XZZ-TIM2 2.4 GHz IEEE 802.15.4 and ZigBee Module · XZZ-TIM2 is a low power IEEE 802.15.4, ZigBee and RF4CE module based on TI CC2530F256 and a power amplifier RFX2401C. This module

XZZ-TIM2

2.4 GHz IEEE 802.15.4 and ZigBee Module

Version 1.0

Shenzhen RF-star Technology Co., Ltd.

Jan. 19th, 2020

XZZ-TIM2

www.szrfstar.com V1.0 - Jan., 2020

Shenzhen RF-star Technology Co., Ltd. Page 1 of 17

ZigBee Module List

Chipset Core FLASH

(KB)

RAM

(KB) Model Antenna

Dimension

(mm)

TX

Power

(dBm)

Range

(M) Photo

CC2530 8051 256 8

XZZ-TIM2 PCB /

IPEX 18 34.4 20

PCB: 1000

IPEX: 1500

XZZ-TIM3 PCB /

IPEX 16 26.2 4.5

PCB: 400

IPEX: 600

XZZ-TIM4 PCB /

IPEX 16 26.2 20

PCB: 1000

IPEX: 1500

WE1005 PCB 16 22 4.5 300

RF-ZM-1338A PCB /

IPEX 16.8 22 3

PCB: 300

IPEX: 450

RF-ZM-1738A PCB /

IPEX 16.8 27.9 17

PCB: 550

IPEX: 850

RF-ZM-TI01 PCB 15.1 22.3 4.5 300

EFR32

MG1B232 M4 256 32

3B32_V102 PCB /

IPEX 14.8 20.4 19.5

PCB: 1000

IPEX: 1500

RF-ZM-SL01 PCB 14 21 19.5 1000

Note:

1. The communication distance is the longest distance obtained by testing the module's maximum transmission power

in an open and interference-free environment in sunny weather.

2. Click the picture to buy modules.

3. All modules with PCB antenna and IPEX connector are dispatched with PCB antenna only by default. If IPEX

connector is needed, pls check with me before quotation.

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XZZ-TIM2



1 Device Overview

1.1 Description

XZZ-TIM2 is a low power IEEE 802.15.4, ZigBee and RF4CE module based on TI CC2530F256 and a power amplifier

RFX2401C. This module can be widely applied to short distance wireless network communication field with the

characteristics of low power consumption, small volume, strong anti-interference ability and so on. The module uses RF-

specific high dielectric constant, low loss sheet, and four-layer board wiring. Capacitance inductance components are

from high-precision and high Q Murata GRM series. The module also uses onboard power supply filter circuit and RF

optimization matching circuit, which makes the module better stability and farther transmission distance. To meet the

industrial application requirements, the module can be equipped with a shield on it, which increases the anti-jamming

capability.

1.2 Key Features

• RF

- 2.4 GHz IEEE 802.15.4 compliant RF

transceiver

- Excellent receiver sensitivity and robustness

to interface

- Programmable output power up to +4.5 dBm

- Very few external components

- Suitable for systems targeting compliance

with worldwide radio-frequency regulations:

ETSI EN 300 328 and EN 300 400 (Europe),

FCC CFR47 Part 15 (US) and ARIB STD-T-

66 (Japan)

• Microcontroller

- High-performance and low-power 8051

microcontroller core with code prefetch

- 256 KB in-system-programmable flash

- 8 KB RAM with retention in all power modes

- Hardware debug support

• Peripherals

- Powerful five-channel DMA

- Integrated high-performance op-amp and

ultralow-power comparator

- IEEE 802.15.4 MAC timer, general-purpose

timers (one 16-bit, two 8-bit)

- IR generation circuitry

- 32-kHz sleep timer with capture

- CSMA / CA hardware support

- Accurate digital RSSI / LQI support

- Battery monitor and temperature sensor

- 12 bit ADC with 8 channels and configurable

resolution

- AES security coprocessor

- Two powerful USARTs with support for

several serial protocols

- 12 general-purpose I/O pins

- Watchdog timer

1.3 Applications

• 2.4 GHz IEEE 802.15.4 systems

• RF4CE remote control systems

• ZigBee systems

• Home automation

• Building automation

• Industrial control and monitoring

• Low-power wireless sensor networks

• Consumer electronics

http://www.szrfstar.com/

XZZ-TIM2



• Health care

1.4 Functional Block Diagram

Figure 1. Functional Block Diagram of XZZ-TIM2

12 GPIOs

Reset

LC Balun Antenna Matching

32.0 MHz 32.768 kHz

Power Filter

CC2530 RFX

2401C PCB Antenna

IPEX Connector

Power Supply 2.0 V ~ 3.6 V


XZZ-TIM2



Table of Contents

ZigBee Module List ............................................................................................................................................................ 1

1 Device Overview ............................................................................................................................................................. 2

1.1 Description............................................................................................................................................................ 2

1.2 Key Features ....................................................................................................................................................... 2

1.3 Applications .......................................................................................................................................................... 2

1.4 Functional Block Diagram .............................................................................................................................. 3

Table of Contents ................................................................................................................................................................ 4

Table of Figures ................................................................................................................................................................... 5

Table of Tables ..................................................................................................................................................................... 5

2 Module Configuration and Functions ...................................................................................................................... 6

2.1 Module Parameters ........................................................................................................................................... 6

2.2 Module Pin Diagram ......................................................................................................................................... 7

2.3 Pin Functions ....................................................................................................................................................... 7

3 Specifications ................................................................................................................................................................... 9

3.1 Recommended Operating Conditions ....................................................................................................... 9

3.2 Handling Ratings ................................................................................................................................................ 9

4 Application, Implementation, and Layout............................................................................................................. 10

4.1 Module Photos .................................................................................................................................................. 10

4.2 Recommended PCB Footprint .................................................................................................................... 10

4.3 Antenna ................................................................................................................................................................ 11

4.4 Schematic Diagram ......................................................................................................................................... 12

4.5 Basic Operation of Hardware Design ...................................................................................................... 12

4.6 Trouble Shooting .............................................................................................................................................. 13

4.6.1 Unsatisfactory Transmission Distance ........................................................................................ 13

4.6.2 Vulnerable Module .............................................................................................................................. 14

4.6.3 High Bit Error Rate ............................................................................................................................. 14

4.7 Electrostatics Discharge Warnings ........................................................................................................... 14

4.8 Soldering and Reflow Condition ................................................................................................................. 14

4.9 Optional Packaging ......................................................................................................................................... 15

5 Revision History ............................................................................................................................................................ 16


XZZ-TIM2



6 Contact Us ....................................................................................................................................................................... 17

Table of Figures

Figure 1. Functional Block Diagram of XZZ-TIM2 ........................................................................................ 3

Figure 2. Pin Diagram of XZZ-TIM2 ................................................................................................................... 7

Figure 3. Photos of XZZ-TIM2 ............................................................................................................................ 10

Figure 4. Recommended PCB Footprint of XZZ-TIM2 (mm) ................................................................. 10

Figure 5. Specification of Antenna Seat ......................................................................................................... 11

Figure 6. Specification of IPEX Wire ................................................................................................................ 11

Figure 7. Schematic Diagram of XZZ-TIM2 .................................................................................................. 12

Figure 8. Recommendation of Antenna Layout ........................................................................................... 13

Figure 9. Recommended Reflow for Lead Free Solder ............................................................................ 15

Figure 10. Optional Packaging Mode .............................................................................................................. 15

Table of Tables

Table 1. Parameters of XZZ-TIM2 ...................................................................................................................... 6

Table 2. Pin Functions of XZZ-TIM2 .................................................................................................................. 7

Table 3. Recommended Operating Conditions of XZZ-TIM2 ................................................................... 9

Table 4. Handling Ratings of XZZ-TIM2 ........................................................................................................... 9


XZZ-TIM2



2 Module Configuration and Functions

2.1 Module Parameters

Table 1. Parameters of XZZ-TIM2

Chipset CC2530F256 + RFX2401C

Supply Power Voltage 2.0 V ~ 3.6 V, recommended to 3.3 V

Frequency 2394 MHz ~ 2507 MHz

Maximum Transmit Power +20 dBm

Receiving Sensitivity -97 dBm

GPIO 12

Crystal 32 MHz, 32.768 kHz

RAM 8 KB

Flash 256 KB

Package DIP Packaging

Frequency Error ±20 kHz

Dimension 25.2 mm x 16.0 mm x (2.1 ± 0.1) mm

Communication Interface UART, ADC

Type of Antenna PCB Antenna (by default) / IPEX Connector

Operating Temperature -40 ℃ ～ +85 ℃

Storage Temperature -40 ℃ ～ +125 ℃


XZZ-TIM2



2.2 Module Pin Diagram

Figure 2. Pin Diagram of XZZ-TIM2

2.3 Pin Functions

Table 2. Pin Functions of XZZ-TIM2

Pin Name Chip Pin Pin Type Description

1 RST RST Reset, active low

2 P22 P2_2 GPIO / Debug DC GPIO / Debug DC

3 P21 P2_1 GPIO / Debug DD GPIO / Debug DD

4 GND GND GND Ground

5 VCC VCC VCC Power supply: 2.0 V ~ 3.6 V, recommended to 3.3 V


7 P02 P0_2 GPIO GPIO





XZZ-TIM2













XZZ-TIM2



3 Specifications

3.1 Recommended Operating Conditions

Functional operation does not guarantee performance beyond the limits of the conditional parameter values in the table

below. Long-term work beyond this limit will affect the reliability of the module more or less.

Table 3. Recommended Operating Conditions of XZZ-TIM2

Items Condition Min. Typ. Max. Unit

Operating Supply Voltage Battery Mode 2.0 3.3 3.6 V

Operating Temperature / -40 +25 +85 ℃

Environmental Hot Pendulum / -20 +20 ℃/min

Notes: To ensure the RF performance, the ripple wave on the source must be less than ±200 mV.

3.2 Handling Ratings

Table 4. Handling Ratings of XZZ-TIM2

Items Condition Min. Typ. Max. Unit

Storage Temperature Tstg -40 +25 +125 ℃

Human Body Model HBM ±2000 V

Moisture Sensitivity Level 2

Charged Device Model ±500 V


XZZ-TIM2



4 Application, Implementation, and Layout

4.1 Module Photos

Figure 3. Photos of XZZ-TIM2

4.2 Recommended PCB Footprint

Figure 4. Recommended PCB Footprint of XZZ-TIM2 (mm)


XZZ-TIM2



4.3 Antenna

XZZ-TIM2 module is integrated the IPEX version 1 antenna seat, the specification of antenna seat is as follow:

Figure 5. Specification of Antenna Seat

The specification of IPEX wire end is as follow:

Figure 6. Specification of IPEX Wire


XZZ-TIM2



4.4 Schematic Diagram

Figure 7. Schematic Diagram of XZZ-TIM2

4.5 Basic Operation of Hardware Design

1. It is recommended to offer the module with a DC stabilized power supply, a tiny power supply ripple coefficient and

the reliable ground. Please pay attention to the correct connection between the positive and negative poles of the

power supply. Otherwise, the reverse connection may cause permanent damage to the module;

2. Please ensure the supply voltage is between the recommended values. The module will be permanently damaged

if the voltage exceeds the maximum value. Please ensure the stable power supply and no frequently fluctuated

voltage.

3. When designing the power supply circuit for the module, it is recommended to reserve more than 30% of the margin,

which is beneficial to the long-term stable operation of the whole machine. The module should be far away from the

power electromagnetic, transformer, high-frequency wiring and other parts with large electromagnetic interference.

4. The bottom of module should avoid high-frequency digital routing, high-frequency analog routing and power routing.

If it has to route the wire on the bottom of module, for example, it is assumed that the module is soldered to the Top

Layer, the copper must be spread on the connection part of the top layer and the module, and be close to the digital

part of module and routed in the Bottom Layer (all copper is well grounded).

5. Assuming that the module is soldered or placed in the Top Layer, it is also wrong to randomly route the Bottom Layer

or other layers, which will affect the spurs and receiving sensitivity of the module to some degrees;

6. Assuming that there are devices with large electromagnetic interference around the module, which will greatly affect

the module performance. It is recommended to stay away from the module according to the strength of the

interference. If circumstances permit, appropriate isolation and shielding can be done.

7. Assuming that there are routings of large electromagnetic interference around the module (high-frequency digital,

high-frequency analog, power routings), which will also greatly affect the module performance. It is recommended


XZZ-TIM2



to stay away from the module according to the strength of the interference. If circumstances permit, appropriate

isolation and shielding can be done.

8. It is recommended to stay away from the devices whose TTL protocol is the same 2.4 GHz physical layer, for

example: USB 3.0.

9. The antenna installation structure has a great influence on the module performance. It is necessary to ensure the

antenna is exposed and preferably vertically upward. When the module is installed inside of the case, a high-quality

antenna extension wire can be used to extend the antenna to the outside of the case.

10. The antenna must not be installed inside the metal case, which will cause the transmission distance to be greatly

weakened.

11. The recommendation of antenna layout.

The inverted-F antenna and IPEX connector position on PCB is free space electromagnetic radiation. The location

and layout of antenna is a key factor to increase the data rate and transmission range.

Therefore, the layout of the module antenna location and routing is recommended as follows:

（1） Place the antenna on the edge (corner) of the PCB.

（2） Make sure that there is no signal line or copper foil in each layer below the antenna.

（3） It is the best to hollow out the antenna position in the following figure so as to ensure that S11 of the module

is minimally affected.

Figure 8. Recommendation of Antenna Layout

Note: The hollow-out position is based on the antenna used.

4.6 Trouble Shooting

4.6.1 Unsatisfactory Transmission Distance

1. When there is a linear communication obstacle, the communication distance will be correspondingly weakened.

Temperature, humidity, and co-channel interference will lead to an increase in communication packet loss rate. The

performances of ground absorption and reflection of radio waves will be poor, when the module is tested close to

the ground.


XZZ-TIM2



2. Seawater has a strong ability to absorb radio waves, so the test results by seaside are poor.

3. The signal attenuation will be very obvious, if there is a metal near the antenna or the module is placed inside of the

metal shell.

4. The incorrect power register set or the high data rate in an open air may shorten the communication distance. The

higher the data rate, the closer the distance.

5. The low voltage of the power supply is lower than the recommended value at ambient temperature, and the lower

the voltage, the smaller the power is.

6. The unmatchable antennas and module or the poor quality of antenna will affect the communication distance.

4.6.2 Vulnerable Module

1. Please ensure the supply voltage is between the recommended values. The module will be permanently damaged

if the voltage exceeds the maximum value. Please ensure the stable power supply and no frequently fluctuated

voltage.

2. Please ensure the anti-static installation and the electrostatic sensitivity of high-frequency devices.

3. Due to some humidity sensitive components, please ensure the suitable humidity during installation and application.

If there is no special demand, it is not recommended to use at too high or too low temperature.

4.6.3 High Bit Error Rate

1. There are co-channel signal interferences nearby. It is recommended to be away from the interference sources or

modify the frequency and channel to avoid interferences.

2. The unsatisfactory power supply may also cause garbled. It is necessary to ensure the power supply reliability.

3. If the extension wire or feeder wire is of poor quality or too long, the bit error rate will be high.

4.7 Electrostatics Discharge Warnings

The module will be damaged for the discharge of static. RF-star suggest that all modules should follow the 3 precautions

below:

1. According to the anti-static measures, bare hands are not allowed to touch modules.

2. Modules must be placed in anti- static areas.

3. Take the anti-static circuitry (when inputting HV or VHF) into consideration in product design.

Static may result in the degradation in performance of module, even causing the failure.

4.8 Soldering and Reflow Condition

1. Heating method: Conventional Convection or IR/convection.

2. Temperature measurement: Thermocouple d = 0.1 mm to 0.2 mm CA (K) or CC (T) at soldering portion or equivalent

methods.

3. Solder paste composition: Sn/3.0 Ag/0.5 Cu

4. Allowable reflow soldering times: 2 times based on the following reflow soldering profile.


XZZ-TIM2



5. Temperature profile: Reflow soldering shall be done according to the following temperature profile.

6. Peak temperature: 245 ℃.

Figure 9. Recommended Reflow for Lead Free Solder

4.9 Optional Packaging

Figure 10. Optional Packaging Mode

Note: Default tray packaging.


XZZ-TIM2



5 Revision History

Date Version No. Description Author

2019.10.22 V0.1 The initial version is released. Aroo Wang

2020.01.19 V1.0 Add ZigBee module list. Sunny Li


XZZ-TIM2



6 Contact Us

SHENZHEN RF-STAR TECHNOLOGY CO., LTD.

Shenzhen HQ:

Add.: Room 601, Block C, Skyworth Building, High-tech Park, Nanshan District, Shenzhen, Guangdong, China

Tel.: 86-755-3695 3756

Chengdu Branch:

Add.: No. B4-12, Building No.1, No. 1480 Tianfu Road North Section (Incubation Park), High-Tech Zone, Chengdu,

China (Sichuan) Free Trade Zone, 610000

Tel.: 86-28-6577 5970

Email: [email protected], [email protected]

Web.: www.szrfstar.com

http://www.szrfstar.com/mailto:[email protected]://www.szrfstar.com/

ZigBee Module List1 Device Overview1.1 Description1.2 Key Features1.3 Applications1.4 Functional Block Diagram

Table of ContentsTable of FiguresTable of Tables2 Module Configuration and Functions2.1 Module Parameters2.2 Module Pin Diagram2.3 Pin Functions

3 Specifications3.1 Recommended Operating Conditions3.2 Handling Ratings

4 Application, Implementation, and Layout4.1 Module Photos4.2 Recommended PCB Footprint4.3 Antenna4.4 Schematic Diagram4.5 Basic Operation of Hardware Design4.6 Trouble Shooting4.6.1 Unsatisfactory Transmission Distance4.6.2 Vulnerable Module4.6.3 High Bit Error Rate

4.7 Electrostatics Discharge Warnings4.8 Soldering and Reflow Condition4.9 Optional Packaging

5 Revision History6 Contact Us

Documents

XZZ-TIM2 2.4 GHz IEEE 802.15.4 and ZigBee Module · XZZ-TIM2 is a low power IEEE 802.15.4, ZigBee and RF4CE module based on TI CC2530F256 and a power amplifier RFX2401C. This module