www.macom.com
Product Selection Guide
Optoelectronics & Photonics
OptoBrochure_031416_final_r1_Layout 1 3/14/16 12:29 PM Page 1
MACOM Optoelectronics
Products to meet the growing demand for data capacity
MACOM supports a large portfolio of electronic components, lasers, and photodiodes for
optical communications from long haul core networks to FTTx access networks. The portfolio
addresses the high performance analog interfaces between electrical and optical domains,
and provides solutions to meet the demanding size, power and signal integrity requirements
of today’s high speed networks—which are expanding to meet the continuously growing
demand for data capacity. These products include high performance modulator drivers,
transimpedance amplifiers, clock/data recovery circuits, APD, PIN photodiodes, and FP and
DFB lasers, ROSAs and TOSAs for enterprise and telecom optical systems operating up to
100 Gbps and beyond. For FTTx, MACOM has the broadest portfolio of lasers, laser drivers,
limiting amplifiers, APD, PIN photodiodes, and TIAs covering systems from GPON,
EPON to XG-PON.
GPPO Module
Surface Mount
Die
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OptoBrochure_031416_final_r1_Layout 1 3/14/16 12:29 PM Page 2
MACOM Optoelectronics
Industry-leading optical portfolio drives the future of FTTx, 10G & 100G Networking
Markets> 100G DWDM> 100G Ethernet > 10G/40G/100G Datacom and Telecom> PON/FTTH> Wireless Backhaul> Beyond 100G: 200G and 400G
Technologies:> Gallium Arsenide (GaAs)> Silicon Germanium (SiGe) > Indium Phosphide (InP) > CMOS> Silicon Photonics (SiPh)
Product Lines:> Modulator Drivers> Laser Drivers > Transimpedance Amplifiers > CDRs> Limiting Amplifiers> Lasers > Crosspoint Switches> Silicon Photonic PIC> ROSAs and TOSAs (Optical Sub Assemblies)
LONG HAUL1000s Km
DATACENTER<100m-10 Km
METRO40-100s Km
For 100 Mbps to 12 Gbps SFP+/XFP and SFP/CSFP/QSFP+
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OptoBrochure_031416_final_r1_Layout 1 3/14/16 12:29 PM Page 3
4
Photonic Integrated Circuits (PICs) is an emerging technology that uses crystalline semiconductor wafers as the platform for the integration of active and passive photonic circuits along with electronic components on a singlemicro-chip. With the necessary expertise, the technology enables innovative solutions utilizing silicon optical circuits and micro-optics, while allowing the optimal integration of control electronics and system packaging.
MACOM is focused on integrated silicon microphotonics which uses fine line lithography to realize high densityfunctionality. These technologies combine high performance, low power optical devices with maximum functionality and high packing density. Silicon microphotonics, in particular, brings the benefits of high-density, low-cost and performance scalability, similar to silicon CMOS chip manufacturing.
Key Advantages
> High functionality covering a variety of devices, including switches, modulators, integrated photodetectors, couplers, biosensors, wavelength combiners and splitters, control and various optical couplers for I/O
> Monolithic integration using commercial semiconductor chip foundries enables repeatable, low cost productsat scalable volumes
> High index contrast for compact optical circuitry> Strong low power optical modulation due to the efficient plasma dispersion effect> High-speed (>50 Gbps) modulation due to speed of carrier transport in silicon diodes> Nanophotonic components - ring resonators, filters> Integrated photodetectors using monolithic germanium integration> Operates in important datacom and telecom wavelengths (O- and C-Bands at 1310 and 1550 nm)
Key Applications
> 100G/400G Datacom: datacenters and campus applications (to 10 km)> Telecom: metro and long-haul applications (to 100 and 400 km)> Ultra short reach optical interconnects and switches within routers, computers, HPC> Functional passive optical elements including AWGs, optical filters, couplers, and splitters> Radio over fiber transport and backhaul> Transceiver products including embedded optical modules, transmitters/receivers, and active optical cables (AOCs)> Optical signal processing with high performance active elements including VOAs and phase, amplitude
and frequency modulators for advanced modulation formats> Military/aerospace/scientific sensor, control, and interconnect application> Optical switch fabrics for communications and testing> Metrology and sensors> Medical applications like DNA, glucose, molecular and cellular analysis sensors> Optical engines combining optics and electronics> Emerging products like 3DICs/integrated optoelectronic chips> Consumer: easy-to-use compact cabling for desktop PC, peripherals, home media servers and networked HDTVs> Professional video, digital signage, digital cinemas, and video recording
MACOM Silicon Photonics Technology
Photonic chipset solutions for optimized power, size and cost
OptoBrochure_031416_final_r1_Layout 1 3/14/16 12:29 PM Page 4
5
MACOM Evaluation Modules and Reference Design Kits
Enhance new product development, reduce costs and optimize time-to-market
In addition to the support of our world-class application team, MACOM offers a number of custom reference design kits, evaluation modules (EVM) and design guides which enhance the development of new products, reduce costs and optimize time-to-market.
MACOM evaluation modules provide customers with a vehicle to test product features, measure productperformance, and help design the product into their application. From backplanes to line cards and optical modules, MACOM reference design kits and EVMs are built to ease the evaluation of our latest solutionsinto the application environments of our customers and partners.
We package these offerings with our extensive GUI support as well. In addition to the EVM module and the required software and user guide—schematics of circuit boards and modules, and supporting documents are provided.
From low-speed solutions to those operating at 100G and above, MACOM offers hardware expertise and designsupport to enable innovative, next-generation optical products in a wide variety of markets.
Contact the MACOM Sales team to learn more.
OptoBrochure_031416_final_r1_Layout 1 3/14/16 12:29 PM Page 5
Optoelectronics
6
Datacenter: QSFP28
Long Haul Metro
Driver
Driver
Driver
Driver
ElectricalOptical
DEMU
X
TIA
TIA
TIA
TIA
Driver
Driver
Driver
Driver
MUX ElectricalOptical
CDR
CDR
CDR
CDR
CDR
CDR
CDR
CDR
Quad Channel Drivers
DAC DAC DAC DAC ADC ADC ADC ADC
DSP Engine
Coherent ASIC
TIA
TIA
TIA
TIA
90%OpticalHybrid
PolarizationController
Coherent Receiver
Dual Polarization
Laser
X
Y
I
Q
I
Q
TOSA: FBT4821AG ROSA: FBR4102PB
MAOM-003427MAOM-003418 MAOM-003405 MAOM-003407 MAOM-003414MAOM-003107
MAOM-003415 MAOM-003417 MAOM-03417BM37040 M37046
MAOM-003108MAOM-002105MAOM-010567MAOM-03404AMAOM-03409B MAOM-03409D
MATA-003806
TOSA:
Lasers127D-25C-LCT11127D-25C-LCT11 131D-25C-LCT11-502133D-25C-LCT11
DriversMAOM-002301MAOM-002304
CDR M37049
ROSA:
Lasers127D-25C-LCT11127D-25C-LCT11 131D-25C-LCT11-502133D-25C-LCT11
TIAM03102
CDR M37049
OptoBrochure_031416_final_r1_Layout 1 3/14/16 12:29 PM Page 6
Optoelectronics
7
Fiber Fronthaul CPRI
Fiber BackhaulSFP28 Long Reach
BOSA-on-Board for PON/FTTx
ElectricalOptical DDMI
PostAmp
LaserDriver
TIA
TIA
Driver
ElectricalOptical
Tx an
d Rx
CDR
GPON
Com
bo C
hipRO
SATO
SA
TIA
OpticalBidirectional
NPU/ASIC
NPU/ASIC
SFP
SFP+
XFP
QSFP+
SFP28
QSFP28
CFP24
CXP
Crosspoints
Switch CardLine Card
GPON Combo ChipM02098M02099M02100
TIAM02015M02016M02027M02029
Lasers 131D-02E-VT5TB-501131D-02E-VT5TB-502131D-02E-VT5MB-502131D-02E-VT5TB-503131A-021-AT4GR-501131P-021-ST4GP131F-021-LT5SB
DML Laser131D-25C-LCT11-502
DML Laser131D-25C-LCT11-502
Laser PDRequest more information
Laser PDRequest more information
Chipset (Laser Driver +Post Amplifier+ DDMI)M02193
Tx and Rx CDRMASC-37028MASC-37029
M02131
MAOM-002301
M03002
CDRs, SignalConditioners &Backplane Drivers
6.5 Gbps # ChannelsM21450 2M21030 4M21451 4M21452 8M21462 8M21453 12M21463 12
10 Gbps M21440 8M21441 12
28 GbpsMAXP-37161 16
Crosspoints
6.5 Gbps # ChannelsM23636 36M21148 48M21147 80M21167 160
12.5 Gbps M21024 24M21036 36M21048 48M21080 80M21601 120M21605 160
28 GbpsMAXP-37161 16
Backplane/Midplane
OptoBrochure_031416_final_r1_Layout 1 3/14/16 12:29 PM Page 7
8
Optoelectronic & Photonic Applications
MAOM-003115 Linear EML Driver 28 1 2 10 Differential/ SMT 4 x 4 x 1.3
Differential
MAOM-004115 Quad Channel Linear EML Driver 28 4 2 10 Differential/ SMT 14 x 9.1 x 2.3
Differential
MAOM-003116 Linear Differential MZ Modulator Driver 32 1 4 15 Differential/ SMT 4 x 4 x 1.3
Differential
MAOM-003117 Linear Differential MZ Modulator Driver 32 1 2.5 9 Differential/ SMT 4 x 4 x 1.3
Single-ended
MAOM-003419 Quad Channel Linear EML Driver 28 4 2 12 Differential/ SMT 6 x 9.1 x 1.33
Single-ended
M37047 Four Channel 25G / 28G CDR with EML Driver 28 4 1.2 — Differential/ CSP 4 x 4.5 Single-ended
M37040 Quad 4 x 28G CDR 28 4 0.9 — Differential/ LFGA
Differential
M37046 Quad 4 x 28G CDR 28 4 0.9 — Differential/ CSP
Differential
MAOM-37051A Quad channel 25/28 Gbps CDR 28 4 2.5 0.1 Differential/ SMT 11 x 7 x 1.4
with EML Driver Single-ended
Drivers and Retimers for Long Reach DML/EML Datacenter Interconnect
Data Rate Max Output Max Input/Output Package TypePart Max Channels Voltage Small Signal Interface and SizeNumber Description (Gbps) (#) (Vpp) Gain (dB) (mm)
Part Max Data Rate Channels Optical Reach Input/Output Package TypeNumber Description (Gbps) (#) Interface Type (m) Interface and Size (mm)
Drivers, TIAs, and Retimers for Short Reach VCSEL for Datacenter Interconnect
MATA-37044 Quad 4 x 28G TIA and CDR 28 4 GS 300 Single-ended/ Die 2 x 3
Differential
MATA-37144 Quad 4 x 28G TIA and CDR 28 4 GS 300 Single-ended/ Die 2 x 3
Differential
MATA-37244 Quad 4 x 28G TIA and CDR 28 4 GSG 300 Single-ended/ Die 2 x 3
Differential
MALD-37045 Quad 4 x 28G VCSEL Driver and CDR 28 4 GS 300 Differential/ Die 2 x 3
Single-ended
MALD-37145 Quad 4 x 28G VCSEL Driver and CDR 28 4 GS 300 Differential/ Die 2 x 3
Single-ended
Data Rate Input/Output Package TypePart Max Channels Transimpedance Bandwidth Interface and SizeNumber Description (Gbps) (#) (kΩ) (GHx) (mm)
TIAs and Retimers for Long Haul, Metro, and Datacenter Interconnect
MATA-003806 Dual channel linear differential TIA 32 2 10 23 Differential/ Die 1.562 x 1.387 x 0.275
Differential
MATA-003817 Linear TIA 28 1 5 23 SIngle-ended/ Die 1.14 x 1.47 x 0.275
Differential
MO3100 TIA 28 4 2.9 21 SIngle-ended/ Die 1.52 x 2.22
Differential
MO3101 TIA 28 4 2.9 21 SIngle-ended/ Die 1.57 x 2.66
Differential
MO3102 TIA 28 4 2.9 21 SIngle-ended/ Die 1.57 x 3.41
Differential
M37041 Quad 4 x 28G Transmit CDR 28 4 1.1 — Differential/ LFGA Differential
MASC-37048 Quad 4 x 28G Transmit CDR 28 4 1.1 — Differential/ CSP
Differential
M37049 Quad 4 x 28G Transmit CDR 28 4 1.1 — Differential/ CSP
Differential
OptoBrochure_031416_final_r1_Layout 1 3/14/16 12:29 PM Page 8
9
Optoelectronic & Photonic Applications
Part Max Data Rate Channels Reach Input/Output Number Description (Gbps) (#) Configuration (km) Interface Package Type
Client Side and Datacenter TOSAs
FBT4821AG 100G-BASE LR4 TOSA 25.78 4 DML + Driver 10 Flex/LC Hermetic
FBT4401NH 100G-BASE LR4, OTU4 28 4 EML 10 Flex/LC Hermetic
FBT4401NH 100G-BASE LR4, OTU4 ROSA 28 4 PIN + TIA 10 Flex/LC Hermetic
Client Side and Datacenter ROSAs
Data Rate Bias Input/Output Package TypePart Max Channels Transconductance Current Interface and SizeNumber Description (Gbps) (#) (mS) (mA) (mm)
Client Side and Datacenter DML Drivers and Retimers (LR4, CWDM, PSM4)
MAOM-002304 Quad channel 28 Gbps DML Driver 28 4 80 100 Differential/ Die 2.978 x 1.378 x 0.1
Single-ended
MAOM-002301 28 Gbps DML Driver 28 1 80 100 Differential/ Die 0.878 x 1.378 x 0.1
Single-ended
MAOM-002305 28 Gbps Linear DML Driver 28 1 65 100 Differential/ Die 0.878 x 1.378 x 0.1
Single-ended
M37040 Quad 4 x 28G CDR 28 4 0.9 — Differential/ LFGA
Differential
M37046 Quad 4 x 28G CDR 28 4 0.9 — Differential/ CSP
Differential
Datacenter: 40G QSFP
Part Max Data Rate Wavelength Temp Options Number Description (Gbps) (nm) (°) Package Type
127D-10G-LCT11-S Die, laser, 10G DFB, 1270 -3.5 nm / +2.5nm, chip on tape 10 1270 — Die
129D-10G-LCT11-S Die, laser, 10G DFB, 1290 -3.5 nm / +2.5nm, chip on tape 10 1290 -5 to 85 Die
131D-10G-LCT11-S Die, laser, 10G DFB, 1310 -3.5nm / +2.5nm, chip on tape 10 1310 — Die
133D-10G-LCT11-S Die, laser, 10G DFB, 1330 -3.5 nm / +2.5nm, chip on tape 10 1330 — Die
127D-25C-LCT11 Die, laser, 25G DFB, 1270 -3.5 nm / +2.5 nm, chip on tape 25 1270 0 to 70 Die
129D-25C-LCT11 Die, laser, 25G DFB, 1290 -3.5 nm / +2.5 nm, chip on tape 25 1290 0 to 70 Die
131D-25C-LCT11 Die, laser, 25G DFB, 1310 -3.5 nm / +2.5 nm, chip on tape 25 1310 0 to 70 Die
133D-25C-LCT11 Die, laser, 25G DFB, 1330 -3.5 nm / +2.5 nm, chip on tape 25 1330 0 to 70 Die
1295-25B-LCT11 Die, laser, 25G DFB, 1295.56±1 nm, chip on tape 25 1295.56 — Die
1300-25B-LCT11 Die, laser, 25G DFB, 1300.05±1 nm, chip on tape 25 1300.05 — Die
1304-25B-LCT11 Die, laser, 25G DFB, 1304.58±1 nm, chip on tape 25 1304.58 — Die
1309-25B-LCT11 Die, laser, 25G DFB, 1309.14±1 nm, chip on tape 25 1309.14 — Die
Datacenter: 100G QSFP
131F-10I-LCT11-S Die, laser, 10G FP, chip on tape 10 1310 -40 to 85 Die
131D-10G-LCT11-503 Die, laser, 10G DFB, WL=±10nm, chip on tape 10 1310 -5 to 85 Die
131D-25C-LCT11-502 Die, laser, 25G DFB, WL=± 10 nm, chip on tape 25 1310 0 to 70 Die
Datacenter: PSM4 40G, 2 km
Datacenter: PSM4 40G, 10 km
Datacenter: PSM4 100G
127D-00G-LCT11-20 Die, laser, CW DFB, 20 mW, chip on tape — 1270 -5 to 85 Die
129D-00G-LCT11-20 Die, laser, CW DFB, 20 mW, chip on tape — 1290 -5 to 85 Die
131D-00G-LCT11-20 Die, laser, CW DFB, 20 mW, chip on tape — 1310 -5 to 85 Die
133D-00G-LCT11-20 Die, laser, CW DFB, 20 mW, chip on tape — 1330 -5 to 85 Die
Datacenter: Silicon Photonics
OptoBrochure_031416_final_r1_Layout 1 3/14/16 12:29 PM Page 9
Optoelectronic & Photonic Applications
10
MAOM-03404A Quad Channel 32 Gbps Limiting Differential 32 4 5 27 Differential/ SMT 14 x 9.1 x 2.3
MZ Modulator Driver Differential
MAOM-03409B Quad Channel 32 Gbps Linear Differential 32 4 4 28 Differential/ SMT 14 x 9.1 x 2.3
MZ Modulator Driver Differential
MAOM-03409D Quad Channel 32 Gbps Linear Differential 32 4 4 19 Differential/ SMT 14 x 9.1 x 2.3
MZ Modulator Driver Differential
MAOM-003415 Quad Channel 32 Gbps Limiting MZ Modulator Driver 32 4 5.5 27 Differential/ SMT 14 x 9.1 x 2.8
Single-ended
MAOM-003417 Quad Channel 32 Gbps Linear MZ Modulator Driver 32 4 4.5 21 Differential/ SMT 13 x 9.1 x 2.3
Single-ended
MAOM-03417B Quad Channel 32 Gbps Linear MZ Modulator Driver 32 4 4.5 27 Differential/ SMT 13 x 9.1 x 2.8
Single-ended
M37040 Quad 4 x 28G CDR 28 4 0.9 — Differential/ LFGA
Differential
M37046 Quad 4 x 28G CDR 28 4 0.9 — Differential/ CSP
Differential
Drivers for Metro (CFP, CFP2)
MAOM-003427 Quad Channel 46 Gbps Linear MZ Modulator Driver 46 4 5 23 Differential/ SMT 13 x 19 x 2.46
Single-ended
MAOM-003418 Quad Channel 46 Gbps Linear MZ Modulator Driver 46 4 5 21 Differential/ SMT/GPPO 41 x 29 x 6.4
Single-ended
MAOM-003405 Quad Channel 32 Gbps Limiting MZ Modulator Driver 32 4 7 27 Differential/ SMT 13 x 19 x 2.46
Single-ended
MAOM-003407 Quad Channel 32 Gbps Linear MZ Modulator Driver 32 4 6 27 Differential/ SMT 13 x 19 x 2.46
Single-ended
MAOM-003414 Quad Channel 32 Gbps Linear MZ Modulator Driver 32 4 6 21 Differential/ SMT/GPPO 41 x 29 x 6.4
Single-ended
MAOM-003107 Dual Channel 32 Gbps Limiting MZ Modulator Driver 32 2 8.2 30 Single-ended/ SMT 16.1 x 10.6 x 3.42
Single-ended
MAOM-003108 Dual Channel 32 Gbps Limiting MZ Modulator Driver 32 2 6 27 Differential/ SMT 10 x 10 x 2.3
Single-ended
MAOM-002105 32 Gbps Limiting MZ Modulator Driver 32 1 7.5 30 Single-ended/ SMT 14.4 x 7 x 2.3
Single-ended
MAOM-010567 10 Gbps Limiting MZ Modulator Driver 10 1 8 30 Single-ended/ SMT 11.4 x 8.9 x 1.4
Single-ended
Data Rate Max Output Max Input/Output Package TypePart Max Channels Voltage Small Signal Interface and SizeNumber Description (Gbps) (#) (Vpp) Gain (dB) (mm)
Drivers for Long Haul
Client Side EML Drivers and Retimers (LR4, ER4)
MAOM-37051A Quad channel 25/28 Gbps CDR 28 4 2.5 0.1 Differential/ SMT 11 x 7 x 1.4
with EML Driver Single-ended
M37047 Four Channel 25G / 28G CDR with EML Driver 28 4 1.2 — Differential/ CSP 4 x 4.5 Single-ended
MAOM-003401 Quad channel 28 Gbps EML Driver 28 4 1.8 0.7 Differential/ SMT 10 x 10 x 1.4
Single-ended
MAOM-002203 28 Gbps EML Driver 28 1 2.5 0.5 Differential/ SMT 4 x 4 x2.3
Single-ended
MAOM-002200 28 Gbps EML Driver 28 1 2.5 0.5 Differential/ SMT 4 x 4 x 1.45
Single-ended
M37040 Quad 4 x 28G CDR 28 4 0.9 — Differential/ LFGA
Differential
M37046 Quad 4 x 28G CDR 28 4 0.9 — Differential/ CSP
Differential
OptoBrochure_031416_final_r1_Layout 1 3/14/16 12:30 PM Page 10
Optoelectronic & Photonic Applications
11
M02067 Laser Driver 2.1 3.3 1 85 4 mm QFN
M02066 Laser Driver 2.5 3.3 1 85 4 mm BCC+24L
M02090 Burst Mode Laser Driver/Limiting Amplifier 2.5 3.3 1 100 5 mm QFN
M02098 Burst Mode Laser Driver/Limiting Amplifier 2.5 3.3 1 100 5 mm QFN
M02099 Burst Mode Laser Driver/Limiting Amplifier 3.1 3.3 1 100 4 mm QFN + DDMI controller & APD DC-DC Controller
M02100 Burst Mode Laser Driver/Limiting Amplifier 3.1 3.3 1 100 4 mm QFN + DDMI controller & EEPROM
Part Max Data Rate Supply Channels Max Output Number Description (Gbps) Voltage (V) (#) Mod Current (mA) Package
M02027 Multirate CMOS TIA with AGC 3.1 42 1.5 4 91 CONTACT MACOM
M02014 AGC Pre-Amplifier 2.488 11 1.4 4 250 -26.5 —
M02015 AGC Pre-Amplifier 2.488 9 1.4 4 290 -26 —
M02024 AGC Pre-Amplifier 2.488 51 1.27 4 180 -28 —
M02035 Burst Mode OLT TIA 2.488 3.6 1.7 1.5 250 — -33
M02013 AGC Pre-Amplifier 3.125 10 2.4 4 475 -23 —
M02025 CMOS TIA with AGC 3.2 20 1.45 4 120 -30 —
M02129 CMOS TIA with AGC 8.5 2 7.8 3 1200 -18 -25
M02036 Burst Mode GPON OLT TIA 1.25 3.8 0.8 2.5 170 — -35
Data Rate Differential Small Signal Input Input Optical OpticalPart Max Transimpedance Bandwidth Overload Referred Noise Sensitivity SensitivityNumber Description (Gbps) Gain (kohm) (GHz) Current (mA) (IRN, RMS nA) with PIN (dBm) with APD (dBm)
GPON TIAs and Drivers
131D-02E-VCT11-50x Die, laser, 2.5G DFB NFF, small size, chip on tape 2.5 1310 -20 to 85 Die
131D-02E-VT5TB-50x TO, laser, 2.5G DFB NFF, 2 mm ball lens (6.6mm FL), pinout type B 2.5 1310 -20 to 85 TO-Can
131D-02E-VT5MB-502 TO, laser, 2.5G DFB NFF, 2 mm ball lens (6.7mm FL), pinout type B 2.5 1310 -20 to 85 TO-Can
131D-02E-LCT11-50x Die, laser, 2.5G Std DFB, chip on tape 2.5 1310 -20 to 85 Die
131A-02I-ACT11 Die, APD, 2.5G, chip on tape — — — Die
131A-02I-AT4GR TO, 2.5G APD+TIA TO-46 2.5 1310 -40 to 85 TO-46
131P-10I-SCT11 Die, PIN for STIA, chip on tape 2.5 1310 -40 to 85 Die
131P-02I-ST4GP TO, PIN+STIA, 2.5G 2.5 — — TO-Can
Part Max Data Rate Wavelength Temp Options Number Description (Gbps) (nm) (°) Package Type
Part Max Data Rate Wavelength Temp Options Number Description (Gbps) (nm) (°) Package Type
GPON
EPON
131F-02I-KCT11 Die, laser, 2.5G FP NFF, chip on tape 2.5 1310 -40 to 85 Die
131F-02I-KT5SB TO, laser, 2.5G FP NFF, 1.5 mm ball lens (6.6 mm FL), pinout type B 2.5 1310 -40 to 85 TO-46
OptoBrochure_031416_final_r1_Layout 1 3/14/16 12:30 PM Page 11
Optoelectronic & Photonic Applications
12
M02067 Laser Driver 2.1 3.3 1 85 4 mm QFN
M02066 Laser Driver 2.5 3.3 1 85 4 mm BCC+24L
M02090 Burst Mode Laser Driver/Limiting Amplifier 2.5 3.3 1 100 5 mm QFN
M02098 Burst Mode Laser Driver/Limiting Amplifier 2.5 3.3 1 100 5 mm QFN
M02099 Burst Mode Laser Driver/Limiting Amplifier 3.1 3.3 1 100 4 mm QFN + DDMI controller & APD DC-DC Controller
M02100 Burst Mode Laser Driver/Limiting Amplifier 3.1 3.3 1 100 4 mm QFN + DDMI controller & EEPROM
Part Max Data Rate Supply Channels Max Output Number Description (Gbps) Voltage (V) (#) Mod Current (mA) Package
M02016 AGC Pre-Amplifier 1.25 24 1 4 130 -29l —
M02026 CMOS TIA with AGC 1.25 112 1.05 4 120 -31 —
M02028 CMOS TIA with AGC 1.25 24 1.3 4 80 -31 —
M02038 Burst Mode GEPON OLT TIA 1.25 8.5 0.85 4 350 — -34
Data Rate Differential Small Signal Input Input Optical OpticalPart Max Transimpedance Bandwidth Overload Referred Noise Sensitivity SensitivityNumber Description (Gbps) Gain (kohm) (GHz) Current (mA) (IRN, RMS nA) with PIN (dBm) with APD (dBm)
EPON TIAs and Drivers
M02180 Burst Mode Laser Driver/Limiting Amplifier 12.5 — CONTACT MACOM — — + Rx CDR + DDMI Controller + APD DC-DC Controller & EEPROM
M02172 EML Driver 11.3 3.3 1 2.5 5 mm QFN
Part Max Data Rate Supply Channels Max Output Number Description (Gbps) Voltage (V) (#) Mod Current (mA) Package
M02139 TIA with AGC 10.312 2.5 7.5 2.5 1500 -20 -27
Data Rate Differential Small Signal Input Input Optical OpticalPart Max Transimpedance Bandwidth Overload Referred Noise Sensitivity SensitivityNumber Description (Gbps) Gain (kohm) (GHz) Current (mA) (IRN, RMS nA) with PIN (dBm) with APD (dBm)
10G-PON Laser Drivers and TIAs
M02097 LED Driver/Limiting Amplifier 0.5 3.3, 5 1 120 5 mm QFN
M02068 622 Mbps, Laser Driver 1 3.3 1 85 4 mm BCC+24L
M02094 VCSEL/FP Laser Driver 2 3.3, 5 1 45 4 mm QFN
M02067 Laser Driver 2.1 3.3 1 85 4 mm QFN
M02066 Laser Driver 2.5 3.3 1 85 4 mm BCC+24L
M02077 Laser Driver/Limiting Amplifier 3.1 3.3 1 100 4 mm QFN
M02076 Laser Driver/Limiting Amplifier 3.1 3.3 1 100 4 mm QFN + DDMI controller & APD DC-DC Controller
M02170 Laser Driver 11.3 3.3 1 100 5 mm QFN
M02171 Dual Loop VCSEL Driver 11.3 3.3 1 25 5 mm QFN
M02172 EML Driver 11.3 3.3 1 2.5 5 mm QFN
M02190 DML Laser Driver/Limiting Amplifier 12.5 3.3, 2.5 1 80 4.5 mm QFN with Integrated Tx/Rx CDR
M02193 DDMI Controller + EEPROM 13.5 3.3, 2.5 1 80 4.5 mm QFN & APD DC-DC Controller
M02095 2.5 Gbps, 3.3/5 V Laser Driver/Limiting Amplifier 1.25 3.3, 5 1 85 5 mm QFN
M02096 2.5 Gbps, 3.3/5 V Laser Driver/Limiting Amplifier 4.3 3.3, 5 1 85 5 mm QFN
Part Max Data Rate Supply Channels Max Output Number Description (Gbps) Voltage (V) (#) Mod Current (mA) Package
Laser Drivers, Post Amplifiers, and TIAs for SFF/SFP/SFP+ Modules (Wireless Mobile, Ethernet, FibreChannel, SONET)
OptoBrochure_031416_final_r1_Layout 1 3/14/16 12:30 PM Page 12
13
Optoelectronic & Photonic Applications
MASC-37028 Dual 28G CDR with integrated laser driver (24G to 26.5G) 28 3.3 / 1.8 2 11 5m LGA
MASC-37029 Dual 28G CDR with integrated laser driver (25.5G to 28.1G) 28 3.3 / 1.8 2 11 5m LGA
Part Max Data Rate Supply Channels Max Output Number Description (Gbps) Voltage (V) (#) Mod Current (mA) Package
M03002 28 Gbps TIA 28 CONTACT MACOM 21 CONTACT MACOM 1.4 CONTACT MACOM
Data Rate Differential Small Signal Input Input Optical OpticalPart Max Transimpedance Bandwidth Overload Referred Noise Sensitivity SensitivityNumber Description (Gbps) Gain (kohm) (GHz) Current (mA) (IRN, RMS nA) with PIN (dBm) with APD (dBm)
Laser Drivers and TIAs for SFP28 (Wireless Mobile, Ethernet, and FibreChannel)
M02006 AGC Pre-Amplifier 0.155 260 0.1 2.2 8 -39 —
M02007 AGC Pre-Amplifier 0.156 62 0.14 2.8 8 -39 —
M02009 AGC Pre-Amplifier 0.622 36 0.4 4.5 70 -32 —
M02011 AGC Pre-Amplifier 0.622 65 0.6 4 50 -34 —
M02016 AGC Pre-Amplifier 1.25 24 1 4 130 -29l —
M02026 CMOS TIA with AGC 1.25 112 1.05 4 120 -31 —
M02028 CMOS TIA with AGC 1.25 24 1.3 4 80 -31 —
M02036 Burst Mode GPON OLT TIA 1.25 3.8 0.8 2.5 170 — -35
M02038 Burst Mode GEPON OLT TIA 1.25 8.5 0.85 4 350 — -34
M02014 AGC Pre-Amplifier 2.488 11 1.4 4 250 -26.5 —
M02015 AGC Pre-Amplifier 2.488 9 1.4 4 290 -26 —
M02024 AGC Pre-Amplifier 2.488 51 1.27 4 180 -28 —
M02035 Burst Mode OLT TIA 2.488 3.6 1.7 1.5 250 — -33
M02013 AGC Pre-Amplifier 3.125 10 2.4 4 475 -23 —
M02025 CMOS TIA with AGC 3.2 20 1.45 4 120 -30 —
M02020 CMOS TIA with AGC 4.25 3.6 3.4 4 550 -23 -29
M02139 TIA with AGC 10.312 2.5 7.5 2.5 1500 -20 -27
M02129 TIA with AGC 8.5 2 7.8 3 1200 -18 -25
M02027 Multirate CMOS TIA with AGC 3.1 42 1.5 4 91 CONTACT MACOM
Data Rate Differential Small Signal Input Input Optical OpticalPart Max Transimpedance Bandwidth Overload Referred Noise Sensitivity SensitivityNumber Description (Gbps) Gain (kohm) (GHz) Current (mA) (IRN, RMS nA) with PIN (dBm) with APD (dBm)
Laser Drivers, Post Amplifiers, and TIAs for SFF/SFP/SFP+ Modules (Wireless Mobile, Ethernet, FibreChannel, SONET) cont’d
131F-10I-LCT11-S Die, laser, 10G FP, chip on tape 10 1310 -40 to 85 Die
131F-10I-LCT11-506 Die, laser, 10G FP, chip on tape 10 1310 -40 to 85 Die
131F-10I-LT5HC-50x(1) TO, laser, 10G FP, 1.5 mm ball lens with offset, pinout type C 10 1310 -40 to 85 TO-56
127D-10I-LT5AC-501 TO, laser, 10G DFB, 1270±10 nm, Asph lens, pinout type C 10 1270 -40 to 85 TO-56
133D-10I-LT5AC-501 TO, laser, 10G DFB, 1330±10 nm, Asph, lens, pinout type C 10 1330 -40 to 85 TO-56
Mobile (4G-LTE)
Part Max Data Rate Wavelength Temp Options Number Description (Gbps) (nm) (°) Package Type
OptoBrochure_031416_final_r1_Layout 1 3/14/16 12:30 PM Page 13
131F-02I-LCT11 Die, laser, 2.5G FP, chip on tape 2.5 1310 -40 to 85 Die
131F-02I-LT5LB TO, laser, 2.5G FP, 1.5 mm ball lens (6.35 mm FL), pinout type B 2.5 1310 -40 to 85 TO-56
131F-02I-LT5KB TO, laser, 2.5G FP, 1.5 mm ball lens (5.8 mm FL), pinout type B 2.5 1310 -40 to 85 TO-56
131D-10G-LT5RC-S TO, laser, 10G DFB, 2 mm ball lens, WL=±10 nm, pinout type C 10 1310 -5 to 85 TO-56
131D-10I-LT5RC-S TO, laser, 10G DFB, 2 mm ball lens, WL=±10 nm, pinout type C 10 1310 -40 to 85 TO-56
131D-25C-LCT11-502 Die, laser, 25G DFB, WL=±10 nm, chip on tape 25 1310 0 to 70 Die
Optoelectronic & Photonic Applications
M21450 2 x 2 6.5 1.2 2 No No 6 mm 40-pin QFN
M21030 4 x 4 6.5 1.2 4 No No 6 mm 40-pin QFN
M21451 4 x 4 6.5 1.2 4 No No 6 mm 40-pin QFN
M21452 8 x 8 6.5 1.2 8 No No 10 mm 72-pin QFN
M21453 12 x 12 6.5 1.2 12 No No 12 mm 88-pin QFN
M23636 36 x 36 6.5 1.2 36 No — 23 mm 484-pin BGA
M21148 48 x 48 6.5 1.2 48 No No 27 mm 676 pin BGA
M21147 80 x 80 6.5 1.2 80 No No 35 mm 1156-pin FCBGA
M21167 160 x 160 6.5 1.2 160 No No 35 mm 1936-pin FCBGA
M21440 8 x 8 10.312 1.2 8 Yes Yes 12 mm 88-pin QFN
M21441 12 x 12 10.312 1.2 12 Yes Yes 19 mm 324-pin BGA
M20001 2 x 2 12.5 3.3 2 No No 3 mm 16-pin QFN
M21024 24 x 24 12.5 1.2 24 No No 21 mm 396-pin BGA
M21036 36 x 36 12.5 1.2 36 No No 23 mm 480-pin BGA
M21048 48 x 48 12.5 1.2 48 No No 27 mm672-pin BGA
M21080 80 x 80 12.5 1.8 80 No No 45 mm 1924-pin FCBGA
M21601 120 x 120 12.5 1.8 120 No No 45 mm 1924-pin FCBGA
M21605 160 x 160 12.5 1.8 160 No No 45 mm 1924-pin FCBGA
MAXP-37161 16 x 16 28.05 1.8 16 Yes No 15 mm 196-pin BGA
Switch Max Data Rate Supply Channels Embedded EmbeddedPart Number Matrix Size (Gbps) Voltage (#) CDR SerDes Package
Line Cards
14
Part Max Data Rate Wavelength Temp Options Number Description (Gbps) (nm) (°) Package Type
Single Channel 2.5G SFP
Single Channel 10G 10 km SFP
Single Channel SFP28
OptoBrochure_031416_final_r1_Layout 1 3/14/16 12:30 PM Page 14
3 mm QFN
4 mm QFN
5 mm QFN
10 mm 72-pin QFN
Surface Mount Devices (SMD)
Modules
Optoelectronics
Photonics
ROSA & TOSA (Optical Sub Assemblies)
3 mm QFN
4 mm 24-pin QFN
6 mm 10-pin QFN
10 mm 72-pin QFN
12 mm 88-pin QFN
17 mm 252-pin BGA
19 mm 324-pin BGA
21 mm 484-pin/ 1924-pin BGA
23 mm 484-pin /1924-pin BGA
23 mm 404-pin PBGA
27 mm 676-pin BGA
34 mm PBGA
35 mm 1156-pin BGA
35 mm 676-pin TEPBGA
35 mm 1936-pin FCBGA
50 mm 2389-pin BGA
Crosspoint Switches
Die
TO-Can TO56, TO46
L PIC , PIC
Package Guide
15
OptoBrochure_031416_final_r1_Layout 1 3/14/16 12:30 PM Page 15
Additional product information can be found on our website at www.macom.com
Contact our worldwide sales offices, authorized representatives,and industry-leading distributors to request samples, test boards,and application support.
All contacts are listed on our website at:
www.macom.com/purchases
M/A-COM Technology Solutions Inc.
Lowell, Massachusetts 01851North America 800.366.2266 • Europe +353.21.244.6400India +91.80.43537383 • China (Shanghai) +86.21.5108.6464
www.macom.com
MTS-L-032016
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