MAY 2017
ENVISION HDI 7833Direct Metallization with Conductive Polymerfor Rigid and Flex Printed Circuitry
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ENVISION HDI
Polyimide & All Resin Conditioner 8511
Envision Catalyst 7833(steady state)
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ENVISION HDI
Direct Metallization Alternatives to E’less Cu
- Pd Seeding� activation on dielectrics & copper curfaces� etch-back removal of activated copper surfaces
- Graphite- & Carbon Activation � activation on dielectrics & copper curfaces� etch-back removal of activated copper surfaces
- Intrinsic Conductive Polymer (ICP)� activation on Dielectrics Only
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no deposition on IL/OL copper
• Selective Activation (HDI)- dielectrics only
laminate resinglass surfaces
• Non-Selective Activation- full hole wall
laminate resinglass reinforcementcopper surface
mandatory: copper microetch
ENVISION HDI
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ENVISION HDI
Perfect Copper / Copper-Adhesion
�no innerlayer connectiondefects (ICD)
�excellent connection to capture pads
�high thermal stability.
�preferred withBlind Micro Vias (BMVs)
Selective Activation
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ENVISION HDI reaction sketch
- activation on dielectrics only· selective MnO2 formation (initiator)
- polymerization of· monomer - EDT· sulfonic acid - HAPSS
EDT
HAPSS
- Mn²+ / H2O
MnO2
R - SO3- H+
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ENVISION HDI
selective polymer formation
Step 1Conditioner
Step 2Initiator
Step 3Catalyst
selective EDT polymerization
on MnO2
ENVISION HDIConductive
Polymer film
uniform hole wall wetting /resin surface roughening
(PI)
selective coverage of resin
and glass
selective MnO2
formation on resin
and glass
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Properties of the ICP-film
• appearance- uniform dark greenish to anthracite/darkblue- thickness approximately 100 nm
• characteristics- high mechanical stability - thermal stability (400°C)- conductivity approx. 0.001 S/cm
• stability- sensitive to chemical oxidation (or reduction)- marginal loss of conductivity- holdtime: best before one week
ENVISION HDI
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MachiningPlasma / Desmear
(for MLB only)
Direct Metallization Cu Plating
PI Conditioner
8511
“STD” Alternative 7310/7311
Initiator
7320
Catalyst
7833Steady state mode
Polyimide activation /
adsorption only
(e.g. FR4)
MnO2 formation on resin Conductive Polymer
on Resin
Easy and Robust Process
Sub-Module 2 Sub-Module 3Sub-Module 1
ENVISION HDI
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ENVISION HDI
CONDITIONER OPTIONS
� conditioner equipment: all standard-equipment, vertical or horizontal.
� ENVISION COND-7310 : micro vias (< 0.15 mm)blind microvias (< 120 µm Ø)
� ENVISION COND-7311 : broad laminate mix, including PTFE,high-Tg FR-4 etc., in particular with MV / BMV
� ENVISION COND 8511 : all polyimide materials, any laminate,rigid-flex layups
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ENVISION HDI cond. systems
Conditioner system Components Comments
7310 A adsorbant (glass)
B wetting agent
Na2CO3
alkaline, historical conditioner
globally releasedappl preferred in Asia
(KSG/ABM only part A)
7311 7310 A
7310 B
H2SO4
CuSO4
acidic
globally released
higher MnO2 uptake
NaPS can be added (softetch)
8505 (flex precond) Enthone KOH/ reductor special flex jobs JCD,Redboard
8510 (flex) sweller
pH 7 !
adhesive&adhesiveless
ACE,JCD,Redboard
only Asia released
8511 (flex & all lams) reductor,NaOH
sweller
novel allround product
to be globally released
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Features Attributes More Info
• engineeredchemistry and equipment
• single pass coverage
• no special req´s on tank & line • for all PI and any laminates
•standard conditioner temp. 45 oC• excellent coverage
• short process times • cost savings by low equipment
investment, less floor space• high productivity• reduced labor cost
• same dwell time as standard conditioner
• standard tank design• drops into existing horizontal and
vertical equipment• low start-up cost
• same conditions asstandard conditioner apply
Conditioner 8511 Process Features
ENVISION HDI
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ENVISION HDI
ENVISION INITIATOR 7320
• ENVISION OXY-7320 - sodium permanganate: potassium optional
• Equipment- horizontal- vertical (with modifications)
• Process Parameters- temperature 80-90 °C (for flex / rigid-flex materials)- temperature 60-70 °C (for acrylic based flex materials)- NaMnO4 concentration 100 (90-110) ml/l- boric acid 10 (8-15) g/l- pH 5.5 (5.0-6.5) adjustment with H2SO4- dwell time: 3 – 4 min vertical / 55 - 70 s horizontal
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Dielectric Activation with MnO 2
• factors of MnO 2 deposition
- laminate type- surface topography / morphology- initiator conditions (in descending order)
� temperature (exponential)� solution pH � immersion time� concentrations
• ICP Conductivity
- refrain from excessive / deficient MnO2 amounts(stick to control limits)
ENVISION HDI
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MnO2 Determination- process test coupon in cond/initiator- dissolve MnO2
(5% H2O2/10% H2SO4, 2 mins)- Mn analysis by AAS or ICP.- calculate MnO2 deposit
Control limits MnO 2 amounts- 2-8 mg/dm2
Coupon Design - Dimension 5x5 cm- 400-800 holes (e.g. 0,3 mm Ø)
Calculation(AAS-figure [mg/l]) x (Volume [ml]) x 1.584------------------------------------------------------------ = mg/dm2 MnO2Number of holes x Hole area [dm2 ]
ENVISION HDI
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ENVISION HDI
0
2
4
6
8
10
Influence of pH on Resistance and Lateral Cu-Growth
Resistance [ KOhm/inch ] 8,5 3,8 2,8 5,5
LCG [ mm/min ] 3,4 5,5 6,8 4,5
pH 8,5 pH 7,5 pH 6,0 pH 3,5
LCG:Lateral Cu Growth
Initiator pH and Conductive Layer Properties
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2 Components - EDT Monomer: ENVISION CAT-7833 Part A / AR - Sulfonic Acid: ENVISION CAT-7833 Part B /BR
Operating Parameters- temperature 15-20 °C- 7833 A-concentration 20 (20-30) ml/l- 7833 B-concentration 30 (20-80) ml/l - pH 1.8-2.2 adjust with H2SO4- Dwell time: 180-360 s vertical / 90-120 s horizontal- Bath life : steady state mode
Full Process Control- EDT by UV-spectroscopy (254 nm)- oligomer by UV-spectroscopy (870 nm)- sulfonic acid by UV-spectroscopy (227 nm)
ENVISION HDI 7833 Catalyst
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ENVISION HDI 7833 Catalyst (steady state)
Concentration
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ENVISION HDI 7833 Catalyst (LCG,Oli,load))
LSL of LCG
Oligomer formation: a mere timely function (must: feed on idle times > 3 days)
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plating time
15 s 30 s 60 s 90 s
Backlight check
ENVISION HDI
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AP-9121 adhesiveless
FQ-9121 acrylic adhesive
FNC-121 epoxy adhesive
ENVISION HDI flex apps
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ENVISION HDI flex apps
Initiator temperature / solder float
After solder float test:
288 oC / 10 s
60 oC 80 oC 90 oC
AP
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ENVISION HDI flex apps
• Polyimide multilayer: flex or rigid-flex (acrylic- or epoxy- adhesives)
• Plasma treatment plus ENVISION HDI 7833
• Standard process parameters
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Catalyst age 8 days
Seemless coverage
Catalyst age 8 days
Seemless coverage
PI ConditionerPI Conditioner
Catalyst age 8 days
Seemless coverage
PI Conditioner
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ENVISION HDI flex apps
reliability & performance
Attribute Details Value
• selectivecoverage of PI
• excellent Cu-Cu adhesion
• Full coverage of micro cavities,highly reliable copper deposition
• no attack of PI & adhesive• no attack of Cu• soft cleaning effect
• high conductivity • quick copper plating on PI
• high MnO2 adsorption (4 mg/dm³)• best conductivity (0.001 S/cm)
Clean without attack
PI CuCu
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ENVISION HDI flex apps
reliability & physical properties
Attribute Detail Value
• qualification
• passed thermal shock test(10 cycles: 288 +/- 5 oC @10s solder float )
• passed thermal cycle test(10 cycles: 255+/- 5 oC @30s molten salt, 15s water /RT
• no defects (cracks)
• no hole wall pull away
• no ICDs
• fastest LCG rate • highest reliability w/t all PI brands• extended catalyst bath-life
• passed back light test (D0)
• LCG: >7mm/min
passed10 x 10sec solder dip 288°C
10µm flash after5 min@2 ASD
passed back light test: D0
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ENVISION HDI laminates processed
ENVISION® Initiator 7320 Operating Parameters
Resin System Temperature oC Dwell Time (s) Typical MnO2 mg/dm2
CEM-1/CEM-3 82-88 30-55 4-6
FR-4 (Tg 140 oC) 82-88 40-60 3-5
FR-4 (Tg 170 - 180 oC) 85-90 40-60 3-5
BT 85-90 50-115 2-4
GETEK® 85-90 50-115 2-4
PTFE 85-90 100-115 2-4
Polyimide 85-90 40-55 3-6
Polyimide/Acrylic Flex 60-70 30-50 4-8
All Polyimide Flex 85-88 40-60 2-4
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ENVISION HDI process steps
Process Step Application Temperature MaterialsHeating
CoolingVent Filter Comments
COND-8511 Flood 40-65 oC Polypropylene Stainless Steel
Stainless Steel Heater/Cooling
YesPolypropylene
3-5 Turn/HourUltrasonic
City Water Rinse (Triple Cascade)
Spray 15-30 oC Polypropylene No No Option
IdleDrag-back Prevention
N/A Stainless Steel No Yes No Vent Demister
OXY-7320 Flood80-90 oC
60-70 oC (acryl)
Insulated Stainless Steel PTFE
Stainless Steel Heating
Stainless Steel
3-5 Turns/Hour
City Water Rinse (Recirc Overflow)
Spray 15-30 oC Polypropylene No No Option Low pressure
City Water Rinse (Triple Cascade)
Spray 15-30 oC Polypropylene No No Option Low pressure
CAT-7833 Flood 15-22 oC PolypropyleneStainless Steel Cooling
YesPolypropylene
3-5 Turns/HourUltrasonic
DI Water Rinse
(Double Cascade)Spray 15-30 oC Polypropylene No No Option
Drying Fluid Head™ 54-63 oC Polypropylene Stainless Steel
No No No
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ENVISION HDI process equipment
line length ~ 25 mline speed 2.5 m / min
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ENVISION HDI process equipment
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• Dosing pumps (replenishment)
• bleed pump (PLC sync.)
Part A-R
4.5 l/100m2
Part B-R2.25 l/100m2
Catalyst tank= 450 l
Total dosing volume6.75 l/100m2
Bleed pumpPump rate ≅ 6.75 l/100m2
drain
ENVISION HDI steady state process
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ENVISION HDI alternatives
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ENVISION HDI alternatives
throughput at 15 m line length
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ENVISION HDI chasing shadows
DMSE myths comment
• Hot permanganate required to
oxidize monomer to form film
• High temps incompatible with flex
adhesives on PI
• Applicable to fewer materials (i.e.
PTFE)
• Tends to microvoid on glass
• Limited conductivity giving
dogboning on high A/R panels
• Conductivity changes with time
• Difficult to protect IP
• Suggested for FR-4 and high layer
count
• No, permanganate forms MnO2
followed by separate catalyst step
(subsequent film forming)
• No, 60 – 70 oC Initiator window for
acrylics
• No, PTFEs for Bosch, Kathrein et al.,
all laminates processable
• Not with any sound PCB shop
• Bull****, complete copper coverage
after 90 sec of plating, best-in-class λ
• No, steady state catalyst 7833
• Have been, continues to be patented
2 novel patents granted/pending
• renowned and proven for any
laminate and technology
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ENVISION HDI myths&reality @ 77 GHz
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ENVISION HDI reliability
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ENVISION HDI reliability
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ENVISION HDI reliability
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ENVISION HDI reliability
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ENVISION HDI CARBON Difference % Savings
1 Number of Process Steps 3 5 2 40,00%
2 Foot Print (area layout) [m2] 105 155 50 32,26%
3 Cycle Time to Dry Film [minutes] 14 22 8 36,36%
4Process Equipment Investment [EUR]
(2.5 m/min , 30.000 m2/month)450.000 500.000 50.000 10,00%
5 Energy Usage (KW/m2) 0,02 0,03 0,01 20,00%
6 Equipment MaintenanceEase of maintenance
(9)
prone to contamination
(4)5 125,00%
7
Cu Consumption [kg/100 m2]
Carbon: Flash + Pattern 25 µm Cu @ 50%
area)
29,00 30,48 1,48 4,86%
8Non-proprietary chemical consumption
[EUR/m2]0,05 0,10 0,05 50,00%
9)Proprietary chemical consumption
[EUR/m2]1,20 1,20 0,00 0,00%
10Water Usage [tons/month]
month = 26 days780 1.040 260 25,00%
11 Waste Treatment [EUR/m2] 0,27 0,35 0,08 22,86%
12Yield (%)
for DS, 4/6L PWBs100,00% 98,50% 1,50% 1,52%
13Yield (%)
for HDI/Microvia product99,80% 97,00% 2,80% 2,89%
14 HDI line capacity (%) 100,00% 70,00% 30,00% 42,86%
9) COGS Envision < Carbon / Graphite
ENVISION HDI vs Carbon (VIU)
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ENVISION HDI customer references
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ENVISION HDI (some..) OEMs
AmazonAnadigicsAnaren Microwave AppleApplied Micro Circuits AstecASUSBBKBoschCanonCascade Micro Tech ChanghongConexantContinental DaikinDelco Ericsson FunaiGeneral Atomics Hewlett Packard
HisenseHuaweiIBMInfineon IntelKathrein KESKyocera L3 Communications LGLockheed Martin LudtkeMagneti MarelliMaxim MeidiNational Semiconductor NewisysNokia Northrup GrummanPanasonicPhilips
PrinarionQualcomm SamsungScientific Atlantic Sharp SiemensSilicon Wave SitronicSolarTRW UnidenUnisys VtechZTE