User s Guide - Texas Instruments Experimenter Board User's Guide Literature Number: SLAU343B May 2011–Revised February 2012

MSP-EXP430FR5739 FRAM Experimenter Board

User's Guide

Literature Number: SLAU343B

May 2011–Revised February 2012

2 SLAU343B–May 2011–Revised February 2012Submit Documentation Feedback

Copyright © 2011–2012, Texas Instruments Incorporated

http://www.go-dsp.com/forms/techdoc/doc_feedback.htm?litnum=SLAU343B

Contents

1 Getting Started With the MSP-EXP430FR5739 FRAM Experimenter Board ................................. 51.1 Introduction ............................................................................................................... 5

1.2 Kit Contents .............................................................................................................. 6

1.3 MSP-EXP430FR5739 Board Overview ............................................................................... 6

1.4 Connecting the Hardware .............................................................................................. 6

1.5 Starting the PC GUI ..................................................................................................... 6

2 MSP-EXP430FR5739 User Experience Demo .......................................................................... 72.1 Associated Zip Folder Contents ....................................................................................... 7

2.2 The User Experience Demo ........................................................................................... 7

2.3 View, Edit, or Recompile the User Experience Code Using an IDE ............................................ 13

3 MSP-EXP430FR5739 Hardware ............................................................................................ 143.1 MSP430FR5739IRHA Device Pin Designation .................................................................... 14

3.2 Schematics ............................................................................................................. 15

3.3 PCB Layout ............................................................................................................. 18

3.4 Bill of Materials (BOM) ................................................................................................ 21

4 Suggested Reading ........................................................................................................... 225 References ....................................................................................................................... 22

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List of Figures

1 MSP-EXP430FR5739 Overview .......................................................................................... 5

2 Comparing Write Speeds When Writing to Nonvolatile Memory (MSP430FR5739 FRAM vsMSP430F2274 Flash) ...................................................................................................... 8

3 Comparing Average Power When Writing to Nonvolatile Memory at 13 kBps (MSP430FR5739 FRAM vsMSP430F2274 Flash)..................................................................................................... 10

4 On-Board Accelerometer ................................................................................................. 11

5 On-Board NTC Thermistor ............................................................................................... 12

6 MSP430FR5739 Pin Designation ....................................................................................... 14

7 Schematics (1 of 3)........................................................................................................ 15

8 Schematics (2 of 3)........................................................................................................ 16

9 Schematics (3 of 3)........................................................................................................ 17

10 MSP-EXP430FR5739 Top Layer........................................................................................ 18

11 MSP-EXP430FR5739 Bottom Layer .................................................................................... 19

12 MSP-EXP430FR5739 Silkscreen ....................................................................................... 20

List of Tables

1 User Experience Source Files ........................................................................................... 13

2 Bill of Materials (BOM).................................................................................................... 21

4 List of Figures SLAU343B–May 2011–Revised February 2012Submit Documentation Feedback


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USB Connection

Debugging andProgramming Interface

Accelerometer

NTC Thermistor

LED0 to LED8

MSP430FR5739 device

User Input Switches S1,S2

Reset Switch

Connection to EXP-MSP430F5438

Connection to CCxxxxDaughter Cards

SBW and MSP430Application UART

User's GuideSLAU343B–May 2011–Revised February 2012

MSP-EXP430FR5739 FRAM Experimenter Board

1 Getting Started With the MSP-EXP430FR5739 FRAM Experimenter Board

1.1 Introduction

The MSP-EXP430FR5739 Experimenter Board introduces TI's first embedded ferro-electric randomaccess memory (FRAM) based MCU, the MSP430FR5739. The experimenter board is an ideal platformfor evaluating the latest in embedded memory technology while allowing the user to easily develop,debug, and implement prototypes in an efficient manner.

The MSP430FR5739 device is supported by both IAR Embedded Workbench and Code Compose Studio.It is recommended to download the latest version of the IDE from www.msp430.com.

The Quick Start Guide (SLAU341) is recommended for users who cannot wait to get started developingwith the MSP430FR5739. For all others, this MSP-EXP430FR5739 FRAM Experimenter Board User'sGuide provides detailed information on the hardware, the user experience firmware, and theMSP430FR5739 device.

The MSP-EXP430FR5739 Experimenter Board is available for purchase from the TI eStore athttps://estore.ti.com/MSP-EXP430FR5739-MSP-EXP430FR5739-Experimenter-Board-P2430C42.aspx.

Figure 1. MSP-EXP430FR5739 Overview

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Getting Started With the MSP-EXP430FR5739 FRAM Experimenter Board www.ti.com

1.2 Kit Contents

The MSP-EXP430FR5739 FRAM Experimenter Board kit includes the following:

• The MSP-EXP430FR5739 board

• Mini USB-B cable, 0.5 m

• 12-pin PCB connectors (two male and two female)

• 32.768-kHz clock crystal from Microcrystal (www.microcrystal.com)

The 32.768-kHz crystal can be used as the low-frequency XT oscillator. It is not required for the UserExperience code and can be populated as needed.

• Quick start guide

See Section 2.1 for details on the associated software and source code.

1.3 MSP-EXP430FR5739 Board Overview

The experimenter board (see Figure 1) comes equipped with the following features:

• USB debugging and programming interface that uses a driverless installation and provides anapplication UART to communicate back to the PC

• On-board ADXL335 accelerometer

• NTC thermistor for temperature sensing

• Two user input switches and a reset switch

• Eight LEDs for output display

• Connectivity to the MSP-EXP430F5438 Experimenter Board

• Connectivity to CCxxx radio daughter cards

• Easily accessible device pins for debugging purposes or as socket for adding customized extension

• Separate power jumpers to measure power to the MSP430 and the RF daughter card.

1.4 Connecting the Hardware

Connect the MSP-EXP430FR5739 to the PC using the enclosed USB cable. If the PC has an MSP430Integrated Development Environment (IDE) such as Code Composer Studio™ or IAR EmbeddedWorkbench™ already installed, the driver files are automatically located and installed.

If there are no IDEs installed in the PC, unzip the folder associated with this user's guide (see Section 2.1)and point the installation to the [Install Path]\MSP-EXP430FR5739\Drivers folder.

After the drivers are installed, go to My Computer → Properties → Hardware → Device Manager to verifythat the board is enumerated under Ports COM & LPT as MSP430 Application UART.

1.5 Starting the PC GUI

The Graphical User Interface (GUI) for the PC is located in the associated zip file (see Section 2.1) under[Install Path]\MSP-EXP430FR5739\Graphical User Interface.

Double click on FRAM_GUI.exe to load the PC application. More information on how to use thisapplication is provided in Section 2.

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www.ti.com MSP-EXP430FR5739 User Experience Demo

2 MSP-EXP430FR5739 User Experience Demo

2.1 Associated Zip Folder Contents

The zip file that contains the software and source code for the MSP-EXP430FR5739 can be downloadedfrom www.ti.com/lit/zip/slac492. The contents of the zip include:

• User Experience source code and project files

• Drivers that support the board installation

• PC GUI

The design files for the experimenter board are can be downloaded from www.ti.com/lit/zip/slac502.

2.2 The User Experience Demo

The User Experience demo is pre-loaded in the MSP-EXP430FR5739 board.

The user input to the demo is given using the switches S1 and S2. These switched allow the user toselect the mode of operation and other options.

The output from the demo is displayed using the LEDs (LED1 to LED8) and is also sent via theback-channel UART that transmits information to the PC.

There are four modes of operation for the User Experience demo:

1. High-speed FRAM writes

2. Emulating the speed of flash writes

3. Sampling accelerometer data and writing to FRAM

4. Sampling thermistor data and writing to FRAM

2.2.1 Entering and Exiting the Demo Modes

Follow these steps to enter and exit the demo modes:

1. Press switch S1 for mode selection. After you press S1, LED8 through LED5 light up to show thecorresponding mode.

2. Press switch S2 to enter the mode.

3. Press switch S2 when inside a mode to turn off the display (LED and UART output). This is usefulwhen measuring power.

4. Press S1 to exit a mode and return to mode selection.

NOTE: Pressing S2 without selecting a mode causes LED8 to toggle rapidly, indicating an invalidsequence. To exit from this mode, press S1 to return to mode selection.

The MSP-EXP430FR5739 board is equipped with a reset switch. On reset, the device displays a shortLED lighting sequence.



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Write

Speed (

kB

/s)

1400

13

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10

100

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10000

FRAM Flash

MSP-EXP430FR5739 User Experience Demo www.ti.com

2.2.2 Using Mode 1 – FRAM High Speed Writes

Mode 1 is entered by pressing S1 once, followed by S2. On entry, LED8 through LED1 light upsequentially to display the speed of FRAM writes.

Every time the LED1 through LED8 sequence is completed, 800KB are written to FRAM. In this mode,FRAM is bring written to at about 1.8MB per second. In comparison, a full-speed write to flash canachieve speeds of approximately 13kB per second.

Figure 2. Comparing Write Speeds When Writing to Nonvolatile Memory(MSP430FR5739 FRAM vs MSP430F2274 Flash)

Note that the code is optimized for power and not speed. FRAM memory blocks can be written at speedsgreater than 8MB per second depending on how the code is optimized. See the application reportAchieving High-Speed FRAM Writes Using the MSP430FR5739 for more details.

On entering Mode 1, the address of the FRAM scratchpad location is calculated. For the User Experiencedemo, the scratchpad location starts at 0xD400 and ends at 0xF000. This location can be modified in theheader file FR_EXP.h. Note that when changing this location, it is important to first check the code spacerequirements in the map file to ensure that the FRAM scratchpad area does not overlap with theapplication code. Different compilers and optimization settings may impact the placement of theapplication code. If any overlap occurs, the application code may be overwritten in Mode 1, which cancause the demo to fail.

In Mode 1, the system main clock is configured to use the DCO set to 8 MHz. A function that performslong-word writes to FRAM is called continuously inside a while loop. Each time the FRAM_Write() functionin FR_EXP.c is called, 512 bytes are written. This number was chosen arbitrarily to mimic flash segments,and there are no restrictions on the number of FRAM bytes that can be written at once. While in Mode 1,the LED sequence changes every time 100kB are written. For example, after the first 100KB are written,LED8 is turned on; after the next 100kB are written, LED8 and LED7 are turned on; and so on. Thesequence completes when all eight LEDs are turned on, after which the process rolls over and startsagain from LED8.

Also, after every 100kB, a UART data transmission occurs. This data is sent to the PC via a back-channelUART and is used to calculate the FRAM write speed and endurance information that is displayed in thePC GUI. The raw data can also be viewed directly using a PC application such as HyperTerminal.



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2.2.2.1 Measuring Current on the MSP-EXP430FR5739

While measuring the active power in a mode, the LEDs should be turned off and the UART transmissionsshould be halted. This is done by pressing switch S2 while inside the mode. Switch S2 toggles the displaysettings, turning them on or off as needed. Turning the display off allows the user to isolate and measurethe current consumption of the MSP430 device when executing instructions at a clock speed of 8 MHzand writing to FRAM. In bench tests, the MSP430 IDVCC was measured at approximately 800 µA.

Note that, because of the nature of the FRAM cache, the number of accesses to FRAM memory cangreatly impact the active power consumption. Unoptimized code that performs a higher number ofaccesses to FRAM can cause an increase in the measured current. It is advisable to review the compilersettings when setting up a project using IDEs such as CCS or IAR to ensure the most efficient code and,hence, the least active power.

The project that accompanies this document (see Section 2.1) uses a level 1 optimization setting in bothIAR and CCS that is one step higher than the default optimization levels.

As mentioned previously, when measuring the ICC on the board, it is important to isolate the currentconsumption by the MSP430FR5739 only. The measurement can be done when the board is powered viaUSB or externally via a battery. When powering via the USB, it is recommended to disconnect theemulation portion from the MSP430FR5739 device. This can be done by removing jumpers TXD, RXD,Reset, and Test on J3. A multimeter can be used to measure the current into the MSP430FR5739 VCC byremoving the VCC jumper and placing the multimeter leads in series.

An alternate approach requires powering the board externally via the VCC and GND connection anddisconnecting the USB cable from the board. In this case, the multimeter can be placed in series to VCC byremoving the MSP_PWR jumper.

These recommendations hold true when measuring IDVCC in all four modes.

2.2.2.2 Displaying Results on the PC GUI

The GUI associated with this document provides details on the time elapsed in the mode, number of byteswritten, speed of FRAM, and the endurance of FRAM emulated over a 512 byte FRAM block.

The endurance is calculated based on the 1014 program/erase cycles for the MSP430FR5739. Becausethe GUI updates every one minute, the scale of reduction of FRAM endurance is very small. A moreobvious decline in endurance can be observed in Mode 2 when the endurance reduction when using flashis emulated.

2.2.3 Using Mode 2 – Emulating the Speed of Flash Writes

Mode 2 is entered by pressing S1 twice, followed by S2. In this mode, the maximum speed at which flashcan be written to (at a 100% active duty cycle) is emulated on FRAM.

Similar to Mode 1, on entry into Mode 2, LED8 through LED1 light up sequentially to display the speed ofemulated flash writes. Every time the LED1 through LED8 sequence is completed, an 800KB write to flashis emulated. In this mode, FRAM is written to at approximately 12 kBps. The entire sequence requiresapproximately 80 seconds, so the demo should be observed for more than one minute to see the LEDsequence roll over.

NOTE: The time to run this sequence varies depending on the frequency source to the interval timer(that is, the VLO).

The test uses the same scratchpad FRAM memory as Mode 1 and the same system setup. In this mode,after every 2KB of memory is written, a UART packet is transmitted to the PC GUI to allow it to calculatespeed and endurance information.

When measuring the average power the methodology described in Section 2.2.2.1 needs to be followed.



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Power Consumption at 13 kB/s (µA)

1

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100

1000

10000

FRAM Flash

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ge p

ow

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2.2.3.1 The Math Behind Mode 2

The MSP430F2274 device was used as a benchmark device to calculate the maximum flash write speed.For a 512-byte block of flash, the following parameters were obtained from the MSP430F2274 data sheet:

Segment erase time = 4819 × tFTG = 16 msWhere, tFTG = 1 / fFTG ≈ 1 / 300 kHz

512 bytes write time ≈ 51.2 ms

Total time to write to 512 bytes ≈ 67.2 ms

Time to write to 100KB = 6.72 seconds, which calculates to 14.8 kBps

When measuring the speed of continuous flash writes on the bench, the observed speed is approximately12 kBps, because the code execution overhead is added to the time calculated above.

This write speed is emulated with the FRAM device by maintaining a low active duty cycle and performingone 512 byte block write every 40 ms.

Number of writes per second = 1 / 40 ms = 25

Number of bytes written per second = 512 × 25 = 12.800 kBps

The timing of the FRAM write is controlled by the VLO clock.

From these bench tests, it can be seen that writing 12 kBps to flash requires nearly 100% duty cycle,while writing the same speed to FRAM requires less than 1% duty cycle. The rest of the time, the FRAMdevice is in shutdown mode (LPM4), which results in an average current of less than 10 µA. Incomparison, for a similar write speed, flash-based MCUs can require average current up to 2.2 mA.

Figure 3. Comparing Average Power When Writing to Nonvolatile Memory at 13 kBps(MSP430FR5739 FRAM vs MSP430F2274 Flash)


When in Mode 2, the GUI provides details on the time elapsed in the mode, number of bytes written,speed of emulated flash writes, and the endurance emulated over a 512 byte flash block.

The endurance is calculated based on the 104 program/erase cycles (minimum) for the MSP430F2274. Ifa 512-byte block on a flash device were written to at a speed of 12.5 kBps (that is, 25 times per second),the endurance would exceed the minimum limit in 10000/25 or 6.6 minutes.

Note that the MSP-EXP430FR5739 board only emulates this test to demonstrate a comparison in speedand endurance between FRAM and flash; it does not perform the test on an actual flash device.



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3 Axis Accelerometer


2.2.4 Using Mode 3 – Accelerometer Demo

Mode 3 is entered by pressing switch S1 three times, followed by switch S2.

Upon entering this mode, the on-board accelerometer (see Figure 4) is calibrated. To aid this calibrationprocess, it is recommended to place the board on a level surface before entering the mode.

Figure 4. On-Board Accelerometer

After the calibration sequence is completed, LED4 and LED5 are turned on. When tilting the board in anupward or downward direction, the LEDs follow the direction of the tilt. S2 toggles the display on and off,similar to other modes.

Mode 3 also writes the sampled data from the ADC to the FRAM in real time with no wait states or extracycles spent on setting up the FRAM. This can be observed in the ADC interrupt service routine. Thesampling takes place at more than 15k samples per second. At this speed, flash devices require that thedata be buffered in RAM before writing to flash. In FRAM devices, the only bottleneck is the speed atwhich the ADC can sample, not the writes to nonvolatile memory.


When in the accelerometer mode, the GUI mimics the LEDs that are lit up on the Experimenter Board andare a reflection of the tilt of the board.



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NTC Thermistor


2.2.5 Using Mode 4 – Temperature Sensor Demo

Mode 4 is entered by pressing switch S1 four times, followed by switch S2.

Upon entering this mode, the on-board thermistor (see Figure 5) is calibrated.

Figure 5. On-Board NTC Thermistor

After the calibration sequence is completed, LED4 and LED5 are turned on. When the NTC resistor isheated (for example, by placing a finger on it), LED3 through LED1 are turned on sequentially. When theNTC is cooled (for example, by using a freeze spay or a keyboard dust remover that uses compressed air)LED5 through LED8 are turned on sequentially.

Similar to Mode 3, Mode 4 also writes the sampled data from the ADC to the FRAM in real time with nowait states or extra cycles spent on setting up the FRAM. This can be observed in the ADC interruptservice routine. The sampling takes place at more than 15k samples per second. At this speed, flashdevices require that the data be buffered in RAM before writing to flash. In FRAM devices, the onlybottleneck is the speed at which the ADC can sample, not the writes to nonvolatile memory.


When in the temperature sense mode, the GUI mimics the LEDs that are lit up on the Experimenter Boardand are a reflection of the thermistor's ambient temperature measurement.



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2.3 View, Edit, or Recompile the User Experience Code Using an IDE

There are different development software tools available for the MSP-EXP430FR5739 board. IAREmbedded Workbench™ KickStart™ and Code Composer Studio™ (CCS) IDEs are both available in afree limited version. IAR Embedded Workbench allows 4KB of C-code compilation. CCS is limited to acode size of 16KB. The software is available at www.ti.com/msp430.

To view, modify, or edit the User Experience code provided with the MSP-EXP430FR5739, an IDEinstallation is required. The associated software package (see Section 2.1) supports both IAR and CCSprojects.

The User Experience source files and project folders are provided in the folder [InstallPath]\MSP-EXP430FR5739\MSP-EXP430FR5739 User Experience.

2.3.1 Setting up the IAR Workspace for the User Experience Code

To set up the IAR workspace for the User Experience demo source code:

1. Double-click and open MSP-EXP430FR5739_Workspace.eww in IAR.

2. The Project is automatically included in the workspace.

3. Click Project → Download & Debug to download the code to the MSP-EXP430FR5739 ExperimenterBoard.

4. If multiple emulation tools are connected to your PC, click Project → Options → FET Debugger →Connection to explicitly select the experimenter board.

2.3.2 Importing the CCS Project for the User Experience Code

To import the CCS project for the User Experience demo source code:

1. Create a workspace folder.

2. Open CCS and point to the newly created workspace folder.

3. Click Project → Import Existing CCS/CCE Eclipse Project.

4. Browse to the folder [Install Path]\MSP-EXP430FR5739\MSP-EXP430FR5739 User Experience thatwas extracted from the associated zip file (see Section 2.1).

5. The project MSP-EXP430FR5739_UserExperience is automatically selected.

6. Click Finish to include the project in the current workspace.

7. Click the Debug icon to download the project

2.3.3 Source Files

Table 1 describes the source files for the User Experience demo.

Table 1. User Experience Source Files

Name Description

Main.c This file contains the user experience demo

Main.h This file contains the definitions that are required for main.c

FR_EXP.c This file contains the definitions of all C functions used by main.c

FR_EXP.h This file contains all the function declarations needed by main.c and FR_EXP.c



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* Not available on MSP430FR5737, MSP430FR5733, MSP430FR5727, MSP430FR5723

Note: Power Pad connection to V recommended.SS

MSP-EXP430FR5739 Hardware www.ti.com

3 MSP-EXP430FR5739 Hardware

3.1 MSP430FR5739IRHA Device Pin Designation

See the MSP430FR5739 data sheet (SLAS639) for the latest information.

Figure 6. MSP430FR5739 Pin Designation



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www.ti.com MSP-EXP430FR5739 Hardware

3.2 Schematics

The schematics and PCB layouts for the MSP-EXP430FR5739 are shown in the following pages.

Figure 7. Schematics (1 of 3)



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GN

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3.3 PCB Layout

Figure 10. MSP-EXP430FR5739 Top Layer



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Figure 11. MSP-EXP430FR5739 Bottom Layer



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Figure 12. MSP-EXP430FR5739 Silkscreen



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3.4 Bill of Materials (BOM)

Table 2 shows the bill of materials for the MSP-EXP430FR5739 board.

Table 2. Bill of Materials (BOM)

NumbePos. Ref Des r per Description

Board

1 C1 1 10n

2 C2,C3 2 16p

3 C4, C6, C8 3 1u/6.3V

C5, C7, C11,4 5 100nC12,C13

C15, C16, C17,5 C18, C20, C31, 7 100n

C58

6 C9, C10 2 22p

7 C14 1 470n

8 C19 1 10u

9 C21, C22 0 12pF

10 C23 1 10uF/10V

11 C24 1 2.2nF

12 C32, C53 2 4.7u

13 D1 1 1N4148

14 FR5739 1 FR5739-RHA40

15 J3 1 2x05 Pin Header Male

16 J4 [1] SL127L6TH

17 J6 1 3-pin header, male, TH

18 LDR 0 Do not populate

19 LED0 1 LED GREEN 0603

20 LED1 - LED8 8 LED BLUE 470NM 0603 SMD

21 MSP_PWR 1 2-pin header, male, TH

22 NTC 1 100k

23 Q1 1 12MHz

24 Q2 1 Crystal

R1, R2, R3, R16,25 4 47kR17, R33

R4, R5, R6, R7,26 4 100RR23

27 R8 1 61k5

28 R12 1 33k

29 R9 1 30K

30 R10 1 10k

31 R11 1 15k

32 R13, R24, R25 3 1k5

33 R14, R15 2 33R

34

35 R18, R20 2 100k/1%

36 R19, R22 2 3k3

37 R21 1 33k

39 R26 1 270



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Suggested Reading www.ti.com

Table 2. Bill of Materials (BOM) (continued)

NumbePos. Ref Des r per Description

Board

R27, R28, R29,40 R30, R31, R32, 8 330

R36, R37

41 R34 0 0R

42 R35 1 470k

43 RF1, RF2 2

44 RF3 0 eZ-RF connector for EXP-F5438 board

45 RF_PWR 1 RF_PWR

46 S1, S2 2

47 RST 1

48 SV1, SV2 2+[2] 12-pin header, TH

49 U$2 1 USB_MINI_B5

50 U1 1 F1612-PM64

51 U2 1 TPS77301DGK

52 U3 1 TUSB3410VF

53 U4 1 TPD2E001

54 U5 1 CAT24FC32UI

55 U6 1 ADXL335 accelerometer

4 Suggested Reading

The primary sources of MSP430 information are the device-specific data sheets and user's guides. Themost up-to-date versions of those documents can be found at the Texas Instruments MSP430 pagewww.ti.com/msp430.

Visit www.ti.com/fram to find the latest information on TI's FRAM family.

To get an inside view of the CCS and IAR IDEs, download the latest version from the MSP430 page andread the included user's guides and documentation in the installation folder.

Documents describing the IAR tools (Workbench/C-SPY, the assembler, the C compiler, the linker, andthe library) are located in common\doc and 430\doc. All necessary CCS documents can be found inmsp430\doc inside the CCS installation path. The Code Composer Studio v4.2 for MSP430™ User’sGuide (SLAU157) and IAR Embedded Workbench Version 3+ for MSP430™ User's Guide (SLAU138)include detailed information on how to set up a project for the MSP430 using CCS or IAR. They areincluded in most of the IDE releases and on the MSP430 page.

5 References

1. MSP430FR5739 data sheet (SLAS639)

2. MSP430F2274 data sheet (SLAS504)

3. MSP430FR57xx Family User's Guide (SLAU272)



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