MARKETDATA
PACKAGING MATERIALSGLOBAL SEMICONDUCTORPACKAGING MATERIALS OUTLOOK
Global Semiconductor Packaging Materials Outlook is a comprehensive market research study that examines semiconductor packaging technology trends and their impact on the packaging materials markets. The report quantifi es the packaging materials markets by segment and by region, highlights new opportunities for emerging package form factors, defi nes supplier market share, and presents market forecasts through 2021.
Global Semiconductor Packaging Materials Outlook is an essential business tool for anyone interested in the plastic packaging materials arena. Packaging materials directly aff ect the performance, reliability and cost of semiconductors, and advancements in packaging materials technology off er the potential for signifi cant improvement across all these areas.
FEATURES
• Technology trends
• Regional market size
• Five-year market forecasts
• Supplier market share
• Market size in revenue and units
• Capacity and utilization trends
• Supply chain Issues
METHODOLOGY
The source of information for this study are in-person interviews with over 150 material suppliers, packaging subcontractors, and semiconductor manufacturers from around the world. The authors of this report used primary research and modeling to develop market size information, and developed fi ve-year market forecasts based on diff erent scenarios of new technology penetration and market growth.
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TO REQUEST A SAMPLE:www.semi.org/
packaging-material-report
• Concise Executive Summary
• Adobe Acrobat chapters for each materials segment
• Excel workbook fi le summarizing market information
• PowerPoint charts, ideal for presentations
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PACKAGING MATERIALS
CONDENSED TABLE OF CONTENTS
1 INTRODUCTION Methodology Assumptions Report Organization
2 SEMICONDUCTOR PACKAGING Industry Market Trends Regional and Market Issues Materials Needs— Customer Input End-market Applications
3 SUBSTRATES Laminate Substrates Build-up Substrates Organic Substrates Markets and Forecast Pricing Supply
4 LEADFRAMES Technology Trends Markets and Forecast Supply
5 BONDING WIRE Technology Trends Markets and Forecast Pricing Trends Supply
6 MOLD COMPOUNDS Technology Trends Markets and Forecast Supply
7 UNDERFILL MATERIALS Capillary Underfill Molded Underfill Technology Trends Markets and Forecast Supply
8 LIQUID ENCAPSULANTS Technology Trends Markets and Forecast Supply
9 DIE ATTACH MATERIALS Technology Trends Markets and Forecast Supply
10 SOLDER BALLS Technology Trends Markets and Forecast Supply
1 1 WAFER LEVEL PACKAGE Dielectrics Technology Trends Markets and Forecast Supply
12 PLATING CHEMICALS Technology Trends Material Development Markets and Forecast Supply
13 SUMMARY AND CONCLUSIONS
14 APPENDICES
PRICING INFORMATION
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Single User License $5,000 $6,000
Multi-user License $12,500 $15,000
* This pricing does not apply to Individual Members
HOW TO ORDER: Visit SEMI® at www.semi.org/packaging-material-report
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ABOUT SEMI ABOUT TECHSEARCH INTERNATIONAL, INC.
Founded in 1987, TechSearch International (Austin, Texas) is a technology licensing and consulting company specializing in accurate, relevant, and timely information on advanced packaging technology and market developments.
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SEMI connects over 2,000 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics manufacturing. Since 1970, SEMI has built connections that have helped its members prosper, create new markets, and address common industry challenges together. SEMI maintains offices in Bangalore, Berlin, Brussels, Grenoble, Hsinchu, Seoul, Shanghai, Silicon Valley (Milpitas, California), Singapore, Tokyo, and Washington, D.C.
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Copyright © 2018 SEMI®. All rights reserved. SEMI and semi.org are trademarks or registered trademarks of SEMI in the United States and other countries. All other company and product names are trademarks of their respective holders. Contents and specifications are subject to change without notice.
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