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20min 30min 45min 1hour 1hour30min
HO
O8
N
OP
O O
OH
O
O
O
O
14
14
Peg8S
DPPC
0min 1min 2min 3min 10min
Time evolution studies of metastable DPPC/PEG8S domains
Pressure-area isotherm of DPPC/PEG8S
Langmuir trough coupled to an imaging ellipsometer
Lipid/Polymer Mixtures at Air/Water InterfaceLipid/Polymer Mixtures at Air/Water Interface
Si
O
O
O O O
n
Alkyl chain (can also be Cholesterol)
Poly(ethylene glycol)
Trichlorosilane
pH 9.0
pH 4.0
Silicon waferFlorescent glassNIPAAMNaMAAInitiatorLipid
Gramicidin A
FITC doped glass will fluoresce differently depending of changes in pH.
pH sensitive copolymer expands and compresses as H+ pumps through the membrane via the gramicidin ion channel.
Building BiosensorsBuilding Biosensors
Directed Assembly using Patterned Brushes and Composite Directed Assembly using Patterned Brushes and Composite NanoparticlesNanoparticles
Polymer-coated nanoparticles patterned onto a gold surfaceGeneral
Scheme
TEM image of polymer encapsulated nanoparticles Detail of RAFT-based tethering methodology
CdS
SiO2
S
S
CN
NH
O
O
N
S11
n
Si
O
Neutron Surface Reflectivity of Dry and Solvated Neutron Surface Reflectivity of Dry and Solvated ATRP Grafted Polystyrene on Si and SiOATRP Grafted Polystyrene on Si and SiO22 Wafers Wafers
R-X + Mtn/L R* + X-Mtn+1/Lkact
kdeact
Monomer
kp
CA after ATRP initiator deposition : 71ºCA after ATRP initiator deposition : 71ºGPC: MGPC: Mnn = 11,000 g/mol, PDI = 1.11 = 11,000 g/mol, PDI = 1.11
CA after polymerization : 112ºCA after polymerization : 112º
Evacuation/backfill portEvacuation/backfill portKrytox ® Krytox ® grease coated grease coated ground glass ground glass jointjoint
Surface platformSurface platform
Addition and Addition and sampling armsampling arm
CuBr : CuBrCuBr : CuBr2 2 : Styrene : PMDETA : EbiB = 9.6 : 0.48 : 960 : 10.8 : 1: Styrene : PMDETA : EbiB = 9.6 : 0.48 : 960 : 10.8 : 1
O
Si
O
Si
O
Si
O
Si
O
O
O
O
O
O
Br
n+CuBr, CuBr2, PMDETA
90 oC
Br
Si
Si
O
Si
O
Si
O
Si
O
Si
O
O
O
O
O
O
Br
Br
106
106
Si
Si
Brush compression vs. brush interdigitationBrush compression vs. brush interdigitation
0 1 2 3 4 50
10
20
30
40
50
60
Mn x
(10
-3)
Time (h)
9-96
Honey regionHoney region
Glue regionGlue region
Coffee regionCoffee region
Bulk polymerization of styrene MBulk polymerization of styrene Mnn vs. time vs. time
Atom Transfer Radical Polymerization (ATRP) SchematicAtom Transfer Radical Polymerization (ATRP) Schematic
0
1
2
3
-100 -50 0 50 100 150 200 250
10-5 Chi^2=1.92
Sca
tte
rin
g L
eng
th D
en
sity
, b x
10-6
Å-2
Z, Distance (Å)
Silicon
Na
tive
Oxi
de
PS
Air
Air
PS
PS
SiO
SiO
22
Si
Si
Scattering length density vs. dry thicknessScattering length density vs. dry thickness
ATRP of styrene “grafting from” Si waferATRP of styrene “grafting from” Si wafer
Polymerization reaction vesselPolymerization reaction vessel
10-12
10-11
10-10
10-9
10-8
0 0.05 0.1 0.15 0.2 0.25 0.3
10-5
Ref
lect
ivity
, RQ
4
Q (Å-1)
Reflectivity plotReflectivity plot
0 10 20 30 40 50 60 70 80
100
200
300
400
500
600
700
800
Th
ickn
ess
(Å)
Mn x (10-3)
(SLD) 10-5 (1.3) 10-6 (1.3) 10-62 (1.3) 10-66 (1.54) 10-67 (1.3) Linear Fit (R=0.9948)
PS brush thickness vs. MPS brush thickness vs. Mnn
Pre-elastomer coating on Pre-elastomer coating on stretched PDMS substratestretched PDMS substrate
Imprint epoxy mold master Imprint epoxy mold master A
Cure / Mold removalCure / Mold removal
ContractionContraction
Epoxy PDMS mold replication Epoxy PDMS mold replication BB
Epoxy master mold Epoxy master mold BB removal removal
Imprint epoxy master mold Imprint epoxy master mold BB on pre- on pre-elastomer coated stretched PDMS elastomer coated stretched PDMS substratesubstrate
Cure / Mold removalCure / Mold removal
ContractionContraction
High-Efficiency Stepwise Contraction and Adsorption High-Efficiency Stepwise Contraction and Adsorption Nanolithography (h-SCAN)Nanolithography (h-SCAN)
http://www.tdk.co.jp/teaah01/aah17200.htmhttp://www.tdk.co.jp/teaah01/aah17200.htm
Statistical analysis of AFM imageStatistical analysis of AFM image
Peak width (nm)Peak width (nm) 1,855 ± (37.87)1,855 ± (37.87)
Valley width (nm)Valley width (nm) 1,979 ± (32.81)1,979 ± (32.81)
Peak height (nm)Peak height (nm) 516.7 ± (7.804)516.7 ± (7.804)
Peak width (nm)Peak width (nm) 1,430 ± (35.33)1,430 ± (35.33)
Valley width (nm)Valley width (nm) 1,774 ± (31.28)1,774 ± (31.28)
Peak height (nm)Peak height (nm) 560 ± (16.6)560 ± (16.6)
Peak width (nm)Peak width (nm) 679.2 ± (43.14)679.2 ± (43.14)
Valley width (nm)Valley width (nm) 1,498 ± (31.62)1,498 ± (31.62)
Peak height (nm)Peak height (nm) 572.9 ± (30.26)572.9 ± (30.26)
Peak width (nm)Peak width (nm) 183.2 ± (7.500)183.2 ± (7.500)
Valley width (nm)Valley width (nm) 120.9 ± (5.670)120.9 ± (5.670)
Peak height (nm)Peak height (nm) 21.59 ± (3.400)21.59 ± (3.400)
Statistical analysis of AFM imageStatistical analysis of AFM imageStatistical analysis of AFM imageStatistical analysis of AFM image
Statistical analysis of AFM imageStatistical analysis of AFM image
AFM image of mold CAFM image of mold C Diagram of the layers of a DL Blue-ray disc Diagram of the layers of a DL Blue-ray disc AFM image of BD-RAFM image of BD-R
AFM image of mold AAFM image of mold A AFM image of mold BAFM image of mold B
Epoxy PDMS mold replication Epoxy PDMS mold replication CC