YC Cheng

2011,Q1Embedded Roadmap

& CCC ServiceMarch 01,2011

Embedded Growth Today and Future

“Tunnel Creek”

“Calpella” -> “Sandy Bridge based platform “Mobile : Huron River /QM67Desktop: Sugar Bay / Q67 /B65Workstation: Bromolow / C206

Intel Tick-Tock Dance:Advanced Process + Innovative Micro-architecture

65nm 45nm 32nm 22nm

Core Nehalem Sandy Bridge ???

Tock

Tick Tick TickTick

TockTockTock

2006 2010 2011 2012 2013200920082007

Nehelem

Westmere

SandyBridge

IvyBridge

Penry

Merom

GM45GM35 QM57 QM67

NISE

EBC3

COMe

3140 3500x 3600

xx 555

x 257x 267/8

965GME

x

x

300

Sandy Bridge Benefits

Sandy Bridge performance brief

Sandy Bridge Enhanced Visual Features

SB Platform Technology: Overview

Intel ECD Scalable platform Roadmap

Intel Low Power Platform Roadmap

Intel Atom Platform Raodmap

Newest D525/D425 platform

Queensbay Platform (Tunnel Creek)

13

Tunnel Creek CPU FeaturesDescription Tunnel Creek CPU

CPU Core 0.6 to 1.3GHz LPIA CoreHyper-Threading and Virtualization (VTx)45nm High K Process

Graphics Integrated 2D/3D Graphics Engine Running up to 400MHzSupports OpenGL* ES2.0, OpenVG* 1.0, DirectX9.0c*Fill Rate (MPPS): 667-800

Display LVDS & SDVO Dual Independent Display18/24-bit 1channel LVDS with max resolution of 1280x768@60HzSDVO max resolution of 1280x1024@85Hz

Video Engine Integrated Hi-Definition Video Decoder & EncoderEncode format: MPEG4, H.264Decode format: MPEG2, MPEG4, VC1, WMV9, H.264

Memory Controller

Single 32-bit channel, DDR2 667/800, 1GB max, memory down

Audio Integrated Intel® Hi-Definition Audio

TDP 2.7~3.3W

Description Tunnel Creek CPU

Timer 8254 Timer containing 3 countersWatchdog timer (1us to 10min)RTC

IO SPI to EFI BIOS (up to 20MHz)SMBus v1.0 (up to 1MHz)14 GPIOLPC 1.1 (25MHz/33MHz)4 PCIe x1 ports host only

LPIA Core

L2 Cache

LVDS (Display)

2D/3DGraphics

DDR2 Controller

SDVO (Display)

LPC Watchdog timer

8254 Timer

SPI

8259 APIC

Intel® HD Audio

PCIe x1 (4)

Tunnel Creek

SMBus

RTC & Sus.

GPIO (14)

Video Encode

Video Decode

Intel Atom family power consumption

Embedded Product MapEmbedded Product Map

ETX/COM Express 3.5” 5.25”

COM Express ETX EBC300

EBC301

EBC500

EBC320

EBC540

EBC550

ODM Service

ProductService

Project Service

System Xcare

BIOS Customization

EmbeddedOS support

ODM PASS

3 daysProposal

Thermal & AirFlow Analysis

Panel support

CCC Service

ICES200

ICES210

ICES122

ICES170

ICES270

ICES300

ICES251

EBC340

EBC342

EBC352

EBC545

EBC572

EBC555

ICES252

ICES253 Atom D525

EBC310ICES267 TYPE2 ,by16

Tunnel Creek Huron River

Mini-ITX/uATX

NEX603

NEX608

NEX880

Atom D525

Sugar Bay

NEX890

Bromolow

NEX881

Sugar Bay w/ Video embedded

Automation

POS

ICES267S

ICES268

ICES251X

TYPE2 ,by SDVOHuron River

Huron River

Wide Temperature

TYPE6 ,2X HDMI

N450

EBC310XWide Temperature

PICMG

PEAK 876/7

PEAK 878

PEAK 8930

PICMG 1.3

PEAK 872

PEAK 777

PICMG 1.0

Workstation Sandy Bridge(Bomolow / C206)

DesktopSandy Bridge(Sugar Bay / Q67)

Q45

G41

Embedded board value FocusEmbedded board value Focus

ATOM Embedded SolutionsATOM Embedded SolutionsAtom Dual Core-Single DC12V input-VGA + LVDS 18/24-bit -2x GbE3x RS2321x RS232/422/485CF/PCI104

Dual Display-VGA + 18 bits LVDSAT/ATX Power InputMini-PCIe + PCI slot+ PCI-1045xRS232 1xRS232/422/485

Display Outputs1. VGA + DVI-D2. 18 bits LVDS + DVI-D

Display Outputs1.VGA + 2x24 bits LVDS2.18 bits LVDS + 2x24 bits LDVS

COMexp Micro Type II COMexp Basic Type II ETX Module

IntelATOM Embedded

SolutionsETX

3.5” 5.25”

COMExpress

EBC352D525

EBC342[N270]

ICES 270Atom N270

ICES 251/251XATOM N450

ICES 252ATOM D510

ICES 170Atom N270

EBC540

N270

SDVO1DVI module

SDVO12x24 bit LVDS module

ICES 253ATOM D525

Dual Display-Single DC12V input-VGA + LVDS 18/24-bitMini-PCIeCF/3x RS232

Atom E600 Extreme Ultra Low Power-Wide Temperature-VGA + LVDS 18/24-bit2x Ethernet/Mini-PCIe/3x RS232

EBC310X[E600 series]

AtomLX800

De

ep

E

mb

ed

de

d

EBC 320

MP MP

EBC 340 EBC 352

MP

EBC 342

Lo

w P

ow

er

Em

be

dd

ed

3.5” embedded Roadmap 3.5” embedded Roadmap

3.5”, Atom E640 1GHz, DDR2-1GB onboard,Mini-PCIe, 2xGbE,VGA/LVDS, 3xCOM, DC12V

EBC 310

3.5”, Atom D525, VGA+LVDS 18/24-bit,2xGbE, Mini-PCIe,4xCOM, PCI104, CF, DC12V

Shipping

Developing

Planning

MP

C3 : 3/E

NPP : 2/B

3.5”, Atom E640 1GHz, DDR2-1GB onboard,Mini-PCIe, 2xGbE,VGA/LVDS, 3xCOM, DC12V

EBC 310X

-40~85C

NPP : 4/B

C3 : 5/M

GM45AtomVIA C7 945GME

Hig

h

Pe

rform

an

ce

5.25” embedded Roadmap 5.25” embedded Roadmap

EBC 550

MP

EBC 580E

MP

EBC 500

MP

EBC 540

MP

EBC 545

MP

Huron River

QM67, 2xGbE, iAMT,PCIe X16/X4 slot,VGA/DVI/HDMI/eDP/LVDSMini-PCIe, 4xCOM, DC12V

NPP : Mid of April, 2011EBC 555

Shipping

Developing

Planning

C3 : Mid of Jun, 2011

EBC 540

MP

Vid

eo

Su

rve

illan

ce

PO

S / K

ios

kA

uto

ma

tion

Mini-ITX/uATX Roadmap Mini-ITX/uATX Roadmap

Mini-ITX, Atom D525, DDR3 SO-DIMM, Mini-PCIe, 1xGbE, VGA/LVDS, 6xCOM,Cash Drawer, Touch Controller, DC12V

NEX603

Shipping

Developing

Planning

MP

Mini-ITX, Atom D525, DDR3 SO-DIMM, Mini-PCIe, 1x PCI, 3xGbE, VGA/LVDS, 4x COM, DC24V, 2KV surge protection

NEX608

MicroATX, Sugar Bay, Q67,4x DDR3 DIMM, Mini-PCIe,32x channels for video,1x PCIe X16, 2xGbE, VGA/DVI-D/HDMI, 2x COM, ATX power input

NEX881 C3 : 3/EMicroATX, Sugar Bay, Q67 or C206,4x DDR3 DIMM, Mini-PCIe,32x channels for video,1x PCIe X16, 2xGbE, VGA/DVI-D/HDMI, 2x COM, ATX power input

NEX880 C3 : 3/ENEX890

MP

C3 : 3/E C3: 3/EMP

Q67 C206

EBC310/310X EBC310/310X

Onboard Atom E640 1GHz ultra low power consumption SoC(3.6W) On-board DDR2 800-MHz 1GB, Non-ECC and Un-buffered Intel EG20T PCH (1.55W) Dual display: VGA + LVDS 18-bit 2 x GbE, Intel 82574L/Realtek 8211CL 1x CAN, 1x MiniPCIe, 2x SATA, 4x USB, 8x GPIO DC12V input, AT/ATX mode Serial port: 3 port, COM1/3: RS232, COM2:RS232/422/485 BIOS selectable EBC 310X supports wide operating temperature -40~85C

Main FeaturesMain Features

Single DC12V input

COM2, 3

Mini PCIe

SATALVDS

LAN1 LAN2 USB COM1 VGA

EBC352 EBC352

Onboard Atom D525 Dual core 1.8GHz / D425 Single core 1.8GHz + ICH8M Chipset One 200-pin SODIMM socket up to 2 GB DDR3 667/800 MHz SDRAM Dual display: VGA + LVDS (18/24-bit, single/dual channel) 1 x Mini-PCIe / PCI 104 1 x CF, 2 x SATA 2 x Intel 82574L GbE, 6 x USB, 8x GPIO, 5.1-CH Audio DC12V input, AT/ATX mode Serial port: 4 port, One DB9 Connector and Three 2 x 5 2.0mm box header w/ RS232 and 1x RS232/422/485

BIOS selectable

Main FeaturesMain Features

Atom D525

LVDS 18/24-bit

Single DC12V input

PCI 104

VGACOM1LAN1 LAN2 USB

ICH8M

SATA

COM2/3/4

D525 performance

EBC340EBC340

Onboard Atom N270 1.66 GHz CPU + 945GSE/ICH7-M Chipset One 200-pin SODIMM socket up to 2 GB DDR2 400/533 MHz SDRAM VGA & LVDS (1 x DF13 20-pin single channel 18bit LVDS) 1 x PCI 104 1 x CF, 1 x SATA 1 x GbE, 4 x COM, 6 x USB, 16-bit GPIO, 5.1-CH Audio AT mode (+5V and +12 Vdc input) Serial port: 4 port, 1xDB9 Connector and Three 2x5 2.0mm Box header serial port 2 support

RS232/RS422/RS485 1 x Realtek RTL8111C-GR PCI Express Gigabit Ethernet

VGA USB

Mic-out

LAN

Mic-in

SATA

PCI 104

ICH7-M

COM1

945GSE

LVDS

CCFL

N270

Power

FAN

LTP

COM 2/3/4

Main FeaturesMain Features

Panel List

G084SN05 V8G084SN05 V8AUO 8.4” 800x600AUO 8.4” 800x600G084SN05 V8G084SN05 V8AUO 8.4” 800x600AUO 8.4” 800x600

EBC342EBC342

Onboard Atom N270 1.66 GHz CPU + 945GSE/ICH7-M Chipset One 200-pin SODIMM socket up to 2 GB DDR2 400/533 MHz SDRAM Dual display: VGA & LVDS (2 x DF13 20-pin up to 24-bit & Dual pixel (48-bit)) 1 x Mini-PCIe 1 x CF, 1 x SATA 1 x GbE, 3 x COM, 6 x USB, 16-bit GPIO, 5.1-CH Audio Support AT/ATX mode and Single +12 Vdc input Serial port: 3 port, One DB9 Connector and Two 2 x 5 2.0mm box header w/ RS232 1 x Realtek RTL8111C-GR PCI Express Gigabit Ethernet

VGA USB

LAN LED

LAN1 LAN2

SATA Power

SATA

GPIO

USB

ICH7-M

Mini-PCIe

COM1

COM2/3

945GSE

LVDS

CCFL

N270

Power

FAN

K/BMouse

Main FeaturesMain Features

Panel List

LTM190M2-L31LTM190M2-L31Samsung 19” 1440x900 48bit LTM190M2-L31LTM190M2-L31Samsung 19” 1440x900 48bit

GL185WX1-1200GL185WX1-1200AUO 18.5” 1366x768 24bitGL185WX1-1200GL185WX1-1200AUO 18.5” 1366x768 24bit

CHIMEI_V216B1-L01 CHIMEI_V216B1-L01 CMO 21.6” 1366x768 24bitCHIMEI_V216B1-L01 CHIMEI_V216B1-L01 CMO 21.6” 1366x768 24bit

LM170E03 LM170E03 LG 17” 1280x1024 48bitLM170E03 LM170E03 LG 17” 1280x1024 48bit

EBC540EBC540Panel List

Onboard Atom N270 1.66 GHz CPU + 945GSE/ICH7-M Chipset One 240-pin DIMM socket up to 2 GB DDR2 400/533 MHz SDRAM Dual display: VGA, LVDS (1 x DF13 20-pin 18-bit), SDVO for EBKSDVO1(DVI) & EBKSDVO2(LVDS) 1 x Mini-PCIe, 1 x PCI, 1 x PCI 104 1 x CF, 2 x SATA 2 x GbE, 6 x COM, 6 x USB, 8 GPIO, 5.1-CH Audio Support AT & ATX mode Serial port: 5x COM support RS232 and 1XCOM support RS232 /RS422/RS485 2 x Realtek RTL8111C-GR PCI Express Gigabit Ethernet

Main FeaturesMain Features

power

Mic-in

2x SATA

COM

Line-out

VGA

2x GbE LAN

N270

CCFL

Mini-PCIe

945GSE

SDVO1/2

DIMM

PCI

CF

2x USB 2.0

KB/MS

LVDS

LPT 2xCOM

ICH7-M

PCI 104

EBC545EBC545

Main FeaturesMain Features GM45 + ICH9-M supports Intel Core™ 2 Quad, Core™ 2 Duo, Celeron CPU Two 240-pin DDR3 DIMM up to 8 GB 1066MHz DRAM Dual display GM45 integrated GMA4500MHD: VGA +VGA, LVDS (2 x DF13 20-pin up to 24-bit & Dual pixel (48-

bit)), SDVO for EBKSDVO1(DVI) & EBKSDVO2(LVDS) 1 x PCI, 1xPCI 104+ 4 x SATA 2 x GbE, 4 x COM, 6 x USB, 8 GPIO Serial port: 3 x COM support RS232 and 1 x COM support RS232/RS422/RS485(BIOS setting) 2 x Intel® 82574L PCI Express GbE

Panel List

M216H1-L01M216H1-L01CHI MEI 21.6” 1920x1080 48bitM216H1-L01M216H1-L01CHI MEI 21.6” 1920x1080 48bit

LP154WP3 LP154WP3 LG 15.4” 1440x900 36bitLP154WP3 LP154WP3 LG 15.4” 1440x900 36bit

Dual output option:VGA+LVDS, VGA+DVI,

LVDS+VGA, LVDS1+LVDS2,

EBC550EBC550Panel List

M216H1-L01M216H1-L01CHI MEI 21.6” 1920x1080 48bitM216H1-L01M216H1-L01CHI MEI 21.6” 1920x1080 48bit

GM45 + ICH9-M supports Intel Core™ 2 Quad, Core™ 2 Duo, Celeron CPU Two 240-pin DDR3 DIMM up to 8 GB 1066MHz DRAM Dual display GM45 integrated GMA4500MHD: VGA & LVDS (2 x DF13 20-pin up to 24-bit & Dual pixel (48-bit)) 1 x PCI, 1xPCIe*16, 1xPCIe*4 4 x SATA 2 x GbE, 4 x COM, 6 x USB, 8 GPIO, Serial port: 4x COM support RS232 only 2x Intel® 82574L PCI Express GbE

Main FeaturesMain Features

AUX

Mic-in

4x COM

PCIe 16 4xSATA

Line-out

VGA

2x GbE LAN

ATX

CCFL

LTP

CPU socket

GM45

2x DDR3

LVDS

PCI

ICH9-M

2x USB 2.0

KB/MS

LP154WP3 LP154WP3 LG 15.4” 1440x900 36bitLP154WP3 LP154WP3 LG 15.4” 1440x900 36bit

NEX603 NEX603

Mini-ITX, Onboard Atom D525 Dual core 1.8GHz / D425 Single core 1.8GHz + ICH8M Chipset Two DDR3 SODIMM socket up to 4GB Dual display: VGA + LVDS (optional 18/24-bit, single/dual channel) 1 x Mini-PCIe 1 x RJ11 for cash drawer 1 x GbE, 2x SATA, LPT, Audio DC12V input Serial port: 6 ports, COM1~4 w/ +5V or +12V DC output selectable, COM5 & 6 w/ +12V DC output

Main FeaturesMain Features

Industry main board for POS/KIOSKIndustry main board for POS/KIOSK

NEX608 NEX608

Mini-ITX, onboard Atom D525 Dual core 1.8GHz / D425 Single core 1.8GHz + ICH8M Chipset One DDR3 SODIMM socket up to 2GB Dual display: VGA + LVDS (18/24-bit, single/dual channel) 1 x Mini-PCIe, 1 x PCIe 3 x GbE 2x SATA, LPT, Audio, 4-in/4-out GPIO DC24V input Serial port: 4 ports, COM1, 3, 4 RS232 COM2 RS232/422/485 selectable

Main FeaturesMain Features

Industry main board for AutomationIndustry main board for Automation

NEX881 NEX881

MicroATX, Support Intel® 2nd generation Core™ i7/i5/i3 Desktop processors(Sugar Bay) Q67 Platform Control Hub Support Non-ECC Dual Channel DIMM-DDR3 1066/1333 MHz up to 8GB Onboard 32 channels video input maximum 1 x Intel® 82579LM Gigabit Ethernet support for AMT 7.0 1 x Intel® 82583V PCI Express Gigabit Ethernet VGA/DVI-D/HDMI 1x PCIe X16 slot 6x SATA, USB, Audio, 2x COM

Main FeaturesMain Features

Industry main board for Video SurveillanceIndustry main board for Video Surveillance

ETX/COM Express ContentsETX/COM Express Contents

• COM Products Roadmap - ETX - COM Express• COM Competence Center (CCC) Services

Existing Q1’11 Q2’11

Entr

y

P

ower

-Effe

ctive

P

erfo

rman

ce

COM Express Product RoadmapCOM Express Product Roadmap

ICES 270Atom N270

ICES 200C2D/945GME

ICES 251Atom N450

ICES 252Atom D510

ICES 300C2D/GM965

ICES 210Atom Z510/Z530

Shipping

Developing

Planning

ICES 267Huron RiverES Q1’11

ICES 253Atom D525

ICES 251XAtom N450-40~85C

NPP : Beginning of Jan., 2011

C3 : End of Jan., 2011

ICES 268Huron RiverES Q1’11

ICES 267SHuron RiverES Q1’11

ETX Product RoadmapETX Product Roadmap

Existing

Entr

y

P

ower

-Effe

ctive

P

erfo

rman

ce

ICES 122LX800

ICES 170Atom N270

Shipping

Developing

Planning

ICES 267 ICES 267

Support Intel 2nd generation Core Mobile processors for powerful computing Integrated Intel HD graphics for 3D performance & Clear Video PCH QM67 1x DDR3 SO-DIMM (1066/1333 MHz) LVDS 18/24-bit, single/dual channel Intel AMT 7.0 6 Express lanes VGA, PCI, IDE, LAN

Main FeaturesMain Features

QM67

DDR3 SO-DIMM

Socket FCPGA 998

Type 2 COM Express Module

COM Express functional blocksFunctional Block

Capabilities

PCI ExpressUp to 32 lanes, shared with 16 PCI Express Graphics lanes and 2 ExpressCard lanes

SATA/SASUp to 4 Serial ATA or Serial Attached SCSI links

LANUp to 3 10/100/1000Base-T links (PHY included)

USB Up to 8 USB 2.0 ports

MemoryOn-board or expansion sockets, single or dual channel

Graphics

Up to 2 LVDS channels for LCD panelsUp to 2 SDVO channels for DVI/TMDS flat-panel displaysx16 PCI Express Graphics link for external GPUs (multiplexed with SDVO)TV-Out scan conversion

CPU & chipsetCISC, RISC, VLIW, etc.

System Management

I2C, watchdog timer, SMBus

Power Management

Save-To-RAM, Save-To-Disk, Suspend, Sleep, Wake

COM form factorsCOM form factors

Multi-Core

AMD LX

Pentium M ETX

114 mm

95mm

COM-Express

155 mm

110mm

125 mm

95mm

High Integration and Scalable

Compact, High

Performance

95mm 95mm

MicroBasic

*Type2 / 6

Extension

Secure Knowledge• Strong engineering know-how is

the key to success for most applications. Customers can keep key design specifications on the carrier board, limiting exposure to design partners outside the company.

Save CostAssembly & Upgrade Cost  • It helps to reduce the cost of

making daughter boards or I/O cables

• customer is also able to save cost when they update their applications to support higher-level calculations; they just simply need to change the COM module.

Timing     A COM-based project can help

shorten the project development schedule because about 80% of the design is already contained in the COM module. Customers can focus their attention on the 20%

Flexibility    • The modularized design of a

COM-based project allows customers to configure COM modules with several carrier boards for different applications without having to create a new board.

CCC Services – Key BenefitsKey Benefits

NEXCOM ICES270

MSC VertriebsCXb-A945M

AdvantechSOM-5761

CongatecConga-BA945

ADLinkExpress-AT

COMexp Carrier Board CompatibleCOMexp Carrier Board Compatible

Nexcom CCC ServicesNexcom CCC Services

Nexcom’s COM

+ Existing

Base Board

Customized Services

COM Product & Document Support

Design AssistanceServices

Embedded OSServices

• ETX & COM Exp.• Evaluation Board• Document - Design Guide - EB’s Schematic - ME Drawing - Certification

• Customer Base Board Design• Thermal Design • Manufacturing• Thermal Solution• On-site Technical Support

• Schematic Review• Placement/ Layout Review • Debugging • Design Training• Design Database

• Customized BIOS• Modularized BIOS• eOS Installation• Custom OS Image• Device Driver• BSP Support

Nexcom’s COM

+ Customer’s Design

Base Board

Nexcom’s COM

+ Customer’s Base Board

Nexcom COM Competence Center (CCC) Services

Nexcom’s COM

+ Nexcom’s

CustomizedBase Board

Modularized Thermal SolutionModularized Thermal Solution

Reducing design effort High flexibility Easy to upgrade

Customized Thermal SolutionCustomized Thermal Solution

Mechanical drawing Mock-up sample Production

CCC Services – Thermal SolutionThermal Solution

Comprehensive Document & Design Review Support

Heat Sink

Heat Spreader

COM Modules

Customer Carrier Board

Thermal Solution Services

Com Product Services

Embedded Software Services

Design Assistance Service Carrier Board Development

BIOS Customization Embedded OS Services Nexcom User Interface ( NUI )

NUI

Modularized BIOS Core Architecture Enhanced Embedded Core Feature BIOS Customization Services

Custom OS Image Complete Device Driver Support Nexcom User Interface

BIOS Customization

Embedded OS Services

NUI

CCC Services – Embedded Software

Schematics ReviewSchematics Review

Schematic Review Placement/Layout Review

Placement/Layout ReviewPlacement/Layout Review

Debugging Assistance ServicesDebugging Assistance Services General/Special Reference Design DatabaseGeneral/Special Reference Design Database

Phenomenon Duplication Analysis and Verification Solution and Suggestion

Debugging Assistance Service General/Special Reference Design Database

Expansion Interface I/O Port Storage Other

Layout Guide line Trace Review Mechanical Conflict

CCC Services – Design AssistanceDesign Assistance

Thank YouThank You