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…..grinding redefined…
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PRECISIONDefinition of Grinding
German DIN Standard 8580
Grinding = Machining with geometrically undefinedcutting edges
Milling / Turning = Machining with geometricallydefined cutting edges
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(made of PSG = Precision Shaped Grain)
DIN definition of grinding is no longer valid!
New = Grinding can be machining with geometrically defined cutting edges
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grinding wheel structure
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PRECISIONWheel structure
Standard Ceramic Structure Structure
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PRECISION Shape of grain
Standard Ceramic
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PRECISIONCutting Behavior
of Conventional Abrasive Grains
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Chip Formation withCubitronTM II Grinding Wheels
Idealized image
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PRECISIONFlowing Chips
Grinding swarf that looks like the chips generated by turning ormilling operations.
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Chips generated with CubitronTM II Grinding
Wheels
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Economic factor: Universality
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Economic factor: Universality
fewer tool changing = less down timefew wheel specs = lower stock keeping cost
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Specification guide: OD grinding
5 specifications
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Specification guide: ID and Centerless
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Economic benefit: Grinding performance
• Up to 4x higher removal rates• Half of the grinding time – high energy
efficiency• Half amount of dressing
Energy costEfficiency
Hig
h
Low
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PRECISIONParameters :
• Surface speed vc (m/s)
• Feed-rate vw (mm/min)
• Speed ratio (wheel – workpiece) qs
• Dressing: Overlap ratio ud
• Specific material removal rate (Q-prime) Q‘w(mm3/mm/sec)
• Specific chip volume V‘w (mm3/mm)
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PRECISIONSurface speed vc
Gear grinding
Surface grinding
Cylindrical grinding
30-35m/sOD 45-80m/sID 45-80m/s30-45m/s
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Range of speed ratios qs
OD, ID, OD, ID, Surface,CL grinding
Critical range
burning
Creep-feed grinding
Speed ratio qs =Vc / Vw
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Dressing BehaviorStandard Ceramic versus CubitronTM II
Idealized image
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PRECISIONDressing Strategy
For roughing:Overlap ratio ud = 1, synchronous 0.6
For finishing:Overlap ratio ud = 4 to 6, asynchronous – 0.6 to – 0.8
Dressing interval compared to standard ceramic abrasives:Rule of thumb: 2 x more parts between dressing cycles, at 50% dressing depth
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Specific Material RemovalRate Q‘w
Q’w as performance factor
Materialremoval in mm3 per mmwheel width per second
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Q`w Values for Cubitron II (30%)
• OD grinding: 5-20 mm3/mm/s
• ID-grinding: 8-15 mm3/mm/s
• Centerless : 15-60 mm3/mm/s
• Surface grinding: 5-20 mm3/mm/s
• Gear grinding: 16-30 mm3/mm/s
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Economic and Quality Benefits of CubitronTM II
• No grinding burn if used properly
• Constant surface finish
• Half of standard grinding time
• Half of dressing amounts
• Half the number of dressing cycles
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• The next part– Blaser Swisslube Microbiology
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