Würth Elektronik Circuit Board Technology - WE (Online · PDF fileWebinar: Design recommendations HDI – HDI Design Guide Würth Elektronik Circuit Board Technology Seite 1 02.07.2013

Webinar: Design recommendations HDI – HDI Design Guide

Würth Elektronik Circuit Board Technology

www.we-online.de Seite 1 02.07.2013

Agenda

Nomenclature and definition

Why Microvia technology?

Possibilities

Costs

Route out a BGA




HDI

• High Density Interconnection

Microvia

• Smallest, laser drilled holes

Buried Via

• Buried drills on the inner layers

Pitch

• Middle of a pad to the middle of a pad



Number of microvia layers Number of inner layers

between the microvias

Number of microvia layers

Number of microvia layers Number of inner layers with

buried vias





Number of inner layers

between the microvias


Number of inner layers with buried vias



High reliability Route out the smallest BGA

pitch



t

h

h

Basic material CTEz

Copper thickness t

Aspect Ratio AR= h /

IPC-2221/2122

TCT i.d.R -45° / + 125° C

Solder process

Expand! 0 10 20 30 40 50 60 70

25 50 75 100 125 150 175 200 225 250 T [°C]

Expand Z

-axis

[µ

m]

Standard-FR4 Z-Achse Cu



Route out the smallest BGA

pitch High reliability

Miniaturisation with ‘Via in Pad’

technology

Cost-effective generation of high wiring density

Future-proof technology –

components are getting smaller all

the time

We will have a…

02.07.2013 www.we-online.de Page 9

What's the reason that plated through holes / vias can not be

reduced to any small size?

Possibilities – Standard Microvias


Standard - Microvia

Pad Ø 300µm

FinalØ 100µm

With 60-70µm

dielectric

Possibilities –Microvias with impedance


Standard - Microvia

Pad Ø 325µm

FinalØ 125µm

- 1 x pressed

- 1 x electroplated

With 85-110µm

dielectric

Possibilities – Staggered Microvias




- 2 x pressed

- 2 x electroplated

- Filling of the microvias and buried vias with epoxy

Via Filling Process


Copper

FR4

Copper

Drilling

Metallization

Vacuum filling

process

Hardening

Polish



Staggered Microvias

Pitch ≥ 300µm



- 3 x pressed

- 3 x electroplated

- Filling of the Micro- and buriedvias with epoxy

Possibilities – Staggered Microvias and Buried Vias


Pitch ≥ 400µm

PadØ 550µm

Possibilities – Staggered Microvias und Buried Vias


- 3 x pressed

- 3 x electroplated

- Filling of the buried vias with epoxy

Possibilities – Stacked Microvias


Copper filled

Stacked microvia

Possibilities – Stacked Microvias


- 3 x pressed

- Filling of Buried Vias with epoxy

- Filling of Microvias with epoxy

- 4 x electroplated, metallization of µVias have to be done seperated to the buried vias

Possibilities – Stacked Microvias on Buried Vias


Stacked Microvia on

Buried Via

Buried Via filled and

capped

We will have a…


With respect to the manufacturing costs, why is it preferable to use

staggered microvias in comparision with the stacked option?

Via Filling Process


Copper

FR4

Copper

Drilling

Metallization

Vacuum filling

process

Hardening

Polish

Metallization

Possibilities – Stacked Microvias on Buried Vias


- 3 x pressed

- Filling of Buried Vias with epoxy and capping

- Filling of Microvias with epoxy

- 4 x electroplated


Complexity

Costs

1 + 6 + 1

1.

Microvias 1 to 2

8 to 7

PTH 1 to 8

1 x pressed

1 x electroplated

1 x laserdrilled

1 x mech. drilled

2 + 4 + 2

2. 1.

Microvias 1 to 2

+ 1 to 3

8 to 6

8 to 7

PTH 1 to 8

2 x pressed

1 x electroplated

1 x laserdrilled

1 x mech. drilled

Microvia Filling?

2 + 4 + 2

2. 1.

Microvias 1 to 2

2 to 3

7 to 6

8 to 7

PTH 1 to 8

2 x pressed

2 x electroplated

2 x laserdrilled

1 x mech. drilled

1 + 6b + 1

1. 2.

Microvias 1 to 2

8 to 7

PTH 1 to 8

Buried Via 2 to 7

2 x pressed

2 x electroplated

1 x laserdrilled

2 x mech. drilled

2 + 4(6b) + 2

2. 1.

Microvias 1 to 2

2 to 3

7 to 6

8 to 7

PTH 1 to 8

Buried Via 2 to 7

2 x pressed

2 x electroplated

2 x laserdrilled

2 x mech. drilled

2 + 4b + 2

2. 1.

3.

Microvias 1 to 2

2 to 3

7 to 6

8 to 7

PTH 1 to 8

Buried Via 3 to 6

3 x pressed

3 x electroplated

2 x laserdrilled

2 x mech. drilled

Laser drilling

1 to 3

Staggered

Microvias

buried Vias

extra

buried

Microvias

1 x pressed 2 x pressed 3 x pressed

100 %

115 %

120 %

142 %

150 %

175 %

90 %

ML08

ohne

µ-Vías

Costs

Route out


BGA Pitch 0,8mm

Route out with mech. vias

Route out


BGA Pitch 0,8mm

Route out with Microvias, Dog bone

Route out


BGA Pitch 0,8mm

Route out with Via in Pad

Route out

www.we-online.de Page 29 02.07.2013


Thank you for your attention!

Dominic Büch

WÜRTH ELEKTRONIK GmbH & Co. KG

Product Management

Lasercavity

Circuit Board Technology

P.: +49 7622 397 223

M.:+49 151 7270 9888

E. [email protected]

W. www.we-online.de

Documents

Würth Elektronik Circuit Board Technology - WE (Online · PDF fileWebinar: Design recommendations HDI – HDI Design Guide Würth Elektronik Circuit Board Technology Seite 1 02.07.2013