Chips

A chip is a complex device that forms the brains of every computing device. While chips look flat, they are three-dimensional structures and may include as many as 30 layers of complex circuitry.

A microchip is a small semiconductor used to relay information via specific electrical characteristics. In some cases, the term can be used interchangeably with integrated circuit. The first chip held one transistor, three resistors and one capacitor; modern ones commonly hold millions of transistors in a space smaller than a U.S. penny. The increase in smaller and smaller semiconductor chips has led to numerous other benefits. Beyond being used in electronic gadgets, they can be inserted into biological organisms as well.

From Sand to IngotsThe semiconductor manufacturing process begins with one of the most common elements on earth, silicon. Silicon is found in abundance in sand, but before it is used in semiconductor manufacturing it is refined to be virtually 100% pure. Purity of materials is fundamental to delivering chips that function as intended.Pure silicon is then heated until it reaches a molten state and a perfectly structured silicon “seed” is then lowered into the molten silicon. The chemical properties of the molten silicon allow a chemical bond to be formed with the seed and a long ingot of solid silicon can slowly be pulled from the silicon as its cools and solidifies around the seed. When the process is complete, the finished ingot exactly mimics the physical characteristics of the original seed material.The ingot is then carefully sawed into thin wafers the diameter of the ingot, most commonly 200 mm (8-inches) or 300 mm (12-inches) across. (Pg.1)

Into the FabSilicon is the base material for chips precisely because of the conductive properties related to its molecular structure. Under certain conditions silicon will conduct electricity and under other conditions it does not. That’s why we use the term “semiconductor.” This on/off capability is what underlies the transistor switching action that forms the ones and zeros of digital logic.The multiple steps in semiconductor manufacturing all serve to build components with the necessary electrical structure to rapidly switch and transfer signals for computational purposes. In addition to the switching transistors and the metal traces that conduct electrical signals between various regions of the chips, insulating materials separate conducting areas of the device.

In order to alter the characteristics of the semiconductor, the following steps are undertaken in various sequences depending on the complexity and functionality of the device.

Deposition is the process by which an insulating layer is grown on the silicon substrate

Diffusion bakes impurities into areas of the wafer to alter its electrical characteristics

Ion implantation is another process for infusing the silicon with various dopants to change its electrical characteristics

In between these steps, areas of the chip are patterned with an image for that particular layer of the device via photolithography. In photolithography, a very precise “mask” is used to expose photoresist that has been applied across the wafer, much like emulsion on film. This pattern hardens into an exact representation of the mask when it is developed.Etching then removes selective areas of the pattern using a plasma that reacts to the material not covered by the hardened photoresist.

These steps are repeated to create layers of transistors with precise operating characteristics that have been determined by the deposition, diffusion and ion implantation steps. A specialized deposition process called Metallization forms the critical interconnections between different areas of the chip and different transistors. Metallization is also used to form the bonding pads that connect the chip to the package and then to the circuit board of the system it supports. (Pg. 2)

After all production steps are complete, a final protective layer is put over the entire wafer. Probe testing then provides an initial look at how many functional devices are on the wafer. (Current technology allows us to pack more than 180,000 transistors in the cross-sectional area of a single human hair. At such tiny dimensions, even the smallest dust particle can ruin the functionality of an entire chip!) Next, a very precise saw cuts the individual chips from the wafer and the good die are packaged, tested again and shipped to the customer.Although the above steps are in general use across the semiconductor industry, proficiency in manufacturing is a vital aspect to success in this highly competitive market.

SandWith about 25% (mass) Silicon is –after Oxygen –the second most frequent chemical element in the earth’s crust. Sand –especially Quartz -has high percentages of Silicon in the form of Silicon dioxide (SiO2) and is the base ingredient for semiconductor manufacturing.

Melted Silicon – scale: wafer level (~300mm/ 12 inch)Silicon is purified in multiple steps to finally reach semiconductor manufacturing quality which is called Electronic Grade Silicon. Electronic Grade Silicon may only have one alien atom every one billion Silicon atoms. In this picture you can see how one big crystal is grown from the purified silicon melt. The resulting mono crystal is called Ingot.

(Pg. 3)

Mono-crystal Silicon Ingot –scale: wafer level (~300mm/ 12 inch)An ingot has been produced from Electronic Grade Silicon. One ingot weights about 100 kilograms (=220 pounds) and has a Silicon purity of 99.9999.

Ingot Slicing-

Scale: wafer level (~300mm/ 12 inch)The Ingot is cut into individual silicon discs called wafers.

Wafer–scale: wafer level (~300mm/ 12 inch)The wafers are polished until they have flawless, mirror-smooth surfaces. Intel buys those manufacturing ready wafers from third party companies. Intel’s highly advanced 45nm High-K/Metal Gate process uses wafers with a diameter of 300 millimeter (~12 inches). When Intel first began making chips, the company printed circuits on 2-inch (50mm) wafers. Now the company uses 300mm wafers, resulting in decreased costs per chip. (Pg. 4)

Photo LithographyApplying Photo Resist –scale: wafer level (~300mm / 12 inch)The liquid (blue here) that’s poured onto the wafer while it spins is a photo resist finish similar as the one known from film photography. The wafer spins during this step to allow very thin and even application of this photo resist layer.

Exposure–scale: wafer level (~300mm / 12 inch) The photo resist finish is exposed to ultra violet (UV) light. The chemical reaction triggered by that process step is similar to what happens to film material in a film camera the moment you press the shutter button. The photo resist finish that’s exposed to UV light will become soluble. The exposure is done using masks that act like stencils in this process step. When used with UV light, masks create the various circuit patterns on each layer of the microprocessor. A lens (middle) reduces the mask’s image. So what gets printed on the wafer is typically four times smaller linearly than the mask’s pattern.

Exposure–scale: transistor level (~50-200nm)Although usually hundreds of microprocessors are built on a single wafer, this picture story will only focus on a small piece of a microprocessor from now on –on a transistor or parts thereof. A transistor acts as a switch, controlling the flow of electrical current in a computer chip. Intel researchers have developed transistors so small that about 30 million of them could fit on the head of a pin.

(Pg.5)

Etching

Washing off of Photo Resist –

scale: transistor level (~50-200nm)The gooey photo resist is completely dissolved by a solvent. This reveals a pattern of photo resist made by the mask.

)

Etching–

scale: transistor level (~50-200nm)The photo resist is protecting material that should not be etched away. Revealed material will be etched away with chemicals.

Removing Photo Resist –

scale: transistor level (~50-200nm)After the etching the photo resist is removed and the desired shape becomes visible.

(Pg. 6)

Ion ImplantationApplying Photo Resist –scale: transistor level (~50-200nm)There’s photo resist (blue top color) applied, exposed and exposed photo resist is being washed off before the next step. The photo resist will protect material that should not get ions implanted.

Ion Implantation –scale: transistor level (~50-200nm)Through a process called ion implantation (one form of a process called doping), the exposed areas of the silicon wafer are bombarded with various chemical impurities called Ions. Ions are implanted in the silicon wafer to alter the way silicon in these areas conducts electricity. Ions are shot onto the surface of the wafer at very high speed. An electrical field accelerates the ions to a speed of over 300,000 km/h (~185,000 mph)

Removing Photo Resist –scale: transistor level (~50-200nm)After the ion implantation the photo resist will be removed and the material that should have been doped (green) has alien atoms implanted now (notice slight variations in color).

(Pg. 7)

Metal DepositionReady Transistor –scale: transistor level (~50-200nm)This transistor is close to being finished. Three holes have been etched into the insulation layer (magenta color) above the transistor. These three holes will be filled with copper which will make up the connections to other transistors.

Electroplating–scale: transistor level (~50-200nm)The wafers are put into a copper sulphate solution as this stage. The copper ions are deposited onto the transistor thru a process called electroplating. The copper ions travel from the positive terminal (anode) to the negative terminal (cathode) which is represented by the wafer.

After Electroplating –scale: transistor level (~50-200nm)On the wafer surface the copper ions settle as a

thin layer of copper.

(Pg. 8)

Metal LayersPolishing–scale: transistor level (~50-200nm)The excess material is polished off.

Metal Layers –scale: transistor level (six transistors combined ~500nm) Multiple metal layers are created to interconnect (think: wires) in between the various transistors. How these connections have to be “wired” is determined by the architecture and design teams that develop the functionality of the respective processor (e.g. Intel®Core™ i7 Processor ). While computer chips look extremely flat, they may actually have over 20 layers to form complex circuitry. If you look at a magnified view of a chip, you will see an intricate network of circuit lines and transistors that

look like a futuristic, multi-layered highway system.

(Pg. 9)

Wafer Sort Test / Slicing

Wafer Sort Test –

scale: die level (~10mm / ~0.5 inch)This fraction of a ready wafer is being put to a first functionality test. In this stage test patterns are fed into every single chip and the response from the chip monitored and compared to “the right answer”.

Wafer Slicing –scale: wafer level (~300mm / 12 inch)The wafer is cut into pieces (called dies).

Discarding faulty Dies –scale: wafer level (~300mm / 12 inch)The dies that responded with the right answer to the test pattern will be put forward for the next step (packaging).

(Pg. 10)

Packaging

Individual Die –scale: die level (~10mm / ~0.5 inch)This is an individual die which has been cut out in the previous step (slicing). The die shown here is a die of an Intel®Core™ i7 Processor.

Packaging–

scale: package level (~20mm / ~1 inch) The substrate, the die and the heatspreader are put together to form a completed processor. The green substrate builds the electrical and mechanical interface for the processor to interact with the rest of the PC system. The silver heatspreader is a thermal interface where a cooling solution will be put on to. This will keep the processor cool during operation.

Processor–scale: package level (~20mm / ~1 inch)Completed processor (Intel®Core™ i7 Processor in this case). A microprocessor is the most complex manufactured product on earth. In fact, it takes hundreds of steps.

– only the most important ones have been visualized in this picture story -in the world's

cleanest environment (a microprocessor fab) to make microprocessors. (Pg. 11)