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Page 1: Bottom-Up Module Reliability Studies at ASU - … · Bottom-Up Module Reliability Studies at ASU Subject The poster was presented during the Identifying Synergies DuraMAT Workshop,

Introduction

Pilot Lines

Bo#om-upModuleReliabilityStudiesatASUMarianaBertoni,GovindasamyTamizhmani,StuartBowden,Chris9anaHonsbergIraA.FultonSchoolsofEngineering,ArizonaStateUniversity,Tempe,AZ,85287

Characterization @ PRL

Ø 6”Siliconprocesslinefordiffusedandheterojunc9oncellsØ BoEom-upEvalua9onof:Ø MaterialsØ ProcessingstepsØ EncapsulantsØ Lamina9on

Advanced Processing

Ø Copper,NickelandTinpla9ng

Ø 20%CellsØ 18%ModulesØ SunsVoccharacteriza9on

Ø StandardandUnconven9onalModules

Band-to-bandEmissionat1.1µm

Voc(mV) Jsc(mA/cm2) FF(%) Eff.(%) Area(cm2)

727 38.7 78.2 22.0 239

Voc(mV) Jsc(mA/cm2) FF(%) Eff.(%) Area(in)

362 36.7 79.8 18.6 6x6

Ø FlexibleSiliconCells

Ø HITCellLine

Ø DiffusedJunc9onCellLine

Lamination

Ø IndoorTes9ngDSC,TGA

CellQEinaModuleCellIVinaModule

Ø OutdoorTes9ngFieldTes9ng

SoilingLossMonitoringEquipment

Ø AcceleratedTes9ngandModeling

AcceleratedTes,ngFieldTes,ng

Pre-characteriza,on

Post-characteriza,on

Modeling

Life,mePredic,on

Walk-inEnvironmentalChamberUVweathering

PRLMissionPIDTeststa9on:ModuleandCellModeling:ReliaSoc,Pvsyst,Minitab,Tableau,SAS,JMPWalk-inUVchamber

(a)IVBifacialElectroplatedCell,(b)SEM,(c)EL,(d)PL

EncapsulatedusingFluoropolymerfoilFront-to-frontandfront-to-backintercon.

(a)  EQE125umand60umcell

(b)  Absorp9ondepthinSi(c)  60um-thickcellbefore

andacerencapsula9on