NeSSI*: Shiftin’ Gears“Moving to the Project Stage”
CPAC - Seattle, WA - May 6, 2002
Rob Dubois - Peter van Vuuren - Jim Tatera .
CPC
“the best way to predict the future is to create it”
Tatera and Associates
*New Sampling/Sensor Initiative
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Presentation Outline
Summary of NeSSI Objectives & Drivers Activities Update [Quick] Gen I, II, III Comparison Project Plans Progress Rating of Gen II Elements Installs & Late Breaking Developments Summary and Acknowledgements
Courtesy of Owen Beattie,
University of Alberta, Canada
Question:
Is Process Analytical frozen in time?
Answer:
No! A renaissance is in progress.
John Torrington Chief Petty Officer on the HMS Terror - preserved in the permafrost. Victim of lead poisoning.
”The Franklin Expedition” d. 1846 (age 20)
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NeSSI Structure
An ad hoc global industry initiative, formed in June, 2000 to drive permanent change in how we do Process Analysis. NeSSI mail-out has now grown to 300+
subscribersRepresents over 31 End Users from Oil and
Petrochemical as wells as Manufacturing Companies, Academia, National Labs, etc.
Center for Process Analytical Chemistry (CPAC) is our sponsor and legal umbrella
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NeSSI Objectives
Facilitate the acceptance/implementation of... modular, miniature & smart process
analytical technology Promote the concept of...
at the pipe/field-mounted (“byline”) analytical systems
Lay the groundwork for... open connectivity communication architecture
Provide a technology bridge to the process for... “sensor/lab-on-a-chip” microanalytical devices
6* Posted on CPAC website
Activities Update
Activities since Fall CPAC, 2001 Tutorial - INTERMAC November, 2001 [Tokyo] Plenary Paper, Session & Roundtable - IFPAC Jan2002 [San
Diego]* Talk - IEC SC65D Maintenance Mtg, Feb. 2002 [Frankfurt] “UMIX” & Workshop Pittcon March, 2002 [New Orleans]* Talk: IEC SC65D Full Committee Mtg, April, 2002 [Beijing] Tutorial & Session - ISA Analytical Div. April, 2002 [Denver] X-team (hazardous area focus group) activities completed NeSSI Marketing Survey - Included in AD newsletter
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NeSSI Generation Segmentation Pyramid
Gen III
Gen II
Gen IMechanical (mostly)
Electrical/Smart (Diagnostic)
MicroAnalytical & WirelessValue
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Gen I - Mechanicalminiature, modular footprint
Adapted from the semicon industry
LEGO® like designISA SP76 Standard
Courtesy of Swagelok
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Gen II SystemPlug and Play Electrical
Programmable Substrate Heater
VP
A
F
Ethernet LAN
Analyzer
Controller or PC
SAM
CANbus
PDA
Auxiliary Heating/Cooling
SubstrateT
T
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Gen III SystemPlug & Play Analytical
SAM
Fiber Optic
AT
One sensorper component“lab on a chip”
One Sensor and Multiple Analytes
Ethernet LANEnabling Technology
for Analytical
VTA
A
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Gen III Plug & Play Wireless Signal
Ethernet LAN
VTP
A
Bluetooth , 802.11 Wi-Fi Power Supplied by...
X-proof MINI bus ...or IS miniature power bus
P.S.
SAM
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Gen I Installs & Tests in progress...
Coutesy of a
gulf coast
petrochemical facility
Courtesy of an east coast petrochemical facility
and Parker-Hannifin
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Gen II Development CampaignLead - Honeywell Labs/Ulrich Bonne
1. Finalize NeSSI Gen II spec2. Fabricate an alpha unit. Lab
evaluate. 3. Fabricate 10-20 beta units. Field
tests years 20044. 2005 Commercial Product available
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Gen II DevelopmentInvolvement and Funding
$1-2M funding request to DoE-OIT Submit White Paper (June 2002)
50% of funding to be borne by “prototype testers” as “work in kind” commitment of $50K/participant ExxonMobil Chemical, Air Products,
ChevronTexaco, Honeywell, Dow We would like 10-20 participants!
Possibly other funding sources (eg ATP)
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Generation II DimensionsProgress to Date...
1. Programmable Substrate2. mini-Sensors3. “Combi” Valve
4. SAM - Sensor/Actuator Manager 5. PC/PDA with HMI* [Wireless]6. Multi-Drop IS Bus7. Micro Climate Enclosure
* HMI = Human Machine Interface
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1. Programmable substrate temp.IEC Ex d Div/Zone 1 Haz. Locations
AC PowerAC Power
Purpose
Maintain the substrate/sample at the appropriate temperature to maintain dewpoint and optimize & simplify sample heating. Improve reliability, minimize utility load and reduce LTCO.
Strengths
Available from certain “solid block” substrate mfgs.
Commercial technology avail.
Weaknesses
Difficult to implement in substrate suspended designs
No IS version of control portion4/10
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2. mini-SensorsIEC Ex ia (low power) Haz. Location
FLOW
PRESSURE
TEMP
Substrate
A/D
Comm.
µP
Mem
ory
A
4/10
PurposeProvides measurements for validation and control. Simplify andstandardize. Lower cost implementation. Increase reliability by increased vigilance of the system and reduce maintenance by predictive as opposed to preventive maintenance.
StrengthsExcellent results from Honeywell - thisappears to be the genesis of process readymini instrumentation suitable for use in hazardous locations. Suspect wide applicability in industry as well as analytical. Enables plug and play with extremely low power.
WeaknessesCurrently untried in industry. We need toknow the operating characteristics such asrange, accuracy, robustness, etc.
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3. “COMBI” ValveIEC Ex ia Low Power Haz. Location
A
Actuator
Instrument Air
Valve
Vent
Vent
Comm.
D/A
Solenoid
Pneumatic valve
3/10
Purpose
On/off and/or modulation of sample and validation fluids. Combining a pneumatic valve and solenoid in one package simplifies design. Low power gives plug and play & multi-drop capabilities. Safe design reduces maintenance.
Strengths
Some commercial products for the pilot valve are available. C/w haz. certifications and very low (1.45 mA) power drain.
Weaknesses
No one has integrated this product into a 1.5” substrate.
No modulation product.
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4. Sensor/Actuator ManagerEx d microPC c/w CE operating system
Gateway to an
Ethernet LAN
Host to a
Sensor/Actuator Bus
Wireless Field
Interface to HMI
Software Applets “Open” Development Space
3/10
PurposeStandardizes repetitiveoperating tasks and providesnetworking hardware.
StrengthsSimplify maintenance across all platforms. Reduces design engineering.
Weaknesses- Competes with some product offerings of existing analytical mfgs.- No standards for applets - foundation like organization req. for over-sight. - Cost and size must be minimized. Remains to be seen if this can be accomplished.
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5. Graphical HMI*Intrinsically Safe Field PC/PDA
PDA/PC
HMI
VTP
A
* HMI = Human Machine Interface
Purpose
Allows field adjustment and interrogation of an analytical system. (mimics remote PC)
Simplifies and uncomplicates maintenance by standardizing interface.
Strengths
Commercial Intrinsically Safe PC’s, PDA’s available. One unit may service many field devices.
Weaknesses
Haven’t set whether IrDA, Bluetooth or Wi-Fi wireless.
Need standard way to do HMI software. Oversight needed.
SAM
5/10
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6. Serial Multi-drop BusEx ia Intrinsically Safe
VTP
A
CANbus
Purpose
Simplify maintenance. Vendors can sell their product with “value added” software applets on board their devices. Plug and Play with no gas test.
Strengths
Many existing multi-drop buses and software. DeviceNet has critical mass in the industry for a bit bus. Low cost.
Weaknesses
Confusion and lack of thrust on identifying an IS product (and cost) to do this properly.
2/10
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7. MicroClimate Enclosure
Div/Zone 1GP. A-D, T4
PurposeProvides a practical temperature controlled microenvironment tohandle sampling and analyticalequipment in varied climatic conditions “in the field”. Simplifies design.
StrengthsAll technology available to implement.Simplifies design by standardizing onan area classification inside the enclosure which accounts for any hazardous fluid leakage.
WeaknessesCooling not addressed at this time.
6/10
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The Race to the PipeWhat will it be? An In-ey or Out-ey? Suggest both...
“Like a thermocouple”
[in situ - inline]
In-ey
“Like a pressure transmitter”
[ex situ - byline]
Out-ey
Analytical sensor (typ.)
tx
tx
SS
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AcknowledgementsEnd Users
Dow Danny Quevillon Reg Hartwig Bac Vu (SP76) Craig Snook Walter Henslee
Air Products Frank Schweighardt
ChevronTexaco D. Nettles/D. Young
ExxonMobil Chemical Dan Podkulski (SP76) Jeff Gunnell John Cumbus Rajko Puzic Kelley Bell
Honeywell Kenneth Creasy John Mosher Ulrich Bonne Bob Nickels