Department of Electrical and Computer Engineering
SDP team Yngvesson
Ioan TiheneaTomas Broka
Dmitriy StupakSergey Derivolkov
IR CARBON NANO-TUBE TRANCIEVER
Department of Electrical and Computer Engineering
Outline Recap Design Overview System Overview Signal Processing Block (Transmitter End) Transceiver Signal Processing Block (Receiver End) Suspension Method Fabrication Techniques Used Current Status and Group Breakup Questions
Department of Electrical and Computer Engineering
Recap Design OverviewFor our Senior Design Project we are working
on creating a communication system that has two computer interface terminals, some signal processing at each end and an Infrared communication channel (transceiver) in the center.
The key component to our SDP project is a Single Walled Carbon Nanotube (SWNT) thin film detector detecting IR radiation which changes the resistivity across it; this will be interpreted in binary values.
Department of Electrical and Computer Engineering
Outline Recap Design Overview System Overview Signal Processing Block (Transmitter End) Transceiver Signal Processing Block (Receiver End) Suspension Method Fabrication Techniques Used Current Status and Group Breakup Questions
Department of Electrical and Computer Engineering
System OverviewComputer Interface
Signal Processing
Transceiver
Computer Interface
Signal Processing
Input from keyboard by user CPU
USB Interface
Software
MultiprocessorDigital to
Analog circuit
Focusing Lenses
USB Cable
IR Radiation
2 wire cable
Legend
Bolometer Analog to Digital Circuit
Multiprocessor
USB Interface
CPU Display
Software
System Block Diagram
LED emiter SWNT film Detector
Department of Electrical and Computer Engineering
Outline Recap Design Overview System Overview Signal Processing Block (Transmitter End) Transceiver Signal Processing Block (Receiver End) Suspension Method Fabrication Techniques Used Current Status and Group Breakup Questions
Department of Electrical and Computer Engineering
Signal Processing Block (Transmitter End)
Microcontroller IR LED and Circuitry Silicon Laboratories SiLabs C8051F340 USBXpress
Department of Electrical and Computer Engineering
Outline Recap Design Overview System Overview Signal Processing Block (Transmitter End) Transceiver Signal Processing Block (Receiver End) Suspension Method Fabrication Techniques Used Current Status and Group Breakup Questions
Department of Electrical and Computer Engineering
Transceiver
Department of Electrical and Computer Engineering
Outline Recap Design Overview System Overview Signal Processing Block (Transmitter End) Transceiver Signal Processing Block (Receiver End) Suspension Method Fabrication Techniques Used Current Status and Group Breakup Questions
Department of Electrical and Computer Engineering
Signal Processing Block (Receiver End)
Amplifier and Comparator Circuitry for clean pulses Microcontroller
Department of Electrical and Computer Engineering
Outline Recap Design Overview System Overview Signal Processing Block (Transmitter End) Transceiver Signal Processing Block (Receiver End) Suspension Method Fabrication Techniques Used Current Status and Group Breakup Questions
Department of Electrical and Computer Engineering
Suspension Method
Fabrication of Supporting Washer
Electrical Contacts Connecting SWCN Film
to Supporting Washer
Department of Electrical and Computer Engineering
Outline Recap Design Overview System Overview Signal Processing Block (Transmitter End) Transceiver Signal Processing Block (Receiver End) Suspension Method Fabrication Techniques Used Current Status and Group Breakup Questions
Department of Electrical and Computer Engineering
Fabrication Techniques Used Plasma etching premade film
• Film was placed in oxygen plasma to etch down to required thickness.
Vacuum filtration method• Pour CNT solution onto membrane and vacuum non-CNT
liquid out. Then dissolve membrane. Dry drop method
• Place electrical contacts on glass slides and putting drops of the CNT solution between them.
Department of Electrical and Computer Engineering
SEM Image
Department of Electrical and Computer Engineering
Outline Recap Design Overview System Overview Signal Processing Block (Transmitter End) Transceiver Signal Processing Block (Receiver End) Suspension Method Fabrication Techniques Used Current Status and Group Breakup Questions
Department of Electrical and Computer Engineering
Group BreakupSergey Derivolkov, EE: Designed the system overview and helped provide more efficient procedures for the
fabrication. Also used SEM to take pictures of the NanoComp film and measured the thickness.
Dmitriy Stupak, EE: Designed the circuitry to test the film resistivity and the effects of IR radiation. He
also joined Ioan during plasma etching procedure and used Profilometer to measure the thickness of the etched film.
Tomas Broka, CSE: Worked on fabrication procedure for the first couple films. Tomas also set up the
website of the team and he is in charge of ordering components, equipment, and keeps contacts up to date through emails and through the website. Also he worked with SEM to take images.
Ioan Tihenea, EE: Worked on plasma etching procedure for the film offered by NanoComp. He used
Atomic Force Microscope (AFM) to take images of the films surface. He also was involved as well as Tomas in the fabrication.
Department of Electrical and Computer Engineering
Outline Recap Design Overview System Overview Signal Processing Block (Transmitter End) Transceiver Signal Processing Block (Receiver End) Suspension Method Fabrication Techniques Used Current Status and Group Breakup Questions
Department of Electrical and Computer Engineering
Questions
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Department of Electrical and Computer Engineering
SiLabs C8051F340 Microcontroller• 48 MIPS 8051 CPU• 64 kB Flash memory• 4352 B RAM• USB 2.0• Integrated transceiver• Integrated clock recovery• 4 kB buffer RAM• Full (12 Mbps), or low-speed operation
• Control endpoint plus six bi-directional endpoint pipes
• 10-bit, 200 ksps ADC• Two asynchronous comparators • Voltage reference • Temperature sensor • 40 Digital I/O