USER MANUAL VIA ALTA DS 3cdn.viaembedded.com/products/docs/alta-ds3/user...USER MANUAL VIA ALTA DS 3 High-performance Edge AI system with dual 4K screen support and rich Á] o v /lK

USER MANUAL

VIA ALTA DS 3 High-performance Edge AI system

with dual 4K screen support and rich wireless and I/O connectivity options

1.02-09162019-191700

Copyright

Copyright © 2018-2020 VIA Technologies Incorporated. All rights reserved.

No part of this document may be reproduced, transmitted, transcribed, stored in a retrieval system, or translated into any language, in any form or by any means, electronic, mechanical, magnetic, optical, chemical, manual or otherwise without the prior written permission of VIA Technologies, Incorporated.

Trademarks

All trademarks are the property of their respective holders.

Disclaimer

No license is granted, implied or otherwise, under any patent or patent rights of VIA Technologies. VIA Technologies makes no warranties, implied or otherwise, in regard to this document and to the products described in this document. The information provided in this document is believed to be accurate and reliable as of the publication date of this document. However, VIA Technologies assumes no responsibility for the use or misuse of the information (including use or connection of extra device/equipment/add-on card) in this document and for any patent infringements that may arise from the use of this document. The information and product specifications within this document are subject to change at any time, without notice and without obligation to notify any person of such change.

VIA Technologies, Inc. reserves the right the make changes to the products described in this manual at any time without prior notice.

Regulatory Compliance

FCC-A Radio Frequency Interference Statement

This equipment has been tested and found to comply with the limits for a class A digital device, pursuant to part 15 of the FCC rules. These limits are designed to provide reasonable protection against harmful interference when the equipment is operated in a commercial environment. This equipment generates, uses, and can radiate radio frequency energy and, if not installed and used in accordance with the instruction manual, may cause harmful interference to radio communications. Operation of this equipment in a residential area is likely to cause harmful interference, in which case the user will be required to correct the interference at his personal expense.

Notice 1

The changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate the equipment.

Notice 2

Shielded interface cables and A.C. power cord, if any, must be used in order to comply with the emission limits.

Notice 3

The product described in this document is designed for general use, VIA Technologies assumes no responsibility for the conflicts or damages arising from incompatibility of the product. Check compatibility issue with your local sales representatives before placing an order.

Battery Recycling and Disposal• Only use the appropriate battery specified for this product. • Do not re-use, recharge, or reheat an old battery. • Do not attempt to force open the battery.• Do not discard used batteries with regular trash.• Discard used batteries according to local regulations.

Safety Precautions• Always read the safety instructions carefully.• Keep this User’s Manual for future reference.• All cautions and warnings on the equipment should be noted.• Keep this equipment away from humidity.• Put this equipment on a reliable flat surface before setting it up.• Check the voltage of the power source and adjust to 110/220V before connecting the equipment to the power inlet.• Do not place the power cord where people will step on it.• Always unplug the power cord before inserting any add-on card or module.• If any of the following situations arise, get the equipment checked by authorized service personnel: • The power cord or plug is damaged. • Liquid has entered into the equipment. • The equipment has been exposed to moisture. • The equipment is faulty or you cannot get it work according to User’s Manual. • The equipment has been dropped and damaged. • The equipment has an obvious sign of breakage.• Do not leave this equipment in extreme temperatures or in a storage temperature above 70°C (158°F). The equipment may be damaged.• Do not leave this equipment in direct sunlight.• Never pour any liquid into the opening. Liquid can cause damage or electrical shock.• Do not place anything over the power cord.• Do not cover the ventilation holes. The openings on the enclosure protect the equipment from overheating

VIA ALTA DS 3 User Manual

Box Contents • 1 x VIA ALTA DS 3 system • 1 x Stand holder • 1 x AC to DC adapter • 1 x Power cord • 1 x Wi-Fi antenna (ALTADS30VA001-T only)

Ordering InformationPart Number Description

ALTADS30VA001-T Android system with 2.342GHz Qualcomm® APQ8096SG Embedded Processor, 16GB eMMC, 4GB POP LPDDR4 RAM, 2 HDMI, 3 USB 3.0, Gigabit Ethernet, Wi-Fi, Bluetooth 4.1, SD card slot, M.2 slot, SIM card slot, miniPCIe slot, Stand holder, US power cord, 12V DC-in

ALTADS30VA002-T Android system with 2.342GHz Qualcomm® APQ8096SG Embedded Processor, 16GB eMMC, 4GB POP LPDDR4 RAM, 2 HDMI, 3 USB 3.0, Gigabit Ethernet, SD card slot, M.2 slot, SIM card slot, miniPCIe slot, Stand holder, US power cord, 12V DC-in

Optional AccessoriesWireless AccessoriesPart Number Description

EMIO-2573-00A0 Quectel EC25-A 4G/LTE mobile broadband full size miniPCIe module for USA with assembly kit and antenna pack

Mounting OptionsPart Number Description

VT6076-C0000A1 VESA mount cradle

Cable AccessoriesPart Number Description

99G33-080297 Debug cable (TX/RX)

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Table of Contents

1. Product Overview .............................................................................................................. 11.1 Key Features ......................................................................................................................................... 1

1.1.1 High Performance .......................................................................................................................... 11.1.2 Fanless and Space Saving ............................................................................................................... 11.1.3 OptimizedIntegrationwithMultipleI/OAccess ........................................................................... 11.1.4 Dual 4K Display Support ................................................................................................................. 11.1.5 Storage Expansion .......................................................................................................................... 11.1.6 Networking Support ...................................................................................................................... 11.1.7 MountingSolution ........................................................................................................................ 21.1.8 EmbeddedOperatingSystemReady .............................................................................................. 2

1.2 ProductSpecifications ......................................................................................................................... 31.3 Layout Diagram .................................................................................................................................... 51.4 Product Dimensions ............................................................................................................................ 6

2. ExternalI/OPinDescriptionsandFunctionality ................................................................ 82.1 HDMI® Ports .......................................................................................................................................... 82.2 USB 3.0 Ports ........................................................................................................................................ 82.3 MiniUSB2.0Port ................................................................................................................................. 92.4 Gigabit Ethernet Port ............................................................................................................................ 92.5 AudioJack ........................................................................................................................................... 102.6 SD Card Slot ........................................................................................................................................ 102.7 PowerButton ..................................................................................................................................... 112.8 DC-InJack ........................................................................................................................................... 11

3. OnboardI/O .................................................................................................................... 123.1 MiniPCIeSlot ...................................................................................................................................... 123.2 M.2Slot .............................................................................................................................................. 133.3 SIMCardSlot ...................................................................................................................................... 14

4. HardwareInstallation ...................................................................................................... 154.1 Opening the Chassis ........................................................................................................................... 154.2 InstallingtheM.22280PCIeNVMeSSDModule ............................................................................... 174.3 Installingthe4GSIMCard .................................................................................................................. 194.4 InstallingtheStandHolder ................................................................................................................. 20

5. SoftwareandTechnicalSupport ...................................................................................... 225.1 AndroidSupport ................................................................................................................................. 225.2 TechnicalSupportandAssistance....................................................................................................... 22

AppendixA.InstallingWirelessAccessories ............................................................................ 23A.1. InstallingVIAEMIO-2573MobileBroadbandModule ....................................................................... 23

AppendixB.InstallingVESAMountCradle .............................................................................. 26

AppendixC.ConnectingDebugCable ..................................................................................... 28

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List of Figures Figure1: FrontpanelI/Olayout .......................................................................................................................... 5Figure2: BackpanelI/Olayout ........................................................................................................................... 5Figure3: DimensionsoftheVIAALTADS3(frontview) ..................................................................................... 6Figure4: DimensionsoftheVIAALTADS3(topview) ........................................................................................ 6Figure5: DimensionsoftheVIAALTADS3withstandholderinstalled(frontview) .......................................... 7Figure6: DimensionsoftheVIAALTADS3withstandholderinstalled(topview) ............................................ 7Figure7: HDMIportdiagram ............................................................................................................................. 8Figure 8: USB 3.0 diagram .................................................................................................................................. 8Figure9: MiniUSB2.0portdiagram ................................................................................................................... 9Figure 10: Gigabit Ethernet port diagram ............................................................................................................. 9Figure11: Audiojacksdiagram ........................................................................................................................... 10Figure 12: SD card slot diagram ......................................................................................................................... 10Figure13: Powerbuttondiagram....................................................................................................................... 11Figure14: DC-injackdiagram ............................................................................................................................. 11Figure15: DC-injackspecificationdiagram ........................................................................................................ 11Figure16: MiniPCIeslotdiagram ....................................................................................................................... 12Figure17: M.2slotdiagram ................................................................................................................................ 13Figure18: SIMcardslotdiagram ........................................................................................................................ 14Figure19: UnscrewingthebackpanelI/Oplate ................................................................................................ 15Figure20: RemovingthebackpanelI/Oplate .................................................................................................... 15Figure21: Removingthetopcover ..................................................................................................................... 16Figure22: Removingthesystem'smainboard .................................................................................................... 17Figure23: InstallingtheM.22280PCIeNVMeSSDmodule ............................................................................... 17Figure24: SecuringtheM.22280PCIeNVMeSSDmodule ................................................................................ 18Figure25: Removingthesystem'smainboard .................................................................................................... 19Figure26: Installingthe4GSIMcard .................................................................................................................. 19Figure27: Installingthestandholder ................................................................................................................. 20Figure 28: Securing the stand holder .................................................................................................................. 21Figure29: InstallingtheVIAEMIO-2573module ................................................................................................ 23Figure30: SecuringtheVIAEMIO-2573moduleandremovingtheantennaholecover ................................... 23Figure31: InstallingtheantennaandantennacableofVIAEMIO-2573module ............................................... 24Figure32: Connectingtheantennacabletothemicro-RFconnectoronVIAEMIO-2573module ..................... 24Figure33: ReinstallingthetopcoverandbackpanelI/Oplate .......................................................................... 25Figure34: InstallingtheVESAmountcradle ....................................................................................................... 26Figure35: InsertingtheVIAALTADS3totheVESAmountcradle ...................................................................... 27Figure36: ConnectingthenecessarycablestotheVIAALTADS3 ...................................................................... 27Figure37: Connectingthedebugcable(TX/RX) ................................................................................................. 28

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List of TablesTable1: HDMIportpinouts .............................................................................................................................. 8Table 2: USB 3.0 pinouts ................................................................................................................................... 8Table3: MiniUSB2.0portpinouts .................................................................................................................... 9Table 4: Gigabit Ethernet port pinouts .............................................................................................................. 9Table5: GigabitEthernetportLEDcolordefinition ........................................................................................... 9Table 6: SD card slot pinouts ........................................................................................................................... 10Table7: Powerbuttonbehaviordescription ................................................................................................... 11Table8: DC-injackpinouts ............................................................................................................................. 11Table9: DC-injackspecification ..................................................................................................................... 11Table10: MiniPCIeslotpinouts ......................................................................................................................... 12Table11: M.2slotpinouts ................................................................................................................................. 13Table12: SIMcardslotpinouts ......................................................................................................................... 14

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1. Product OverviewAccelerateyourintelligentsignage,kiosk,andaccesscontroldevicedevelopmentanddeploymentwiththeVIAALTADS3EdgeAIsystem.PoweredbytheQualcomm®APQ8096SGEmbeddedProcessor,theVIAALTADS3combinescutting-edgecompute,graphics,andAIprocessingperformancewithdual4Kdisplaysupport,richconnectivityoptions,andflexiblecameraandI/Operipheralintegrationcapabilitiesinanultra-compactfanlessform factor.

Measuringjust175mm(W)x25mm(H)x118mm(D),thesystemintegratesarichsetofI/Ofeaturesthroughthefrontandrearpanelsofitsultra-compactfanlesschassis,includingtwoHDMIports,threeUSB3.0ports,oneMiniUSB2.0port,andoneminiPCIeslot.Otherfeaturesinclude4GBPOPLPDDR4RAM,16GBeMMCflashmemory,oneSDcardslot,oneM.2slot,andline-outandmic-inaudiojacks.ThesystemdeliversrichnetworkconnectivitythroughitsGigabitEthernetportandachoiceofWi-Fi&Bluetooth4.1or4GLTEwirelessintegrationoptions.

TofacilitatesoftwareandAIapplicationdevelopment,theVIAALTADS3comeswithaBSPfeaturingAndroid8.0whichincludestheQualcomm®NeuralProcessingSDKforartificialintelligencedesignedtohelpdevelopersrunoneormoreneuralnetworkmodelstrainedinCaffe/Caffe2,ONNX,orTensorFlowusingtheCPU,GPU,orDSPintheQualcomm®APQ8096SGEmbeddedProcessor.

1.1 Key Features

1.1.1 High-PerformanceTheARMbasedVIAALTADS3systemispoweredbyaQualcomm®APQ8096SGEmbeddedProcessorthatprovidesafullrangeofrichfeaturesincludingsuperbmulti-taskingperformance.

1.1.2 Fanless and Space SavingTheVIAALTADS3featuresfanlessoperationinaslimchassisdesignedtosavespace,makingitidealforinstallationinawiderangeofenvironments.

1.1.3 OptimizedIntegrationwithMultipleI/OAccessWithfrontandbackpanelI/Oaccess,theVIAALTADS3canbeeasilyconfiguredtosupportawidevarietyofapplicationswitheasyintegrationandquicksetup.

1.1.4 Dual 4K Display SupportTheVIAALTADS3hasanindependentintegratedHDMI2.0transmitterthatsupports4KUHDdisplayoutput,and4KUHDdisplayoutputfromdualMIPIDSItoHDMI1.4converter.

1.1.5 Storage ExpansionTheVIAALTADS3has16GBeMMCflashstorageonboardandfeaturesanSDCardslotsupportsandadditional32GB.TheonboardM.2slotenablesfurtherexpansionwithitsupportforextrastorageofupto1TB.

1.1.6 Networking Support TheVIAALTADS3isequippedwithanRJ-45portthatsupportshigh-speedGigabitEthernet.WirelessconnectivitycanbeaddedthroughtheminiPCIeslotusingtheoptionalVIAEMIO-2573mobilebroadbandminiPCIemodule.


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1.1.7 MountingSolutionTheVIAALTADS3supportsmultiplemethodsformountingthechassissecurely.Itcanbemountedtoanyflatsurfaceusingthestandholder,oreventoVESAmountablesurfaceswithaVESAmountingkit.

1.1.8 EmbeddedOperatingSystemReadyTheVIAALTADS3featuresacompletesoftwareevaluationimagefeaturingAndroid8.0.


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1.2 ProductSpecifications

Processor• Qualcomm®APQ8096SGEmbeddedProcessor

◦Twohigh-performanceKryocoresupto2.342GHz◦TwolowpowerKryocoresupto1.593GHz

System Memory• 4GBPOPLPDDR4SDRAM

Storage • 16GBeMMCflashmemory• M.2slotforM.22280PCIeNVMeSSD• SD card slot

Graphics• Qualcomm®Adreno530GPU

◦ 3Dgraphicsacceleratorwith64-bitaddressing624MHz◦GraphicsenginesupportingOpenGLES3.1/GEP,GL4.4,DX11.3/4,OpenCL2.0,Renderscript-Next◦SupportsH.264,H.265(HEVC8/10-bit)videodecodingupto:4K@60fps

Wireless Connectivity• NFA324A-12H32QCA6174A-1Wi-Fi802.11a/b/g/n/ac+BT4.1comboLGAmodule

Audio • WCD9335AudioCodec

HDMI• IntegratedHDMI2.0transmitteranddualDSItoHDMI1.4converter

Front Panel I/O• 1xPowerbuttonwithpowerLEDindicator• 1 x SD card slot• 2 x USB 3.0 ports• 1 x Line-out• 1xMic-in(oroptionalCIR)

Back Panel I/O• 1xDC-injack• 1 x Gigabit Ethernet port• 2xHDMIports• 1 x USB 3.0 port• 1xMiniUSB2.0port(fastbootmodeonly)• 1xAntennahole(for4GorWi-Fi)• 1 x Kensington Lock

Onboard I/O• 1xMiniPCIeslot• 1xM.2slot• 1xSIMcardslot


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Power Supply

• 12VDC-in

Operating System

• Android8.0

Operating Temperature

• 0°C ~ 40°C

Operating Humidity

• 0%~95%@40°C(non-condensing)

Storage Temperature

• -20°C ~ 70°C

Mechanical Construction

• Plasticframe• Metalbracket

Mounting

• Standholder,VESAmount(optional)

Dimensions

• 175mm(W)x25mm(H)x118mm(D)(6.88”x0.98”x4.64”)

Weight

• 0.61kg(1.34lbs)

Compliance

• CE,FCC

Notes:1.AstheoperatingtemperatureprovidedinthespecificationsisaresultoftestingperformedinVIA’schamber,anumberofvariablescaninfluencethisresult.Pleasenotethattheworkingtemperaturemayvarydependingontheactualsituationandenvironment.Itishighlyrecommendedtoexecuteasolidtestingprogramandtakeallthevariablesintoconsiderationwhenbuildingthesystem.Pleaseensurethatthesystemrunswellundertheoperatingtemperatureintermsofapplication.

2.PleasenotethatthelifespanoftheonboardeMMC/UFSmemorychipmayvarydependingontheamountofaccess.MorefrequentandlargerdataaccessontheeMMCmemorymakesitslifespanshorter.Therefore,itishighlyrecommendedtouseareplaceableexternalstorage(e.g.,SDcard)forlargedataaccess.


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1.3 Layout Diagram

Figure 1: FrontpanelI/Olayout

Figure 2: BackpanelI/Olayout


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1.4 Product Dimensions

Figure 3: DimensionsoftheVIAALTADS3(frontview)

Figure 4: DimensionsoftheVIAALTADS3(topview)


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Figure 5: DimensionsoftheVIAALTADS3withstandholderinstalled(frontview)

Figure 6: DimensionsoftheVIAALTADS3withstandholderinstalled(topview)


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2. External I/O Pin Descriptions and FunctionalityTheVIAALTADS3hasawideselectionofinterfaces.Itincludesaselectionoffrequently-usedportsaspartoftheexternalI/Ocoastline.

2.1 HDMI® PortsTheVIAALTADS3isequippedwithtwoHDMIportsonthebackpanelwhichuseanHDMIportTypeAreceptacleconnectortoconnectHighDefinitionvideoanddigitalaudiousingasinglecable.ThepinoutsoftheHDMIportareshownbelow.

Table 1: HDMIportpinouts

2.2 USB 3.0 PortsTheVIAALTADS3isequippedwiththreeUSB3.0ports,oneinthefrontpanelandtwointhebackpanel.EachUSB3.0porthasamaximumdatatransferrateofupto5GbpsandiscompatiblewithUSB2.0specifications.This USB port gives complete Plug and Play and hot swap capability for external devices. The pinouts of the USB 3.0 port are shown below.

Table 2: USB 3.0 pinouts

Pin Signal Pin Signal1 D2+ 11 GND2 GND 12 CLK-3 D2- 13 CEC4 D1+ 14 NC5 GND 15 DDC_CLK6 D1- 16 DDC_DATA7 D0+ 17 GND8 GND 18 HDMI_5V9 D0- 19 PLUG_DET

10 CLK+

Pin Signal1 VBUS2 D-3 D+4 GND5 RX-6 RX+7 GND8 TX-9 TX+

Figure 7: HDMIportdiagram

Figure 8: USB 3.0 diagram


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2.3 MiniUSB2.0PortTheVIAALTADS3isequippedwithaminiUSB2.0portonthebackpanelwhichisonlyusedduringthefastbootmodewheninstallingtheAndroidimage.ThepinoutsoftheminiUSB2.0portareshownbelow.

Table 3: MiniUSB2.0portpinouts

2.4 Gigabit Ethernet PortTheVIAALTADS3comeswithoneGigabitEthernetportonthebackpanelwhichusesan8Positionand8Contact(8P8C)receptacleconnectorcommonlyknownasRJ-45.ItisfullycompliantwiththeIEEE802.3(10BASE-T),802.3u(100BASE-TX),and802.3ab(1000BASE-T)standards.ThepinoutsoftheGigabitEthernetport are shown below.

Table 4: Gigabit Ethernet port pinouts

TheGigabitEthernetport(RJ-45)isequippedwithtwoLEDindicatorsonthefrontsidetoshowitsActive/Linkstatus and Speed status.

Table 5: GigabitEthernetportLEDcolordefinition

Pin Signal1 VCC5V2 D-3 D+4 ID5 GND

Figure 9: MiniUSB2.0portdiagram

Pin Signal1 TX1+2 TX1-3 TX2+4 TX2-5 TX3+6 TX3-7 TX4+8 TX4-

Active LED(Left LED on RJ-45 port)

Link LED(Right LED on RJ-45 port)

Linkoff LEDisoff LEDisoffSpeed_10Mbit Greenflash LEDisoffSpeed_100Mbit Redflash LEDisoffSpeed_1000Mbit LEDisoff Orangeflash

Figure 10: Gigabit Ethernet port diagram


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2.5 AudioJackTheVIAALTADS3offersHighDefinitionaudiothroughtwo3.5mmTRSjacksonthefrontpanel:Line-outandMic-in.TheLine-outjackisforconnectingtoexternalspeakersorheadphones.TheMic-injackisforconnectingtoamicrophone.Thediagramoftheaudiojacksisshownbelow.

2.6 SD Card SlotTheVIAALTADS3comeswithanSDcardslotlocatedonthefrontpanelwithsupportforamaximumstoragecapacity of 32GB. The pinouts of the SD card slot are shown below.

Table 6: SD card slot pinouts

Figure 11: Audiojacksdiagram

Figure 12: SD card slot diagram

Pin Signal 1 SDC2_DATA32 SDC2_CMD3 GND4 VDD5 SDC2_CLK6 GND7 SDC2_DATA_08 SDC2_DATA_19 SDC2_DATA_2

CD SD_CARD_DET_INWP SD_WP


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2.7 PowerButtonTheVIAALTADS3comeswithapowerbuttonfeaturingabuilt-inpowerLEDindicator(bluelight).Thepowerbuttoncansupporttwofunctions:SystemSuspend/ResumeandPop-uppowercontrolmenu.Thediagramofthepowerbuttonisshownbelow.

Table 7: Powerbuttonbehaviordescription

2.8 DC-InJackTheVIAALTADS3comeswithaDC-injackthatcarriesa12VDCexternalpowerinput.ThespecificationandpinoutsofthepowerDC-injackareshownbelow.

Table 8: DC-injackpinouts

Table 9: DC-injackspecification

Pin Signal 1 +12V2 GND

Physical Specification Outer Diameter 6.5mmInnerDiameter 2.0mmBarrel Depth 8.2mm

Electrical SpecificationInputVoltage +12V

Figure 13: Powerbuttondiagram

Figure 14: DC-injackdiagram

Figure 15: DC-injackspecificationdiagram

Power Button behavior Suspend/ResumeSystem Quicklypressthepowerbuttononcetosuspend.Whilein

suspendmodequicklypressoncetoresume.Pop-up power control menu Occurswhenthepowerbuttonispressedforlongerthan

3 seconds.


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3. Onboard I/O ThischapterprovidesinformationabouttheonboardI/OconnectorsontheVIAALTADS3system’smainboard.

3.1 MiniPCIeSlotTheVIAALTADS3isequippedwithaminiPCIeslotforwirelessnetworkingoptionssuchasa4Gmodule.ThepinoutsoftheminiPCIeslotareshownbelow.

Figure 16: MiniPCIeslotdiagram

Table 10: MiniPCIeslotpinouts

Pin Signal Pin Signal1 Reserved 2 VDD3V3_MPCIE3 Reserved 4 GND5 Reserved 6 VDD1V57 Reserved 8 USIM_VCC_A9 GND 10 USIM_DATA_A

11 Reserved 12 USIM_CLK_A13 Reserved 14 USIM_RST_A15 GND 16 USIM_VPP_A17 Reserved 18 GND19 Reserved 20 MPCIE_W_DISABLE21 GND 22 MPCIE_RST_N23 Reserved 24 VDD3V3_MPCIE25 Reserved 26 GND27 GND 28 VDD1V529 GND 30 Reserved31 Reserved 32 Reserved33 Reserved 34 GND

Pin Signal Pin Signal35 GND 36 MINI_PCIE_USB_DM37 GND 38 MINI_PCIE_USB_DM39 VDD3V3_MPCIE 40 GND41 VDD3V3_MPCIE 42 Reserved43 GND 44 Reserved45 Reserved 46 Reserved47 Reserved 48 VDD1V549 Reserved 50 GND51 Reserved 52 VDD3V3_MPCIE


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3.2 M.2SlotTheVIAALTADS3isequippedwithaM.2slotwhichisusedtosupportanM.22280PCIeNVMeSSDmoduleforadditionalstorageofupto1TB.ThepinoutsoftheM.2slotareshownbelow.

Figure 17: M.2slotdiagram

Table 11: M.2slotpinouts

Pin Signal Pin Signal1 GND 2 VDD3V3_M23 GND 4 VDD3V3_M25 NC 6 NC7 NC 8 NC9 GND 10 VDD3V3_M2

11 NC 12 VDD3V3_M213 NC 14 VDD3V3_M215 GND 16 VDD3V3_M217 NC 18 VDD3V3_M219 NC 20 NC21 GND 22 NC23 NC 24 NC25 NC 26 NC27 GND 28 NC29 NC 30 NC31 NC 32 NC33 GND 34 NC35 NC 36 NC37 NC 38 PCIE2_DSLP39 GND 40 NC

Pin Signal Pin Signal41 PCIE2_RX_M 42 NC43 PCIE2_RX_P 44 NC45 GND 46 NC47 PCIE2_TX_M 48 NC49 PCIE_TX_P 50 PCIE2_RST_N51 GND 52 PCIE2_CLKREQ_N53 PCIE2_CLK_M 54 PCIE2_WAKE_N55 PCIE2_CLK_P 56 MFG_DATA57 GND 58 MFG_CLCOK59 - 60 -61 - 62 -63 - 64 -65 - 66 -67 NC 68 M2_SUSCLK69 VDD3V3_M2 70 VDD3V3_M271 GND 72 VDD3V3_M273 GND 74 VDD3V3_M275 GND


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3.3 SIMCardSlotTheVIAALTADS3isequippedwithaSIMcardslotthatcansupporta4GSIMcard.UsingtheSIMcardslotontheVIAALTADS3requiresa4GmoduletobeinstalledintheminiPCIeslottoenablethe4Gfunction,otherwisetheSIMcardslotisdisabled.TheSIMcardslotisdesignedonlyfora4Gmodulewithoutabuilt-inSIMcardslotonit.TheSIMcardslotislabeledas"SIM1".ThepinoutsoftheSIMcardslotareshownbelow.

Figure 18: SIMcardslotdiagram

Table 12: SIMcardslotpinouts

Pin Signal 1 USIM_VCC_A2 USIM_RST_A3 USIM_CLK_A4 -5 GND6 USIM_VPPSIM_A7 USIM_DATA_A


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4. Hardware InstallationThischapterprovidesinformationaboutthehardwareinstallationprocedures.Itisrecommendedtouseagroundedwriststrapbeforehandlingcomputercomponents.Electrostaticdischarge(ESD)candamagesomecomponents.

Reminder:Oncethechassishasbeenopened,thewarrantyofthisproductisnolongervalid.

4.1 Opening the ChassisStep 1

RemovethetwoscrewsonthebackpanelI/Oplate.

Figure 19: UnscrewingthebackpanelI/Oplate

Step 2

GentlypulloutthebackpanelI/Oplate.

Figure 20: RemovingthebackpanelI/Oplate


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Step 3

Gentlyslidethetopcoverhorizontallytodisengageitfromthechassisandpulluptoremoveitcompletely.

Figure 21: Removingthetopcover


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4.2 InstallingtheM.22280PCIeNVMeSSDModule

Step 1

Followtheinstructionsinsection4.1 above to open the chassis.

Step 2

Removethefourscrewsofthesystem'smainboardthengentlyremovethemainboardfromthechassis.

Figure 22: Removingthesystem'smainboard

Step 3

Onthebottomsideofthesystem'smainboard,alignthenotchontheM.22280PCIeNVMeSSDmodulewiththecounterpartontheM.2slot.Theninsertthemoduleata30°angle.

Figure 23: InstallingtheM.22280PCIeNVMeSSDmodule


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Step 4

OncetheM.22280PCIeNVMeSSDmodulehasbeenfullyinserted,pushdownthemoduleuntilthestandoffhole is aligned with the screw hole and then secure the module with the provided screw.

Figure 24: SecuringtheM.22280PCIeNVMeSSDmodule


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4.3 Installingthe4GSIMCard

Step 1


Step 2

Removethefourscrewsofthesystem'smainboardthengentlyremovethemainboardfromthechassis.

Figure 25: Removingthesystem'smainboard

Step 3

Onthebottomsideofthemainboard,firmlypushbacktheSIMcardslottounlocktheopening.PulluptheslotandplacetheSIMcardinside.GentlylocktheSIMcardslotbyslidingbacktheslot.

Figure 26: Installingthe4GSIMcard


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4.4 InstallingtheStandHolderThestandholderisdesignedtoholdtheVIAALTADS3inanuprightposition.

Step 1

Alignthepre-installedscrewofthestandholderwiththemountingholeattherightsideofthechassisandthengentlyattachthestandholdertothechassis.

Figure 27: Installingthestandholder


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Step 2

Oncethestandholderhasbeenfullyattached,secureitwiththepre-installedscrewlocatedonthebottomside of the stand holder.

Figure 28: Securing the stand holder


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5. Software and Technical Support

5.1 AndroidSupportTheVIAALTADS3featuresacompletesoftwareevaluationimagefeaturingtheAndroid8.0operatingsystem.

5.2 TechnicalSupportandAssistance•ForutilitiesdownloadsandthelatestdocumentationandinformationabouttheVIAALTADS3,pleasevisit our website at https:/www.viatech.com/en/systems/android-signage-players/alta-ds-3

•Fortechnicalsupportandadditionalassistance,alwayscontactyourlocalsalesrepresentativeor boarddistributor,orgotohttps://www.viatech.com/en/support/driver-support-fag/technical-support/ for technical support.

•ForOEMclientsandsystemintegratorsdevelopingaproductforlongtermproduction,other code and resources may also be made available. Please visit our website at https://www.viatech.com/en/ about/contact/ tosubmitarequest.

https://www.viatech.com/en/about/contact/ about/contact/

https://www.viatech.com/en/about/contact/ about/contact/


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Appendix A. Installing Wireless AccessoriesThischapterprovidesinformationonhowtoinstalltheVIAEMIO-2573mobilebroadbandminiPCIemoduleintheVIAALTADS3system.

A.1. InstallingVIAEMIO-2573MobileBroadbandModule

Step 1


Step 2

AlignthenotchontheVIAEMIO-2573modulewithitscounterpartontheminiPCIeslotonthemainboard.Then insert the module at a 30° angle.

Figure 29: InstallingtheVIAEMIO-2573module

Step 3

OncetheVIAEMIO-2573modulehasbeenfullyinserted,pushdownthemoduleuntilthescrewholealignswiththestandoffholeandthensecurethemodulewiththeprovidedscrew.Lastly,removetheantennaholecoverfromthebackpanelI/Oplate.

Figure 30: SecuringtheVIAEMIO-2573moduleandremovingtheantennaholecover


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Step 4

Insertthe4GantennacableintotheantennaholefrominsideofthebackpanelI/Oplate.Insertthewasher,fastenitwiththenut,andinstalltheexternalantenna.

Figure 31: InstallingtheantennaandantennacableofVIAEMIO-2573module

Reminder:

Onlyusetheprovided4GantennacablefortheVIAEMIO-2573modulewhichisprovidedinthepackage.

Step 5

Gentlyconnecttheotherendofthe4Gantennacabletothemicro-RFconnectorlabeled“MAIN”ontheVIAEMIO-2573module.

Figure 32: Connectingtheantennacabletothemicro-RFconnectoronVIAEMIO-2573module


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Step 6

ReinstallthetopcoverandbackpanelI/Oplate,andthensecureitwiththetwoscrews.

Figure 33: ReinstallingthetopcoverandbackpanelI/Oplate


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Appendix B. Installing VESA Mount CradleThischapterprovidesinformationonhowtoinstalltheoptionalVESAmountcradleformountingtheVIAALTADS 3 behind the monitor.

Step 1

AligntheVESAmountingholeoftheVESAmountcradleonthebackofthemonitor.ThensecuretheVESAmount cradle with the provided four screws.

Figure 34: InstallingtheVESAmountcradle

Caution:DonotuseanyothertypesofscrewsfortheVESAmountcradlebecausetheymightcausedamagetotheinternalboardofthemonitorandVESAmountcradle.Pleaseusethescrewswhichareprovidedinthepackage.


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Step 2

SlidetheVIAALTADS3systemintotheVESAmountcradle.

Figure 35: InsertingtheVIAALTADS3totheVESAmountcradle

Step 3

ConnectallthenecessarycablesonthefrontpanelandbackpaneloftheVIAALTADS3system.

Figure 36: ConnectingthenecessarycablestotheVIAALTADS3


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Appendix C. Connecting Debug CableThischapterprovidesinformationofhowtoconnectthedebugcable(TX/RX)totheVIAALTADS3system.

Step 1


Step 2

Gentlyattachthedebugcable(TX/RX)ontotheonboardCOMdebugconnectorlabeledasCONSOLE1.

Figure 37: Connectingthedebugcable(TX/RX)

Step 3

Afterdebugging,removethedebugcable(TX/RX)thenreinstallthetopcover.

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