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he Energy Efficient Solutions logo, mobileGT, PowerQUICC, QorIQ, StarCore and Symphony
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of their respective owners. © 2011 Freescale Semiconductor, Inc.
► Freescale was informed thru a customer quality issue that an unexpected reset was generated when some cQuest devices wake up from stop mode. The Quest/cQuest (MM912F634CVx) is an integrated single package solution that integrates an HCS12 microcontroller with a SMARTMOS analog control IC (Calango).
► Root cause investigation identified a design issue on the analog die (Calango), where Stop Mode Wake-Up generates a Reset and set WUR bit into RSR register. After a transition from Stop mode to Normal mode due to a wake up event, the device may generate a Reset. If this occur, WUR bit into RSR register is set until reading of RSR register. This behavior will affect parts with VDD in stop mode below LVR in normal mode.
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and Symphony are trademarks of Freescale Semiconductor, Inc., Reg. U.S. Pat. & Tm. Off. BeeKit, BeeStack, ColdFire+, CoreNet, Flexis, Kinetis, MXC, Platform in a
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All other product or service names are the property of their respective owners. © 2011 Freescale Semiconductor, Inc.
2
►The issue is impacting other dual die devices with Calango die embedded, ie. MM912G634 (CQUEST48K, QUICKSILVER 48) and MM912H634 (QUICKSILVER 64).
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and Symphony are trademarks of Freescale Semiconductor, Inc., Reg. U.S. Pat. & Tm. Off. BeeKit, BeeStack, ColdFire+, CoreNet, Flexis, Kinetis, MXC, Platform in a
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All other product or service names are the property of their respective owners. © 2011 Freescale Semiconductor, Inc.
3
• Root cause has been identified
− During the transition from stop mode to normal mode, the monitoring of LVR
(Low Voltage Reset) of normal mode is activated too early.
• Qualification of the design change has been completed.
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Freescale, the Freescale logo, AltiVec, C-5, CodeTEST, CodeWarrior, ColdFire, C-Ware, the Energy Efficient Solutions logo, mobileGT, PowerQUICC, QorIQ, StarCore
and Symphony are trademarks of Freescale Semiconductor, Inc., Reg. U.S. Pat. & Tm. Off. BeeKit, BeeStack, ColdFire+, CoreNet, Flexis, Kinetis, MXC, Platform in a
Package, Processor Expert, QorIQ Qonverge, Qorivva, QUICC Engine, SMARTMOS, TurboLink, VortiQa and Xtrinsic are trademarks of Freescale Semiconductor, Inc.
All other product or service names are the property of their respective owners. © 2011 Freescale Semiconductor, Inc.
4
TM
Freescale, the Freescale logo, AltiVec, C-5, CodeTEST, CodeWarrior, ColdFire, C-Ware, the Energy Efficient Solutions logo, mobileGT, PowerQUICC, QorIQ, StarCore
and Symphony are trademarks of Freescale Semiconductor, Inc., Reg. U.S. Pat. & Tm. Off. BeeKit, BeeStack, ColdFire+, CoreNet, Flexis, Kinetis, MXC, Platform in a
Package, Processor Expert, QorIQ Qonverge, Qorivva, QUICC Engine, SMARTMOS, TurboLink, VortiQa and Xtrinsic are trademarks of Freescale Semiconductor, Inc.
All other product or service names are the property of their respective owners. © 2011 Freescale Semiconductor, Inc.
5
RevC low voltage reset management
is based on bias OK signal and fixed
delay only � issue if bias OK is
established (more than 3 us) before
the lvr (normal mode) is high the IC
will see low voltage reset activated
RevD low voltage reset management
is based only on filtered low voltage
reset (normal mode) � no lvr
transition before lvr normal mode is
established
Change list: 1. Use LVR normal rising edge to change
LVR Mux selection from stop to normal
mode.
2. Add RC filter at LVR Normal mode- use
RC (200k, 1.35pF) spare devices. New Metal wires
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Freescale, the Freescale logo, AltiVec, C-5, CodeTEST, CodeWarrior, ColdFire, C-Ware, the Energy Efficient Solutions logo, mobileGT, PowerQUICC, QorIQ, StarCore
and Symphony are trademarks of Freescale Semiconductor, Inc., Reg. U.S. Pat. & Tm. Off. BeeKit, BeeStack, ColdFire+, CoreNet, Flexis, Kinetis, MXC, Platform in a
Package, Processor Expert, QorIQ Qonverge, Qorivva, QUICC Engine, SMARTMOS, TurboLink, VortiQa and Xtrinsic are trademarks of Freescale Semiconductor, Inc.
All other product or service names are the property of their respective owners. © 2011 Freescale Semiconductor, Inc.
6
• Change impacts Metal1, Via1, Metal2, Via2,
Metal3.
• Metal4, passivation and polyimide are the same
• No change in die size
3. M3 test points added on critical wires.
4.Change revision Id
Pad PTB0 –PIN#26 Pad PTB1 –PIN#27
Title: Qualification strategy on QUEST and CQUEST32K (MM912F634DVxAx)
Ambient Operating Temperature range: Grade 2 (-40°C to 105°C)
Name: QUEST/CQUEST32K
Customer PN: Various
The qualification on the MM912F634DVxAx (D-version) was performed based on the changes comparedto the previously successfully qualified part: MM912F634CVxAx (C-version). The difference betweenthese two product revisions are the design changes on the analog die. No changes were performed on the
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Freescale, the Freescale logo, AltiVec, C-5, CodeTEST, CodeWarrior, ColdFire, C-Ware, the Energy Efficient Solutions logo, mobileGT, PowerQUICC, QorIQ, StarCore
and Symphony are trademarks of Freescale Semiconductor, Inc., Reg. U.S. Pat. & Tm. Off. BeeKit, BeeStack, ColdFire+, CoreNet, Flexis, Kinetis, MXC, Platform in a
Package, Processor Expert, QorIQ Qonverge, Qorivva, QUICC Engine, SMARTMOS, TurboLink, VortiQa and Xtrinsic are trademarks of Freescale Semiconductor, Inc.
All other product or service names are the property of their respective owners. © 2011 Freescale Semiconductor, Inc.
7
these two product revisions are the design changes on the analog die. No changes were performed on themicrocontroller or the package.
Qualification stressing was performed on:- Quest: 912F634DVxAE/R2 (exposed pad version)- cQuest32k: 912F634DVxAP/R2 (non-exposed pad version)
Objective:Qualification Results for Calango P2.5 + CrowntailFreescale PN:
Part Name:
Calango P2.5 (analog die) in dual die product
cQuest32k/Quest
MM912F634
Customer
Name(s):
PN(s):
Various Plan or Results:
Revision # & Date:Results
2.0 ; 12 September 2012
Technology:
Package:
SmartMOS8MV
LQFP 48 7x7 mm Exposed pad/ LQFP 48 7x7 mm (non-
exposed pad) Design Engr:
Phone #:
Arlette Marty -R16192
+ 33-561191003 QUARTZ Tracking #:218288/218289
Fab / Assembly /
Final Test Sites:
CHD for Calango, ATMC for Crowntail and TJN for
Assy/Test
Product Engr:
Phone #:
Y.H. Zhang - B11287
+86-22-85684630 (Signature/Date shown below may
be electronic)
Maskset#:
Rev#:
Calango P2.3/P2.4 (old): 4M91W/5M91W
Calango P2.5 (new): 6M91W
Crowntail: 4M33G
Prod. Package
Engr:
Phone #:
Garry Ge - B17616
+86-22-85684585
PPE Approval (for
DIM/BOM results)
Signature & Date:
Die Size (in mm)
W x L x T
M91W: 1984 x 3188 - Calango
M33G: 2030 x 2390 - Crowntail
NPI PRQE:
Phone #:Ylva Adner - R48929
+498992103- 683
NPI PRQE Approval
Signature & Date:
Ylva Adner
17Sep2012
Part Operating
Temp. Grade: Grade 2 -40°C to +105°C Trace/DateCode:
LOT A
Wafer :
Assy :
LOT B
Wafer :
Assy :
LOT C
Wafer :
Assy :
CAB Approval
Signature & Date:
9/17/2012
12110645M
Target Dates
Test Start:
Test Finish: Test Program Name:
Customer Approval
Signature & Date:
This testing is performed by TJN Freescale Reliability Lab unless otherwise noted in the Comments.
GROUP A - ACCELERATED ENVIRONMENTAL STRESS TESTS
Stress Test Reference Test Conditions
End Point
Requirements/ Acceptance
Minimum Sample
Size(Note 1)
# of Lots
Total Units
including
spares
Results
Lot ID-(#Rej/SS)
NA=Not Applicable
Comments(Note 2)
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Freescale, the Freescale logo, AltiVec, C-5, CodeTEST, CodeWarrior, ColdFire, C-Ware, the Energy Efficient Solutions logo, mobileGT, PowerQUICC, QorIQ, StarCore
and Symphony are trademarks of Freescale Semiconductor, Inc., Reg. U.S. Pat. & Tm. Off. BeeKit, BeeStack, ColdFire+, CoreNet, Flexis, Kinetis, MXC, Platform in a
Package, Processor Expert, QorIQ Qonverge, Qorivva, QUICC Engine, SMARTMOS, TurboLink, VortiQa and Xtrinsic are trademarks of Freescale Semiconductor, Inc.
All other product or service names are the property of their respective owners. © 2011 Freescale Semiconductor, Inc.
8
Acceptance
criteria(Note 1) spares NA=Not Applicable
(Note 2)
PC
JESD22-
A113
J-STD-020
Preconditioning (PC) :PC required for SMDs only.
MSL 3 @ 260°C, +5/-0°C
TEST @ R All surface mount devices prior to TC. See previous qualification results
HAST
JEDEC
JESD22
-A101 or
A110
Biased HAST 130°C/85%RH for 96hours TEST @ RH 0 0 0 NA/ See previous qualification results
UHST
JEDEC
JESD22
-A102,A118
or A101
Unbiased HAST 130°C/85%RH for 96
hours
TEST @ R 0 0 0 N/A See previous qualification results
TC
JESD22-
A104
AEC Q100-
Appendix 3
Temperature Cycle (TC):PC before TC (for SMDs only): Required
TC = -50°C to 150°C for 500 cycles. 1000
cycles performed for information only.
TEST @ H 77 1 lot Quicksilver 77 PASS
0/77
Performed on Quicksilver. Results:
Pass 0/77 1000TC
HTSL
JESD22-
A103High Temperature Storage Life (HTSL):150°C for 1000hrs
TEST @ RH 0 0 0 N/A See previous qualification results
TEST GROUP B - ACCELERATED LIFETIME SIMULATION TESTS
Stress TestReferenc
eTest Conditions
End Point
Requireme
nts/
Acceptance
criteria
Minimum
Sample Size
(Note 1)
# of Lots
Total Units
including
spares
Results
Lot ID-(#Rej/SS)
NA=Not Applicable
Comments
(Note 2)
HTOL
JESD22-
A108
High Temperature
Operating Life (HTOL):
Ta = 125°C for 408hrs .
TEST
@RHC
77 1 77 PASS
0/77
Lot A: cQuest32k
ELFR
AEC
Q100-
008
Early Life Failure Rate
ELFR):
TEST @ RH 0 0 0 N/A See previous
qualification results
TEST GROUP C - PACKAGE ASSEMBLY INTEGRITY TESTS
Stress TestReferenc
eTest Conditions
End Point
Requireme
nts
Minimum
Sample Size
(Note 1)
# of Lots
Total Units
including
spares
Results
Lot ID-(#Rej/SS)
NA=Not Applicable
Comments
(Note 2)
WBS
AEC
Q100-
001
Wire Bond shear (WBS) Cpk = or >
1.67
0 0 0 N/A See previous
qualification results
WBP
MilStd88
3-
Wire Bond Pull (WBP):
Cond. C or D
Cpk = or >
1.67
0 0 0 N/A See previous
qualification results
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Freescale, the Freescale logo, AltiVec, C-5, CodeTEST, CodeWarrior, ColdFire, C-Ware, the Energy Efficient Solutions logo, mobileGT, PowerQUICC, QorIQ, StarCore
and Symphony are trademarks of Freescale Semiconductor, Inc., Reg. U.S. Pat. & Tm. Off. BeeKit, BeeStack, ColdFire+, CoreNet, Flexis, Kinetis, MXC, Platform in a
Package, Processor Expert, QorIQ Qonverge, Qorivva, QUICC Engine, SMARTMOS, TurboLink, VortiQa and Xtrinsic are trademarks of Freescale Semiconductor, Inc.
All other product or service names are the property of their respective owners. © 2011 Freescale Semiconductor, Inc.
9
WBP 3-
2011
Cond. C or D 1.67 qualification results
SD
JESD22-
B102
Solderability (SD):
8hr.(1 hr. for Au-plated leads)
Steam age prior to test.
If production burn-in is done,
samples must also undergo
burn-in prior to SD.
>95% lead
coverage of
critical
areas
0 0 0 N/A See previous
qualification results
PDJESD22-
B100
Physical Dimensions(PD):
PD per FSL 98A drawing
Cpk = or >
1.67
0 0 0 N/A See previous
qualification results
DIM
&
BOM
Dimensional (DIM):
PPE to verify PD results
against valid 98A drawing.
BOM Verification (BOM):
PPE to verify qual lot ERF
BOM is accurate.
See previous
qualification results
TEST GROUP E - ELECTRICAL VERIFICATION TESTS
Stress Test Reference Test ConditionsEnd Point
Requirements
Minimum
Sample Size
(Note 1)
# of Lots
Total Units
including
spares
Results
Lot ID-(#Rej/SS)
NA=Not Applicable
Comments
(Note 2)
TEST
Freescale
48A
Pre- and Post Functional /
Parametrics (TEST):
Test software shall meet
requirements of AEC-Q100-007.
Testing performed to the limits of
device specification in temperature
and limit value.
0 Fails All All All BI requirement: 125C/12hrs
prior to test
HBM
AEC-Q100-
002
ElectroStatic Discharge/
Human Body Model Classification
(HBM):
Required :
Test @
- LIN (DGND, PGND, AGND, and
LGND shorted) : 8000V
- VS1, VS2, VSENSE, Lx: 4000V
- HSx: 3000V
- All other Pins: 2000V
See AEC-Q100-002 for
classification levels.
-TEST @ RH 3 units per
Voltage level. 4
voltage levels.
2 24 PASS
0/24
Lot A: cQuest32k
Lot B: Quest
Performed in TLS.
MM
AEC-Q100-
003
ElectroStatic Discharge/
Machine Model Classification
m(MM):
Required :
TEST @ RH 3 units per
Voltage level
2 6 PASS
0/6
Lot A: cQuest32k
Lot B: Quest
Performed in TLS.
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Freescale, the Freescale logo, AltiVec, C-5, CodeTEST, CodeWarrior, ColdFire, C-Ware, the Energy Efficient Solutions logo, mobileGT, PowerQUICC, QorIQ, StarCore
and Symphony are trademarks of Freescale Semiconductor, Inc., Reg. U.S. Pat. & Tm. Off. BeeKit, BeeStack, ColdFire+, CoreNet, Flexis, Kinetis, MXC, Platform in a
Package, Processor Expert, QorIQ Qonverge, Qorivva, QUICC Engine, SMARTMOS, TurboLink, VortiQa and Xtrinsic are trademarks of Freescale Semiconductor, Inc.
All other product or service names are the property of their respective owners. © 2011 Freescale Semiconductor, Inc.
10
MM Required :
Test @ 200V
See AEC-Q100-003 for
classification levels.
CDM
AEC-Q100-
011
ElectroStatic Discharge/
Charged Device Model
Classification (CDM):
Test @ 500, 750V
TEST @ RH
Corner pins
=/> 750V;
All other pins
=/> 500V
3 units per
Voltage level. 2
Voltage levels
2 12 PASS
0/12
Lot A: cQuest32k
Lot B: Quest
LU
JESD78
plus
AEC-Q100-
004
Latch-up (LU):
Test per JEDEC JESD78 with the
AEC-Q100-004 requirements.
Ta= Maximum operating
temperature
Vsupply = Maximum operating
voltage
TEST @ RH 6 2 12 PASS
0/12
Lot A: cQuest32k
Lot B: Quest
Performed in TLS.
ED
AEC-Q100-
009,
Freescale
48A spec
Electrical Distribution (ED) TEST @ RHC
Cpk = or >
1.67
30 2 60 PASS Lot A: Quest
Lot B: cQuest32k
Two different wafer lots of
Calango used.
TM