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VLSI System Design VLSI System Design Lect. 2.1 CMOS Transistor Theory Engr. Anees ul Husnain ( [email protected] ) Department of Electronics & Computer Systems Engineering, College of Engineering & Technology, IUB

VLSI System Design

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VLSI System Design. Lect. 2.1 CMOS Transistor Theory. Engr. Anees ul Husnain ( [email protected] ) Department of Electronics & Computer Systems Engineering, College of Engineering & Technology, IUB. Outline. Introduction MOS Capacitor nMOS I-V Characteristics - PowerPoint PPT Presentation

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Page 1: VLSI System Design

VLSI System DesignVLSI System Design

Lect. 2.1 CMOS Transistor Theory

Engr. Anees ul Husnain ( [email protected] )

Department of Electronics & Computer Systems Engineering,College of Engineering & Technology, IUB

Page 2: VLSI System Design

Outline

Introduction MOS Capacitor nMOS I-V Characteristics pMOS I-V Characteristics Gate and Diffusion Capacitance

Page 3: VLSI System Design

Introduction So far, we have treated transistors as ideal switches An ON transistor passes a finite amount of current

Depends on terminal voltages Derive current-voltage (I-V) relationships

Transistor gate, source, drain all have capacitance I = C (V/t) -> t = (C/I) V Capacitance and current determine speed

Page 4: VLSI System Design

polysilicon gate

(a)

silicon dioxide insulator

p-type body+-

Vg < 0

MOS Capacitor Gate and body form MOS

capacitor

Operating modes Accumulation Depletion Inversion

(b)

+-

0 < Vg < Vt

depletion region

(c)

+-

Vg > Vt

depletion regioninversion region

Page 5: VLSI System Design

Terminal Voltages Mode of operation depends on Vg, Vd, Vs

Vgs = Vg – Vs

Vgd = Vg – Vd

Vds = Vd – Vs = Vgs - Vgd

Source and drain are symmetric diffusion terminals By convention, source is terminal at lower voltage Hence Vds 0

nMOS body is grounded. First assume source is 0 too. Three regions of operation

Cutoff Linear Saturation

Vg

Vs Vd

VgdVgs

Vds+-

+

-

+

-

Page 6: VLSI System Design

nMOS Cutoff No channel

Ids ≈ 0

+-

Vgs = 0

n+ n+

+-

Vgd

p-type body

b

g

s d

Page 7: VLSI System Design

nMOS Linear Channel forms Current flows from d to s

e- from s to d

Ids increases with Vds

Similar to linear resistor

+-

Vgs > Vt

n+ n+

+-

Vgd = Vgs

+-

Vgs > Vt

n+ n+

+-

Vgs > Vgd > Vt

Vds = 0

0 < Vds < Vgs-Vt

p-type body

p-type body

b

g

s d

b

g

s dIds

Page 8: VLSI System Design

nMOS Saturation Channel pinches off Ids independent of Vds

We say current saturates Similar to current source

+-

Vgs > Vt

n+ n+

+-

Vgd < Vt

Vds > Vgs-Vt

p-type body

b

g

s d Ids

Page 9: VLSI System Design

I-V Characteristics In Linear region, Ids depends on

How much charge is in the channel? How fast is the charge moving?

Page 10: VLSI System Design

Channel Charge MOS structure looks like parallel plate capacitor

while operating in inversions Gate – oxide – channel

Qchannel = CV

C = Cg = oxWL/tox = CoxWL

V = Vgc – Vt = (Vgs – Vds/2) – Vt

n+ n+

p-type body

+

Vgd

gate

+ +

source

-

Vgs

-drain

Vds

channel-

Vg

Vs Vd

Cg

n+ n+

p-type body

W

L

tox

SiO2 gate oxide(good insulator, ox = 3.9)

polysilicongate

Cox = ox / tox

Page 11: VLSI System Design

Carrier velocity Charge is carried by e-

Electrons are propelled by the lateral electric field between source and drain E = Vds/L

Carrier velocity v proportional to lateral E-field v = E called mobility

Time for carrier to cross channel: t = L / v

Page 12: VLSI System Design

nMOS Linear I-V Now we know

How much charge Qchannel is in the channel

How much time t each carrier takes to cross

channel

ox 2

2

ds

dsgs t ds

dsgs t ds

QI

tW VC V V VL

VV V V

ox = W

CL

Page 13: VLSI System Design

nMOS Saturation I-V If Vgd < Vt, channel pinches off near drain

When Vds > Vdsat = Vgs – Vt

Now drain voltage no longer increases current

2

2

2

dsatds gs t dsat

gs t

VI V V V

V V

Page 14: VLSI System Design

nMOS I-V Summary

2

cutoff

linear

saturatio

0

2

2n

gs t

dsds gs t ds ds dsat

gs t ds dsat

V V

VI V V V V V

V V V V

Shockley 1st order transistor models

Page 15: VLSI System Design

Example We will be using a 0.6 m process for your project

From AMI Semiconductor tox = 100 Å

= 350 cm2/V*s Vt = 0.7 V

Plot Ids vs. Vds

Vgs = 0, 1, 2, 3, 4, 5

Use W/L = 4/2

14

28

3.9 8.85 10350 120 μA/V

100 10ox

W W WC

L L L

0 1 2 3 4 50

0.5

1

1.5

2

2.5

Vds

I ds (m

A)

Vgs = 5

Vgs = 4

Vgs = 3

Vgs = 2

Vgs = 1

Page 16: VLSI System Design

pMOS I-V All dopings and voltages are inverted for pMOS

Source is the more positive terminal

Mobility p is determined by holes Typically 2-3x lower than that of electrons n

120 cm2/V•s in AMI 0.6 m process Thus pMOS must be wider to

provide same current In this class, assume n / p = 2

-5 -4 -3 -2 -1 0-0.8

-0.6

-0.4

-0.2

0

I ds(m

A)

Vgs = -5

Vgs = -4

Vgs = -3

Vgs = -2

Vgs = -1

Vds

Page 17: VLSI System Design

Operation modes summary

2

cutoff

linear

saturatio

0

2

2n

gs t

dsds gs t ds ds dsat

gs t ds dsat

V V

VI V V V V V

V V V V

Page 18: VLSI System Design

Capacitance Any two conductors separated by an

insulator have capacitance

Gate to channel capacitor is very important Creates channel charge necessary for

operation

Page 19: VLSI System Design

Capacitance Source and drain have capacitance to body

Across reverse-biased diodes Called diffusion capacitance because it is associated

with source/drain diffusion

Page 20: VLSI System Design

Capacitance

Page 21: VLSI System Design

Gate Capacitance Approximate channel as connected to source Cgs = oxWL/tox = CoxWL = CpermicronW

Cpermicron is typically about 2 fF/m

n+ n+

p-type body

W

L

tox

SiO2 gate oxide(good insulator, ox = 3.90)

polysilicongate

Page 22: VLSI System Design

Diffusion Capacitance Csb, Cdb

Undesirable, called parasitic capacitance Capacitance depends on area and perimeter

Use small diffusion nodes Comparable to Cg

for contacted diff Varies with process