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Pub. No.: WO/2011/075705 International Application No.: PCT/US2010/061156 Publication Date: 23.06.2011 International Filing Date: 17.12.2010 IPC: H01Q 1/38 (2006.01), H01Q 5/02 (2006.01) H ELECTRICITY 01 BASIC ELECTRIC ELEMENTS Q AERIALS 1 Details of, or arrangements associated with, aerials 36 Structural form of radiating elements, e.g. cone, spiral, umbrella 38 formed by a conductive layer on an insulating support H ELECTRICITY 01 BASIC ELECTRIC ELEMENTS Q AERIALS 5 Arrangements for simultaneous operation of aerials on two or more different wavebands 01 Resonant aerials 02 for operation of centre-fed aerials which comprise a single, or two or more collinear, substantially straight elongated active elements Applicants: SRI, INTERNATIONAL; 333 Ravenswood Avenue Menlo Park, CA 97025 (US) (For All Designated States Except US). HODGES, John, Jr. [US/US]; (US) (For US Only). RIPPEN, Marc [US/US]; (US) (For US Only). BIVER, Carl, Jr. [US/US]; (US) (For US Only) Inventors: HODGES, John, Jr.; (US). RIPPEN, Marc; (US). BIVER, Carl, Jr.; (US) Agent: WAGNER, Justin, D.; MARGER JOHNSON & MCCOLLOM, P.C. 210 SW Morrison Street, Suite 400 Portland, OR 97204 (US) Priority Data: 61/288,219 18.12.2009 US Title (EN) THREE-DIMENSIONAL ELECTROMAGNETIC METAMATERIALS AND METHODS OF MANUFACTURE (FR) MÉTAMATÉRIAUX ÉLECTROMAGNÉTIQUES TRIDIMENSIONNELS ET PROCÉDÉS DE FABRICATION Abstract: (EN)In certain embodiments, a method may include a computing device generating a digital representation of a metamaterial structure and sectioning the digital representation to generate a plurality of substantially two-dimensional layer layouts. The method may also

world wide patent on 3d printing

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Page 1: world wide patent on 3d printing

Pub. No.: WO/2011/075705 International Application No.: PCT/US2010/061156 Publication Date: 23.06.2011 International Filing Date: 17.12.2010 IPC: H01Q 1/38 (2006.01), H01Q 5/02 (2006.01) H ELECTRICITY 01 BASIC ELECTRIC ELEMENTS Q AERIALS 1 Details of, or arrangements associated with, aerials 36 Structural form of radiating elements, e.g. cone, spiral, umbrella 38 formed by a conductive layer on an insulating support H ELECTRICITY 01 BASIC ELECTRIC ELEMENTS Q AERIALS 5 Arrangements for simultaneous operation of aerials on two or more different wavebands 01 Resonant aerials 02 for operation of centre-fed aerials which comprise a single, or two or more collinear, substantially straight elongated active elements Applicants: SRI, INTERNATIONAL; 333 Ravenswood Avenue Menlo Park, CA 97025 (US) (For All Designated States Except US).HODGES, John, Jr. [US/US]; (US) (For US Only).RIPPEN, Marc [US/US]; (US) (For US Only).BIVER, Carl, Jr. [US/US]; (US) (For US Only) Inventors: HODGES, John, Jr.; (US).RIPPEN, Marc; (US).BIVER, Carl, Jr.; (US) Agent: WAGNER, Justin, D.; MARGER JOHNSON & MCCOLLOM, P.C. 210 SW Morrison Street, Suite 400 Portland, OR 97204 (US) Priority Data: 61/288,219 18.12.2009 US Title (EN) THREE-DIMENSIONAL ELECTROMAGNETIC METAMATERIALS AND METHODS OF MANUFACTURE(FR) MÉTAMATÉRIAUX ÉLECTROMAGNÉTIQUES TRIDIMENSIONNELS ET PROCÉDÉS DE FABRICATION Abstract: (EN)In certain embodiments, a method may include a computing device generating a digital representation of a metamaterial structure and sectioning the digital representation to generate a plurality of substantially two-dimensional layer layouts. The method may also include a printing device sequentially fabricating each of a plurality of substantially two- dimensional layers based on a corresponding one of the plurality of substantially two- dimensional layer layouts.(FR)Selon certains modes de réalisation, le procédé peut utiliser un dispositif de calcul générant une représentation numérique d'une structure de métamatériaux et sectionnant la représentation numérique afin de générer une pluralité d'agencements de couches essentiellement bidimensionnelles. Ce procédé peut également utiliser un dispositif d'impression qui fabrique séquentiellement chacune desdites plusieurs couches essentiellement bidimensionnelles en fonction d'un agencement correspondant parmi lesdits plusieurs agencements de couches essentiellement bidimensionnelles.

Page 2: world wide patent on 3d printing

Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IS, JP, KE, KG, KM, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LT, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PE, PG, PH, PL, PT, RO, RS, RU, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW.African Regional Intellectual Property Org. (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, SD, SL, SZ, TZ, UG, ZM, ZW)Eurasian Patent Organization (EAPO) (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)African Intellectual Property Organization (OAPI) (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG). Publication Language: English (EN) Filing Language: English (EN)