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A garphene bilayer channel transistor with a very high Ion/Ioff ratio, graphene single electron devices and graphene nano-mechanical structures for NEMS Z. Moktadir 1 , S. A. Boden 1 , A. Ghiass 1 , H. Rutt 1 , H. Mizuta 1 , H. Miyazaki 2 , Song-Lin Li 2 , K. Tsukagoshi 2 1 Nano Group, Electronics and Computer Science, University of Southampton U. K., 2 International Center for Materials Nanoarchitectonics (MANA), National Institute for Material Science, Tsukuba, Japan Introduction Graphene has ignited tremendous interest since its discovery in 2004[1]. The observation of field effect in graphene has particularly attracted the atten- tion of the electron devices community resulting in a large volume of work on graphene field effect transistors (GFET). Indeed graphene is one of the possible materials for the neo silicon era, according to the 2009 Internation- al Technology Roadmap for Semiconductors . One outstanding property of graphene is its high carrier mobility at room temperature. In exfoliated sup- ported graphene, mobility as high as 70000 cm 2 V -1 s -1 has been reported [2]. However, large area monolayer or bilayer graphene suffers from the absence of a band gap, which results in poor switching capability of GFETs. Despite the intense work to improve the Ion/off ratio, only values less than 400 were achieved. The largest band gap values were achieved with dual gated GFETs which are controlled using a top gate and a back gate. Values of I on /I off ratios of around 400 have been demonstrated [3]. Single electron transport in graphene quantum dots is still not fully under- stood despite efforts by several researchers investigating graphene single electron transistor (GSET)[4]. Our group is engaged in the development of such devices with the aim of building tunable, well controlled GFETs. Despite the significant amount of work on graphene electronic devices such as the field effect transistor, its use in sensors, actuators or micro and nano- electro-mechanical systems in general, is far from being explored. Owing its extraordinary electronic, mechanical and thermal properties, extremely en- hanced micro and nanosystems can be built, that surpass their silicon counter- part. By combining graphene's electronic and mechanical properties, mono- lithic sensors can be developed with superior sensitivity. Device fabrication U-shaped Graphene bilayer channel transistor All fabrication was carried out using a dual focused ion beam/scanning elec- tron microscope system (Zeiss NVision40 FIB/FEGSEM) equipped with a gas injection system (GIS). A bilayer graphene flake on a 300 nm layer of SiO 2 on Si (sample purchased from Graphene Industries Ltd.) was used. Electron beam- induced tungsten deposition was then used to deposit thin protective layers across the edges of the graphene flake in areas where contact form- ation would take place. Square contact pads, 50 µm x 50 µm, and smaller rectangular strips to connect the pads to the graphene were deposited using gallium ion beam-induced tungsten deposition in the same system. The ion beam current was adjusted in the range 0.08 – 13 nA for maximum deposition rate depending on the areas over which the deposition was occurring. The Gallium ion beam was then used to mill the contact wires and graphene flake to form and isolate the device. A beam current of 150 pA was used when milling the tungsten and 80 pA when milling the graphene. The samples were annealed at 400 o C for 10 minutes prior to their characterisation. Graphene single electron devices A variety of quantum structures were fabricated using mono and bilayer graphene. The devices were fabricated in two steps: coarse patterning us- ing e-beam lithography and fine patterning using the helium ion microscope. The coarse patterning is used to define contact leads and to isolate an area of 1 um x 1 um where helium ion direct write will take place to define the quantum dots. For the fine patterning we used the helium ion microscope (HIM) which is a new imaging technology based on a scanning helium ion beam instead of an electron beam. The HIM provides a helium ion probe with a size smaller than 0.5 nm in combination with smaller proximity effect compared to ebeam lithography. This allows a much localized writing on materials as we will show here. Our tool integrates a pattern generator software which offers a user interface allowing the exposure parameters to be adjusted such as the dose, dwell time, writing resolution, etc., as well as the definition of the pattern to be written, either as predefined geometries or an uploaded bitmap file. The helium ion beam can carve extremely sharp structures in graphene thanks to it small spot size. Graphene nano-mechanical devices Graphene nano-mechanical structures are fabricated with the helium ion microscope. The sample was loaded into the HIM and the writing was per- formed under a vaccum of 5 x 10 -7 Torr. Prior to writing, the HIM chamber was cleaned overnight by an embedded plasma system to avoid contamination of the sample during the writing operation. Results U-shaped bilyer graphene transistor[5] Scanning electron micrographs showing: (a) The graphene flake. The dashed outline marks the areas suit- able for formation of the devices; (b) The device and the contact pads, with the dashed outline marking the same area as in (a); (c) the graphene U-shaped device with tungsten contact wires and pads, (d) detail of the graphene U-shaped device. The I d -Vg characteristic at V d = 1 V, showing the off-point of the U-shaped transistor (a), and the Id-Vd characteristic at Vg =-4 V (b). The results above shows the drain current Id as a function of the back gate voltage, Vg , for a drain voltage of 1V. Figure 2-b shows the drain current as a function of the drain voltage V d for Vg =4 V. The Id-Vg characteristic shows a marked dip around Vg=V off = 3V, where the GFET channel is switched off. This characteristic is dissimilar to the usual large area graphene I d -Vg characteristic which shows a smooth evolution of the drain current towards the Dirac point. The I on /I off derived here is around 4.8×10 5 (taking I d =3.5×10 -4 A at Vg=-5 V, and I d =7.25×10 -10 A at Vg=3.3 V), larger by 3 orders of magnitude than the highest I on /I of f obtained in dual gated GFET. Graphene single electron devices[6] Arrays of fabricated graphene quantum dots. the pictures shows a zoom-in the central area where the helium ion direct write takes place. The contact leads were fabricated using a lift-off process after ebeam exposure. The quantum dots were defined by the helium ion microscope. We have fabricated two kinds of single electron devices: four coupled quantum dots and two coupled quantum dots fabricated with the helium ion microscope. The four coupled quantum dots can be used as a quantum cel- lular automaton, allowing a logic operation. The characterisation of these devices is in progress. Notice the fine edges and the squared shape of the double quantum dot. This kind of sharpness is difficult to achieve with ebeam lithography. Graphene for nano-electromechanical systems[7] We have fabricated three type of nanostructures: a nano-beam, a wine glass disk resonator nanostructure and a resonant torque Nanostructure respect- ively. These structures were patterned with a resolution of 1 nm/pixel. After patterning, the structures were released buy vapor HF etching of the under- lying oxide (300 nm thick ). One notices the fine edges of these structures thanks to the very small spot of the beam. This level of accuracy is very hard to achieve with e-beam lithography which is widely used for graphene pat- terning. The beam has a length of 1 um and the width of about 200 nm, while the resonator has a diameter of 1 um and a gap of less than 30 nm. Gap values less than 10 nm can be achieved. Helium ion patterning of nanostructures on bilayer graphene: a) a nano-beam having a length of 1 um, a width of 200 nm; b) a wine glass disk graphene resonator and C) a resonant torque structure. Conclusions In conclusion, we have fabricated a graphene field effect transistor having a U-shape geometry using FIB technology. The achieved Ion/Ioff exceeds 10 5 . We have also developed single electron devices using a two step process: coarse structures with e-beam lithography while the very fine structures were fabricated with a helium ion microscope. We have shown that graphene can be used as a material for nano-electro-mechanical-systems. Owing its ex- traordinary electrical and mechanical properties, enhanced devices can be achieved. Future work will focus of the functionalisation of such devices by electrodes deposition on the structures to characterise their electro-mech- anical properties. References [1]] Novoselov, K. S.; Geim, A. K.; Morozov, S. V.; Jiang, D.; Zhang, Y.; Du- bonos, S. V.; Grigorieva, I. V.; Firsov, A. A., Science, 36, 666, (2004) [2]Fang Chen, Jilin Xia, David K. Ferry and Nongjian Tao, Nano Lett., 9 (7), pp 2571–2574 (2009) [3]Xia, F.; Farmer, D. B.; Lin, Y.; Avouris, Ph. Nano Lett. , 10, 715 (2010) [4]T. lhn et al. Materials Today, 13, pp 44, (2010) [5] Z. Moktadir, S. A. Boden, A. Ghiass, H. Rutt and H. Mizuta, Electronics Letters (in press) [6] S. A. Boden, Z. Moktadir, D. M. Bagnall, H. Mizuta and H. Rutt, Microelec- tronic Eng. (in press) [7] Z. Moktadir, S. A. Boden, H. Mizuta and H. Rutt, MicroMechanics Europe workshop (MME 2010) proceeding, pp. 88-91, (2010)

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A garphene bilayer channel transistorwith a very high Ion/Ioff ratio, graphene

single electron devices and graphenenano-mechanical structures for NEMSZ. Moktadir1, S. A. Boden1, A. Ghiass1, H. Rutt1, H. Mizuta1,

H. Miyazaki2, Song-Lin Li2, K. Tsukagoshi21Nano Group, Electronics and Computer Science, University of Southampton U. K.,

2International Center for Materials Nanoarchitectonics (MANA), National Institute for Material Science, Tsukuba, Japan

IntroductionGraphene has ignited tremendous interest since its discovery in 2004[1]. Theobservation of field effect in graphene has particularly attracted the atten-tion of the electron devices community resulting in a large volume of workon graphene field effect transistors (GFET). Indeed graphene is one of thepossible materials for the neo silicon era, according to the 2009 Internation-al Technology Roadmap for Semiconductors . One outstanding property ofgraphene is its high carrier mobility at room temperature. In exfoliated sup-ported graphene, mobility as high as 70000 cm2 V-1 s-1 has been reported [2].However, large area monolayer or bilayer graphene suffers from the absenceof a band gap, which results in poor switching capability of GFETs. Despitethe intense work to improve the Ion/off ratio, only values less than 400 wereachieved. The largest band gap values were achieved with dual gated GFETswhich are controlled using a top gate and a back gate. Values of Ion/Ioff ratiosof around 400 have been demonstrated [3].

Single electron transport in graphene quantum dots is still not fully under-stood despite efforts by several researchers investigating graphene singleelectron transistor (GSET)[4]. Our group is engaged in the development ofsuch devices with the aim of building tunable, well controlled GFETs.

Despite the significant amount of work on graphene electronic devices suchas the field effect transistor, its use in sensors, actuators or micro and nano-electro-mechanical systems in general, is far from being explored. Owing itsextraordinary electronic, mechanical and thermal properties, extremely en-hanced micro and nanosystems can be built, that surpass their silicon counter-part. By combining graphene's electronic and mechanical properties, mono-lithic sensors can be developed with superior sensitivity.

Device fabricationU-shaped Graphene bilayer channel transistor

All fabrication was carried out using a dual focused ion beam/scanning elec-tron microscope system (Zeiss NVision40 FIB/FEGSEM) equipped with a gasinjection system (GIS). A bilayer graphene flake on a 300 nm layer of SiO2

on Si (sample purchased from Graphene Industries Ltd.) was used. Electronbeam- induced tungsten deposition was then used to deposit thin protectivelayers across the edges of the graphene flake in areas where contact form-ation would take place. Square contact pads, 50 µm x 50 µm, and smallerrectangular strips to connect the pads to the graphene were deposited usinggallium ion beam-induced tungsten deposition in the same system. The ionbeam current was adjusted in the range 0.08 – 13 nA for maximum depositionrate depending on the areas over which the deposition was occurring. TheGallium ion beam was then used to mill the contact wires and graphene flaketo form and isolate the device. A beam current of 150 pA was used whenmilling the tungsten and 80 pA when milling the graphene. The samples wereannealed at 400 oC for 10 minutes prior to their characterisation.

Graphene single electron devices

A variety of quantum structures were fabricated using mono and bilayergraphene. The devices were fabricated in two steps: coarse patterning us-ing e-beam lithography and fine patterning using the helium ion microscope.The coarse patterning is used to define contact leads and to isolate an areaof 1 um x 1 um where helium ion direct write will take place to define thequantum dots. For the fine patterning we used the helium ion microscope(HIM) which is a new imaging technology based on a scanning helium ion beaminstead of an electron beam. The HIM provides a helium ion probe with a sizesmaller than 0.5 nm in combination with smaller proximity effect comparedto ebeam lithography. This allows a much localized writing on materials aswe will show here. Our tool integrates a pattern generator software whichoffers a user interface allowing the exposure parameters to be adjusted suchas the dose, dwell time, writing resolution, etc., as well as the definition ofthe pattern to be written, either as predefined geometries or an uploadedbitmap file. The helium ion beam can carve extremely sharp structures ingraphene thanks to it small spot size.

Graphene nano-mechanical devices

Graphene nano-mechanical structures are fabricated with the helium ionmicroscope. The sample was loaded into the HIM and the writing was per-formed under a vaccum of 5 x 10-7 Torr. Prior to writing, the HIM chamber wascleaned overnight by an embedded plasma system to avoid contamination ofthe sample during the writing operation.

ResultsU-shaped bilyer graphene transistor[5]

Scanning electron micrographs showing: (a) Thegraphene flake. The dashed outline marks the areas suit-able for formation of the devices; (b) The device andthe contact pads, with the dashed outline marking thesame area as in (a); (c) the graphene U-shaped devicewith tungsten contact wires and pads, (d) detail of thegraphene U-shaped device.

The Id-Vg characteristic at Vd = 1 V, showing the off-pointof the U-shaped transistor (a), and the Id-Vd characteristicat Vg =-4 V (b).

The results above shows the drain current Id as a function of the back gatevoltage, Vg , for a drain voltage of 1V. Figure 2-b shows the drain currentas a function of the drain voltage Vd for Vg =4 V. The Id-Vg characteristicshows a marked dip around Vg=Voff= 3V, where the GFET channel is switchedoff. This characteristic is dissimilar to the usual large area graphene Id-Vgcharacteristic which shows a smooth evolution of the drain current towardsthe Dirac point. The Ion/Ioff derived here is around 4.8×105 (taking Id=3.5×10-4

A at Vg=-5 V, and Id=7.25×10-10 A at Vg=3.3 V), larger by 3 orders of magnitudethan the highest Ion/Ioff obtained in dual gated GFET.

Graphene single electron devices[6]

Arrays of fabricated graphene quantum dots. the pictures shows a zoom-in the central area where the heliumion direct write takes place. The contact leads were fabricated using a lift-off process after ebeam exposure. Thequantum dots were defined by the helium ion microscope.

We have fabricated two kinds of single electron devices: four coupledquantum dots and two coupled quantum dots fabricated with the helium ionmicroscope. The four coupled quantum dots can be used as a quantum cel-lular automaton, allowing a logic operation. The characterisation of thesedevices is in progress. Notice the fine edges and the squared shape of thedouble quantum dot. This kind of sharpness is difficult to achieve with ebeamlithography.

Graphene for nano-electromechanical systems[7]

We have fabricated three type of nanostructures: a nano-beam, a wine glassdisk resonator nanostructure and a resonant torque Nanostructure respect-ively. These structures were patterned with a resolution of 1 nm/pixel. Afterpatterning, the structures were released buy vapor HF etching of the under-

lying oxide (300 nm thick ). One notices the fine edges of these structuresthanks to the very small spot of the beam. This level of accuracy is very hardto achieve with e-beam lithography which is widely used for graphene pat-terning. The beam has a length of 1 um and the width of about 200 nm, whilethe resonator has a diameter of 1 um and a gap of less than 30 nm. Gap valuesless than 10 nm can be achieved.

Helium ion patterning of nanostructures on bilayer graphene: a) a nano-beam having a length of 1 um, a width of 200nm; b) a wine glass disk graphene resonator and C) a resonant torque structure.

ConclusionsIn conclusion, we have fabricated a graphene field effect transistor having aU-shape geometry using FIB technology. The achieved Ion/Ioff exceeds 105.We have also developed single electron devices using a two step process:coarse structures with e-beam lithography while the very fine structures werefabricated with a helium ion microscope. We have shown that graphene canbe used as a material for nano-electro-mechanical-systems. Owing its ex-traordinary electrical and mechanical properties, enhanced devices can beachieved. Future work will focus of the functionalisation of such devices byelectrodes deposition on the structures to characterise their electro-mech-anical properties.

References[1]] Novoselov, K. S.; Geim, A. K.; Morozov, S. V.; Jiang, D.; Zhang, Y.; Du-bonos, S. V.; Grigorieva, I. V.; Firsov, A. A., Science, 36, 666, (2004)

[2]Fang Chen, Jilin Xia, David K. Ferry and Nongjian Tao, Nano Lett., 9 (7),pp 2571–2574 (2009)

[3]Xia, F.; Farmer, D. B.; Lin, Y.; Avouris, Ph. Nano Lett. , 10, 715 (2010)

[4]T. lhn et al. Materials Today, 13, pp 44, (2010)

[5] Z. Moktadir, S. A. Boden, A. Ghiass, H. Rutt and H. Mizuta, ElectronicsLetters (in press)

[6] S. A. Boden, Z. Moktadir, D. M. Bagnall, H. Mizuta and H. Rutt, Microelec-tronic Eng. (in press)

[7] Z. Moktadir, S. A. Boden, H. Mizuta and H. Rutt, MicroMechanics Europeworkshop (MME 2010) proceeding, pp. 88-91, (2010)