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VTT MICROELECTRONICS 3D RADIATION DETECTORS ORSAY SEPTEMBER 2003. STATUS AS PERFORMER OF RESEARCH AND DEVELOPMENT WORK. Basic research Applied research Development work. Universities. VTT. Industry. VTT IN BRIEF www.vtt.fi. Staff breakdown by location: Oulu323 Outokumpu37 - PowerPoint PPT Presentation
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VTT MICROELECTRONICS3D RADIATION DETECTORS
ORSAY SEPTEMBER 2003
VTT CENTRE FOR MICROELECTRONICS
27.02.2003 / S. Eränen 2
STATUS AS PERFORMER OF RESEARCH AND DEVELOPMENT WORK
Basicresearch
Appliedresearch
Developmentwork
VTT
Industry
Universities
VTT CENTRE FOR MICROELECTRONICS
27.02.2003 / S. Eränen 3
Staff breakdown by location:
Oulu 323Outokumpu 37Jyväskylä 128Tampere 332Lappeenranta 12Espoo 2 159Others 21
Total 3 012
Units:
VTT ElectronicsVTT Information TechnologyVTT Industrial SystemsVTT ProcessesVTT BiotechnologyVTT Building and Transport
VTT Information ServiceVTT Corporate Management and Services
Staff: 3 012
Turnover: 214 M€
• Basic govern. funding to researchon VTT’s own initiative 34 M€
• Jointly funded projects 92 M€
• Commercial activities 88 M€
VTT IN BRIEFwww.vtt.fi
VTT CENTRE FOR MICROELECTRONICS
27.02.2003 / S. Eränen 4
Income from commercial activities
Income from jointly funded activities
Basic governmental funding to jointly funded activities
Basic governmental funding to research on VTT’s own initiative
VTT’S TURNOVER BY TYPE OF INCOME AND FUNDING
0
50
100
150
200
250
1996 1997 1998 1999 2000 2001
41%
27%
16%
16%
40%
30%
14%
16%
39%
32%
16%
13%
39%
32%
17%
12%
40%
28%
18%
14%
40%
25%
19%
16%
VTT CENTRE FOR MICROELECTRONICS
27.02.2003 / S. Eränen 5
DETECTOR ACTIVITIES IN 2003
1. Products + extras
2. New detector types for imaging & xrf
3. Device and process physics for planar detectors
4. 3D-detectors
VTT CENTRE FOR MICROELECTRONICS
27.02.2003 / S. Eränen 6
3D
3D PLANAR (strips &pixels)
VTT CENTRE FOR MICROELECTRONICS
27.02.2003 / S. Eränen 7
DETECTOR ACTIVITIES IN 2003
3D
WHY
• small voltage
• high collection speed
• edgeless
• radiation hardness
• Spatial resolution
• Large area CZ-wafers
APPLICATIONS: hep & imaging
VTT CENTRE FOR MICROELECTRONICS
27.02.2003 / S. Eränen 8
DETECTOR ACTIVITIES IN 2003
3D
PROCESSING
1. Normal processing steps applied for the planar detectors
2. Deep hole etching
• ICP-silicon etching (so called Bosch-process): established silicon process
3. Hole filling / planarization (polished surface, wafer handling & processing)
• LPCVD polysilicon or so-called epitaxial polysilicon (epi-poly)
• both processes can be grown as non-doped or in-situ doped (n or p-type)
• minimum resistivity: 1 mcm-range
• growth rate: LPCVD 1 m/hour (thick layers require sequential runs), epi-poly 1 m/min
• CMP ?
4. Dicing
• important especially for so-called edgeless detectors
VTT CENTRE FOR MICROELECTRONICS
27.02.2003 / S. Eränen 9
DETECTOR ACTIVITIES IN 2003 DETECTOR ACTIVITIES IN 2003
3DPROCESSING EXAMPLES: epi-poly
Problem: void formation
VTT CENTRE FOR MICROELECTRONICS
27.02.2003 / S. Eränen 10
DETECTOR ACTIVITIES IN 2003
3DPROCESSING: dicing
Problem: thickness of damage layer
substrate
backsides doping
oxide
edge doping
metal
Active strip doping
DICING BLADE:
• width 20 m
• position accuracy ± 2 m
VTT CENTRE FOR MICROELECTRONICS
27.02.2003 / S. Eränen 11
DETECTOR ACTIVITIES IN 2003
3DSIMULATIONS
2D
• Silvaco tools
• mixed mode
VTT CENTRE FOR MICROELECTRONICS
27.02.2003 / S. Eränen 12
DETECTOR ACTIVITIES IN 2003
3D3DSIMULATIONS: ISE
VTT CENTRE FOR MICROELECTRONICS
27.02.2003 / S. Eränen 13
DETECTOR ACTIVITIES IN 2003
3D3D SIMULATIONS: ISE
VTT CENTRE FOR MICROELECTRONICS
27.02.2003 / S. Eränen 14
Micro packaging
• Bump bonding of detector modules for Alice, LHCb, Medipix2
VTT CENTRE FOR MICROELECTRONICS
27.02.2003 / S. Eränen 15
Contacts
• Micro packaging: Jorma Salmi, + 358 9 456 6639, [email protected]
• IC processes: Hannu Ronkainen, + 358 9 456 6660, [email protected]
• IC design: Markku Åberg, + 358 9 456 6619, [email protected]
• MEMS: Hannu Kattelus, + 358 9 456 6319, [email protected]
• SOI-wafers: Kimmo Henttinen, + 358 9 456 6310, [email protected]
• Silicon detectors: Simo Eränen, + 358 9 456 6661, [email protected]