Upload
tobias-obrien
View
222
Download
0
Tags:
Embed Size (px)
Citation preview
Ver : GC-2.4
Company LocationCompany Location
2
3
• Company GIANTA CO., LTD • Address No.130, Sec. 2, Yangsin Rd., Yangmei
Township, Taoyuan County 326, Taiwan (R.O.C.)• Inauguration Date July 4, 2000
• Capital Investment NT$21,224,900
• Board Of Directors C.E.O. H.C.Yen Director Y.M.Yang Director S.J.Huang Director C.H. Lin Director J.W.Chia Supervisor C.H. Hsiao
• Associated Bank 1.Cooperative Bank of Taiwan SHING-SHEN BRANCH 2.E.SUN Bank YANG MEI BRANCH
• Factory Area 7,000sq.m
• Workforce 240Workers (2013/02) • Principal Manufacturing SMT LINE X5 DIP LINE X3 (For PB Free)
ASSembly conveyor X2 ASSembly-Free Flow X1 AOI (SMT) X8
AOI (DIP) X1 X-RAY X2 Other Solder paste thickness analyzer High Resolution Digital Microscope Solder paste viscostiy tester Humidity & Temperature control ovens etc.
Company ProfileCompany Profile
4
CEO President
Admin Division
Manufacturing Division
SMT Sec.
SMT Division
SMT PE Sec.
Quality Control Division.
Production Sec.
Admin Sec.
Purchasing Sec.
Quality Control Sec.
Technical Division
Manufacturing Sec.
OrganizationOrganization
5
ISO 9001 2008 Ver
ISO 14000 2004 Ver.
SONY Certificate of Green Partner
Supervisor level with over 12yrs.
Manufacturing experience
AOI, X-RAY, Solder paste
Thickness analyzer,
High resolution digital
Microscope 3D analyzer,
CSP Repair Equipment
Etc.
*PCBA LCD Monitor、 Wireless(802.11) 、 BLUE TOOTH、 MFP、 DSC、 PDA 、 VGA、 GPS、 GSM、 LCDLCD TV、 IPC、DVBT TUNER MODULE etc.*FPCA CCD IMAGE BOARD(DSC) IMAGE MODULE(MOBILE PHONE) etc.*SET STB、 STORAGE PROD、 ADSL、 ROUTER 、 GPS etc.E-BooK, Game Capture. Optical Tx.Rx Module
Highest level industry equipment
SONY Medium speed mounter,
AOI inspection
Panasonic solder paste printer,
High Speed Mounters
UNIVERSAL General surface mounter
ETC N2 Reflow
Manufacturing Tooling
Design & SMT Technology
0201(0603) ,Micro BGA Chip
Pb free Prod.
maunfacturing
Quality
Cost
Delivery
Service
Environment
Customer satisfaction
NO.1
New equipment
latest
Development
SMT equipment
Highly qualified & trained management Skilled engineers to make a unique team
Most complete
Equipment for
Quality Assurance
Quality Assurance
and Environmental Protection System
Hi-grade
Manufacture
Technology
Varied products Manufacturing Ability
Company StrengthsCompany Strengths
6
Production
Pilot Run Manufacture
Design Review & Setup
‧Manufacture scheduling‧Manufacturing control‧Product quality control‧Inventory control‧Delivery scheduling control
‧Design Review Results confirmation‧Pilot Run report‧Manufacturing tool design & production
‧Board design review & recommendation‧Prototype‧Prototype assessment report
Full manufacturing service SMT DIP assembly Function Test Packing delivery Full engineering support. meets customer’s total requirements.PCBA pilot run services Evaluate SMT、 DIP pilot run production, improve production efficiencies. Suitable for local design house using mainland production sources.Procurement service Components sourcing/purchase service,reduce customer’s logistical load, manpower + warehousing consideration
Professional Services & Support ServicesProfessional Services & Support Services
7
Middle SpeedPlacer
Middle SpeedPlacer
Whole Process Auto-Optical Inspection
A Line M:330*250
B Line M:330*250
C Line
L:460*360
D Line
M:330*250
E Line
M:330*250
SolderPrinter
High Speed
Placer
LOADERSolderPrinter
AOIMiddle Speed
PlacerN2
RefolwMulti-Function
Placer
LOADERSolderPrinter
AOIHgh Speed
PlacerMiddle Speed
PlacerN2
RefolwMulti-Function
Placer
LOADERSolderPrinter
AOIHgh Speed
PlacerMiddle Speed
PlacerN2
RefolwMulti-Function
Placer
Middle SpeedPlacer
Middle SpeedPlacer
Multi-FunctionPlacer
N2Reflow
AOIInspector
SMT Manufacturing ResourceSMT Manufacturing Resource
LOADERSolderPrinter
Middle SpeedPlacer AOI
Middle SpeedPlacer
N2Refolw
Multi-Function
Placer
Middle SpeedPlacer
Capacity:3.5 Mil Shoots/22hrs
Capability:1.Chip:0201
2.Micro BGA: pitch 0.4mm ball 0.25mm
3.POP
8
and others ----------
175X Video magnifier
KEYENCE VH6300
25X-40X LCD magnifier
SONY TW-TL1S
Paste viscosity tester
MALCOM PC-1TLBGA Repair Station
Oventemp,Porfile recorder
KIC Slim 2000X-Ray Inspection machine
MACRO SCIENCE MSX-2000
Paste thickness analyser
HS-2000 PackageIQFLex
WLAN2.4/5GHZShielding BOX
QA ResourceQA Resource
9
Manufacturer Model SET Model Year Print Capability Tolerance
PANA SPP-V 4
00.1001.0201.0301.03
0.3 mm PITCH ±0.025 mm
SONY SI-P950 1 02.12 0.3 mm PITCH ±0.012 mm
Manufacturer Model SET Model Year Mount Capability Tolerance
PANA MSR 3
00.1001.0203.08
0.08 SEC/Chips ±0.10 mm
1Solder Paste Screen Printer
2 High Speed Chip Mounter
Equipment SpecificationEquipment Specification
EquipmentEquipment SpecificationSpecification
10
Manufacturer Model SET Model Year Mount Capability Tolerance
SONY SI-E1000 7 00.10 0.198 SEC/Chips ±0.10 mm
SONY SI-E1100 1 03.09 0.17 SEC/Chips ±0.06 mm
SONY SI-F130 1 04.10 0.139 SEC/Chips ± 0.05 mm
SONY SI-F130 1 07.10 0.139 SEC/Chips ± 0.05 mm
SONY SI-G200MK3 2 10.12 0.139 SEC/Chips ± 0.05 mm
3 Mediun Speed Chip Mounter
Manufacturer Model SET Model Year Tolerance
UNIVERSALGSM-1 2 00.10
01.02 ±0.0127 mm
GSM-2 2 02.1203.09
SONY SI-G200 1 10.12 ±0.025 mm
4 General Surface Mounter
11
Manufacturer Model SET Model Year Additioual Compatability
ETC NE06-81M40 2 08.02 Heat W/N2 & Pb free Solder Possible
ETC NIS-208 2 01.0803.07
Heat W/N2 & Pb free Solder Possible
ETC NIS2O-102C 1 02.12 Heat W/N2 & Pb free Solder Possible
Manufacturer
Model SET Model Year
Resolution Detectable conditions
PWB visual
inspectorMIRTEC SONY
MV-2HTL CPC-1500
5
310.0903.09
25umMissing parts, off-center,
standing,bridging,
PWB visual
inspectorMIRTEC MV-2HTL 1 07.08 15.9um
Missing parts, off-center,
standing,bridging,
5 Reflow Oven
6 CHIP Visual Optical Inspection
Equipment SpecificationEquipment Specification
12
Manufacturer Model SET
25X→40X LCD magnifier SONY TW-TL1S 1
X-RAY Inspection Machine TECHNO TE-X2000MD 1
Paste thickness analyser MALCOM TD-3 1
Paste viscosity tester MALCOM PC-1TL 1
Oven temp. profile recorder MALCOM RC9 2
Paste blender GENITEC GAM-60 1
175X video magnifier KEYENCE VH6300 1
100X mcroscope inspection station HOZAN 1
SMD machine lang.Converter software SWIN SWIN-1000 1
MSD Ultra Low Humidity Cabinet ACE Dragon SDE-315 2
BGA/CSP repair work station FONTON RD-200 1
Humidify & temperature
Control ovens W/N2
COUN SMO-5 1
PCB “V” cut TME TB150-90 1
Router ELI ELI-5400 1
Ultrasonic welder IYEN W-22-F15C 1
Miscellaneous Numerous others
7 Additional Support Testing Equipment
Equipment SpecificationEquipment Specification
13
Reflow profile each LOT
Product quality control-daily monthly Report【 All mounted parts are inspected 】
․
․
Solder paste control-stock rotationSolder paste printing quality control All printed pads AOI inspected for sufficient coverage
Solder paste control-stock rotation
Reflow profile each LOT
Product quality control-daily
Solder paste printing quality control All printed pads AOI inspected for sufficient coverage
【 All mounted parts are inspected 】
․
․
․
․
․
․
REFLOW
AOI
Complete product
OK
NGRepair
F / B
Chip mounting
OK
PCB loading
Chip mounting
REFLOW
AOI
PCB loading
Solder paste printing
OK
OK
NGRepair
F / B
Solder paste printing
SMT Flow ChartSMT Flow Chart
14
Hand mount
Board loading
Touch up
DIP (Wave soldering)
F / B
QC random Inspec.
Delivery
OKNG
Repair, analyze, measure
Finished product
Rework
Elec.Testing
Assembly
Testing &inspection
Packaging
OK
OK
NG
NGRepair
Repair
F/B
AOI
OK
NG
‧Visual inspection-1st board part confirmation
‧Repair report‧Prod.Report-daily+monthly
‧Visual inspection-1st board part confirmation
‧Prod. Report-daily+monthly
‧Visual inspection-1st board part confirmation‧Defective product counter measure report‧Prod. Report-daily+monthly
‧QC report‧Delivery report
Mount & Assembly Flow ChartMount & Assembly Flow Chart
QC Engineer Diagram
15
PROCEDURE
PROCESS /ITEM
CONTROL ITEM
CONTROL CONDITION
CONTROL FREQUENCY
EQUIPMENT, INSTRUMENT,
FIXTURE / USING RULERECORDS
OP or Auditor
DOCUMENT for OPERATION
1 IQC Incoming Material ControlAQL According to MIL-STD 105E
Item & Q'ty check by invoice
Vendor approval and major / minor defect definition
FW-0802-03-01-02 Inspection Record
IQC Op.WI-0704-01-03 Incoming inspection procedure.
Ma=0.4 Mi=0.65 2 Baking PCB Baking 4hrs/125 Every Lot Oven Baking record. OP Customer request. IC Baking 4hrs/125 Every Lot Oven Baking record. OP Customer request.
3Preparation for material
Working order for apply material Product and Qty Customer order Customer order SALES/PP Customer order
Programming Model, Product, Qty Every time in new line MC Dept. filing Operator BOM Stencil Part number, edition Every time in new line Operator 4
To print solder paste at top side
Solder paste Leadfree Type(Customer spec) Every lot Solder paste machine. Daily report EngineerWI-3002A Solder paste instruction
Plane of knifeSet an angle at 60°, non-transparent area
Daily inspection Visual inspection Operator
Clean parameter for stencilWipe by manual Automatic wipe
Manual: once per hour Auto: 10 pcs. / each run
Dustless paper/ cleaner/ air gun
Operator
Mix rate for solder pastestirred solder paste 3 minutes before using
Every bottleSolder paste shaking machine
Operator
The thickness of paste 7 ± 1mil.Once per 2 hrs or change line
LSM Operator
Expiry of paste confirmation According to vendor's instruction Every bottleSolder paste inspection report
FM16-09 Expiry confirmation record.
Engineer
Storage temperature confirmation 0 ~ 10℃ Every bottleRefrigerator & thermometer
Engineer
Warm up time2 hours , 20 ~30℃ ℃, RH40 ~ 60%
Every bottle Dry box & humidity meter Operator Validation after opening cap 24 hours Every bottle Dry box & humidity meter Operator
Printing quality inspection smooth, mis-position, poor soldering, short
Change line after, mass production before once per 2 hrs
Visual & paste thickness analyser
SMT's members
Inspection first article inspection Thickness of paste, position magnifying glass Operator Sampling inspect 2pcs/ per 30minsThickness of paste, position magnifying glass Operator
16
QC Engineer Diagram5 Pick and Place Parts database & update To ensure parts specs P/R, new parts add upBOM FM16-02 Engineer BOM
Properly feeding & dispensingTo ensure station & parts while change line
Daily production/ prepare parts before change line
Visual inspectionFM16-03 CHIP confirmation sheet
OperatorWI-3004A, WI-3005A, WI-3006A
Properly on Ca & Cp of X-Y position
To avoid damage, reversed polarity, EC
Daily production/ change line first article inspection
Visual inspection & BOM
SMT's members
6 IR Reflow Temperature at each zonePre-heating area : average 0~4 /sec. Below℃
Every timeSlim-KIC Profiling recorder
FM16-06 Temperature records
Technician
WI-D080 IR reflow instruction
Speed of chainconstant temperature :150-190 time:60-120sec.℃
Ensure temp. & speed for stopping one month's product
IR- reflowFM16-05 IR reflow records
Engineer
IR Reflow: OVER 220 ℃above , 30 ~ 75sec
Daily report
peak temp.:230-250℃
Speed: 60-120 cm/m. Ref. Profile
7Inspection/ Touch up
Soldering spot & parts inspection
PCBA inspection criteria 100% inspection AOIDaily inspection report
Visual inspector
WI-3024B
Soldering spot, short, mis-soldering, wetless soldering
BOM 、 SOP, first article 100% inspection Visual inspection
Polarity, position, specs.
Short, duplicate, stand up
damaged parts, reversed polarity
17
QC Engineer Diagram8
To print solder paste on reverse side
Solder paste Leadfree type(Customer specified) Every lotSolder paste thickness analyser.
Daily report EngineerWI3002A Solder paste instruction
Plane of knifeSet an angle at 60°, non-transparent area
Daily inspection Visual inspection Operator
Clean parameter for stencilWipe by manual Automatic wipe
Manual: once per hour Auto: 10 pcs. / each run
Dustless paper/ cleaner/ air gun
Operator
Mix rate for solder pastestirred solder paste 3 minutes before using
Every bottleSolder paste shaking machine
Operator
The thickness of paste 7 ± 1mil.Once per 2 hrs or change line
LSM Operator
Expiry of paste confirmation According to vendor's instruction Every bottleSolder paste inspection report
FM16-09 Expiry reservation record.
Engineer
Storage temperature confirmation 0 ~ 10℃ Every bottle Refrigerator & themometer Engineer
Warm up time2 hours , 20 ~30℃ ℃, RH40 ~ 60%
Every bottle Dry box & humidity meter Operator
Validation after opening cap 24 hours Every bottle Dry box & humidity meter Operator
Printing quality inspection smooth, mis-position, poor soldering, short
Change line after, mass production before once per 2 hrs
Visual & paste thickness analyser
SMT's members
Visual inspection Thickness of paste, positionInspection first article inspection
magnifying glass Operator
Visual inspection Thickness of paste, positionSampling inspect 2pcs/ per 30mins
magnifying glass Operator
9 Pick and Place Parts database & update To ensure parts specs P/R, new parts add up BOM FM16-02 Engineer BOM
Properly feeding & dispensingTo ensure station & parts while change line
Daily production/ prepare parts before change line
Visual inspectionFM16-03 CHIP confirmation sheet
OperatorWI-3004A, WI-3005A, WI-3006A
Properly on Ca & Cp of X-Y position
To avoid damage, reversed polarity, EC
Daily production/ change line first article inspection
Visual inspection & BOM SMT's members
18
QC Engineer Diagram10 IR Reflow Temperature at each zone
Pre-heating area : average 0~4 /sec. Below℃
Every timeSlim-KIC Profiling recorder
profile records TechnicianWI-D080 IR reflow instruction
Speed of conveyorconstant temperature :150-190 ℃time:60-120sec.
Ensure temp. & speed for stopping one month's product
IR- reflow IR reflow records Engineer
IR Reflow: OVER 220 ℃above , 30 ~ 75sec
peak temp.:230-250℃ Speed: 60-120 cm/m. Ref. Profile
11 InspectionSoldering spot, short, mis-soldering, wetless soldering
PCBA inspection criteria 100% inspection Visual inspection SMTVisual inspector
WI-C004 PCBA inspection criteria
Polarity, position, specs. BOM 、 SOP, first article AOIdaily inspection report
Short, duplicate, stand up damaged parts, reversed parity Wave solder and repair
12 Singulation PCB type/Version V-Cut speed 1st. Art. Insp rec V-Cut Machine FM17-08C Operator
13Mount shield case
Preparation for shield case Part number Every piece Wave soldering,template Operator
13Throughhole component
part number polarity of part insertion Dip carrier jig
Wave solder Pot Temp. 260+/-5C start of ea. Lot temp. probe FM17-02A Operator WI3453D
velocity 1-1.1 m./min. 1st. Art. Insp rec elec. Display FM17-09F
pre-heat temp. >70 temp.probe
Touchup solder condition 1. poor solder each pc temp.control soldering iron Operator SOP
solder iron temprature 2.bridge 1pcs/ per 4 hrs solder iron temp.rec
14 InspectionSoldering spot, short, mis-soldering, wetless soldering
PCBA inspection criteria 100% inspection Visual inspection SMT use formVisual inspector
WI-C004 PCBA inspection criteria
Polarity, position, specs. BOM 、 SOP, first article AOI
QC Engineer Diagram15 Function test Function test program,version
Function test fixture and result display
100% test Daily report Operator Follow Customer SOP
16 FQC Sample test, According to Process inspection specification
MIL-STD-105E , Level ⅡAcc/Rej=0/1
FM24-04 QC record
Quality inspector
FM24-05 PCB Inspection SOP.
Appearance inspection Reference test specificationFM25-01 Inspection report.
Operator
Avoid scrach on surfaceAccording PCBA inspection specification
17 Packing Packing materials According to SOP procedure Each box. Daily production report
Operator Packing SOP.
S/N controlScan barcode for S/N(optional)
Foreman
Uniform on accessories
18 OQC Label, BOX, Module Q'tyShipping document.Customer Packing Spec.
Each box.Label printer.Packing machine.
OQC record. Operator QC Document
19 Stock inQty of finish goods & management
According to SOP for delivering procedure
Every lotImplement according to SOP
Operator
19