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MD-50H12NBC50-inch (diag.) HD Plasma Display Panel Module
SpecificationsPower Source 100-240 V AC, 50 / 60 Hz
Plasma Display panel Drive method : AC type 50-inch,
16:9 aspect ratio
Screen size 1,106.46 mm (W) × 622.08 mm (H)
No. of pixels 1,049,088 (1,366 (W) × 768 (H)) [4,098 × 768 dots]
Weight approx. 18.5 kg net
Operating ConditionsTemperature 32°F - 104°F (0 °C - 40 °C)
Humidity 20 % - 80 %
Notes: · Design and specifications are subject to change without notice. Weight and dimensions shown are approximate.
ORDER NO.PDP0905001CE
1 Safety Precautions 3 1.1. General Guidelines 3
2 Prevention of Electrostatic Discharge (ESD) toElectrostatically Sensitive (ES) Devices 4
3 About lead free solder (PbF) 5 4 PCB Structure and List 6 5 Set Serial Label Information 7 6 Troubleshooting guide 8
6.1. How to identify SOS Signal 8
6.2. Timing Chart of LED Blinking 8
6.3. How to Display Internal Test pattern 9
6.4. No Power 10
6.5. No Picture 10
6.6. Local screen failure 11
7 Adjustment Procedure 12 7.1. Driver Set-ups 12
7.2. Initialization Pulse Adjust 13
7.3. P.C.B. (Printed Circuit Board) exchange 13
7.4. Adjustment Volume Location 14
7.5. Test Point Location 14
8 Block Diagram 15 8.1. Main Block Diagram 15
9 Replacement Parts List 17 9.1. Replacement Parts List Notes 17
9.2. Parts List 17
CONTENTS Page Page
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1.1.1. Leakage Current Cold Check 1. Unplug the AC cord and connect a jumper between the two
prongs on the plug. 2. Measure the resistance value, with an ohmmeter, between
the jumpered AC plug and each exposed metallic cabinetpart on the equipment such as screwheads, connectors,control shafts, etc. When the exposed metallic part has areturn path to the chassis, the reading should be between1MΩ and 5.2MΩ.When the exposed metal does not have a return path to
the chassis, the reading must be .
Figure 1
1.1.2. Leakage Current Hot Check (SeeFigure 1.)
1. Plug the AC cord directly into the AC outlet. Do not use anisolation transformer for this check.
2. Connect a 1.5kΩ, 10 watts resistor, in parallel with a 0.15µFcapacitors, between each exposed metallic part on the setand a good earth ground such as a water pipe, as shown inFigure 1.
3. Use an AC voltmeter, with 1000 ohms/volt or moresensitivity, to measure the potential across the resistor.
4. Check each exposed metallic part, and measure thevoltage at each point.
5. Reverse the AC plug in the AC outlet and repeat each of theabove measurements.
6. The potential at any point should not exceed 0.75 voltsRMS. A leakage current tester (Simpson Model 229 orequivalent) may be used to make the hot checks, leakagecurrent must not exceed 1/2 milliamp. In case ameasurement is outside of the limits specified, there is apossibility of a shock hazard, and the equipment should berepaired and rechecked before it is returned to thecustomer.
1 Safety Precautions1.1. General Guidelines 1. When servicing, observe the original lead dress. If a short circuit is found, replace all parts which have been overheated or
damaged by the short circuit. 2. After servicing, see to it that all the protective devices such as insulation barriers, insulation papers shields are properly
installed. 3. After servicing, make the following leakage current checks to prevent the customer from being exposed to shock hazards.
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2 Prevention of Electrostatic Discharge (ESD) toElectrostatically Sensitive (ES) Devices
Some semiconductor (solid state) devices can be damaged easily by static electricity. Such components commonly are calledElectrostatically Sensitive (ES) Devices. Examples of typical ES devices are integrated circuits and some field-effect transistors andsemiconductor "chip" components. The following techniques should be used to help reduce the incidence of component damagecaused by electrostatic discharge (ESD). 1. Immediately before handling any semiconductor component or semiconductor-equipped assembly, drain off any ESD on your
body by touching a known earth ground. Alternatively, obtain and wear a commercially available discharging ESD wrist strap,which should be removed for potential shock reasons prior to applying power to the unit under test.
2. After removing an electrical assembly equipped with ES devices, place the assembly on a conductive surface such asaluminum foil, to prevent electrostatic charge buildup or exposure of the assembly.
3. Use only a grounded-tip soldering iron to solder or unsolder ES devices. 4. Use only an anti-static solder removal device. Some solder removal devices not classified as "anti-static (ESD protected)" can
generate electrical charge sufficient to damage ES devices. 5. Do not use freon-propelled chemicals. These can generate electrical charges sufficient to damage ES devices. 6. Do not remove a replacement ES device from its protective package until immediately before you are ready to install it. (Most
replacement ES devices are packaged with leads electrically shorted together by conductive foam, aluminum foil or comparableconductive material).
7. Immediately before removing the protective material from the leads of a replacement ES device, touch the protective materialto the chassis or circuit assembly into which the device will be installed.Caution
Be sure no power is applied to the chassis or circuit, and observe all other safety precautions. 8. Minimize bodily motions when handling unpackaged replacement ES devices. (Otherwise hamless motion such as the brushing
together of your clothes fabric or the lifting of your foot from a carpeted floor can generate static electricity (ESD) sufficient todamage an ES device).
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3 About lead free solder (PbF)Note: Lead is listed as (Pb) in the periodic table of elements.In the information below, Pb will refer to Lead solder, and PbF will refer to Lead Free Solder.The Lead Free Solder used in our manufacturing process and discussed below is (Sn+Ag+Cu).That is Tin (Sn), Silver (Ag) and Copper (Cu) although other types are available.
This model uses Pb Free solder in it’s manufacture due to environmental conservation issues. For service and repair work, we’dsuggest the use of Pb free solder as well, although Pb solder may be used.
PCBs manufactured using lead free solder will have the PbF within a leaf Symbol stamped on the back of PCB.Caution
· Pb free solder has a higher melting point than standard solder. Typically the melting point is 50 ~ 70 °F (30~40 °C) higher.Please use a high temperature soldering iron and set it to 700 ± 20 °F (370 ± 10 °C).
· Pb free solder will tend to splash when heated too high (about 1100 °F or 600 °C).
If you must use Pb solder, please completely remove all of the Pb free solder on the pins or solder area before applying Pbsolder. If this is not practical, be sure to heat the Pb free solder until it melts, before applying Pb solder.
· After applying PbF solder to double layered boards, please check the component side for excess solder which may flow ontothe opposite side. (see figure below)
Suggested Pb free solderThere are several kinds of Pb free solder available for purchase. This product uses Sn+Ag+Cu (tin, silver, copper) solder.However, Sn+Cu (tin, copper), Sn+Zn+Bi (tin, zinc, bismuth) solder can also be used.
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4 PCB Structure and List
Board Name FunctionP Power SupplyD Interface & Digital ProcessC1 Data Driver (Lower Right)C2 Data Driver (Lower Center)C3 Data Driver (Lower Left)SC Scan DriveSU Scan Drive out (Upper)SD Scan Drive out (Lower)SS Sustain Drive
SS2 Sustain Connector out
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5 Set Serial Label Information
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6 Troubleshooting guide6.1. How to identify SOS Signal[Function]
When an abnormality has occurred in the PDP module, the protection circuit operates and reset to the stand-by mode. At thesame time, the defective P.C.Board can be indicated by the number of the pulse at Pin 17(LED_R) of D6 connector on D Board.
By using this tool (V1 board), the indication of pulse is shown to the blinking of red LED.(Pluse High = LED light, Pulse Low light off)
Tool name Part number Supply period Supply routeV1 board TNPA3199 until end of AUG /2009 Normal spare part route (chargeable)
[How to check]Connect the V34 connector on V1 board to D6 connector on D board with Lead Wire (V1-D).And then turn on the power of PDP module.If power is shut down by protection circuit, the red LED of V1 board will be shown as blinking.(If the unit keeps power on, the green LED of V1 board will be lighting.)
6.2. Timing Chart of LED Blinking 1. Subject
Information of LED Blinking timing chart. 2. Contents
When an abnormality has occurred the unit, the protection circuit operates and reset to the stand by mode. At this time, thedefective block can be identified by the number of blinkes of LED on V1 board.
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6.3. How to Display Internal Test pattern
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6.4. No PowerPreparation
The V1 board is connected with D board (D6 connector).First check point
There are following 3 states of No Power indication by power LED. 1. No lit 2. Green is lit then turns red blinking a few seconds later. 3. Only red is lit.
6.5. No Picture
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6.6. Local screen failurePlasma display may have local area failure on the screen. Fig-1 is the possible defect P.C.B. for each local area.
Fig-1
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7 Adjustment Procedure7.1. Driver Set-ups
7.1.1. Item / Preparation 1. Input a white signal of RGB signal generator.
7.1.2. AdjustmentsAdjust driver section voltages referring the panel data on the panel data label.
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7.2. Initialization Pulse Adjust 1. Input a white signal of RGB signal generator. 2. Adjust the indicated test point for the specified wave form.
Test point Volume LevelT2 TPSC1 (SC) VR16601 (SC) 210V ± 10V
at 100µs period of the initialization pulseslope by VR16601
7.3. P.C.B. (Printed Circuit Board) exchange7.3.1. Caution 1. To remove P.C.B. , wait 1 minute after power was off for discharge from electrolysis capacitors.
7.3.2. Quick adjustment after P.C.B. exchangeP.C.B. Name Test Point Voltage Volume Remarks
P Board Vsus TPVSUS (SS) Vsus ± 2V R737 (P) *SC Board Vad TPVAD (SC) -180V ± 2V VR16600 (SC)
Vscn TPVSCN (SC) Vad_base:+145V±4VGND_base: -35V±6V
Fixed
Vset TPVSET (SC) 290V ± 9V FixedSS Board Ve TPVE (SS) Ve ± 2.5V Fixed *
Vda TPVDA (P) 60V +1V , -2V Fixed
*See the Panel label.
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7.4. Adjustment Volume Location
7.5. Test Point Location
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8 Block Diagram8.1. Main Block Diagram
HOTCOLD
CONTROL SIGNAL +15V(P)
VIDEO DATA
+15V(P)
D20
FSTBY+15V
SS2
SUSTAIN DRIVE
RELAY
SUB-FIELD PROCESSOR
POWER SUPPLY
VSET GEN.
RECTIFIER
SC46
DATADRIVER
DATADRIVER
C22
SCAN OUT (UPPER)
SU11
+5V(P)
+5V(P)
P25
+5V(P)
C2C1
DATADRIVER
+15V(P)
P34
+5V
(P)
DATADRIVER
EEPROM
SU41
P11
VSUS
MAIN SW1UNREG_15V
POWERFACTORCONTROL
SCANDRIVER
SOS8_SS
Vda
SS22
+5V(P)
SCAN DRIVESC
D32
DATA DRIVER (LEFT)
C10
SS
10bit L
VD
S
STBY5V
PS SOS4
+5V(P)
C35
PANEL MAIN ON
SOS8_SS
DATA DRIVER
MAIN SW2P
AN
EL S
TB
Y_O
N
DISCHARGECONTROL
RE
AD
Y
BUFFER
P
SS23
POWER MICOM
SC20
P35
SOS7_SC2
SD46
Vda
SU
UNREG_FSTB
SO
S8_S
S
DATADRIVER
SD
D25
VSUS
P60
SC-BOARDENEGRY RECOVERYSOS DETECT
SC-BOARDFLOTING PARTSOS DETECT
C32
+5V(P)
DATA DRIVER (CENTER)
SUSTAIN CONTROL
H/V SYNC CONTROL
VIDEO DATA
SD11
SOS6_SC1
SS-BOARDSOS DETECT
SC41
PLASMA AI PROCESSOR
SCANDRIVER
SUSTAIN
SUSTAIN CONTROL
SOS7_SC2
SUSTAINVOLTAGERECTIFIER
SOS4_PS
SS3
(24bit)
DATADRIVER
D31
FORMAT CONVERTER,
CONNECTOR
VSUS GEN.
SS3
VSCAN GEN.
+5V
(P)
AR
AR
M
VIDEO DATA
DATADRIVER
DATADRIVER
SC42
SOS8_SS
DATA DRIVER (RIGHT)
C11
LVDS RX
SU
ST
AIN
CO
NT
RO
L
SOS6_SC1
SCAN OUT (LOWER)
C20
SOS4_PS
F_STBY_ON
+15V(P)
+5V(P)
SS24
+5V(P)
CPG with SS
P7
SC2
VIDEO DATA
SS11
(24bit)
VE GEN.
SOS7_SC2
STBY5V
(LOWER)
Vda
SD42
POWER SOS
VSUS
Vda
SCAN CONTROL
GenX7
D5
VSUS
SOS6_SC1
SCAN CONTROL
Vda
SOS8_SS
DATADRIVER
ON/OFF CONTROL
RECTIFIER
Vda
P-BOARDSOS DETECT
MEMORY
+15V(AUDIO)
P2
P9
SUSTAIN CONTROL
PROCESSVOLTAGERECTIFIER
STBY5V
DDR
FLASH
STANBYVOLTAGERECTIFIER
CONTROLPULSE
P6
Vda
PANEL MICOM
DATADRIVER
DATADRIVER
C33
PLASMA AI
+5V
(P)
FSTBY+15V
RESET
+15V(P)
C21
D
C3
MD-50H12NBCMain Block Diagram
MD-50H12NBCMain Block Diagram
MD-50H12NBC
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NOTE
MD-50H12NBC
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Ref.No.
Part No. Part Name & Description Pcs Remarks
PCB LSEP1279WMHB CIRCUIT BOARD P 1
PCB TXNC111ABG CIRCUIT BOARD C1 1
PCB TXNC211ABG CIRCUIT BOARD C2 1
PCB TXNC311ABG CIRCUIT BOARD C3 1
PCB TZTNP011ABG CIRCUIT BOARD D 1
PCB TXNSC11ABG CIRCUIT BOARD SC 1
PCB TXNSD11ABG CIRCUIT BOARD SD 1
PCB TXNSS11ABG CIRCUIT BOARD SS 1
PCB TXNSS211ABG CIRCUIT BOARD SS2 1
PCB TXNSU11ABG CIRCUIT BOARD SU 1
THEL069J SCREW (TU:2 INLET:3CONT:1)
29
THEL069J SCREW (TU:2 INLET:3CONT:1)
33
XYN4+F10FJ SCREW(SUSD:4) 4
XYN4+F10FJ SCREW(HANGERE METALKARI)
8
TSXL519 CABLE(SU11-SD11/C10-C20)
2
TSXL719 CABLE(D20-SC20) 1
TSXL737 CABLE(C22-C32) 1
TSXL779 CABLE(C11-D31) 1
TSXL780 CABLE(C21-D32) 1
MD50H12M1J PLASMA DISPLAY PANEL 1
9 Replacement Parts List9.1. Replacement Parts List Notes
9.2. Parts List
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NOTE
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