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WWW.SEMI-UST.COMServices provide by UST CO.,LTD
Universal Semiconductor Technology
UST Co.,Ltd will put customer' need before us andpromise that all UST staffs will do their best for maximization of satisfaction
Head Office & R&D CenterTechno Park D-908, Yatap-Dong 151, Bundang-Gu, Seongnam-City,Gyeonggi-Do, KOREA (463-760)
TEL : +82-31-604-1004FAX : +82-31-711-6344E-mail : [email protected]
Clean Room & Facility150-1, Seongju-ri, Wongog-myeon, Anseong, Gyeonggi-do, KOREA (456-812)
E-mail : [email protected]
Yatap Subway Station
Head Office & R&D CenterTechno Park D-908, Yatap-Dong 151, Bundang-Gu, Seongnam-City,Gyeonggi-Do, KOREA (463-760)
Clean Room & FacilityInside C&G Hitech, 150-1, Seongju-ri, Wongog-myeon, Anseong-City, Gyeonggi-do, KOREA (456-812)
CEOCEO
AccountingTeam
Sales TeamSales Team
R&D Dept.R&D Dept.
TRACK Dept.TRACK Dept.
CMP Dept.CMP Dept.
EngineeringTeam
EngineeringTeam
EquipmentMachine Dept.
EquipmentMachine Dept.
We’ve got your solution Semiconductor Equipment tool UST Inc Supplies FAB, SUB/FAB of semiconductor equipment and specialize refurbishment.
TEL MARK-7,8 and ACT-8,12 Modification, Up-grade and Overhaul System Configuration Free Change, Modification and Up-gradeOpen Cassette Type to SMIF Type Modification and Size Conversion
6inch and 8inch Multi FlowCassette Unit and Robot ModificationMapping Sensor Block Modification Main Robot Arm ModificationCOAT Unit and Cup ModificationDEV Unit and Cup ModificationWDS/Plate Modification
TEL MARK-II, V, VZ, 7, 8 Machine’s Inch Conversion (2,4,5,6,8 inch)
TEL ACT-8,12 Machine’s Inch Conversion (6,8 inch)
6inch and 8inch Multi FlowCassette Unit and Robot ModificationMapping Sensor Block ModificationMain Robot Arm ModificationCOAT Unit and Cup ModificationDEV Unit and Cup ModificationWDS/Plate Modification
2nd Source Parts and Unit of TEL MARK-II,V,VZ,7,8 and ACT-8,12
Fast delivery and Low-cost but same condition with OEM PartsCassette Stage Assembly manufactureC/A Arm, Main Arm (Ceramic, Vacuum Arm, Aluminum and Anodizing Type) manufacture Plate (LHP, HHP, CPL, HCP, ADH, HEL and CP Power Supply) manufactureFan Filter Unit A,B Type (Included HEPA Filter) Oven Central Stack manufacture of TEL ACT8, 12
L/E Tank (45cc, 100cc, 150cc, 200cc, etc) manufactureTEL MARK and ACT SMIF Type Unit manufacture of Same condition with OEMCOAT Nozzle Assembly (EBR, Back Side Rinse and Photo Resist Nozzle Tip) manufactureDEV Nozzle Assembly (H, SH, Spray and Stream type) manufacturePlasma to TFT LCD modification and Upgrade for TEL MARK by Low -cost
2nd Source Parts and Unit of TEL MARK-II,V,VZ,7,8 and ACT-8,12
TEL Clean Track Mark and ACT-8,12 Hot and Cooling Plate
Hot / Cooling Plate ProductionCPL, HCP, ADH, LHP, HHP Assembly ProductionHot Plate Modification (LHP ⇔ HHP, CPL ⇔ HCP)Thermo Controller ProductionSame Condition with OEMThermo Controller and Circulator of SMC 200mm / 300mm’s Repair Service
Auto Chemical Supply System modification and upgrade
CSS or Manual Supply or Both supply modificationBuffer Tank Auto Exchange Type System modificationSolvent/Develop/HMDS Chemical Supply System manufacture and modificationResist Cabinet Photo Resist Auto-Exchange manufacture and modificationAuto Drain Controller and Tray manufacture and modification
TEL/DNS/SEMES Spin Scrubber Refurbishment and Overhaul
6inch and 8inch Multi FlowCassette Unit and Robot ModificationMapping Sensor Block ModificationMain Robot Arm ModificationConsumable Parts Solution2nd Source Parts Controller and OS upgrade (Window XP Version)Provide Labor and Service
EBARA EPO2226,2228 Modification, Upgrade and Overhaul
EPO2226/EPO2228Trouble Shooting and Labor ServiceFree conversion between 6inch with 8inch I-Head Repair and ChangeProvide 2nd Source Parts -Rotary Joint manufacture and modification-I-Head manufacture and modification-Provide all of Consumable Parts
Single/Double-Layer PCBMulti-Layer PCB (4Layer ~ 26Layer)P.C.B Art WorkMetal / Flexible PCBMicom Firmware DevelopmentWire DesignBuild up etc.
P.C.B (Printed Circuit Board) Art-work and Assembly
OEM / ODM R&D Service
We can develop and provide all types of PCB from double-layer products to Carbon, MLB-B/D
OEM / ODM R&D Service
Development process chartDevelopment Planning and Review- Item Concept arrangement- technology deployment for Item and Review- Making a Development Plan Product Design - Product Features- 3D Rendering or Make a Design Mock-up and AssemblyThe design and mold development- Product Features- Make a each Standard Plane for Mechanism, Electronic and Circuit- 3D modeling design and 2D drawing - Mold supplier selection and order - Parts assembly, test and review- Written specifications of Product and Parts
Product Design and Development Support
Wafer Pre-Aligner
Wafer alignment system is equipped with X-axis, Y-axis. It performs highly-accurate centering and Flat or Notch find up to 300mm wafers.
Compact size Fast alignment High performance accuracy High performance repeatability Easy to use and install Notch, Flat wafer Sapphire, Glass wafer Wafer broken detect Wafer diameter detect Ethernet communication
Description Specification
Substrate size ~ 300mm Wafer
Power DC24V
Position Accuracy
Centering < ±20㎛
Theta < ±0.1 degree
Wafer Eccentricity R: ±5mm
Processing Time (sec)Alignment 3.2 ~ 3.7 sec
Warming up R: ±5mm
Detect Line CCD Camera
Moving Axis X, Y, Θ
Dimension(mm) 213(W) x 248(D) x 301(H)
Weight 8kg
Lift- Off System and Manual Spin CoaterThe machine has designed and manufactured a compact and easy-to-use spin-coater. This system consists of wet bath, Lift off and cleaning unit and includes chemical recycle function for saving chemical volume
Auto Loading & Dispensing
SPECIFICATION
Wafer Size: 2” ~ 8” WaferChemical Bath
- Double Layer Bath - Wafer Jig up-Down Unit- Ultra Sonic Spin Units
- Chuck: Edge Gripping type- Chemical / DIW Dispensing - Drain System Transfer Robot Chemical recycling Tank
- Temperature Control Available Chemical supply System Operation: Touch Screen
High Pressure Nozzle
LIFT-OFF System
Auto Track Spinner System
As the system is used in Lithography, the system coats wafers with photo resist and develop patterns on wafer with develop liquid. This system is used in many kinds of special coating process including MEMS process and includes both coating function of top/back side.
UMSC-5 Glass Coater
Description UMSC-5 Specification
Standard / Option Standard Option
Sample Loading 370 x 470 1,000 x 1,000
Operation PLC & Touch Screen PC
Dispensing Auto Dispensing Arm Slit Nozzle
Volume Control PR Pumping Tool
Motor AC Servo Motor / Direct Type AC Servo Motor / Belt Type
Spin Step 20 Steps, 20 Recipes
Spin RPM ~ 1,500rpm ~ 5,000rpm
Spindle Cover Installed
EBR (Edge Bead Removal) Installed
• UMSC-5 possible the EBR (Edge Bead Removal) on Square Glass• Auto Supply System can be set by N2 Pressure• LED, MEMS, Bumping, GaAs, Glass, Quartz• Multi process flow (Supported Cascade Mode )• Various System Configuration• The machine already tested High-repeatability and stability at the production wafer FAB
Glass Developer
Wafer Loading Module (Wafer Sorter)
Wafer Loading Module is equipped with X, Y-axis and Theta, Z-axis. It performs fast and precision motion controlling by micro motor.
Cylinder Type Flipping Type
Substrate size ~ 300mm Wafer
Operation PC Base
Robot Cylinder Type Flipping Robot
Suction Vacuum Vacuum
Mapping Sensor Option Attachment
StrokeX-Axis: AC Servo Motor R-Stroke: 410mm
Z-Axis: Air Cylinder Z-Stroke: 350mm
Arm Ceramic Finger Arm Ceramic Finger Arm
