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Glossary
AC PDP :Plasma d isplay driven by alternating current plasma electric discharge.
Address discharge(Reference : scan and da ta) :Term w ith two m eanings that can be used for both scan an d data (w rite or erase) discharge.
Address Electrode(Reference : scan and da ta electrode) :Term w ith two m eanings that can be used for both scan and data electrodes.
Address pulse(Reference : scan and da ta pu lse) :Add ress drive wav e form
Address voltage(reference; scan and da ta voltage) :Add ress drive amp litud e of vibration
Addressing :Process that gives authorization to cells to allow for turning on an d off by d rive wave form.
Addressing speed :Time necessary for writing and erasing.
ADS, address display separation :Drive tech th at separates add ress pulse temporarily from sustained voltage.
Aging :The change of operation expectancy- for example, operation voltage change and luminance decline-relatedcharacteristics.
Angular distribution :Characteristics w hich change as fun ction of an gles between perp endicularity and surface.referring to dependency on angles of, for example, luminance or chromaticity.
Aperture ratio :Referring to the ratio of an element activation area to the gross area.
Area luminance :Luminance measured in relatively large area.
10. Glossary
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Glossary
Barrier rib :barriers that cross all the gaps of wafers dividing the cells in panel.
Black stripe :black substance located in between the fluorescent areas to bring about improvement in contrast by reflec-tion ra tio decline. Generally, this is striped .
Bright defect :defects that occur wh en the image is rather br ight than accurate.
Brightness(Reference : luminance) :visible and subjective quality, for examp le, how bright matters look or how mu ch visible rays are per-ceived.Notice) Do not get confused lu minance with brightness because those tw o are not the same. Brightness issubjective w hile lum inance is objective.
Brun in :element's initial operat ion section that takes p lace un til the element stabilizes or the initial expectancy expi-
ration is d etected.
Bus electrode :aggregate of sustained electrodes that are bussed together.
Cathode electrode :cathod e electrified electrod e that releases electrod e from element . In AC plasm a panel, polarity sw itches inevery h alf a cycle.
Cell :capacity corresponding to each electric discharge. In general, it is defined by the shape of substrates andelectrodes bu t can be d efined by partitions.
Cell gap :
measuremen ts identifying the gap s between substrates.
Cell pitch :
measurement that identifies the cells from the surface of substrates. It varies depending on the direction ofrows and columns.
Charge transfer curves :curves expressing the quantity of electric charge that is transferred, as the function of drive wave formcharacteristics.(for examp le, voltage, time and others)
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Glossary
Color coordinates, CIE 1960 :Method for colors, know n as (u, v), where image colors are expressed in more even color dim ension. colorsof matter are expressed as color coord inates pair(u , v). Here, u=4X(X+15Y+32), y=6Y/ (X+15Y+32Z).
Color coordinates, CIE 1976
Method for colors, known as (u, v), where revised image colors are expressed in more even color dimen-sion. v is 1.5-fold of recommend ed v valu e of 1960. The color of mat ter is expressed a s color coord inatespair (u , v). Here, u =4X/ (X+15Y+3Z ) , v= 9Y/ ( X+15Y+3Z ).
Color coordinates , CIE 1976 CIELUV and CIELAB :
Three dimensional param eters expressing w ith u and v including against chromaticity and lumi-nance of standard wh ite light in display. Among the param eters, only CIELUV gets to have p roper colorspace where additional two blend light appears in line segment. (refer to CIE Publication 15.2, Colorimetry1st edition 1976, 2nd ed ition 1986)
Color depth :The number of digital bit alocated to each major color.
Color gamut :Physically realizable color sp ace area.
Color reproducibil ity (Refer to color gamu t) :The expression of realizable colors limited by color information d istinction or fluorescent su bstancechromaticity.
Color temperature, correlated (symbol CCT) :Seemingly temperatu re expressed w ith absolute temperatu re of black bod y rad iation w ith the closest chro-maticity. This can be expressed as CCT, in the form of C. S. McCamy. CCT=437N3+3601n2+5517, n=(x-0.3320)/ (0.1858-y) and x, y=color coord inates of CIE 1931.
Columm electrode :Vertically successive electrodes. It generally refers to data electrodes. When p anel is installed along the p ho-tograph , this can be arr anged along the horizontal direction.
Concurrent driving method :
Driving method to disperse add ress pu lse and scan p ulse at equal distance.
Contrast ratio Columm electrode :Ratio of wh ite luminance to black lum inance of image. This measurement h as man y p arameters, so mea-surers are required to explain the consideration for measurem ent to make u nd erstood the meaning of themeasuremen t. The p arameters of contrast ratio are as follows.
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Glossary
I Cm - Michelson contrast or contrast modu lation:Here, Lw is the lum inance of the color white while Lb is the lum inance of the color black.
I CT - Threshold contrast ratio: the minimum contrast ratio that is permissive, in general.
Chip on board(COB) :PCB with IC on substrate.
Dark defect :
Defects in the br ighter image realization than norm al one.
Data electrode :Electrodes allowed for controlling electric discharge by changing the cells state to sw itch on from off (andvise versa) in AC plasma p anel.
Data electrode driver :Driving circuit to be attached to dada electrode.
Data write pulse :Wave form for data electrode that switches from off to on.
Data erase pulse :Wave form for data electrode that switches from on to off.
DC PDP :Display panel wh ose plasma discharge is driven by direct current.
Decay time :Time required for parameters to drop from certain level to another. It can be time necessary for droppingfrom 90% to 10%, or to e-1 level of the initial value, or to certain irreversibility.
Dielectric layer :Dielectric layer with larger sustained electric constan t.
Discharge :1. neutra lization of electric charge (for examp le, voltage decrease of capacitor)2. electric cur rent flow in d ielectric media su ch as gas.
Discharge current :Discharge electric cur rent.
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Glossary
Displacement current :Electric current flow through capacitor that includes atomic rearrangement of discharge within electric mat-ter.
Di splay color number (color num ber possible to be displayed w ith other w ords.) :displayable individual color s nu mber.
Display D iagonal :Diagonal size of display contour
Display efficiency :The ratio of gloss outp ut d ivided by th e entire display power.
Display height :Height of display contour
Display scan electrode :(Refer to scan electrode)
Display width :Width of display contour
Displayed color :Refer to displayed color number.
Di splayed color number :Color num bers that can be made by d isplay.
Dot (Refer to cell, pixel and subp ixel) :The term is ha rd to be defined because it is not clear if the term refers to full color pixel or subp ixel. Theterm is used w hen referring to color related elements that m ake up full color pixel or subp ixel.
Dot pitch :(Ambigu ous expression. Refer to dot, cell pitch, pixel pitch and subp ixel pitch.)
Driving w aveform :Expressing change of driving signal voltage.
Driving scheme :Expressing th e though t ap plying d riving voltage to display.
Eff
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Glossary
Erase voltage :Erase pu lse voltage requ ired for era sing cells from AC p lasma p anel.[symbol : Ve]
Evacuating (Interchangeable terms : evacuation, exhaust) :Process where un wan ted gas is rid from d evice.
Exhaust tubulation (Interchangeable terms: exhaust tube, exhaust pipe) :Tube shap ed h ole in d evice connected to external vacuu m pu mp , for controlling the initiation from deviceduring process. This is usually glass tube that prevents with flannelet after filling proper gas
Filling gas (Refer to gas m ixture) :After removing air, plasma panel goes through filling with proper electric and optical gas. Therefore, panelgas comp osition is comm only called "filling gas".
Firing vo ltage :Minimum voltage where triggers discharge in plasma device[symbol : Vf]
Flicker :
Fast and instant changes in lum inance, perceivable in almost regu lar luminan ce experiment pattern.
Front substrate :
Substrates closer to the viewers, made of transparent material such as glass
Full color display :Full color image (for example, image with more than 8 bit color tone) realizable display
Fpc(Flexible Printed Curcuit) :Flexible substrates with circuited copper foil on polyimide
Gas mixing ratio (Interchangeable terms: gas mixture, gas composition) :Gas composition w ithin plasma device. It is usually expressed with ratio of the constituent gas.
Gas voltage (Interchangeable terms: gas break down voltage) :Voltage where electrode an d ion w ithin plasma device can generate add itional electrodes and ions.-Thus, increasing the electric current within the device sharply. (break down or overflowing)
Glass substrate :Substrates consisted of glass
Glow discharge :Plasma discharge taking place under pressure of tens of millimeter. This is defined by ionization generatedb i d l i d i h d l l i h d b i b b d
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Glossary
Image sticking :(Refer to Image reten tion.)
Interconnect pad groups :A group of connection terminals that attach to individu al connector. (also referred to as term inal block.)
Interconnect pad pitch :Mutu al measurements for ind ividu al of interconnect pad grou p.
Interconnect pad spacing :
The size of non-electric conductive area between individual terminal.
Inter-electrode gap :In Three electrodes plasma panel, the measurem ent of sustained voltage separated from outside d ischargespace.
Ion bombardment :The bombardment of energetic ions in the surface of solid matter. The transfer of kinetic energy toward sur-
face from ions can cause electron release, ion or neutron release and temperature change in surface.
Life time :Time during device exerts its function. Commonly known as mean time failure (MTTF).
Low melting point glass :Glass of which m elting poin t (temp eratu re with viscosity of 1014.5 poise) is relatively low.Since glass is non- crystalline, the word melting is not appropriate, but it gets more fluid as it becomes hot.
Luminance :Colloquial term for measurement of brightness of display.It also refers to display related CIE Y constituent. it is expressed by cd/ m2.
Luminance efficacy :It refers to gloss outpu t against the total d isplay consum ption p ower. It is calculated by the valuegenerated through dividing gloss output of wh ite substance with gross consum ption p ower. It isexpressed as lumen/ watt.
Luminance efficiency :Gloss outp ut v alue according to consum ption p ower increase, calculated by the value generated throughdividing gloss outp ut of wh ite substance with wh ite screen pow er consump tion increase against blackscreen. It is expressed as lum en/ watt.
L i l di
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Glossary
Memory margin :The disparity between the maximum sustained voltage for keeping discharge and the su stained v oltage fortu rning off the cells
Memory type PDP :Refer to AC Plasma Panel that h as mem ory. PDP mad e up of cells that keep tu rned on or off until switchoccurs.
MgO layer :In bombardment of electrons and ions, MgOs high electron release rate, like cathode application, makes it
easier to release electrons.
MgO protecting layer (Refer MgO layer) :MgO layer on fluorescent m aterial has second ary benefit that prevents fluorescent d egradation by ion bom-bardment.
Minimum f iring vo ltage :Minimum voltage that can turn on any cells.[symbol : V1]
Minimum sustain voltage :Minimum sustain voltage that keeps tu rned on cell on.[symbol : Vsm1]
Monochrome display Minimum sustain voltage :Display that only expresses a limited color such as white, green and amber.
Multi-color display :Display th at can express mu ltiple colors .if not all colors.
Non-discharge slit :(Refer to inter electrode gap)
Operating margin :AC PDP voltage range that keeps cells turn ed on or off. Generally, its value gets less than m emory m arginbecause of additional factors such as temperature effect, gloss ionization effect and waveform change.
Operating w indow :Actual voltage range that keeps cells turned on or off in any d rive levels and surrou nd ing environment.
Operating window degradation :Gradu al decline in operating w indow, according to operating time.
O d di h
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Glossary
Phosphor degradation :Grad ual d ecline in fluorescence efficiency accord ing to op erating exp ectancy.
Phosphor layer :Thin layer mad e up of phosph or. FluorescencPle substance must be thick enough to optimize transferringthe ultraviolet rays from plasma discharge to visible light
Pixel, picture element :The smallest un it that can d isplay the en tire range of lum inance and chromaticity. Generally, pixel consistsof sub p ixels (or dots).
Pixel arrangement :Expression of sub pixels within a p ixel.
Pixel count :The num ber of pixels that make u p a display. It is described as the n um ber of column pixels against thenu mber of row p ixels.
Pixel pitch :The distance between the centers of the two closest pixels. Move as far as the pitch and reach the identicallocation.
Plasma display :Electrically dr iven d isplay d evice for causing electric discharge in gas with in d evice. Electric energy gener-ates light with atomic light release or from proper colored fluorescence substance.
Positive column discharge :
The plasm a area for long glow d ischarge. This area is a low electric field bu t relatively electric cond uctiveplasma area.
Pre discharge :Cells state w here p re d ischarge is taking place. In this case, cells state becomes electric cond uctive d ue toformation of discharge generated by ionization process of gas.
Priming :
The stage wh ere ions are generated for form ing d ischarge. Generally, this is requ ired for injection.
Priming pulse :Electric waveform to define the proper conditions for the next cell discharge.[symbol : Pp]
Priming voltage :V l f i i l [ b l V ]
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Glossary
Reset :(Refer to erase.)
Reset discharge, Reset pulse :(Refer to erase.)
Resolution :Displays ability to enable to distingu ish the m atters close to each oth er. It is confusing with ad dressibilitythat generates pattern un distinguishable to the eyes.
Row electrodes :Horizontally successive electrodes. In terms of traditional drive concept, these are the sustained electrodes.If the panel is installed toward portrait, these row electrodes can be arranged horizontally.
Sand discharge :Process where grinding of surface occurs. It is used for making three dimensional surface in lithography orsilt in sheet.
Scan discharge :Discharge injected along the pair of sustained electrodes.
Scan electrode :Electrodes of the p air of sustained electrodes that inject d ischarge d ownw ard along the p anel colum ns.
Scan pulse :Waveform that injects discharge with new columns.Optic defects where scratches display over certain size.
Seal :Combining the substrates or substrate w ith ventilation tu be.
Seal layer :Material layer tha t prov ides the conn ection of substrates. This can be a single layer of solder glass (frit) orthe combination of solder glass and r ing.
Sealing :Process where free electrons th at get ou t of the sur face by extracting static electricity field w hen en ergeticelectrons or ions are limited to a surface.
Secondary electron emission :P h d di h d ll i f Thi ld b f i i i ff h
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Glossary
Space charge :Mutual repulsion caused by accumulation of electric charge of similar signal.
Stripe rib :Stripe shap ed partition structure. It follows p anel colum n direction.
Sub frame :(Refer to sub field)
Sub field :
A part of panel
Surface charge :It refers to the location of discharge in AS plasma panel where sustained electrodes are on the same surface.
Surface charge PDP :AS plasma pan el where sustained electrodes are on the same su rface.
Sustain :Discharge in AC plasma panel that keeps on or off until the cell is erased or written. Sustained electrodesare divided into bus (common electrodes) and add ressable electrodes.
Sustain driver :Circuit that drives sustained electrodes.
Sustain electrode :Electrodes d riven by AC voltage that p rovides plasma w ith energy m ajor p arts. This electrode is d riven by
enough waveform to keep d ischarge of turned on state. In tu rned off cell, trigger d ischarge d oes not takesplace.
Sustain magin :The disparity between sustained voltage that keeps turned on cells and sustained voltage that can turn offcells.
Sustain pulse :
Sustained drive w aveform[symbol : Ps]
Sustain vlotage :Voltage level of sustained waveformThermal compaction :Substrates successive density increase observed by substrates pattern contraction.
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Glossary
Tip pipe :(Refer to exhaust turbulation.)
Townsend discharge :Self susta ined p lasma d ischarge expressed by Townsend in 1901. This discharge requ ires 200v voltage.
Transparent electrode :Electrode made up of transparent electric conductive matter such as ITO.
Two eledtrode type :
Original AC plasma pan el used two electrodes that provid e not only sustained w aveform but also writeand erase waveform.
Ultraviolet ray :Ultraviolet light below 380nm in spectrum.
Vacuum ul traviolet :Ultraviolet ray of wavelength below 200nm.
Viewing angle :Vertical angle that can display the image. It is normally limited by the change in luminance and chromatici-ty.
Viewrable screen diagonal :Releasable screen d iagonal length measured between ou tmost p ixel edges
Viewrabel screen height :
Releasable screen height m easured between ou tmost p ixel edges
Viewrable screen width :Releasable screen wid th m easured betw een outm ost pixel edges.
Visible defect :Imperfection that prevents d isplaying w ith proper im age.
Wall charge :Pure accumulation of positive and negative charges in cell wall.
Wall charge erase pulse :Pulse that neutralizes wall charge
W ll h f
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Glossary
Write electrode :
(Refer to da ta electrode)[symbol : Pw]
Write electrode :
(Refer to d ata electrode)[symbol : Vw]
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Alignment and Adjustments
4. Alignment and Adjustments
4-1 Service Mode
4-1-1 SERVICE MODE ENTRY METHOD (General Transmitter)
1. Tur n off the pow er to make the SET STAND-BY mod e.
2. In order to enter the Service Mode, select MUTE-1-8-2-POWER.
In case entry into SERVICE MODE is unsu ccessful, repeat the p rocedu res above.
4-1-2 Initial DISPLAY State in times of SERVICE MODE Switch overs
4-1-2(A) OSD DISPLAY
4-1-2(B) BUTTONS OPERATIONS WITHIN SERVICE MODE
1. PW364A 9. CXA2101Q-2
2. VPC3230 10. PinP Control
3. SDA9400 11. OSD Position
4. SDA9280 12. Test Position5. AD9884-Video 13. Option Table
6. AD9884-PC 14.Reset
7. AD9884-DTV
8. CXA2101Q-1
Release Time :
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Alignment and Adjustments
4-1-3 Details of Control
-. Varies according to color system-. Varies according to input mode-. Varies according to Scart/RCA
4-1-3(A) PW364A
No OSD AV1(S-Video) AV2(S-Video) AV2 Component1 Component2 PC Remark
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
H Position
V Position
Red Gain
Green Gain
Blue Gain
Red offset
Green offset
Blue offset
APL on/off
High Light
Low Light
Shift Pixel
Test
Pixel Number
Shift Line
Time
35
34
140
140
140
90
90
90
1
140
90
On
0
4
4
4
120
120
120
140
140
140
1
120
140
On
0
4
4
4
120
120
120
140
140
140
1
120
140
Off
0
4
4
4
Mode 1 : AV1(Video)
AV2(S-Video)
AV2
Component1
Mode 2 : Component2
Mode 3 : PC
Doesnt operate in PC
Mode
Different input signal
White Balance, High Light, Low Light must be separately adjusted according to three modes shown below and be saved
to the data of each mode.
Mode 1 (adjust AD9884 to Video): AV1(Video), AV1(S-Video), AV2, Component1 identical Data
Mode 2 (adjust AD9884 to DTV): Component2
Mode 3 (adjust AD9884 to PC): PC
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Alignment and Adjustments
4-1-3(B) VPC3230
No OSD AV1(S-Video) AV2(S-Video) AV2 Component1 Component2 PC Remark
1
2
3
4
5
6
7
8
9
10
11
12
13
14
1516
CIP Bright
CIP Cont
IF Comp
Chroma Band
Ena Luma
HPLL Speed
Luma Delay
3230 Bright
3230 Contrast
H LPF Y/C
H LPF Chroma
H peaking
Coaring Off/On
CIP Sat Cb
CIP Sat CrCIP Tint
195
27
2
3
1
1
See attachment below
168
36
0
0
2
1
23(Scart Model) 42(RCA Model)
29(Scart Model) 42(RCA Model)
36
Different system and
input mode
Operate only in
Component1
Operate only in
Component1
Attachment: Initial data by Luma Delay Color System and input mode
AV1(Video)
5
6
6
6
6
5
AV1(S-Video)
5
5
7
7
7
5
AV2
5
6
4
4
4
5
Component1 Component2 PC
PAL
SECAM
NTSC4.43
NTSC3.58
PAL-M
PAL-N
-. Calls the data created before switching to
the above mode
-. As the above mode signals don't pass
through the VPC3230 Luma Delay loot,
they are not affected by the value of
Luma Delay.
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Alignment and Adjustments
4-1-3(C) SDA9400
No OSD AV1(S-Video) AV2(S-Video) AV2 Component1 Component2 PC Remark
1
2
3
4
5
6
SNR On
VCSNR On
HCSNR On
DTNR On
TNRCLY
TNRCNC
1
1
0
1
5
5
Same in all modes
4-1-3(D) SDA9280
No OSD AV1(S-Video) AV2(S-Video) AV2 Component1 Component2 PC Remark
1
2
3
4
5
6
7
8
CTI Thresh
CTI Trawid
Y-Delay
LPF Gain
BPF Gain
HPF Gain
Phacom
Cor
0
0
9
4
8
8
0
1
Scart = 11(Fix)
Same in all modes
Same in all modes
Y-Delay :
Scart model : 11(Fix) RCA model : 9 (Fix)
4-1-3(E) AD9884
No OSD
AV1(S-Video) AV2(S-Video)
AD9884-Video
AV2 Component1 Component2 PC
AD9884-DTV AD9884-PCRemark
Scart=Europe,
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Alignment and Adjustments
4-1-3(F) CXA2101-1
No OSD AV1(S-Video) AV2(S-Video) AV2 Component1 Component2 PC Remark
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
Sub Bright
Limit Level
System
D-Color
R Drive
G Drive
B Drive
R CutOff
G CutOff
B CutOff
ABL Mode
ABL TH
H Sep Sel.
Fix Sync.
V Time Con
H Width
HHD timi Con
51
0
1
1
32
32
32
32
32
32
0
0
0
0
1
1
0
55
0
1
1
32
32
32
32
32
32
0
0
0
0
1
1
0
51
0
1
1
32
32
32
32
32
32
0
0
0
0
1
1
0
Fixed after setting
picture quality
Component2 is
separate
Items that must be separately saved according to mode: Sub Bright, R Drive, G Drive, B Drive, R Cutoff, G Cutoff, B Cutoff
The items must be separately adjusted according to two modes shown below and be saved to the data of each mode.
(The initial value is fixed after setting picture quality.)
Mode 1 : AV1(Video), AV1(S-Video), AV2, Component1, PC
Mode 2 : Component2
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Alignment and Adjustments
4-1-3(G) CXA2101-2
No OSD AV1(S-Video) AV2(S-Video) AV2 Component1 Component2 PC Remark
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
HS Mask
Sub Cont
Sub Color
Sub Hue
Sub SHP
R-Y/R
R-Y/B
G-Y/R
G-Y/B
PABL Level
SHP FO
Pre/over
CTI Level
LTI Level
DC-Tran
D-Pic
Cr-Offset1
Cb-offset1
1
6
8
8
3
8
2
3
1
0
1
1
7
7
1
0
8
8
3
8
2
3
1
0
1
1
7
7
1
6
8
8
3
8
2
3
1
0
1
1
7
7
Must be separately
saved according to
color system and
input mode
See attachment below
Component2 is
separate
Items that must be separately saved according to mode: Sub Cont, R-Y/R, R-Y/B, G-Y/R, G-Y/B
The items must be separately adjusted according to three modes shown below and be saved to the data of each mode.
(The initial value is fixed after setting picture quality.) Mode 1: AV1(Video), AV1(S-Video), AV2, PC
Mode 2: Component1
Mode 3: Component2
Attachment : Items that must be separately saved according to Color System and Input Mode
Component2 is
separate
Adjusts and operates
only in Component2
AV1(Vid ) AV1(S Vid ) AV2 PC C t1 C t2
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Alignment and Adjustments
4-1-4 White Balance Adjust Method
1. Press MUTE-1-8-2-POWER to enter the factory mode.
2. Enter PW364.
3. Ad just LOW coordinates as R, G, OFFSET and HIGH coord inates as R, G, GAIN.(Blue is fixed)
4. Ad just LOW ligh t as Center Offset.
5. Adjust H IGH light as Gain Max.
6. Ad just fine as B-Offset an d B-Gain.
SCART MODEL : W/ B Adjustm ent SPEC(Suw on Factory Toshiba PATTERN)
VIDEO MODE
PC MODE
AdjustmentCoordinates
H-LIGHT
L-LIGHT
CoordinatesValue
x : 282
y : 296
Y : 24.5[f\]
x : 282
y : 296
Y : 0.95[f\]
AdjustmentDeviation
: 3
: 3
: 1
: 5
: 5
: 0.1
Adjustment
Coordinates
Coordinates
Value
Adjustment
Deviation
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Alignment and Adjustments
RCA0 MOD EL : W/ B Adjustm ent SPEC(Suwon Factory Toshiba PATTERN)
VIDEO MODE
Compon ent2(DTV) m ode
PC MODE
Adjustment
Coordinates
H-LIGHT
L-LIGHT
Coordinates
Value
x : 282
y : 296
Y : 25.5[f\]
x : 282
y : 296
Y : 0.95[f\]
Adjustment
Deviation
: 3
: 3
: 1
: 5
: 5
: 0.1
Adjustment Coordinates Adjustment
Adjustment
Coordinates
H-LIGHT
L-LIGHT
Coordinates
Value
x : 273y : 273
Y : 25.5[f\]
x : 273
y : 273
Y : 0.95[f\]
Adjustment
Deviation
: 3 : 3
: 1
: 5
: 5
: 0.1
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Alignment and Adjustments
al
H_
P 0 0 0 0 0 1 1 1 1 1 1 0 0
fO(Hz
)
70.1
85
75
72.8
59.9
85.1
75
72.2
60.3
56.3
85
75
70.1
60
V_
P 1 0 0 0 0 1 1 1 1 1 1 0 0
D
ot
_c
28
.232
36
.0
31
.5
31
.5
25
.175
5
6.2
5
49
.5
50
.0
40
.0
36
.0
94
.5
7
8.7
5
75
.000
65
.000
HS1Period
31
.777u/10
.1n=
314
6.2
=228
8.2
1
=264
0.2
9
=261
5.1
4
=314
6.2
3
=184
4.6
5
=211
2.1
7
=205
9.4
=261
3.8
6
=281
6.2
3
=144
1.6
8
=164
9.5
0
=175
3.1
6
=204
7.2
2
HFreqSec
/99=
31
.777
=23
.111
=26
.666
=26
.414
=31
.777
=18
.626
=21
.333
=20
.797
=26
.393
=28
.444
=14
.555
=16
.656
=17
.707
=20
.676
CLOCK/
PHASE
125/22/0/0
125/8/0/1
124/31/0/0
125/31/0/0
125/2/0/0
125/9/1/2
125/0/0/1
125/31/0/2
125/15/0/1
126/1/0/1
126/14/2/3
125/20/1/3
125/21/1/3
125/16/1/2
Factory
HP/VP/P
125/22/0/0
125/8/0/1
124/31/0/0
125/31/0/0
125/2/0/0
125/9/1/2
125/0/0/1
125/31/0/2
125/15/0/1
126/1/0/1
126/14/2/3
125/20/1/3
125/21/1/3
125/16/1/2
USER
V-
Position
PS42P2ST
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Alignment and Adjustments
4-3 Discharge Voltage Adjustment Method (Monitor) in Times of ASSY Repair
and Replacement
-All VR (Variable Resistor), except for VR for Vs, voltage goes d own w hen tur ned counterclockwise.
G Vsc and Vy Adjustment Method
G Vs and Va Adjustment Method
Y-MainI Vsc is the voltage of the left term inal
for D5207
I Voltage ad justm ent is made for Vsc by
using VR5201
I Standard voltage for Vsc is 55V10V
I Vy is the voltage of the righ t term inal
for D5207
I Voltage ad justm ent is made for Vy by
using VR5200
I Standard voltage for Vy is 132V10V
I Vs is the voltage o f the no.11 PIN of
SX Connector.
I Voltage ad justm ent is made for Vs by
using VR in 7
I Vs is 1755V
I Va is the voltage of th e no.7 PIN of SX
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Alignment and Adjustments
G Vw Adjustment Method
I Vw is the voltage of the right term inal
for R4414
I Voltage adjustment is made for Vw byus ing VR4400
I Standa rd voltage for Vw is 175V5V
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Alignment and Adjustments
4-4 Fault Finding Using MULTI METER
Parts defects can be found for DIODE TRANSISTOR IC, using MULTI TEST includ ing
Forward/ Reverse direction Multi Test. Of cour se, in case resistance of several ohm s and COIL are connect-
ed in parallel circuit, the lock out circuit parallel connected to part must be severed.
1.DIODE
2. TRANSISTOR
G For NPN(KSC815-Y, 2SC2068, 2SC2331-Y)
+ - + -
Forward Direction
Hundreds of ohms
Reverse Direction
InfinityBetween Anode and Cathode
C (COLLECTOR)
E
B(BASE)
B CE (EMITTER)
Forward Direction
Hundreds of ohms
Hundreds of ohms
Infinity
Reverse Direction
Infinity
Infinity
Infinity
Between B and E
Between B and C
Between E and C
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Alignment and Adjustments
3. IC (INTEGRATED CIRCUIT)
IC has bu ilt in DIODE against overvoltage in PIN . Generally, except for intern al circuit d efects, IC defects
can be found, by m easuring the DIODE.
Defects have SHORT(0 ohm) for both forward and reverse direction.
Hundreds of ohmsForward Direction
Reverse DirectionVarying depending on IC but generally normal
Infinity in DIODE TEST MODE
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Alignment and Adjustments
6-2 Partly no screen
1/ 7 no screen Yes
Power on
Replace Upper Scan Buffer B d
Replace Lower Scan Buffer B d
Replace Correspond ing
Add ress Buffer B d
Replace Panel
Replace Panel
Upp er part no screen
Lower part n o scree
1/ / 14 Screen part
Abnormal
1/ 28 no screen
Yes
No
No
No
No
Yes
Yes
Yes
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Troubleshooting
6-3 Checking the Board (Unit)
6-3-1 Y buffer
- To check the main board , you have to check the Y buffer first.
- After separating Y Main and Y buffer board,
- Check the Diode between OUTL and OUTH, and m ake sure that the forward voltage drop is between
0.4 and 0.5V.
- Check that the resistance between the two terminals is more than several kW.
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Troubleshooting
6-3-2 Y Main
- After connecting Y main an d Y buffer board, check that on e of the outpu t w aveforms from O UT 1, 2, 3
or 4 is the same as that of the app endix 1 when p ower is supp lied.
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Troubleshooting
6-3-4 SMPS
- Check outp ut voltage.
- If outpu t voltage is not d etected, check the following lists:
(1) Check fuse
(2) In case of +5V(D), check that D305 is short
(3) In case of VSAMP, check th at D506 is shor t
(4) In case of VA, check th at D303 is shor t
(5) In case of VS, check that p in 2 and 3 of Q303 are shor t
(6) In case of Q6S, check th at p in 2 and 3 are short
(7) Check that BRD101S is short
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Troubleshooting
6-3-5 Scaler Borad
1. PW364 Input Clock
(1) MCKEXT
Check IC406(IC502) pin 5.
Power on : MCKEXT = 97.5MHz
Standby : MCKEXT = 48.75MHz
(2) MCKEXT, DCKEXT
Check IC407(ICS502) pin 25. DCKEXT = 65MHz
(3) VCLK
Check IC203(SDA9400) pin 26. VCLK = 27MHz
(4) GCLK
Check IC401(AD9884) pin 115(TP404).
GCLK is differently seen according to PC input signal format(VGA, SVGA, XGA)
GCLK = 15MHz ~ 50MHz(This value is apparently half of the clock frequency of the relevant PC input signal format.
2. VPC3230
- Check power is supplied(5V, 3.3V).
- Check Reset(pin 15) is high.
- Check I2C-bus(pins 13, 14)
- Check the signal input to Y signal(pin73), C signal(pin 71), PLL DVD-Y signal (pin 72).
- Check the output clocks LLC1(pin 28), LLC2(pin 27). (LLC1 = 13.5MHz, LLC2 = 27MHz)
- Check the output H sync(pin 56) and check V sync(pin 57) is output.- Check output digital data.
3. SDA9400
- Check power is supplied(3.3V).
- Check Reset(pin 30) is high.
- Check I2C-bus(pins 20, 21)
- Check clock is input.(pins 28, 54 : 27MHz. pin 29 : 13.5MHz)- Check digital data input.
- Check the input H sync (pin 23) = 15.75MHz, V sync (pin 22) = 60Hz
- Check digital data input.
- Check the output H sync (pin 60) = 31.5KHz, V sync (pin 61) = 60Hz, VCLK (pin 26) = 27MHz
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Troubleshooting
5. AD9884(IC801)
- Check power is supplied(3.3V).
- Check I2C-bus(pins 29, 30)
- Check Video signal is input.
- Check the input signal 2HS (pin 40 or TP406)
- Check the output signal VHS (pin 117 or TP409)
- Check the output signal VCLK (pin 115 or TP408)
- Check digital data input.
6. PW364 Reset
- When the Reset switch is pressed. if OTP01(29LV160T) pin 28(TP151) undergoes ransition.
PW364 operates and OTP01 also does. Unless transition happens, it means PW364 is not operating.
7. PW364 Communication
- Operate the PC hyper terminal Settings are as follows :
Model Selection : Direct connect to com1
No. of Bit per second : 57600
Data Bit : 8
Parity : None
Stop Bit : 1
Flow Control : None
- Whenever the Reset switch is pressed, the following is displayed on the PC hyper terminal screen.
CBooter V1.5 & 2000.01.26
CBooter V1.5 & 2000.01.26
CBooter V1.5 & 2000.01.26
8. SDA6001
- Check power is supplied ( 5V, 3.3V )
Check I2C bus ( Pins 98 99 )
Schematic Diagrams
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TP10
TP11
TP09
12. Schematic Diagrams
Samsung Electronics 12-1
12-1 SCALER1 SIGNAL INPUT, LVDS OUTPUT
TP09 DTV/PC H-SYNC
TP10 DTV/PC V-SYNC
TP11 DTV/PC B-OUT
Schematic Diagrams
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12-2 Samsung Electronics
TP03 TP04
TP02
TP01
TP05TP06
TP05 TP06 TP04 TP03
TP06 TP08P07
12-2 SCALER2 VIDEO DECODER MAIN, PROGRESSIVE CON.
TP01 Main-Y IN
TP02 Main-C IN
TP03 VS-OUT
TP04 HS-OUT
TP05 LLC1
TP06 CLK2
TP07 HOUT(IVHS)
TP08 VOUT(IVVS)
Schematic Diagrams
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Samsung Electronics 12-3
12-3 SCALER3 VIDEO DECODER PIP, FIRST IN/OUTPUT
Schematic Diagrams
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12-4 Samsung Electronics
12-4 SCALER4 VIDEO DA CON.
Schematic Diagrams
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Samsung Electronics 12-5
12-5 SCALER5 VIDEO PROCESSOR, SAND CASTLE PULSE GEN.
TP12
TP13
TP15
TP14
TP17
TP16
TP12 HS-OUT
TP13 VS-OUT
TP14 SCP H-BLK
TP15 SCP V-BLK
TP16 SCP CLAMPER
TP17 SCP
Schematic Diagrams
( )
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12-6 Samsung Electronics
12-6 SCALER6 ADC(VIDEO)
TP19 TP20
TP18
TP18 HS-OUT
TP19 VHS
TP20 VCLK
Schematic Diagrams
12 7 SCALER7 ADC(PC)
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Samsung Electronics 12-7
12-7 SCALER7 ADC(PC)
TP22 TP23
TP21
TP21 MHSYNC
TP22 MHS
TP23 PCLK
Schematic Diagrams
12 8 SCALER8 PW364
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12-8 Samsung Electronics
12-8 SCALER8 PW364
TP18
TP25
TP24
TP23
TP20 VCLK
TP23 PCLK
TP24 MCKEXT
TP25 DCKEXT
Schematic Diagrams
12-9 SCALER9 POWER DEGUGER MEMORY REMOCON RS232 RTC
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Samsung Electronics 12-9
12-9 SCALER9 POWER, DEGUGER, MEMORY, REMOCON, RS232, RTC
Schematic Diagrams
12-10 SCALER10 MEGA TTX CAPTION
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12-10 Samsung Electronics
12-10 SCALER10 MEGA TTX, CAPTION
TP28
TP29TP30TP31
TP27TP26
TP26 IVVS
TP27 IVHS
TP28 TTX_FB
TP29 TTX_R
TP30 TTX_G
TP31 TTX_B
Schematic Diagrams
12-11 SOUND
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Samsung Electronics 12-11
SOU
Schematic Diagrams
12-12 LINE-FILTER, POWER SW, SPEAKER TERMINAL
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12-12 Samsung Electronics
, ,
POWER SWLINE-FILTER SPEAKER TERMINAL
Schematic Diagrams
12-13 CONTROL, REMOCON
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Samsung Electronics 12-13
CONTROL
REMOCON
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