Hybrid Pixel R&D After BTeV
• As of two years ago:– FNAL-designed readout chip had two minor fatal
flaws.– No system demonstration had yet been done.
• An “extended closeout” R&D program was approved– 1 more readout chip submission.– Pixel R&D refocused on ILC.– Two system tests approved:
• Telescope for the forward direction of PHENIX (at RHIC)• Test beam telescope
– Both efforts in collaboration with LANL & Columbia U.
Sensor & FPIX2.1 wafers
Sensor wafers produced for PHENIX by CiS (LANL has agreed to donate
the x4 sensors for use in MTest)
FPIX2.1 fabricated on wafer with “TripT” for D0; fatal flaws fixed; 11 wafers
purchased by LANL for PHENIX, 11 by FNAL to support R&D - 2 required for
MTest telescope.
Sensors & ROCs probed – yield is high
260945-12 sensor 06 11_06 UNM
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V (volts)
I (nA)Series1
Typical FPIX2.1 wafer map
Typical sensor IV curve
Hybridization – solder bump bonding done by VTT (Finland)
X-ray made at FCC
VTT bump-deposition process flow
Production orders placed ~10/15/07Delivery of hybrids is the schedule
driver.
Half-plane = three 1x4 modules
Station = two half-planesoffset by active area of sensor
read out by 1 FPGA
2 stations upstream of DUT & 2-4 downstream
(precision x & precision y)
Test beam telescope
MT6-1A Assets
• Climate controlled hut.• Aluminum table on rails allows entire setup to be
removed from beam.• Dark box with feed throughs for signals, power,
& cooling fluid.• Remotely controlled motors determine (x,y)
position of both ends of box.• Local chiller provides closed loop cooling system• CAEN power system can provide LV & sensor
bias (“HV”).• Plenty of quiet power is available.
Schedule
• Goal = installation in February 2008 (depends on delivery of bump bonded hybrids).
• First user = LHCb.• Hybrid pixel telescope will measure every
beam particle with good timing and moderate precision (5-10 m).
• Anticipate the addition of one station with very high precision (& probably much less good time resolution), such as MAPS.