Working Towards Large Area, Picosecond-Level Photodetectors* * Thanks to Matthew Wetstein (ANL/EFI), Henry Frisch (EFI), Mike Albrow (FNAL) and Anatoly

Working Towards Large Area, Picosecond-Level Photodetectors*

* Thanks to Matthew Wetstein (ANL/EFI), Henry Frisch (EFI),

Mike Albrow (FNAL) and Anatoly Ronzhin (FNAL)

Erik RambergFermilab

Anti-Proton Workshop22 May, 2010

LAPPD Collaboration: Large Area Picosecond Photodetectors

2E. Ramberg/Fast Timing at Fermilab Test Beam/TIPP09

Time-of-flight (TOF) in Particle Physics

• Particle identification in High Energy Physics is as important as ever, for investigating flavor physics and rare processes.

• Traditionally, Cerenkov detectors have outperformed TOF for energies above 2 GeV.

• Typical TOF resolution (100 picoseconds) has been dominated by physical size of signal generation (cm size of dynode structures) and inherent time scale of scintillation.

100 picoseconds = 3 cm 5 picoseconds = 1.5 mm


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What If?

What if we could build cheap, large-area MCP-PMTs:

• ~ 100 psec time resolution.• ~ mm-level spatial resolution.• With close to 100% coverage.• Cost per unit area comparable to

conventional PMTs.

How could that change the next-gen WC Detectors?• Could these features improve background rejection?• In particular, could more precision in timing information combined with better coverage

improve analysis?

Large Water-Cherenkov Detectors will likely be a part of future long-baseline neutrino experiments.


04/19/23

Detector Prescription (Generic)• Small feature size needed

(reminder: 300 microns = 1 psec)

• Homogeneity the ability to make uniform large-areas (think solar-panels, floor tiles, 50”-HDTV sets)

• Intrinsic low cost Although application specific, you need low-cost materials and robust batch fabrication. Needs to be simple.

-> Micro-channel plate photo multipliers (MCP/PMT) are our weapon of choice


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The LAPPD Collaboration

• Funded by DOE and NSF• 4 National Labs• 5 Divisions at Argonne• 3 US small companies; • Electronics expertise at Universities of

Chicago and Hawaii

Goals: • Exploit advances in material science

and nanotechnology to develop new, batch methods for producing cheap, large area MCPs.

• To develop a commercializable product on a three year time scale.

Large Area Picsecond Photodetector Collaboration

John Anderson, Karen Byrum, Gary Drake, Henry Frisch, Edward May, Alexander Paramonov, Mayly Sanchez, Robert Stanek, Robert G. Wagner, Hendrik Weerts, Matthew Wetstein, Zikri Zusof

High Energy Physics Division, Argonne National Laboratory, Argonne, IL

Bernhard Adams, Klaus Attenkofer, Mattieu Chollet

Advanced Photon Source Division, Argonne National Laboratory, Argonne, IL

Zeke Insepov

Mathematics and Computer Sciences Division, Argonne National Laboratory, Argonne, IL

Mane Anil, Jeffrey Elam, Joseph Libera, Qing Peng

Energy Systems Division, Argonne National Laboratory, Argonne, IL

Michael Pellin, Thomas Prolier, Igor Veryovkin, Hau Wang, Alexander Zinovev

Materials Science Division, Argonne National Laboratory, Argonne, IL

Dean Walters

Nuclear Engineering Division, Argonne National Laboratory, Argonne, IL

David Beaulieu, Neal Sullivan, Ken Stenton

Arradiance Inc., Sudbury, MA

Sam Asare, Michael Baumer, Mircea Bogdan, Henry Frisch, Jean-Francois Genat, Herve Grabas, Mary Heintz, Sam Meehan, Richard Northrop, Eric Oberla, Fukun Tang, Matthew Wetstein, Dai

Zhongtian

Enrico Fermi Institute, University of Chicago, Chicago, IL

Erik Ramberg, Anatoly Ronzhin, Greg Sellberg

Fermi National Accelerator Laboratory, Batavia, IL

James Kennedy, Kurtis Nishimura, Marc Rosen, Larry Ruckman, Gary Varner

University of Hawaii, Honolulu, HI

Robert Abrams, valentin Ivanov, Thomas Roberts

Muons, Inc., Batavia, IL

Jerry Va’vra

SLAC National Accelerator Laboratory, Menlo Park, CA

Oswald Siegmund, Anton Tremsin

Space Sciences Laboratory, University of California, Berkeley, CA

Dimitri Routkevitch

Synkera Technologies Inc., Longmont, CO

David Forbush, Tianchi Zhao

Department of Physics, University of Washington, Seattle, WA


04/19/23

MCP development: use modern fabrication processes to control emissivities, resistivities, out-gassing

Use Atomic Layer Deposition for emissive material. Amplification on cheap inert substrates (glass capillary arrays, AAO). Scalable to large sizes, economical, chemically robust and stable.

Readout: use transmission lines and modern chip technologies for high speed cheap low-power high-density readout.

Anode is a 50-ohm stripline, scalable up to many feet in length. Readout 2 ends; CMOS sampling onto capacitors- fast, cheap, low-power

Simulation: use computational advances to make design choices. Modern computing tools allow simulation at level of basic processes-

validate with data.

Detector Development- 3 Prongs

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At colliders we measure the 3-momenta of hadrons, but can’t follow the flavor-flow of quarks, the primary objects that are colliding. 2-orders-of-magnitude in time resolution would allow us to measure ALL the information=>greatly enhanced discovery potential.

Application 1-Energy Frontier

t-tbar -> W+bW-bbar at CDF

Specs:

Signal: 50-10,000 photons

Space resolution: 1 mm

Time resolution 1 psec

Cost: <100K$/m2:


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Application 2- Lepton Flavor Physics

• Example- DUSEL detector with 100% coverage and 3D photon vertex reconstruction.

• Need >10,000 square meters!

• Spec: single photon sensitivity, 100 ps time, 1 cm space, low cost (5-10K$/m2)

Application 2 - Intensity Frontier


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Application 3- Medical Imaging (PET)

Depth of interaction measurement currently has best value of 375 ps (1 cm) resolution (H. Kim, UC).

Spec: signal 10,000 photons,30 ps time, 1 mm space, 30K$/m2, MD-proof


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Parallel Efforts on Specific Applications

.

LAPPD Detector Development

PET(UC/BSD,

UCB, Lyon)

Collider(UC,

ANL,SLAC,..

DUSEL(Matt,

Mayly, Bob, John, ..)

K->(UC(?))

Security(TBD)

Drawing Not To Scale (!)

ANL,Arradiance,Chicago,Fermilab, Hawaii,Muons,Inc,SLAC,SSL/UCB, Synkera, U. Wash.


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Anatomy of an MCP-PMT

1. Photocathode2. Multichannel Plates3. Anode (stripline) structure4. Vacuum Assembly5. Front-End Electronics

Conversion of photons to electrons.


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1. Photocathode2. Microchannel Plates3. Anode (stripline) structure4. Vacuum Assembly5. Front-End Electronics

Amplification of signal. Consists of two plates with tiny pores (~10 microns), held at high potential difference.

Initial electron collides with pore-walls producing an avalanche of secondary electrons. Key to our effort.



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Charge collection. Brings signal out of vacuum.



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Maintenance of vacuum. Provides mechanical structure and stability to the complete device.



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1. Photocathode2. Microchannel Plates3. Anode (stripline) structure4. Vacuum Assembly5. Front-end electronics

Acquisition and digitization of the signal.



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Channel Plate Fabrication

Conventional MCP Fabrication Proposed Approach

• Separate out the three functions

• Hand-pick materials to optimize performance.

• Use Atomic Layer Deposition (ALD): a cheap industrial batch method.

• Pore structure formed by drawing and slicing lead-glass fiber bundles. The glass also serves as the resistive material

• Chemical etching and heating in hydrogen to improve secondary emissive properties.

• Expensive, requires long conditioning, and uses the same material for resistive and secondary emissive properties. (Problems with thermal run-away).


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Front-end Electronics/Readout Waveform sampling ASIC

Have to understand signal and noise in the frequency domain

Electronics Group: Jean-Francois Genat, Gary Varner, Mircea Bogdan, Michael Baumer, Michael Cooney, Zhongtian Dai, Herve Grabas, Mary Heintz, James Kennedy, Sam Meehan, Kurtis Nishimura, Eric Oberla, Larry Ruckman, Fukun Tang (meets weekly)


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Front End Electronics

Wave-form sampling is best, and can be implemented in low-power widely available CMOS processes (e.g. IBM 8RF). Low cost per channel.

First chip submitted to MOSIS -- IBM 8RF (0.13 micron CMOS)- 4-channel prototype. Next chip will have self-triggering and phase-lock loop

• Collaboration between U of Chicago and Hawaii.• Resolution depends on # photoelectrons, analog bandwidth,

and signal-to-noise.• Transmission Line: readout both ends position and time• Cover large areas with much reduced channel count.• Simulations indicate that these transmission lines could be

scalable to large detectors without severe degradation of resolution.

J-F. Genat, G. Varner, M. Bogdan, M. Baumer, M. Cooney, Z. Dai, H. Grabas, M. Heintz, J. Kennedy, S. Meehan, K. Nishimura, E. Oberla, L.Ruckman, F. Tang

Differential time resolution between two ends of a strip line


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Photonis Planicon on Transmission Line Board

Couple 1024 pads to strip-lines with silver-loaded epoxy (Greg Sellberg, Fermilab).


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Simulation• Working to develop a first-

principles model to predict MCP behavior, at device-level, based on microscopic parameters.

• Will use these models to understand and optimize our MCP designs.

Z. Yusov, S. Antipov, Z. Insepov (ANL), Z. Yusov, S. Antipov, Z. Insepov (ANL), V. Ivanov (Muons,Inc), A. Tremsin (SSL/Arradiance),V. Ivanov (Muons,Inc), A. Tremsin (SSL/Arradiance),

N. Sullivan (Arradiance)N. Sullivan (Arradiance)

Transit Time Spread (TTS)


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Scaling Performance to Large AreaAnode Simulation(Fukun Tang)

• 48-inch Transmission Line- simulation shows 1.1 GHz bandwidth- still better than present electronics.

KEY POINT- READOUT FOR A 4-FOOT-WIDE DETECTOR IS THE SAME AS FOR A LITTLE ONE- HAS POTENTIAL…


04/19/2322BNL Colloquium

Mechanical Assembly

8” proto-type stack design sketch

8” proto-type mock-up

Rich Northrop, Dean Walters, Joe Gregar Bob Wagner, Michael Minot, Jason McPhate, Ossy Siegmund


04/19/2323BNL Colloquium

The 24”x16” `SuperModule

Mockup of 1x3 ½ SM

Real glass parts

Electrical tests in air in situ about to begin

Tile now has no penetrations- neither HV nor signals

Digital card in design

Front-end ASICs ditto


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Channel Plate Fabrication w/ ALD

1 KV

pore

borosilicate glass filters(default)

Anodic Aluminum Oxide (AAO)

1. Start with a porous, insulating substrate that has appropriate channel structure.

2. Apply a resistive coating (ALD)

3. Apply an emissive coating (ALD)

4. Apply a conductive coating to the top and bottom (thermal evaporation or sputtering)

SiO2

Conventional MCP’s:

Alternative ALD Coatings:

MgO

ZnO

(ALD SiO2 also)

Al2O3


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Status After Several Months

• After characterizing the Photonis MCP, we coat the plates with 10 nm Al2O3.

• The “after-ALD” measurements have been taken without scrubbing.

• These measurements are ongoing.

• Using our electronic front-end and striplines with a commercial Photonis MCP-PMT, were able to achieve 1.95 psec differential resolution, 97 µm position resolution (158 photoelectrons).

• Demonstrated ability produce 33 mm ALD coated channel-plate samples.

• Development of advanced testing capabilities underway.

• Preliminary results at APS show amplification in a commercial MCP after ALD coating.

• Growing collaboration between simulation and testing groups.

Preliminary

B. Adams, M. Chollet (ANL/APS),

M. Wetstein (UC, ANL/HEP)


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Beam line time-of-flight for particle identification

8 GeV/cp or π

A

B

Bat + 7m farposition

TRIG L*R

VETO L+R

C = PMT210reference

SiPM’s also an option and were tested.

Testing the Photek 240 MCP/PMT in Fermilab’s Test Beam


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t ps, which means each device contributes 11 ps

channels

Some Results:

Remove tails of PH distributions(correlated, probably interactions)

Apply time-slewing correction(CFD needs residual PH correction)

Fit t = (t1 – t2) to Gaussian:

Test Beam Results for 120 GeV monoenergetic protons beam on quartz bar detector


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Proton content of beam gives 146 ps difference

Resolution of timing difference σ = 7 ch = 21.7 ps

Positive 8 GeV/c beam over 7 m:

π

p

(No corrections for slewing etc)

Test Beam Results for 7 meter separation in 8 GeV mixed (muons, pions, protons, electrons) beam


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Conclusions

• The large area, fast timing photodetector project is an advanced cooperative research project, headed up by U. Chicago, and highly supported by the DOE. We’re on a 3 year time table. Lots of work ahead. Preliminary achievements are encouraging.

• The cooperation between quite different research areas (materials science, space science, high energy physics, medical imaging) is striking and is perhaps a model for future endeavors.

• If successful, this project presents potential opportunities for future water Cherenkov detectors, collider detectors, fixed target detectors, medical imaging, etc.

Documents

Working Towards Large Area, Picosecond-Level Photodetectors* * Thanks to Matthew Wetstein (ANL/EFI), Henry Frisch (EFI), Mike Albrow (FNAL) and Anatoly