Wafer Foundry Offerings for Smart Mobility Solutions

Alexander Muffler

Field Application Engineering Manager EMEA

Outline

• Introduction

• Holistic Wafer Foundry Approach Semiconductor process

Design support

Wafer fab / operations

Quality systems

• Summary

What Is Smart Mobility?

• Smart mobility is a new and revolutionary way of transportation Cleaner

Safer

More efficient.

• Implication to semiconductors Increased focus on safety, robustness and reliability

Introduction

Overview of typical Semiconductor applications in modern cars, especially in high-temperature environments

High temperature spots in different zones of a car

(source: www.eetimes.com)

Hall sensor Pressure sensor Inertial/gyro sensor Temperature sensor Optical sensor Touch panel sensor

Battery Fuel Gauges Battery Monitors Battery Protectors

LIN & CAN bus transceiver

Voltage regulator IC BLDC motor controller Full Bridge MOSFET Pre-Driver Mid.-Power 3 Phase BLDC Pre-Driver

X-FAB Semiconductor Foundries – Who We Are

• The More than Moore Foundry.

• 25 years proven track record of

experience in pure-play foundry

services for analog/mixed-signal

semiconductor applications

• Specialty foundry with a

comprehensive set of robust

technologies serving automotive

needs such as high temperature,

high voltage and non volatile

memories

• Manufacturing excellence

• 6 wafer fab facilities in Germany,

France, Malaysia and US

• Capacity: 98,000 wafer starts per

month (200mm equiv.)

• IATF 16949 certification for all sites

• Audited and approved by major

OEMs

• More than 4,000 employees

worldwide

• Technologies interfacing the real world

• Expertise in analog/mixed-signal IC

production, MEMS and SiC with a focus

on high-growth automotive, medical and

industrial end markets with long

lifecycles

• Strong design support to drive customer

engagement over the long-term with

successful technology leaders

• Technologies qualified according to

AEC-Q100

Automotive Semiconductor Requirements

Function - Technologies interfacing the real world

Robustness - Temperature, vibration, humidity, acceleration

Reliability - Zero ppm

Cost - Best cost per function, best die cost

Quality Systems - ISO TS / IATF 16949 certification

Automotive Quality: Degree to which the primary characteristics like function, robustness, reliability and cost are fulfilling the customer requirements Robustness

Cost

Reliability

Function

Function – Automotive SOC

• Increases complexity – more digital content • Wide range of sensing capabilities

Pressure, Temperature, Inertial, Light, Magnetic Field, …

• High voltage and power handling capabilities • Intelligence

Signal conditioning ADC / DAC conversion Configuration according to environmental

conditions Short loop control function

• Networking capabilities Wire line, RF or optical connectivity

Automotive SOC require monolithic integration of digital, analog,

high voltage and NVM (non volatile memory) options

How X-FAB Supports Customers to Achieve “0 ppm“ Automotive Requirements

To fulfill your need to do Design for Reliability X-FAB is providing (selection):

• Spice models with 6-sigma limits

• Reliability specifications

• Monte-Carlo models

• Safe operating area check (SOAC)

• Design for test to achieve high test coverage Particular applicable for the provided IP & NVM blocks

Customer contribution requires:

Post wafer processing tasks to achieve 0-ppm goal:

• High test coverage

• Test at high or low temperature

• Provide test results to X-FAB

Automotive Quality Approach

• Infrastructure is in place at X-FAB to be part of the supply chain in order to support Automotive requirements

Wafer manufacturing

Raw material

Component manufacturing

Module manufacturing

OEM / Car manufacturing

End Customer Field

Yield Quality

Yield Quality

Yield, RMA Quality

Lifetime / RMA Yield, RMA Quality

Yield Quality

S u p p l y C h a i n

X-FAB Customer Supplier

Yield EOL 0miles Field Return

Qualification Methods

AEC-Q100, Rev. H

Level 2a

Level 1

Level 1 reliability assessment Focus on intrinsic failure mechanisms (e.g. JESD122, internal

knowledge)

Wear out tests

Test methods following JEP001A standard or internal procedure

Level 2a reliability assessment Focus on intrinsic failure mechanisms (e.g. JESD122, internal

knowledge)

Stress tests

Test methods following AEC-Q100-005 and JESD47 standards

NVM qualification methodology

AEC-Q100, Rev. H

Technology Certifications

Holistic Automotive Foundry Approach

Fab / Operations Process /

Technology

Design

Quality

X-FAB

Implication of Automotive Requirements

Design for test Design for manufacturing

Design for reliability

Characterization Safe operating area 6-Sigma modeling

Advanced manufacturing, inline inspection

and PCM test

Zero defect mindset Safe launch

Design Support

• 3- to 6-Sigma models

• Ready for high temperature design (Tj = 175°C)

• Operating condition check (extended simulation models)

• DFM: a built-in feature to the digital libraries

Increased dimensions where applicable, design tools to enable multiple via placement

• NVM IP blocks

Qualified for high temperature (+175°C) usage

Failure redundant solutions available – e.g. NVM ECC, Internal IP ownership

Embedded test features including wafer level test capability

• ESD

Extended ESD support with HV IO library building blocks proven in silicon

TLP measurements for ESD structures supporting I/O development for >8kV

Strong engineering support for custom I/O development

• EMC robust design environments

• ESD Checker tool

ECC = Error Correction and Detection Single bit error correction and dual bit error detection

ESD solutions and ESD support

ESD Webinars

ASIC Design

ESD Design Checker (XESDC)

Special ESD Protection

Structures

Consultations and ESD Design

Reviews Circuit Under Pad

IO / HV library documentation

HBM (CDM) ESD Test Reports of ESD

Test Vehicles

TLP I-V Characteristics of Primitive Devices and

ESD Protection Structures

ESD Design Guidelines

Standard Digital I/O Libraries

Special I/O Libraries

IC d

am

ag

e

V m a x

E S D

D e s i g n

W i n d o w

V t 1 , I t 1

V b r

sa

fety

ma

rg

in

V h

n o r m a l

o p e r a t i n g

r e g i o n

R o n

V t 2 , I t 2

V m i nI m a x

Cu

rre

nt

V o l t a g e

Fab / Operations

Extensive (cpk monitored) inline parameter control

Advanced inline SPC use of extended WECO rules

Use of customer yield information / ppm data, needed to trigger closed loop continuous improvement activities

Limited agreed rework

Automotive Processing Capabilities

ADVANCED PROCESSING

Automotive Processing Capabilities

ADVANCED INLINE SCREENEING

Cpk monitored parameter testing (Cpk ≥ 1.67)

Additional inline inspections:

- Enhanced event control

- Yield-matched, tightened reject criteria

- Higher sensitivity levels at inspections

Advanced outgoing product inspection

- 100% automated visual inspection (AVI) with electronic wafer maps

- Outlier screening

Quality Systems

Quality Methods

Test data feedback (PCM and

customers)

Inspection concept

Wafer level reliability

Safe launch Fast and secure

ramp up

Problem solving

competence 8d & 5why

6 S Program

Automotive Quality System - Zero Defect Mindset

6 SIGMA approach for measurement, analysis,

improvement and control

Zero defect mindset requires close alignment between Manufacturing, Design Support, Process Technology and Quality Systems This is ensured by strictly following and applying the implemented quality methods:

Design

Quality

Fab

Process / Technology

Summary

Quality Assurance Methods @ X-FAB

Area Method X-FAB’s contributions to support the method

Design Design for Robustness Six-Sigma Process Spec, Monte-Carlo Simulation, Lot-Specific SPICE Models, Corner Models; Process Reliability Spec, SOA Check, DRC, Reliability Design Rules, Reliability Calculator

Design for Test BIST for IP blocks, NVM IP Test Spec

FMEA/FMEDA Design FMEA, Process Reliability Spec, FIT Data

Qualification Robustness Validation AEC-Q100/JEDEC Process Qual., Reliability Models, Reliability Margin Analysis, Reliability Monitoring

KB Qualification Level 1 Reliability Tests, Reliability Failure Matrix

Manufacturability Study Statistical Process Qualification Methods, Cp/Cpk Study, Process Boundary Study, Corner Lot Evaluation

Manufacturing Process Control Inline Control, PCM Test, AVI, WLR/fWLR, SPC

Screening NVM IP Test Spec, Screening Guidelines

Failure Analysis Construction Analysis, Failure Case Studies; 8D Procedure, FA Support, IP Design for Analysis

Thank You! Alexander Muffler Field Application Engineering Manager EMEA E-Mail: alexander.muffler[at]xfab.com

Abbreviations

Foundry Solutions for Autonomous Driving 28

ADAS … Advanced driver assistance systems

APQP … Advanced product quality planning

AVI … Automated visual inspection

ASIL … Automotive Safety Integrity Level

BLDC … Brushless DC electric motor,

BIST … Built-In Self-Test

CAN … Controller area network

DFM … Design for manufacturability

DRC … Design rule check

EEPROM … Electrically Erasable Programmable Read-Only Memory

EMC … Electromagnetic compatibility

ESD … Electrostatic discharge

ECC … Error correcting code

FIT … Failure in time

FMEDA … Failure Modes, Effects and Diagnostics Analysis

HV … High Voltage

IP … Intellectual Property

IP … Intellectual property

IATF … International Automotive Task Force

ISO TS … International Organization for Standardization Technical Sspecification

Tj … junction temperature

LIDAR … Light detection and ranging

LED … Light-emitting diode

LIN … Local Interconnect Network

MOS … Metal Oxide Semiconductor

MEMS … Micromechanical sensor

NVM … Non Volatile Memory

OTP … One Time Programmable (Memory)

OCAP … Out of control action plan

Cpk … Process capability index

PCM … Process control monitor

PPAP … Production Part Approval Process

RGB … red green blue

SiC … Silicon Carbide

SONOS … Silicon Oxide Nitride Oxide Silicon

SPC … Statistical process control

SILC … Stress Induced Leakage Current

TLP … Transmission-line pulse

WLR … Wafer level reliability