
n R
R(d
B)
IOUT=1mAIOUT=30mAIOUT=50mA
90
7080
5060
3040
1020
0
VIN=5.0VDC+0.5Vp-p,COUT=Ceramic 1.0μF
10.1 10010Frequency f(kHz)
Rip
ple
Rej
ectio
n R
R(d
B)
IOUT=1mAIOUT=30mAIOUT=50mA
10) Input Transient Response (IOUT=30mA, CIN=none, tr=tf=5μs, COUT=Ceramic 0.47μF)
R1114x151x 1.55
1.54
1.53
1.52
1.51
1.50
1.49
4
3
2
1
0
Time T(μs)
Out
put V
olta
ge V
OU
T(V)
Inpu
t Vol
tage
VIN
(V)
100 20 40 50 60 70 80 90 10030
Input Voltage
Output Voltage
R1114x281x 2.85
2.84
2.83
2.82
2.81
2.80
2.79
6
5
4
3
2
1
0100 20 40 50 60 70 80 90 10030
Time T(μs)
Out
put V
olta
ge V
OU
T(V)
Inpu
t Vol
tage
VIN
(V)
Input Voltage
Output Voltage
R1114x
18
11) Load Transient Response (tr=tf=0.5μs, CIN=Ceramic 1.0μF)
R1114x151x VIN=2.5V, COUT=Ceramic 1.0μF
1.75
1.70
1.65
1.60
1.55
1.50
1.45
150
100
50
0
Out
put C
urre
nt IO
UT(
mA)
20 4 8 10 12 14 16 18 206Time T(μs)
Out
put V
olta
ge V
OU
T(V)
Output Current
Output Voltage
R1114x151x VIN=2.5V, COUT=Ceramic 2.2μF
1.75
1.70
1.65
1.60
1.55
1.50
1.45
150
100
50
0
20 4 8 10 12 14 16 18 206
Out
put C
urre
nt IO
UT(
mA)
Time T(μs)
Out
put V
olta
ge V
OU
T(V)
Output Current
Output Voltage
R1114x281x VIN=3.8V, COUT=Ceramic 0.47μF
3.05
3.00
2.95
2.90
2.85
2.80
2.75
150
100
50
0
20 4 8 10 12 14 16 18 206
Out
put C
urre
nt IO
UT(
mA)
Time T(μs)
Out
put V
olta
ge V
OU
T(V)
Output Current
Output Voltage
R1114x
19
R1114x281x VIN=3.8V, COUT=Ceramic 1.0μF
3.05
3.00
2.95
2.90
2.85
2.80
2.75
150
100
50
0
20 4 8 10 12 14 16 18 206
Out
put C
urre
nt IO
UT(
mA)
Time T(μs)
Out
put V
olta
ge V
OU
T(V)
Output Current
Output Voltage
R1114x281x VIN=3.8V, COUT=Ceramic 2.2μF
3.05
3.00
2.95
2.90
2.85
2.80
2.75
150
100
50
0
20 4 8 10 12 14 16 18 206O
utpu
t Cur
rent
IOU
T(m
A)
Time T(μs)
Out
put V
olta
ge V
OU
T(V)
Output Current
Output Voltage
12) Turn-on/off speed with CE pin (D version)
R1114x151D (VIN=2.5V, CIN=Ceramic 1.0μF, COUT=Ceramic 1.0μF)
4
0
1
2
3
6
2
3
0
1
4
5
Time T(μs)
CE
Inpu
t Vol
tage
VC
E(V)
Out
put V
olta
ge V
OU
T(V)
50-5 2510 15 20
VIN
IOUT= 0mAIOUT= 30mAIOUT= 150mA
4
0
1
2
3
6
2
3
0
1
4
5
500-50 450100 150 200250 300 350 400Time T(μs)
CE
Inpu
t Vol
tage
VC
E(V)
Out
put V
olta
ge V
OU
T(V)
VIN
IOUT= 0mAIOUT= 30mAIOUT= 150mA
R1114x
20
R1114x281D (VIN=3.8V, CIN=Ceramic 0.47μF, COUT=Ceramic 0.47μF)
4
0
-1
1
2
3
8
45
0
321
6
7
0 5 10 15 20 25-5Time T(μs)
CE
Inpu
t Vol
tage
VC
E(V
)
Out
put V
olta
ge V
OU
T(V
)
VIN
IOUT= 0mAIOUT= 30mAIOUT= 150mA
4
0
-1
1
2
3
8
45
0
321
6
7
0 20 40 60 80 120100 140160180-20Time T(μs)
CE
Inpu
t Vol
tage
VC
E(V)
Out
put V
olta
ge V
OU
T(V)
VIN
IOUT= 0mAIOUT= 30mAIOUT= 150mA
R1114x401D (VIN=5.0V, CIN=Ceramic 0.47μF, COUT=Ceramic 0.47μF)
8
6
4
2
0
-2
14
12
10
8
6
4
2
0
-20 5 10 15 20 25-5
Time T(μs)
CE
Inpu
t Vol
tage
VC
E(V)
Out
put V
olta
ge V
OU
T(V)
VIN
IOUT= 0mAIOUT= 30mAIOUT= 150mA
8
6
4
2
0
-2
14
12
10
8
6
4
2
0
-20 20 40 60 80 100 120 140 160 180-20
Time T(μs)
CE
Inpu
t Vol
tage
VC
E(V)
Out
put V
olta
ge V
OU
T(V)VIN
IOUT= 0mAIOUT= 30mAIOUT= 150mA
R1114x
21
ESR vs. Output Current When using these ICs, consider the following points: In these ICs, phase compensation is made for securing stable operation even if the load current is varied. For
this purpose, use a capacitor COUT with good frequency characteristics and ESR (Equivalent Series Resistance) of which is in the range described as follows:
GND
VOUTCE
VIN
VINIOUT
ESR
R1114xxx1B/DS.A.
CeramicCap.
CeramicCap.
SpectrumAnalyzer
Measuring Circuit for white noise; R1114xxx1B/D
The relations between IOUT (Output Current) and ESR of an output capacitor are shown below. The conditions when the white noise level is under 40μV (Avg.) are marked as the hatched area in the graph. (Note: If additional ceramic capacitors are connected to the Output Pin with Output capacitor for phase compensation, the operation might be unstable. Because of this, test these ICs with as same external components as ones to be used on the PCB.)
<Measurement conditions> (1) VIN=VOUT+1V (2) Frequency Band: 10Hz to 2MHz (3) Temperature: −40°C to 25°C R1114x151x R1114x161x
100
10
1
0.1
0.01
Load Current IOUT (mA)0 6030 150120
ES
R (Ω
)
90
CIN=Ceramic 1.0μF,COUT=Ceramic 1.0μF
100
10
1
0.1
0.01
Load Current IOUT (mA)0 6030 150120
ES
R (Ω
)
90
CIN=Ceramic 0.47μF,COUT=Ceramic 0.68μF
R1114x
22
R1114x211x R1114x281x
100
10
1
0.1
0.01
Load Current IOUT (mA)0 6030 150120
ES
R (Ω
)
90
CIN=Ceramic 0.47μF,COUT=Ceramic 0.47μF
100
10
1
0.1
0.01
Load Current IOUT (mA)0 6030 150120
ES
R (Ω
)90
CIN=Ceramic 0.47μF,COUT=Ceramic 0.47μF
Ricoh is committed to reducing the environmental loading materials in electrical deviceswith a view to contributing to the protection of human health and the environment. Ricoh has been providing RoHS compliant products since April 1, 2006 and Halogen-free products since April 1, 2012.Halogen Free
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1. The products and the product specifications described in this document are subject to change or discontinuation of production without notice for reasons such as improvement. Therefore, before deciding to use the products, please refer to Ricoh sales representatives for the latest information thereon.
2. The materials in this document may not be copied or otherwise reproduced in whole or in part without prior written consent of Ricoh.
3. Please be sure to take any necessary formalities under relevant laws or regulations before exporting or otherwise taking out of your country the products or the technical information described herein.
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5. The products listed in this document are intended and designed for use as general electronic components in standard applications (office equipment, telecommunication equipment, measuring instruments, consumer electronic products, amusement equipment etc.). Those customers intending to use a product in an application requiring extreme quality and reliability, for example, in a highly specific application where the failure or misoperation of the product could result in human injury or death (aircraft, spacevehicle, nuclear reactor control system, traffic control system, automotive and transportation equipment, combustion equipment, safety devices, life support system etc.) should first contact us.
6. We are making our continuous effort to improve the quality and reliability of our products, but semiconductor products are likely to fail with certain probability. In order to prevent any injury to persons or damages to property resulting from such failure, customers should be careful enough to incorporate safety measures in their design, such as redundancy feature, fire containment feature and fail-safe feature. We do not assume any liability or responsibility for any loss or damage arising from misuse or inappropriate use of the products.
7. Anti-radiation design is not implemented in the products described in this document. 8. The X-ray exposure can influence functions and characteristics of the products. Confirm the product functions and
characteristics in the evaluation stage. 9. WLCSP products should be used in light shielded environments. The light exposure can influence functions and
characteristics of the products under operation or storage. 10. There can be variation in the marking when different AOI (Automated Optical Inspection) equipment is used. In the
case of recognizing the marking characteristic with AOI, please contact Ricoh sales or our distributor before attempting to use AOI.
11. Please contact Ricoh sales representatives should you have any questions or comments concerning the products or the technical information.
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