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Work at OIF on Interfaces for Optical Modules including Very
Short Reach (VSR) and Electrical Interfaces
Raj SavaraNetwork Elements Inc.
Why VSR Interfaces?
Explosive growth in the demand for bandwidth is fuelling the development of optical networks
Optical Networking has increased the number of NE in a carrier’s central office and the related NE –NE interconnecting Cost
OIF recognized this and started a project on lowering the cost of these very short reach interfaces (<2Km)
OIF has announced 4 VSR Implementation Agreements to address Low cost intra office interconnect applications
Vendor Specific
Tra
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ATM
ADM
PXC/EXC
VSR
VSR
VSR VSR
VSR
VSR
VSR
VSR
VSR
VSR
Standards Interface Vendor Specific
Standard SONET frame format
Promotes multiple vendors
Promotes interoperability
Reach 2m to 2km Multiple client
signals Low cost
Very Short Reach (VSR) interfaces
Reference Application 2: 2m to 300m, with 0-2 patch
panels
Reference Application 1:2m to between 50m and 100m direct connection
Reference Application 4: 2m to 600m, one PXC, and 0-4
junction boxes
Reference Application 3:
2m to 600m, with 0-2 patch panels
VSR Reference Application Models
VSR-1 : 12 Fiber optical Link running at 1.25Gb/s between two Network Elements. 10 fibers carry the data 1 carries CRC error correction information 1 fiber carries parity of the 10 data fibers This enables hitless correction of errors on any single fiber, including the loss of a fiber. Fiber Type : 400KHz, MM Fiber Reach: 300m Laser: 850nmVCSEL Field termination is supported link electronics automatically compensate for ribbon orientation.
16:12 SERDES
chip
OC-192 FRAMER
12:16 SERDES
chip
OC-192 FRAMER
VCSEL Laser ArrayPIN PD Array
VSR-1 Satisfies Reference Application Model 1 and 2
Interface Definition for VSR-1 Implementation Agreement (IA)
VSR-2/5: 1310 nm serial OC-192 SMF VSR optical link between two network elements. 1 Single Mode Fiber Based on G.693, ITU Specifications Fiber Type : G.652, SM Fiber Reach: 600m Link budget: 6dB VSR-2, 11dB VSR-5 Laser: un-cooled 1310nm , FP Field termination is supported
16:1 SERDES
chip
OC-192 FRAMER
1 :16 SERDES
chip
OC-192 FRAMER
FP Laser PIN
VSR-2/5 Satisfies Reference Application Model 1 ,2 and 3
Interface Definition for VSR-2/5 IA
VSR-3 : 4 Fiber optical Link running at 1.25Gb/s between two Network Elements. 4 fibers each carry the 2,5Gb/s data Fiber Type : 500KHz, MM Fiber Reach: 600m Laser: 850nmVCSEL Field termination is supported
16:4 SERDES chip
OC-192 FRAMER
4:16SERDES chip
OC-192 FRAMER
VCSEL Laser Array PIN PD array
VSR-3 Satisfies Reference Application Model 1 and 2
Interface Definition for VSR- 3 IA
VSR-4: 850 nm serial SMF VSR optical link (VSR-4) between two network elements.
1 Multi Mode FiberReach: 85m using 500MHz.km 50 mm fiber, 300m using 2000 MHz.km 50 mm fiberLaser: 850nm VCSEL Field termination is supported
16:1 SERDES chip
OC-192 FRAMER
1 :16 SERDES chip
OC-192 FRAMER
VCSEL Laser PIN
VSR-4 Satisfies Reference Application Model 1 and 2
Interface Definition for VSR-4 IA
Why SFI Interfaces?
Explosive growth of 10Gb/s systems required a common interface to connect stream data from Chip to Chip, and Chip to Modules.
SFI-4 SerDes Framer Interface is used for SONET, Forward Error Correction, and IEEE802.3ae (XSBI).
SFI-4 phase 2 is a 4 lane interface with 64/66 encoding. Each lane does not require any clock, or alignment to adjacent lanes.
CEI is a 10Gbps serial interface in development at OIF.• Two speeds 10Gbps and 6Gbps.
• Lower speed for Fibre channel and backplanes.• Higher speeds for XFI interfaces and backplanes.
• Two Distances for XFI and backplane applications.
OIF Electrical Interfaces
Framer or
PHY MAC
Network Elements
300pin MSA transponder
SFI-4 Phase 1SPI-4 Phase 1/2 VSR-2/5
This interface is Demonstrated here at the OIF booth.
FEC chips also use SFI4 phase 1. This would be a block between the Framer and the 300 pin MSA module.
OIF Electrical Interfaces
SFI4 Phase 1• 16 bit LVDS with
clock bi-directional
• Used on all 300 pin MSA modules
• Used on 200 pin MSA modules
See live demo of modules with this interface at SFI4 demo table.
OIF Electrical Interfaces
SFI4 Phase 2• 4 lane self
clocking with de-skew, 64/66 encoding, and bi-directional.
• Used for XenPak, X2, & XPAK modules with 70 pin connectors.
XPAK: 4.3 in2 / 2800 mm2
1.4 x 3.1 x 0.4 in 36 x 79 x 10mm
XENPAK: 6.7 in2 / 4400 mm2
1.4 x 4.8 x 0.7 in 36 x 121 x 17mm
X2: 5.2 in2 / 3400 mm2 1.4 x 3.7 x 0.5 in 36 x 95 x 11mm
OIF Electrical Interfaces
CEI 10Gbps serial interface (In work at OIF)• Single lane interface for
Framer, backplane interconnect, self clocking, and bi-directional.
• Used on all XFP modules with 30 pin connectors.
• Capable of 1m and two connectors over FR4 for backplane applications.
XFP: 2.1 in2 / 1400 mm2
0.7 x 3.0 x 0.3 in 18 x 78 x 9 mm
NEI Modules using OIF interfaces
XPAK: 4.3 in2 / 2800 mm2
1.4 x 3.1 x 0.4 in 36 x 79 x 10mm
X2: 5.2 in2 / 3400 mm2 1.4 x 3.7 x 0.5 in 36 x 95 x 11mm
XENPAK: 6.7 in2 / 4400 mm2
1.4 x 4.8 x 0.7 in 36 x 121 x 17mm
XFP: 2.1 in2 / 1400 mm2
0.7 x 3.0 x 0.3 in 18 x 78 x 9 mm
MSA300: 6.6 in2 / 4100 mm2
2.2 x 3.0 x 0.5 in 56 x 74 x 14 mm
MSA200: 5.1 in2 / 3200 mm2
1.7 x 3.0 x 0.6 in 42 x 75 x 16 mm
OIF Interfaces for Modules
OIF creates high speed electrical interfaces for true interoperability between component suppliers.
OIF’s Live demonstration proves Implementation agreements WORK!
OIF is paving the way for next generation interfaces such as CEI.