Advances in FHE Integration using FleXform-ADC
2016FLEX Conference
March 03, 2015
©2016 American Semiconductor, Inc. All rights reserved.
Flexible Hybrid System“Combination of flexible printed materials and
flexible silicon-based ICs to create a new class of flexible electronics.”
Printed ElectronicsLow Cost, R2R, Large
Format
Printed Electronics• Sensors• Interconnects• Substrates• Displays
• Low Cost, Large Format• Roll-To-Roll, Screen, Inkjet Print,
…
What are Flexible Hybrid Electronics?
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Flexible FleX-ICsHigh Performance, High Density
FleX-ICs• Sensor Signal Processing• Data Processing• Data Storage• Communications
• Low Cost, High Performance• Compatible with Printed Electronics• Foundry CMOS + FleX Processing
Molex flexible substrateAmerican Semiconductor
©2016 American Semiconductor, Inc. All rights reserved.
FleXform-ADC™ Development Kit
FleXform-ADC Kits provide:
• SOTA FHE System
• Supports printed sensor development
• User printable FHE with on-board FleX-ADC™
• Integration Board and Software
• Enables printed device demonstrations
• Fully supported by ASI flexible technology
integration team for design and manufacturing
FleXform-ADC Kit contents:
• Quick Start Guide
• FleXform-ADC printed circuit board (PCB)
• Two button cell batteries
• One 8.5” X 5.5” flexible circuit board sheet with two instances of the
FleXform-ADC flexible circuit board (FCB)
• Additional documentation, videos and software development tools
are available for download
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This work sponsored in part by Air Force Research Laboratory
Kit Availability:
• Limited initial release 2/23/15
• Now accepting pre-orders for March deliveries
©2016 American Semiconductor, Inc. All rights reserved. 4
FHE Capability Demonstration
Brewer Science/American Semiconductor collaboration• FleXform-ADC™ Dev Kit (FleX ADC IC)
• Temperature and humidity sensors (printed SWCNT)
Temperature Testing
Humidity Testing
©2016 American Semiconductor, Inc. All rights reserved.
Flexible ICs
FleX-ICs required to achieve a fully flexible system
• Traditional packaged parts and bare die can be surface
mounted to flexible substrates
Create rigid “islands” in flex substrates and/or
Rigid parts delaminate with even gentle curvature
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FleX OPAMP
Test Setup:
Vdd = 2.5V
Vss = 0V
Ibias = 10uA
In-pos = 1kHz square wave (YELLOW trace on
oscilloscope)
In-neg = connected to Out, voltage follower configuration
(BLUE trace on scope)
Out= connected to In-neg, voltage follower configuration
(BLUE trace on scope)
Package Die
BareDie
SoPDie
~300um ~30um
Flex Op-Amp functions at
5mm radius of curvature!
©2016 American Semiconductor, Inc. All rights reserved.
SOTA (In-Production)
• FleX-ADC/OPAMP
• 200um/300um Pad Pitch
• Pad up
• Silver Epoxy
• Manual Assembly
• 5mm RoC
Attach and Interconnect
Flip Chip (fcst 2016)
• 200um/300um (ADC/OpAmp)
• 160um/260um (MCU)
• All FleX ICs
• Plated Pads
• ACA/ACI (tbd)
• Manual Assembly
This work has been partially funded by NBMC contract
FA8650-13-2-7311
2014 MRL 3
Flip Chip/ACI (2014)
• FleX-MCU
• 160um/260um Pad Pitch
• AS_MEC1001.fxd
• AS_MEC4001.fcb
• ACA manual assembly
2014 MRL 4
Today MRL 8
Flip Chip (fcst 2017)
• All FleX ICs
• <260um pitch
• ACA/ACI (tbd)
• Fully Automated
©2016 American Semiconductor, Inc. All rights reserved.
Interconnect Direct Write
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2014 MRL 4
Today MRL 8
2016 Engineers Showing Off
2012 First Functional Print
©2016 American Semiconductor, Inc. All rights reserved.
Encapsulation
Reliability Requirements
Scratch protection
Environmental protection
Mechanical Requirements
Conformal
Thin
Flexible
Beta 2015 RoC 40mm
Gen 1 2016 RoC <5mm
“Beta” Units
• 600um thickness
• Rcurve limit 40mm
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Gen 1 Units
• 120um thickness
• Rcurve limit <5mm
FAIL
PASS
80% thinner
~90% more flexible
Overlaycompare
©2016 American Semiconductor, Inc. All rights reserved.
FleXform-ADC™ PlatformFHE Reliability Testing
Goals:
1. Dynamic Radius of Curvature (RCurve) Testing
2. Dynamic Complex Bend (Torsion) Testing
Test Coupon:
Flexible Hybrid Electronics (FHE) system with FleX-OpAmp on a PET substrate
• 127um (5mil) thick PET substrate with traces screen printed using a silver nanoparticle ink
• FleX-OpAmp™ general purpose operational amplifier configured as a voltage follower
• UV curable, non-conductive adhesives used for die attach and overcoat
• Thermal cure silver flake conductive adhesive used for interconnect
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150mm
©2016 American Semiconductor, Inc. All rights reserved.
FleXform-ADC™ Platform Radius of Curvature Testing
• Robotics system used to dynamically flex
the FHE system around a 15mm radius
mandrel
• FHE system tested electrically throughout
the curvature cycles
• Sample 1 – 10K cycles convex followed by
13.6K cycles concave without failure
• Sample 2 – 11K cycles concave followed
by 15.8K cycles convex before first failure
Failure due to crack in the silver flake
conductive adhesive used for interconnect
on the VDD line
Sample would still function if stress applied
to bridge the crack
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©2016 American Semiconductor, Inc. All rights reserved.
FleXform-ADC™ Platform Axial Torsion Testing
• Robotics system used to rotate the sample ±60
or ±90 degrees
• FHE system tested electrically throughout the
application of rotational stresses
• Sample 3 – 10K cycles of ±60 degrees followed
by 92K cycles of ±90 degrees before failure
• Failure mode indicates a crack in the silver flake
conductive adhesive
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©2016 American Semiconductor, Inc. All rights reserved.
• FleXform-ADC Development Kit (AS_DEVA) – Immediate availability
• FleXform-MCU Development Kit (AS_DEVB) – Available Q2 2016
• FleX-OPA1 Dual General Purpose Opamps (AS_OPA1) – Immediate availability
• FleX-OPA2 Quad General Purpose Opamps (AS_OPA2) – Available Q3 2016
• FleX-OPA3 Quad High Performance Opamps (AS_OPA3) – Available Q4 2016
• FleX-OPA4 Quad Output Transconductance Amps (AS_OPA4) – Available Q4 2016
• FleX-ADC1 8-channels, 8-bits (AS_ADC1) – Immediate availability
• FleX-ADC2 ADC with 3 Configurable Opamps (AS_ADC2) – Available Q4 2016
• FleX-MCU1 8-bit PIC Microcontroller (AS_MCU1) – Available Q2 2016
• FleX-MCU2 Microcontroller with ADC (AS_MCU2) – Available Q4 2016
• FHE Sensor Reference Design – Available Q2 2016
Flexible ICs
Thank You
American Semiconductor, Inc.6987 W. Targee St.
Boise, ID 83709Tel: 208.336.2773Fax: 208.336.2752
www.americansemi.com
© 2016 American Semiconductor, Inc. All rights reserved. American Semiconductor is a registered trademark of American Semiconductor, Inc. FleXform, FleXform-ADC, FleX, Silicon-on-Polymer, FleX-ADC, FleX-MCU and FleX-IC are trademarks of American Semiconductor, Inc.
Thank you for attending
Special thanks to :• Air Force Research Lab• Brewer Science• Molex• Boise State University