Department of Electronics and Communications Engineering
Activities in electromagnetic track
Progress report, year 2015
Presented by: Dmitri MoltchanovTampere University of Technology
Department of Electronics and Communications Engineering
Local TUT team Dr. D. Moltchanov PhD student V. Petrov MSc. student M. Komar
Current collaborators CPU: Dr. P. Kustarev, ITMO, Russia CPU: Dr. R. Shaloo, NYU B2B: Dr. J. Lehtomaki, Oulu, Finland THz propagation: Dr. G. Molis, Teravil, Lithuania
Personnel
Department of Electronics and Communications Engineering
Dense THz random deployments Interference, SINR, connectivity, spectral efficiency Methods: stochastic geometry
Wireless THz CPU design Feasibility, traffic modeling, design Methods: measurements, simulations
B2B communications Cooling/transmission pipes Methods: THz-TDS measurements, COMSOL
Active topics
Department of Electronics and Communications Engineering
Questions of interest Interference, SIR, optimal communications distance
What is the difference? Received signal strength
Noise at the receiver
What has been done this year: Interference: VTC’15, opt. distance: Globecom’15 THz booth 802.15.3d scenario for ICC’16
1. Dense THz networks
Department of Electronics and Communications Engineering
Board-to-board communications in THz One of the killer app in IEEE 802.15.3d
Principle: waveguide with coolant inside What has been done this year:
ACM Nanocomm’15 + journal under preparation
2. Joint cooling/transmission system
Department of Electronics and Communications Engineering
Wireless cores-LLC interface in CPUs Communications subsystem: bottleneck How to efficiently connect e.g. 50 cores to LLC?
Existing architecture
Step-by-step: terahertz-traffic-feasibility-design
3. Wireless CPU design
Department of Electronics and Communications Engineering
Methodology: measurements, extrapolation 8-cores Intel Core i7 Haswell-E 5980X, 20Mb LLC Intel PCM (counters available since SandyBridge)
3. Feasibility of THz
Department of Electronics and Communications Engineering
Proposed 3D-stacked design
Current questions: Propagation inside compartment and materials MAC design for intra-CPU traffic
3. Wireless CPU design
Department of Electronics and Communications Engineering
Propagation and materials Ray-launcher is being developed Measurement by Teravil
Traffic nature and MAC CPU modeling (gem5, ITMO) Measurements using Intel PCM
What has been done this year Two journal papers + conference paper
3. Current research focus
Department of Electronics and Communications Engineering
Traffc at L2-L3 Stochastic even for a single core and simple app! Far from Poisson assumption Has clearly distinguishable batch behavior
3. Example of L2-L3 traffic
Reading Encryption