Developers Conference 2007Amsterdam, The Netherlands
Jeff ChangStaccato Communications, Inc.
Silicon Solutions
–
3
AgendaAgenda
• The Vicious Cycle
• What’s Important?
• A Quick History Lesson
• Anatomy 101
• What’s on the Menu?
• Putting It All Together
• All Packed Up
4
Typical Product Cycle Typical Product Cycle
ProductionProduction
Certification/Certification/ComplianceCompliance
Test/QATest/QA
PrototypePrototype
DesignDesign
ComponentSelectionComponentComponentSelectionSelection
Architecture/RequirementsArchitecture/Architecture/RequirementsRequirements
ConceptConceptTechnologyTechnologyEvaluationEvaluation
5
What’s Important?What’s Important?
• Start with your requirements:• Target Application• Performance (range/throughput)• International Standards• Cost• Power• Thermals• Size• Software
6
What’s Important?Target ApplicationsWhat’s Important?Target Applications
HostHost DeviceDevice
7
What’s Important?Performance (range/throughput)What’s Important?Performance (range/throughput)
HostHost DeviceDevice
HWA/DWAHWA/DWA55--10m10m
3030--50Mbps50Mbps
8
What’s Important?Performance (range/throughput)What’s Important?Performance (range/throughput)
HostHost
WHCI (or HWA)WHCI (or HWA)~2~2--10m10m
100100--200Mbps (aggregate)200Mbps (aggregate)
Mobile DevicesMobile Devices~2~2--3m3m
6060--80Mbps80Mbps
Mass StorageMass Storage~2~2--5m5m
100100--200Mbps200Mbps
Printing/ImagingPrinting/Imaging~2~2--10m10m
3030--50Mbps50MbpsMobileMobile--MobileMobile
~2~2--3m, 603m, 60--80Mbps80MbpsDirect PrintingDirect Printing
~2~2--3m, 103m, 10--20Mbps20Mbps
DeviceDeviceanimated
9
What’s Important?International StandardsWhat’s Important?International Standards
WW RegulatoryWW Regulatory PlatformPlatformStandardsStandards
ProtocolProtocolStandardsStandards ProductsProducts
Mobile Handsets
PC/Peripherals
Consumer ElectronicsEU (ECC)Japan (TELEC)Korea (MIC)China (MII)US (FCC)
10
What’s Important?Cost, Cost, CostWhat’s Important?Cost, Cost, Cost
• Total cost impact to an OEM/ODM• Component cost• System board cost• System test cost• System yield cost
• Complete Certified Wireless USB Solution• Certified Wireless USB chip(set) or module• All external active and passive components
• UWB filter, T/R switch, balun, RF matching circuits, crystal• External memory: Flash, EEPROM, SRAM• Additional chips to support host I/O needs• Support for association models (pushbutton, display, switch, etc...)• Antenna, ground plane size, cables & connectors as required• Regulators• Thermal considerations• Shielding
• Does footprint allow single or double-sided PCB?• Does package allow standard FR4 design rules?
11
What’s Important?PowerWhat’s Important?Power
POW
ER
TIME
PeakPeakActiveActive
PPTX/RXTX/RX
PPSTANDBYSTANDBY
PPAVGAVG
Radio “duty cycle”can be controlled to optimize for power
StandbyStandby
Deep SleepDeep Sleep(or OFF)(or OFF)
• UWB radios allow for advanced power saving modes• TX/RX peak power• Standby• Various sleep states (intra/inter-superframe low-power modes)• Deep sleep• Total energy consumed from battery is the “area” under the curve
• Power Consumption in a given application is a function of range, throughput, and time• Your requirements will drive component selection
12
What’s Important?ThermalsWhat’s Important?Thermals
• Depending on application average throughput needs and duty cycle, thermals may be a concern
• Considerations for thermals• Chipset operating temp
• Packaging technology
• Metal shields to help dissipate
• Thermal vias in designs
• Zero airflow for most designs• External USB Dongle
• ExpressCard, Mini Card
• Mobile Storage, Printers, PMPs, etc..
13
What’s Important?SizeWhat’s Important?Size
• Focus on Total Solution Footprint• Not just the silicon package sizes, ALL components• Are passives 0102, or 0204 for increased manufacturability?
• Height from PCB• Slim mobile applications may demand low height• Height considerations for an RF or thermal shield• 1.8mm → 1.4mm → 1.0mm → 0.8mm
• Key Decision – module or IC?
14
What’s Important?SoftwareWhat’s Important?Software
• Firmware• Depends on IC architecture and function• Common functions – HWA, DWA, Native Host, Native Device, Dual-
Role-Device, WHCI• Multi-Protocol support will also likely become prominent in the future
• Drivers• PC host drivers (HWA/DWA, WHCI) – XP and Vista• Embedded drivers – USB class functions (e.g. mass storage), wired
I/O drivers
• Embedded Libraries• Hardware abstraction of chip interfaces• Can be high-level or low-level abstractions• Vendors (typically) provide an API as well as source code
15
What’s Important?SoftwareWhat’s Important?Software
PC Host (WHCI, HWA)• NB/Desktop/Media
Center PC, Set-Top Box
DWA• Wireless Hub, Docking
Station, APR, Printer
Dual-Role Device (DRD)• DSC, Handset, Printer
Native Device• DSC, DVC, Handset,
Printer
Native Host• Kiosk, PDA
Target Application / Firmware Support
*
WUSB Device Class Driver(s)
DWA Driver
WUSB Host
Driver
Embedded Wired IO
DriverWUSB Device
Function DriverWUSB Host Stack
Embedded Library
• Typical application software requirements:
* Likely to be shipped w/ host solution
16
A History Lesson: BluetoothA History Lesson: Bluetooth
Bluetooth Volume Ramp and ASPs
0
100
200
300
400
500
600
700
800
900
1999 2000 2001 2002 2003 2004 2005E 2006E 2007E 2008E 2009E
Annu
al S
olut
ion
Ship
men
ts (M
u)
0
5
10
15
20
25
30
35
ASP
(US$
)
v1.0
v1.0b
v1.1
v1.2v2.0
Source: IMS, Instat, Staccato
3-chip 2-chip 1-chip solutions
animated
17
Anatomy of a ProductAnatomy of a Product
RFRFXcvrXcvr BBBB MACMAC IOIO
NVMNVM VregVreg XtalXtal
Filter,Filter,Matching, Matching,
T/R Switch, T/R Switch, BalunBalun, , etcetc……
Passives & Supporting Passives & Supporting ComponentsComponents
AntennaAntenna
RF Xcvr = Radio TransceiverBB = BasebandMAC = Media Access ControllerNVM = Non-Volatile Memory
USB 2.0USB 2.0SDIOSDIOPCIePCIeMMIMMIEtcEtc……
18
Anatomy of a ProductMulti-Chip/Die SolutionsAnatomy of a ProductMulti-Chip/Die Solutions
RFRFXcvrXcvr BBBB MACMAC IOIO
NVMNVM VregVreg XtalXtal
Filter,Filter,Matching, Matching,
T/R Switch, T/R Switch, BalunBalun, , etcetc……
Passives & Supporting Passives & Supporting ComponentsComponents
AntennaAntenna USB 2.0USB 2.0SDIOSDIOPCIePCIeMMIMMIEtcEtc……
Integrated BB+MAC ControllerIntegrated BB+MAC Controller(typically CMOS)(typically CMOS)
RF RF XcvrXcvr(typically (typically SiGeSiGe))
Proprietary RFProprietary RF--BB InterfaceBB Interface
• Host MAC – WHCI, HWA, Native• Device MAC – DWA, Native, ASSP
19
Anatomy of a ProductMulti-Chip/Die SolutionsAnatomy of a ProductMulti-Chip/Die Solutions
RFRFXcvrXcvr BBBB MACMAC IOIO
NVMNVM VregVreg XtalXtal
Filter,Filter,Matching, Matching,
T/R Switch, T/R Switch, BalunBalun, , etcetc……
Passives & Supporting Passives & Supporting ComponentsComponents
AntennaAntenna USB 2.0USB 2.0SDIOSDIOPCIePCIeMMIMMIEtcEtc……
MAC ControllerMAC ControllerPHYPHY
WiMediaWiMedia StandardStandardMACMAC--PHY InterfacePHY Interface
20
Anatomy of a ProductSingle-Chip SolutionsAnatomy of a ProductSingle-Chip Solutions
RFRFXcvrXcvr BBBB MACMAC IOIO
NVMNVM VregVreg XtalXtal
Filter,Filter,Matching, Matching,
T/R Switch, T/R Switch, BalunBalun, , etcetc……
Passives & Supporting Passives & Supporting ComponentsComponents
AntennaAntenna USB 2.0USB 2.0SDIOSDIOPCIePCIeMMIMMIEtcEtc……
SingleSingle--Chip PHY+MAC ControllerChip PHY+MAC Controller(typically CMOS)(typically CMOS)
21
Anatomy of a ProductSingle-Chip SolutionsAnatomy of a ProductSingle-Chip Solutions
RFRFXcvrXcvr BBBB MACMAC IOIO
NVMNVM VregVreg XtalXtal
Filter,Filter,Matching, Matching,
T/R Switch, T/R Switch, BalunBalun, , etcetc……
Passives & Supporting Passives & Supporting ComponentsComponents
AntennaAntenna USB 2.0USB 2.0SDIOSDIOPCIePCIeMMIMMIEtcEtc……
Complete Module SolutionComplete Module Solution
22
What’s on the Menu?Certified Wireless USB TodayWhat’s on the Menu?Certified Wireless USB Today
• Multi-chip solutions available (see backup slides)• Flexibility to mix & match using the WiMedia MAC-PHY Interface• Multiple options to choose from
• Enables fast time-to-market for Gen1 products• Today, typically 180nm SiGe + 130nm CMOS• Typically, better “native” RF performance with SiGe• Typically, inherently higher cost structure
• Single-chip solutions available (see backup slides)• Fully integrated solutions• Today, typically 110/130nm CMOS (moving to 90nm and 65nm)• Freedom from PHY and MAC compatibility/integration issues• Typically, smaller footprint• Typically, lower cost structure
23
What’s on the Menu?Gen1 ProductsWhat’s on the Menu?Gen1 Products
• Gen1 products will support Certified Wireless USB 1.0• A single-SKU product can operate worldwide in Band 3 FFI mode
• Products shipped in the US can utilize the entire band group
• Upper-band support is being targeted for Wireless USB 1.1
3432MHz
3960MHz
4488MHz
Band #1
3168 MHz
3696 MHz
4224 MHz
DAA after 2010
Band #2
Band #3
4752 MHz
Unusable bands
Usable bands (DAA)
Usable bands (NO DAA)
DAA after 2008
EU
Japan
US
Band Group #1
DAA after 2010
Korea
24
What’s on the Menu?Taking the High BandWhat’s on the Menu?Taking the High Band
25
What’s on the Menu?Taking the High BandWhat’s on the Menu?Taking the High Band
Time
Single-chipPHY+MAC
CMOS MACSiGe PHY
Single-chipPHY+MAC
Inte
grat
ion
& F
unct
iona
lity Single-chip
PHY+MAC
CMOS MACSiGe PHY
Single-chipPHY+MAC
i.e. 110nm CMOS
i.e. 90nm CMOS
i.e. 65nm CMOS
i.e. 45nm CMOS
i.e. 130nm CMOS
i.e. 180nm SiGe
i.e. 65nm CMOS
i.e. 130nm SiGe
Low-band only
High-band capable
Timeframe?• Specifications• Interoperable solutions• Compliance programs
animated
26
What’s on the Menu?Opportunities for SOC IntegrationWhat’s on the Menu?Opportunities for SOC Integration
• Minimize RF front-end components• Balun• Matching• T/R Switch• Filter
• Integrate NVM
• MIMO techniques to improve distance & throughput
• Expand to combo capabilities• Bluetooth, Wi-Fi, etc…• Shared MAC
27
All Packaged Up… the ChoicesModulesAll Packaged Up… the ChoicesModules
• Module Benefits:• Minimize design, production, test, and yield risk to OEM/ODMs• Higher level of integration (single or multi-chip implementations)• Fast time-to-market• Smaller form factor
• Modules can be small ceramic/organic substrate designs, PCB daughtercards, or even a Mini Card
• Footprint can be minimized further by using double-sided or cavity-based technology
• Cost/height/size tradeoffs
28
All Packaged Up… the ChoicesStandard IC PackagingAll Packaged Up… the ChoicesStandard IC Packaging
• Ultimately, low-cost and low-height packaging will utilize standard IC packaging technology
• Thin Quad Flatpack (TQFP)• Quad Flatpack No-lead (QFN)• Ball Grid Array (BGA)• Chip Scale Packaging (CSP)• Many Other Options…
29
Putting It All TogetherA Design Example…Putting It All TogetherA Design Example…
• Certified Wireless USB Multi-Function Printer• Multiple options:
1. Device Wire Adapter2. Native Device3. Dual-Role Device
• Requirements:• Performance (range/throughput) 30Mbps @ 10m• International Standards WiMedia BG1, Band 3 FFI• Cost < $10• Power Self-powered, 1W peak ok• Thermals zero air flow, 0 to 70° C• Size 20mm x 20mm FR4 PCB• Software Depends on option above
30
Putting It All TogetherA Design Example…Putting It All TogetherA Design Example…
• Option 1 – Device Wire Adapter• Benefits – fast time-to-market (minimal changes to existing design)• Select single or multi-chip solution to meet your design requirements• DWA daughtercard can be embedded inside or reside outside plastics,
connection to existing USB device port• Printer must supply power to DWA• Cable association supported either natively or using external USB
components• Numeric association supported with additional display (adds cost), through
GPIO backchannel (requires software in printer – longer TTM) or software channel (also requires software in printer)
DWA
31
Putting It All TogetherA Design Example…Putting It All TogetherA Design Example…
• Option 2 – Native Device• Benefits – lower-cost solution, fully integrated, better performance• Select single or multi-chip solution to meet your design requirements• IC solution interfaces and communicates with printer SOC through wired
interface (USB, SDIO, etc…)• IC embedded library resides locally on printer RTOS
• Allows high-level abstraction calls through library to the IC
• Cable/numeric association handled more seamlessly• DRD adds native host support
NativeDevice
Printer Application &
GUI
Printer Class Driver
Wired IO Driver
Embedded Library
Running onEmbedded Linux
32
SummarySummary
• Start with your requirements• Focus on the complete system solution
• Cost• Power• Size• Performance
• Single-chip solutions will (likely) become predominant, similar to Bluetooth trends• Low cost• Small footprint• Packaging choices will allow for risk and cost reduction through time
• Roadmap will extend from Low-Band today, to Dual/Multi-Band solutions in the future
• Questions? [email protected]
Developers Conference 2007
Summary of Certified Wireless USBSilicon Vendors
Backup
35
LucidPort TechnologyLucidPort Technology
• L800 Certified Wireless USB Peripheral Controller• Manages all functions required by the Certified Wireless USB and
WiMedia protocols, including encryption, association, and beaconing
• Supports all compliant transfer sizes, packet sizes, burst sizes, and number of endpoints
• L800 Certified Wireless USB Development Kit• Includes a PCI card to convert a PC to a wireless USB peripheral• Supplied firmware supports mass storage, video, camera,
scanner, and printer class devices• Comes with detailed source code and wireless USB APIs
• The L800 is certified by the USB-IF to interop with other Certified Wireless USB devices
• Available Now
36
NEC Electronics CorporationNEC Electronics Corporation
• Word’s first USB-IF certified silicon
• Wireless Host Controller• uPD720170• PCI interface and WiMedia MAC-PHY interface• CardBus card, miniCard, PCI card• In volume production
• Wireless Hub Controller• uPD720180• WiMedia MAC-PHY interface and USB2.0 interface • Wireless Hub, Wireless Devices• In volume production
37
NXP SemiconductorsNXP Semiconductors
• Focus on embedded functionality for Wireless USB device and host solutions
• ISP3582 WUSB device is now certified and on the Integrator’s List
• Extend NXP Wired USB support package to wireless
• WW sales and applications support• Evaluation kits and app notes• Driver/firmware support
• Complete module solution package
Deliver system solutions that integrate directly into end systems via popular I/O, for lowest price, power, and footprint!
38
Realtek Semiconductor Corp.Realtek Semiconductor Corp.
• Single-chip Device Controller based on Certified Wireless USB• USB2.0 and SDIO1.2 interfaces• DWA or Native Wireless USB support• Multi-protocol device includes IP-over-UWB• First chip with multi-band support: WiMedia Band Groups 1 and 3 (3.1-
4.8GHz and 6.3-7.9GHz)• CMOS, 9mm x 9mm QFN; CSP also available• Full support for all WiMedia-based modes in band groups 1 and 3
• Single-chip PHYs• RTU7010 (Band Group 1, with multiple radio diversity), RTU7015 (Band
Groups 1 and 3)
• Contact: Frederic Battaglia, [email protected]
39
Staccato Communications, Inc.Staccato Communications, Inc.
• Ripcord™ Single-Chip Solution• 110nm all-CMOS, fully-integrated PHY+MAC+IO• Benefits – low-cost, low-power, small form-factor• Supports Wireless USB HWA, DWA, and Native applications• Protocol Independent Kernel (PIKTM) supports multiple protocols• USB 2.0 host/device, SDIO 1.1 device interfaces available• Small form-factor BGA package (7.5mm x 7.5mm, Pb-free)
• Development & Reference Design Kits Available• Embedded DVK environment for simple integration of Wireless USB• HWA dongle, Mini card, DWA hub and SDIO card RDKs
• First with single-chip aggressive roadmap toenable volume markets (cost, size, power)
• Contact [email protected]
40
Synopsys Device, WHCI Host, and Dual Role DeviceThe Industry’s First Wireless USB Device IP
• Based on the Certified Wireless USB specification from the USB-IF
• Single Architecture• WiUSB Device• WiUSB DRD• WiUSB WHCI Host
• WiMedia MAC PHY interface for multiple PHY vendor support
• Low power architecture – dual power rails
• Optimized gate count for small die area
• Configurable to specific end product requirements – firmware flexibility for post-silicon changes
BusManagement
Unit
WiMediaMBOA MAC
WUSBPAL S
YN
CC
SR
PowerManagement
RAM
RAM
WiMedia MAC-PHY Interface
AHB Interface
41
Wipro-NewLogicWipro-NewLogic
• Industry’s First WiMedia based MAC IP Core• Industry’s First Dual Role Device MAC IP Core (based on the Certified
Wireless USB Specification)• Wireless USB Device• Wireless USB Host• Wireless USB Dual Role Device
• Silicon Proven MAC• Unique Future Proof implementation• Working with multiple PHYs• FPGA based Reference platform available now• Professional services for UWB, USB, Bluetooth and IEEE 1394 based
technologies• Contact: Aditya Agarwal
42
• WQST110/101 Chipset• Certified for HWA and DWA by the USB-IF• Integrated MAC + PHY; Integrated USB 2.0 Subsystem
• The Leading PC and PC Aftermarket OEMs use WiQuest silicon
• Belkin – Certified Wireless USB Hub/Adapter (F5U302)
• Dell – Certified Wireless USB Inspiron 1720 Notebook PC
• D-Link – Certified Wireless USB Hub/Adapter (DUB-9240)
• Lenovo – Certified Wireless USB ThinkPad T61/T61p Notebook PC
• Well-positioned for the next generation• Contact [email protected]; +1 214-547-1600 x131
Lenovo’s ThinkPad T61/T61p 15.4-inch
widescreen
Dell’s Inspiron 1720 Notebook PC
WiQuest CommunicationsWiQuest Communications
Belkin’s Wireless USB Hub (F5U302)
D-Link Wireless USBHub/Adapter (DUB-9240)
WiQuest leads the industry in the number of products containingCertified Wireless USB silicon
WiQuest leads the industry in the number of products containingCertified Wireless USB silicon
Developers Conference 2007Amsterdam, The Netherlands