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WARMES GmbH
PRESENTATION:
HIGH - CURRENT Printed Circuit Boards
HIGH – CURRENTPrinted Circuit Boards
As an optimal combination of power electronics with digital electronicsKorsten & Goossens GmbH has developed and Herr Thomas Mang has patentedthe High - Current Printed Circuit Board (EP 1 639 869 B1) for you. WARMES GmbH is the onlycontracted partner who can produce such high current PCB in China.
High current becomes a big issue in the business area of power electronics:
Power- and control electronic on the same board.
In power electronics, increasing currents must be realized with a minimum of space.
Thermal management is another challenge. Also because the components gets more powerful and they produce heat. Because of the integrated copper bus bar, heat problems can be solved more easily.
Due to all of these benefits reducing costs is the most important issue. As a result ofthe High current PCB, interfaces can be reduced, as well as integration of functionsand technical needs. So by the end system costs can be cut down to more than50%!!
Power electronics is probably the most increasing business area in the electronic industry, HC-PCB’s as a part of that will be basic technology in this field. Applicationslike cell connector board, converter and electric rectifier, Hybrid and Electric cars andother fields will be a million Dollar market.
HIGH – CURRENTPrinted Circuit Boards
Industrial Electronics
Propulsion Technology
Generation of Energy
Automotives
Construction Machines
Electric Vehicles
Railway Technology
Military, Aviation, Navy
Today‘s Projects and possible Application Areas
HIGH – CURRENTPrinted Circuit Boards
OverviewTechnical Aspects
1. Transportation of high currents on the PCB of up to 1.000 A
2. Heat management
3. Indexing new technical possibilities
4. Much degree of flexibility (design of PCB)
5. Reduction of interfaces on the PCB
6. Connection techniques
7. Functionality
8. Production parameters
9. Soldering parameters
Conceptual formulation: Calculating the profile of conductor forhigh currents related to:
Heat Case of usage and defect (shortcut/overheat protection) Thermal resistance (layer structure, materials, connections…) Lot of heat and capacity Radiation and convection (unforced and forced)
Forces Mechanical stress by heat and expansion System of static / Connections (bearings, chucks, screw joint…)
-> torsion & camber Magnetic fields Vibration, impulses und frequencies…
Technical AspectsTransportation of High Currents
Heat measure by Phoenix Contact:2mm and 6mm of conductor width, lead- free
Technical AspectsTransportation of High Currents
High Current conductor Al/Cu combination as carrier, conductor and cooler
Through-plated holes
Copper as High Current conductor
Aluminium cooler
Top and Bottom layer
Aluminium, integrated byParts Aluminium as High
Current conductor
Technical AspectsHeat Management
Aluminium as carrier and cooler
Copper as High Current conductor
„HEAT Pipelining“
Ceramics
Heapipe
Hot module
Base material
Copper
Heatpipe leading to outer cooler Ceramic tube
Heat radiation
Technical AspectsHeat Management
• Press - Fit Technique
Technical AspectsHeat Management
…with 400µ - technique–> 20mm conductor width= conductor width ≥ 100mm
…with 2,0mm high current conductor–> 4mm conductor width
= conductor width ≥ 26mm
Conceptual formulation: Realisation of 8mm² conductor cross section over different technologies
Space saving by integration of capacity
max. 26mm
20mm
Technical Aspectsnew Technical Possibilities
Top view:
Single layer PCB
2 - layer PCB 200µm Cu
400µm Cu
d=2,0mm Cu – thickness
PCB ≥ 100mm
Cross section:
4 - layer multilayer 100µm Cu
Technical Aspectsnew Technical Possibilities
PCB ≥ 100mm
PCB ≥ 100mm
…with 2,0mm high current conductor–> 4mm conductor width
= conductor width ≥ 26mm
Example: Single layer PCB400µm Cu
With conventional technology:
Because of the height of the outer copper, the solder resist must be done by multiple printing or space has to be filled first.
With High – Current PCB of WARMES GmbH:
Because of the integrated high current conductors inside the PCB the result is an even surface where solder resist can be applied easily.
500µm Cu
Solder resist
Even surface
Technical AspectsIndexing new Technical Possibilities
400µm Cu
Improved voltage resistance
With conventional technology:
Reduced coverage of solder resist at the conductors edges leads to reduced voltage resistance. The result is danger by discharging through the air.
With High – Current PCB of WARMES GmbH:
Because of the even surface and the integrated high current conductors the PCB gets increased voltage resistance.
500µm Cu
Technical Aspectsnew Technical Possibilities
2- layer signal + high current layerHigh current layer at 0,6 – 2mm thickness
4- layer signal + high current layerHigh current layer at 0,6 – 2mm thickness
1- layer signal + high current layerHigh current layer at 0,6 – 2mm thickness
1
a)
1
2
b)
70µ
1234
1234
c)
35µ
1.500µ
Technological build-up
Technical AspectsMuch Degree of flexibility
Delivery also with RoHS - conformity
6- layer signal + 2 high current layersHigh current layers inside withe. g. 0,5 – 1mm of thickness
35µ
123456
d)
70µ
1.000µ
500µ
Technical AspectsMuch Degree of Flexibility
With High – Current PCB of WARMES GmbH:
Integration of control and power currents
With conventional technology:
Connection of control and power –unit by cable
Power unit
Control unit
Technical AspectsReduction of Interfaces on the PCB
Solution so far Solution from now
Technical AspectsReduction of Interfaces on the PCB
Tapped holethrough high current layer
Connection jack with drill for screw
Threaded bolt
COMBICON – connector(e. g. press – fit contact)
Blind via
Drills isolated fromhigh current layer
Drills outside high current layer
Technical AspectsConnection Techniques
Mechanical possibilities for connectionsPress – fit contacts:
Thermal attachment on high current conductor
Surface for access
Electrical connection
Mosfet
Thermal connection Electrical connection
Even surface
High current conductor
Technical AspectsConnection Techniques
Reduction of scattering fields by integrating specific highcurrent layers or mass areas.Example: Scattering fields of a 4 layered multilayer board canbe reduced by adding specific high current layers.
Obtaining a higher material stability by inner high current layer.– Example: In contrary to a 4-layerd multilayer which has to be bolt
together the High - Current PCB is much more stable because the viasdo not crack.
Hülsenrisse
Technical AspectsFunctionality
In contrast to conventional technologies, with an optimized layout there will be no through hole plating necessary to carry high currents.
Because of the High – Current Technology, in contrast to traditional fabrication the danger of over- under etching factors can excluded.
Technical AspectsFunctionality
Material quality
Exa
mpl
er fo
r bas
e m
ater
ials
Tg-V
alue
[°C
]
Vol
tage
re
sist
ance
[kV
/mm
]
Hea
t tra
nsm
issi
on
[W/m
*K]
DE 104 130 >40 0,3IS 410 170 >40 0,3IS 620 215 >40 0,399ML 170 >40 1,1
Ceramic - 15 16-30
Bei
spie
le fü
r W
erks
toffe
Spe
cific
ele
ktric
al
resistance[Ωmm2 /m
]
Hea
t ca
paci
ty[J
/kg*
K]
Hea
t tra
nsm
issi
on
[W
/m*K
]
Den
sity
[g/c
m³]
Cu-sheet 0,0178 385 380 8,92Al-sheet 0,0264 900 237 2,70Ceramic 1018 900 16-30 3,5
Technical AspectsFunctionality
Format of data: Gerber or extended Gerber
Design rules: Avoidance of too complex structures of high – current layers,proportion of copper maximum at 75%
What to take care of when designing a high – current PCB
Declaration of copper thickness of all layers
Declaration of special materials e. g. solder special solder resist or base materials
Multiple printing of solder resist to get higher voltage resistanceTypical values: 20-30µm of solder resist per print on even surfaces, at the edgesabout 5-8µm at a voltage resistance of 160-190kV/mm
Final thickness of PCB ≤ 3,2mm; every high current-layer needs a coverage ≥ 0,3mm standard
At the area of depth - milling of course no through hole plating possible.
Technical AspectsProduction Parameters
... What to take care of when designing a high – current PCB
Maximum format of manufacturing: 570mm x 340mm, bigger formats on demand
Hole diameters: >=0,8mm – 1,5mm (depending on depth of drill and copper)
Pitch of drilled edge to high – current conductor >=1mm
Press – Fit Contacts as reliable and effective connector
High current conductors may not be composite inside a PCB
Declaration of Surface chem. Sn, chem. Ni/Au galv. Sn, galv. Ni/Au, galv. Ni/Au/Rh H.A.L. (lead free) subject to layout (limited)
Technical AspectsProduction Parameters
In General: PCBs have to be annealed with 120°C for 120 minutes
to avoid delaminating , just like every multi – layered PCB Usage of suitable flux Sufficient pre – heating and careful cool off (copper stores lots of heat)
Wave soldering (conventional equipment): Lead free at about 250°C - 270°C, 5 - 10 Sekunden (may vary) Improved soldering results with vacuum or higher wave pressure Better results by choosing suitable length and forms of connectors
Reflow – technique (SMD - equipment): Lead free at peak about 240°C and 0,8 m/min Dwell at Peak about 5 Sekunden
Technische AspekteSoldering Parameters
With High – Current PCB of WARMES GmbH:
Integration of control and power unit
With conventional technology:
Control and power unit separately
Application: Battery drive for hall carriage machines
Commercial AspectsComparison
With High – Current PCB of WARMES GmbH:
With conventional technology:
Product price: 180 Euro
Assembly costs: 20 Euro
Set-up: 20 Euro
System costs: 220 Euro
Product price: 100 Euro
Assembly costs: 5 Euro
Set-up: 10 Euro
System costs: 115 Euro
In this example cost saving is about 50%.
Commercial AspectsCost Opposite
Summary:
System price is at favourable price
Miniaturization (space saving + less weight)
Reduction of suppliers and mounting
Less numbers of interfaces
Shorter time of implementation
Saving of mechanical components
Technical progress with High – Current PCB possible
Servicemanagement
Commercial AspectsAdvantages
Twisted copper cable, integrated in FR4 or high temperature Material
Flat cell connected with high current PCB by Ultrasonic welding
Further DevelopmentsHigh current and signal electronicaround the corner
Ultrasonic weldingfor Li-Ion flat cells
2.5mm copper bus bar, integrated in FR4 or high temperature Material
High current and Polyimide in one PCB
Further DevelopmentsHigh current and signal electronicaround the corner
... just give us a call.we like to help you with your new applications and optimized PCB.
... And what can we do for YOU?
YOUR Contact Person:
Mr. Yingjun Zhang
WARMES GmbHLuxemburger Str. 267D-50354 HürthGermanyTelefone: +49 2233-708318Telefax: +49 2233-77888E-Mail: [email protected]