Upload
kaliappan45490
View
215
Download
0
Embed Size (px)
Citation preview
8/13/2019 Ultrasonic Evaluation of TiAl And40 Cr Diffusion Bonding Quality Based on Time-scale Characteristics Extraction
1/8
Ultrasonic evaluation of TiAl and 40Cr diffusion bonding quality based
on time-scale characteristics extraction
Yilin Luan a,n, Tao Sun a, Jicai Feng b, Tie Gang c
a School of Mechatronics Engineering, Harbin Institute of Technology, Harbin, Chinab School of Materials Science & Engineering, Harbin Institute of Technology at Weihai, Weihai, Chinac State Key Lab of Advanced Welding and Jointing, Harbin Institute of Technology, Harbin, China
a r t i c l e i n f o
Article history:Received 25 September 2010
Received in revised form
12 April 2011
Accepted 13 July 2011Available online 27 July 2011
Keywords:
Ultrasonics
Diffusion bonding
Dissimilar materials
Continuous wavelet transform
Time-scale amplitude and phase
a b s t r a c t
To solve the problem of ultrasonic pulse-echo method in the evaluation of kissing bond and unbond inTiAl and 40Cr diffusion bonding, a characteristics extraction algorithm was proposed. The algorithm was
based on continuous wavelet transform to convert ultrasonic TiAl and 40Cr diffusion bonding interface
signals into time-scale domain. The ultrasonic tests were performed by an ultrasonic C-scan imaging
system using a 10 MHz focused transducer. The time-scale amplitude and phase of the interface signals
were calculated and analyzed to distinguish the kissing bond and the unbond from the perfectly
bonded interface. The kissing bond can be detected by the scale-dependent amplitude combined with
phase variation and the unbond can be measured by the opposite phase. The amplitude and phase
characteristics were extracted to reconstruct the amplitude and phase characteristics images for TiAl
and 40Cr diffusion bonding specimens evaluation. The amplitude and phase characteristics images are
effective in the evaluation of bonding quality.
& 2011 Elsevier Ltd. All rights reserved.
1. Introduction
Diffusion bonding has been considered as a potential welding
method and increasingly used in the field of aerospace and
industry, which has many advantages such as high performance,
significant cost and weight savings, and low requirement for the
weldability of materials [1,2]. However, imperfections such as
kissing bond and unbond may occur at the interface due to
improper surface preparation and upset bonding conditions [3].
These defects can degrade bonding strength, especially fracture
toughness and fatigue strength [46]. Thus, it is necessary to
develop non-destructive evaluation of diffusion bonding.
The interfacial imperfections are parallel to the specimen
surface, which is a suitable position for ultrasonic test [7].
A variety of ultrasonic methods have been applied in the evalua-tion of bonding quality, such as pulse-echo method, laser ultra-
sonic system[8], guided waves [911], and nonlinear ultrasonic
measurement [1214]. Pulse-echo method is the most popular
technique among these ultrasonic methods. Palmer et al. [15]
described the application of ultrasonic reflectivity for the char-
acterization of copper diffusion bonds with different bonding
qualities. Ultrasonic reflection coefficients at 10 MHz were
correlated with the ultimate tensile strength. Kato and Abe [16]measured diffusion bondings of steel to titanium plates to obtain
the relationships among bonding strength, state of bonding
interface, and two major components derived from ultrasonic
testing. Considerable progress was made by Greenberg et al. [17]
in developing a real-time system for the monitoring of bonding
process by analyzing the amplitude ratio and attenuation of
acoustic waves. In other efforts, the C-scan images at the bonding
interface were used to calculate the ratio of non-bonded area of
diffusion bonded joints of mild steel, combined with impact tests
for threshold level determination [18]. Similar technique was
applied to field-assisted diffusion bonding joints to assess the
mechanical quality by increasing the ultrasonic frequency up to
20 MHz[19].
In general, the unbonds in similar diffusion bondings arereadily detectable by normal incidence wave since the ultrasonic
wave will be reflected at the defects whereas passing through the
perfectly bonded regions. The bonding quality can be assessed by
the amplitude of the reflected signals. However, the kissing bonds
are only a few micrometers in size, which result in weak
reflection. The bonding joints appear to be flawless under ultra-
sonic inspection [20]. As for the dissimilar diffusion bondings,
some ultrasonic energy is still reflected from the perfectly bonded
interface due to the effect of impedance mismatch between
materials to be bonded[7]. It is difficult to distinguish the defect
signals from the interface signals so that the bonding quality
cannot be assessed by the amplitude of the reflected signals.
Contents lists available at ScienceDirect
journal homepage: www.elsevier.com/locate/ndteint
NDT&E International
0963-8695/$ - see front matter & 2011 Elsevier Ltd. All rights reserved.
doi:10.1016/j.ndteint.2011.07.008
n Corresponding author. Tel./fax: 86045186413115.
E-mail addresses: [email protected] (Y.L. Luan),[email protected] (T. Sun),
[email protected] (J.C. Feng),[email protected] (T. Gang).
NDT&E International 44 (2011) 789796
http://www.elsevier.com/locate/ndteinthttp://localhost/var/www/apps/conversion/tmp/scratch_2/dx.doi.org/10.1016/j.ndteint.2011.07.008mailto:[email protected]:[email protected]:[email protected]:[email protected]://localhost/var/www/apps/conversion/tmp/scratch_2/dx.doi.org/10.1016/j.ndteint.2011.07.008http://localhost/var/www/apps/conversion/tmp/scratch_2/dx.doi.org/10.1016/j.ndteint.2011.07.008http://localhost/var/www/apps/conversion/tmp/scratch_2/dx.doi.org/10.1016/j.ndteint.2011.07.008http://localhost/var/www/apps/conversion/tmp/scratch_2/dx.doi.org/10.1016/j.ndteint.2011.07.008mailto:[email protected]:[email protected]:[email protected]:[email protected]://localhost/var/www/apps/conversion/tmp/scratch_2/dx.doi.org/10.1016/j.ndteint.2011.07.008http://www.elsevier.com/locate/ndteint8/13/2019 Ultrasonic Evaluation of TiAl And40 Cr Diffusion Bonding Quality Based on Time-scale Characteristics Extraction
2/8
In this paper, we focus on the evaluation of TiAl and 40Cr
diffusion bonding quality. A time-scale characteristics extraction
algorithm is proposed to measure TiAl and 40Cr diffusion bonding
interfacial imperfections. The algorithm is based on continuous
wavelet transform to analyze the amplitude and phase variation
of ultrasonic interface signals in the time-scale domain. The
authors shall demonstrate that the defects can be assessed by
the time-scale amplitude and phase characteristics.
2. Theoretical background
Classical boundary condition for ultrasonic wave interaction
with welded or perfectly bonded interface assumes that stress
and displacement across the interface is continuous. When an
ultrasonic wave is normally incident to such an interface, the
reflection coefficient R12 is given by[21]
R12 Z2Z1Z2 Z1
1
whereZ1and Z2 are the acoustic impedances of the materials on
either side of the interface. Note that the reflection coefficient
from the perfectly bonded interface is just a function of the
impedances.
If the bonding is imperfect and the size of imperfections is
considerably smaller than the wavelength of ultrasound, the inter-
face can be modeled by a set of distributed springs. The ultrasonic
wave interaction with such an interface can be described using
spring boundary condition. The reflection coefficient of normal
incidence ultrasonic wave from imperfect interface is given by[22]
R12 Z2Z1 io=knZ1Z2Z2 Z1io=knZ1Z2
2
whereo is the angular frequency of the ultrasonic wave and kn isthe normal interfacial stiffness, which is defined as distributed
spring contacts per unit area. The normal interfacial stiffness varies
from infinity when perfectly bonded is achieved, to zero for an
unbond surface. The normal interfacial stiffness must be much lessthan infinity when kissing bond occurs at the interface.
The reflection coefficient of the imperfect interface is related to
three factors: the acoustic impedances of the materials on either
side of the interface, the ultrasonic frequency, and the normal
interfacial stiffness. The amplitude and phase of the reflection
coefficient of TiAl and 40Cr diffusion bonding interface as shown
in Fig. 1 are calculated to illustrate the relationship among the
reflection coefficient and the three factors. The acoustic impe-
dances of TiAl and 40Cr are 2.73 107 and 4.68 107 Pa s m1,
respectively. As the phase is a periodic function with period p,
the result is only shown between p/2 and p/2. As kn-N,corresponding to the case of perfectly bonded, the amplitude of
the reflection coefficient9R9-(Z2Z1)/(Z2Z1) at all frequencies.The phase of the reflection coefficient tends to zero from the
positive direction, which means the reflected wave and the
incident wave are in-phase. As kn-0, corresponding to the case
of unbond, the amplitude of the reflection coefficient9R9-1 andalso no frequency dependence is observed. There is an exception
to the rule.9R9 tends to (Z2Z1)/(Z2Z1) when fis close to zero.The frequency used in ultrasonic testing is usually greater than2.5 MHz, even greater than 5 MHz. So this tendency has little
effect on the practical ultrasonic testing. The phase of the
reflection coefficient tends to zero from the negative direction,
which is equivalent to F-p. The reflected wave is opposite inphase to the incident wave. As kn is much less than infinity,
corresponding to the case of kissing bond, part of the ultrasonic
energy is reflected from the interface and the amplitude of the
reflection coefficient increases with the frequency. The phase of
the reflection coefficient is the same at low frequencies and
opposite at high frequencies. The phase transition occurs when
F-7p/2.
3. Experimental
3.1. Specimens preparation
TiAl intermetallic compound and 40Cr steel were used in the
study. The specimens were a rectangular shape of 45 mm 30 mm,
and the thicknesses of TiAl and 40Cr were 4.2 and 14.8 mm,
respectively. TiAl specimens were given chemical cleaning by 5%
hydrofluoric acid, then rinsed in water and finally dried in hot
airflow. 40Cr specimens were cleaned using acetone. Six specimens
were then bonded at various temperatures under a constant
pressure of 1.33 103 Pa in a vacuum furnace. The welding
temperatures were 900, 950 and 1000 1C to obtain unbond, kissing
bond, and perfectly bonded joints, respectively. The welding pres-
sure was 15 MPa for 15 min. A TiAl plate without diffusion bondingwas prepared as reference specimen.
3.2. Ultrasonic measurement
Ultrasonic tests were performed using ULTRAPAC C-scan
immersion system produced by Physical Acoustic Corporation.
The system consists of an immersion system including a scanning
frame assemble, motorized axis adjusters, an immersion tank, and
a computer with ULTRAWIN software to control test and provide
result display. A broadband focused transducer with central
Fig. 1. Calculated reflection coefficient of TiAl and40
Cr diffusion bonding interface: (a) amplitude of reflection coefficient and (b) phase of reflection coefficient.
Y.L. Luan et al. / NDT&E International 44 (2011) 789796790
8/13/2019 Ultrasonic Evaluation of TiAl And40 Cr Diffusion Bonding Quality Based on Time-scale Characteristics Extraction
3/8
frequency at 10 MHz was used. The ultrasonic wave at normal
incidence from TiAl side was focused on the TiAl and 40Cr
diffusion bonding interface. The C-scan images of the specimens
and the interface A-scan signals were obtained at the same time
with sampling frequency of 100 MHz. The ultrasonic wave was
also focused on the bottom of the reference TiAl plate and the
reference signal was collected from the TiAlair interface, which
had 99.99% amplitude and opposite phase of the incident wave.
Phase inversion was performed on the reference signal.
3.3. Shear test
The central part of each diffusion bonding specimen was cut to
obtain 20 shear test specimens with the dimensions of 4 mm
9 mm 19 mm. A plan view of the shear test specimens cutting
method are illustrated inFig. 2.The area with section lines was not
used for shear test to eliminate the edge effect caused by focused
transducer in the ultrasonic measurement. The numbers were the
serial number of shear test specimens. The shear test specimens were
subjected to shear tests at TiAl and 40Cr diffusion bonding interface in
a universal testing machine, providing information on the shear
strength of 20 areas of the diffusion bonding specimen. The shear
strength tbwas obtained by
tb FbA0
3
whereFbis the loading of final failure and A0is the area of shear test
specimen.
3.4. Metallographic analysis
The cross-sections of TiAl and 40Cr bonding joints were
polished for metallographic analysis. TiAl specimens were lightly
etched with 2% nitric acid. Micrographs of the diffusion bonding
interfaces were obtained by an optical microscope.
4. Time-scale characteristics extraction algorithm
As we know from Section 2, the ultrasonic amplitude and
phase after interacting with the interface are affected by the
bonding quality of the interface. Therefore, the interfacial imper-
fections can be evaluated by the ultrasonic amplitude and phase
characteristics. The time-scale characteristics extraction algo-
rithm is proposed to assess the bonding quality. The algorithm
procedures are as follows:
(1) The continuous wavelet transforms are performed on both
the interface signals and the reference signal according to the
following equation:
Wfa,b
Z 11
ftca,btdt 1ffiffiffiffiffiffiffi
9a9q
Z 11
ftc tb
a
dt
tA0,n 4
whereWf(a,b) is the continuous wavelet transform of function
f(t), f(t) is the interface signal or the reference signal, tis the
time variable, (0,n] is the sampling interval off(t),c(t) is the
basic wavelet, andaandbare referred to as the scale and timeparameter, respectively. The complex morlet wavelet is
employed in the continuous wavelet transform for its simi-
larity to the ultrasonic signal and linear phase. The complex
morlet wavelet is defined as
ct 1ffiffiffiffiffiffiffipfb
p et2=fb e2ipfct 5wherefb and fcare the bandwidth parameter and the central
frequency of the basic wavelet, respectively.
It is necessary to optimize the time-scale resolution and
determine the scale parameter a and the step of the scale s
prior to the continuous wavelet transform. The time-scale
resolution is related to 1=2pfc ffiffiffiffifbp , and therefore, fcis set as1 Hz to adjust fb. The optimal time-scale is obtained when fbequals 0.8. The scale parameter a of the continuous wavelet
transform is determined by the following equation:
a fcfs
fa6
wherefsis the sampling frequency of the ultrasonic measure-
ment and fa is the central frequency of the wavelet corre-
sponding to scale a. As can be seen, the scale is related to fawhenfcand fs are known, which is determined by the useful
bandwidth of the transducer. The useful bandwidth of the
transducer is ranging from 6 to 15 MHz. The scale parameter
is 16.76.7 according to Eq. (6). The scale parameter is
rounded to integers as 176 and the correspondence band-
width is ranging from 5.8 to 16.7 MHz. The step of the scale s
is set as 0.2 considering the computation efficiency.
(2) The time-scale ratio of the interface signal and the reference
signal R(a,b) is obtained by
Ra,b Wfa,binterfaceWfa,breference
7
where the subscript interfaceand reference correspond to the
interface signal and the reference signal, respectively.
(3) The time-scale amplitude 9R(a,b)9 and the time-scale phaseF(a,b) are obtained by
Ra,b
ffiffiffiffiffiffiffiffiffiffiffiffiffiffiffiffiffiffiffiffiffiffiffiffiffiffiffiffiffiffiffiffiffiffiffiR2Ra,b R
2I a,b
q 8
Fa,b +Ra,b arctan
RIa,b
RRa,b 9
where the subscript R and I correspond to the real and the
imaginary part of R(a,b), respectively. Concerned only with
the same or opposite of the time-scale phase, 1 is
employed to represent the same phase, and 1 is employed
to represent the opposite phase.
(4) The time-scale amplitude9R(a,bj)9of every time parameter bjis linear fitted along the scale parameter a decreasing direc-
tion to obtain the fitting curve yj according to the following
equation:
yj Aj9Ra,bj9 Kj, j l, l 1=fs,. . .,m 10
where Aj and Kj are the fitting slope and the fitting constant
of the fitting curve yj, respectively, and l and m are the
scope of the time parameter b, respectively. The amplitude
1 2 3 4
5 6 7 8
9 10 11 12
13 14 15 16
17 18 19 20
45
30
4
9
Fig. 2. Plan view of the shear test specimens.
Y.L. Luan et al. / NDT&E International 44 (2011) 789796 791
8/13/2019 Ultrasonic Evaluation of TiAl And40 Cr Diffusion Bonding Quality Based on Time-scale Characteristics Extraction
4/8
characteristicCR is obtained by
CR Xmj l
Aj 11
(5) The phase characteristic CF is calculated by
CF s
vu s
1
mfslf
s1 X
v
i uX
m
j l
Fai,bj
i u,u s,. . .,v, j l, l 1=fs,. . .,m 12
where u and v represent the scope of the scale parameter a,
F(ai,bj) is the time-scale phase of every scale parameter ai and
every time parameter bj. The reason of amplitude and phase
characteristics extraction will be explained in results and discus-
sion section.
5. Results and discussion
Fig. 3 shows the reflected signals of the perfectly bonded
interface, the kissing bond, and the unbond and the correspond-ing shear strengths of the joints are 246.1, 44.7, and 6.7 MPa,
respectively. As can be seen, there are reflected signals not only
from the kissing bond and the unbond but also from the perfectly
bonded interface due to the effect of impedances mismatch (the
reflectivity of the TiAl and 40Cr diffusion bonding interface is
26.3%). Moreover, there is no apparent difference between signals
from the perfectly bonded interface and from the kissing bond. It
is difficult to detect the kissing bond by the signals and the
bonding quality cannot be accessed by the amplitude of the
reflected signals.
Differences are illustrated clearly after the signals are pro-
cessed by the algorithm described in Section 4. Fig. 4 shows
the time-scale amplitude of the signals shown in Fig. 3. The
signal-to-noise ratio of time-scale amplitude is low when time is
less than 0.1 ms and greater than 0.4 ms, so that the signal analysis
was performed at the interval of [0.1ms, 0.4 ms]. Four time
parameters were extracted and the curves of the amplitude
changing with the scale were illustrated on the right side of
the time-scale amplitude. The extracted time parameters were
0.1, 0.2, 0.3, and 0.4 ms. As can be seen from Fig. 4(a), the
amplitude was low and remained roughly constant from 0.1 to0.4 ms at every time parameter for the perfectly bonded interface.
This phenomenon was confirmed by the extracted time para-
meters for the curves of the amplitude changing with the scale
were almost straight lines. As the scale is related to the frequency,
the amplitude does not vary with the frequency. For the kissing
bond as shown inFig. 4(b), the amplitude increased with the scale
decreasing at every time parameter. According to (6), the scale is
in inverse proportion to the central frequency of the wavelet, that
is to say, the amplitude increases with the frequency. The
amplitude was high and did not vary with the scale for the
unbond as shown in Fig. 4(c). The reason of the scale-dependent
amplitude may be explained as follows. The length of the kissing
bond is much smaller than the wavelength of the ultrasonic wave.
The ultrasonic wave of low scale (high frequency) is much more
sensitive to the interfacial imperfection than that of high scale
(low frequency). The lower the scale (the higher the frequency is),
the higher the amplitude after interacting with the defect. Thus,
the scale-dependent amplitude is observed for the kissing bond.
Though the kissing bond cannot be detected by the amplitude of
the reflected signals, one can reliably identify the defect using the
scale-dependent amplitude.
As for the kissing bond, the time-scale amplitude 9R(a,bj)9 ofevery time parameter bj increased with the decrease in scale ,
whereas that of the unbond and the perfectly bonded interface
did not vary with the scale. Therefore, the fitting slope Aj of the
fitting curveyjalong the scale decreasing direction was chosen to
0.0-1.0
-0.5
0.0
0.5
1.0
Normalizedamplitude
Time (s)
0.0-1.0
-0.5
0.0
0.5
1.0
Normalizedamplitude
Time (s)
0.1 0.2 0.3 0.4 0.5 0.1 0.2 0.3 0.4 0.5
-1.0
-0.5
0.0
0.5
1.0
Normalized
amplitude
Time (s)
0.0 0.1 0.2 0.3 0.4 0.5
Fig. 3. Ultrasonic signals reflected from TiAl and40
Cr diffusion bonding interface: (a) perfectly bonded interface, (b) kissing bond, and (c) unbond.
Y.L. Luan et al. / NDT&E International 44 (2011) 789796792
8/13/2019 Ultrasonic Evaluation of TiAl And40 Cr Diffusion Bonding Quality Based on Time-scale Characteristics Extraction
5/8
represent the scale-dependent feature of 9R(a,bj)9. The fittingslopes Aj were then summed as the amplitude characteristic CR.
The calculated amplitude characteristics were 6.30, 0.02, and
0.01 for the kissing bond, the unbond, and the perfectly
bonded interface, respectively. The kissing bond was distin-
guished from the unbond and the perfectly bonded interface by
the extracted amplitude characteristics.
A special phenomenon for the unbond was observed in the
experiment as shown in Fig. 5. The time-scale amplitude of theunbond decreased with the scale at every time parameter when
the ultrasonic signal was too high to overflow the oscilloscope. This
was because the signal was distorted by the saturated sampling.
However, this phenomenon has no effect to distinguish the unbond
from the kissing bond and the perfectly bonded interface.
Fig. 6shows the time-scale phase of the signals reflected from
the perfectly bonded interface, the kissing bond, and the unbond.
As can be seen fromFig. 6, the phase was almost the same for the
perfectly bonded interface at the interval of [0.1 ms, 0.4 ms]; the
time-scale phase presented the same at high scale whereas
opposite at low scale for the kissing bond; the time-scale phase
was opposite for the unbond. The opposite phase can be
explained by considering the difference in the acoustic impe-
dances on either side of the interface. The phase is the same after
the ultrasonic wave interacting with the interface in the case of
the acoustic impedance of the top material is less than that of the
bottom material, whereas the phase is opposite in the case of the
acoustic impedance of the top material is greater than that of
the bottom material. The acoustic impedance of the interface
layer is much less than that of the upper materials for the kissing
bond and the unbond, so that the opposite phase occurs. Although
the bonding quality is difficult to be evaluated by the amplitude
of the reflected signal, the kissing bond can be detected by thephase variation, and the unbond could be measured by the
opposite phase. The time-scale phase becomes another useful
tool to assess the kissing bond and the unbond.
The extraordinary feature of the time-scale phase of different
bonding quality was the same and opposite differences. The mean
value of the time-scale phase was able to represent the phase
differences. This is the reason for selecting the mean value as the
phase characteristic. The phase characteristic CR of the kissing
bond predicted to be between 1 and 1 for the time-scale
phaseF(ai,bj) presented the same at high scale whereas opposite
at low scale. The time-scale phase F(ai,bj) for the unbond and the
perfectly bonded interface were opposite and the same, so that
the predicted phase characteristics CR should be 1 and 1.
The calculation result showed that phase characteristics were
Time (s)
Scale
0 0.1 0.2 0.3 0.4 0.5
17
15
13
11
9
7
0
0.5
1
170.0
0.2
0.4
0.6
0.8
1.0
Amplitude
Scale
t=0.1s
t=0.2s
t=0.3s
t=0.4s
Time (s)
Scale
0 0.1 0.2 0.3 0.4 0.5
17
15
13
11
9
70
0.5
1
0.0
0.2
0.4
0.6
0.8
1.0
Amplitude
Scale
Time (s)
Scale
0 0.1 0.2 0.3 0.4 0.5
17
15
13
11
9
7
0
0.5
1
0.0
0.2
0.4
0.6
0.8
1.0
Amplitude
Scale
16 15 14 13 12 11 10 9 8 7 6
17 16 15 14 13 12 11 10 9 8 7 6
17 16 15 14 13 12 11 10 9 8 7 6
t=0.1s
t=0.2s
t=0.3s
t=0.4s
t=0.1s
t=0.2s
t=0.3s
t=0.4s
Fig. 4. Time-scale amplitude of signals from TiAl and 40Cr diffusion bonding interface: (a) perfectly bonded interface, (b) kissing bond, and (c) unbond.
Y.L. Luan et al. / NDT&E International 44 (2011) 789796 793
8/13/2019 Ultrasonic Evaluation of TiAl And40 Cr Diffusion Bonding Quality Based on Time-scale Characteristics Extraction
6/8
0.68, 0.99, and 0.97 for the kissing bond, the unbond, and
the perfectly bonded interface, respectively. The extracted phase
characteristics distinguished the kissing bond and the unbonded
from the perfect bonded interface.
The characteristics extraction was performed on the diffusion
bonding specimens. The amplitude and phase characteristics
images were reconstructed according to the position of the ultra-
sonic C-scan images using color indicating their values. Results of
one specimen are shown in Fig. 7. Fig. 7(a)(d) are the ultrasonicC-scan image, the shear strength of 20 areas of the specimen, the
amplitude characteristics image, and the phase characteristics
image, respectively. The lines on Fig. 7(b) were manually added
according to the dimension of the shear test specimens. The
elliptical regions A, B, and C were discussed. The amplitude of the
C-scan image is approximately 40% in region A, which is close to
region C. However, the shear strength of region C is 173.1 MPa,
whereas that of region A is averagely 19.5 MPa. There must be some
imperfections on the interface and their characteristics match those
of the kissing bonds. However, it is too difficult to identify the
kissing bonds by the ultrasonic C-scan image. Differences are
illustrated clearly in the amplitude and phase characteristics
images. The amplitude characteristics approach to 5 and the phase
characteristics are approximately 0.7 in region A. The amplitude
and phase characteristics of region C are approximately 0.02 and
0.98. The amplitude of the ultrasonic C-scan image in region B is
too high to overflow the oscilloscope and the shear strength is zero.
These defects belong to the unbond. The amplitude characteristics
are less than zero due to signal saturation sampling and the phase
characteristics are approximately 1.
The microstructures of the regions A and B are shown in Fig. 8.
Small areas with the length of a few micrometers in which
diffusion process is inhibited can be seen at the kissing bondinterface; and a narrow long gap with the width of approximately
89 mm is located at the unbond interface. The amplitude and
phase characteristics images are effective to assess the kissing
bonds and the unbonds in the TiAl and 40Cr diffusion bonding
specimens. Analogous signal analyses were performed on five
other specimens, and the same results were obtained.
6. Conclusions
Ultrasonic interface signals of the TiAl and 40Cr diffusion
bondings are transformed in the time-scale domain to analyze
the time-scale amplitude and phase and extract characteristics for
the bonding quality assessment. The algorithm proposed by the
0.0-1.0
-0.5
0.0
0.5
1.0
No
rmalized
amplitude
Time (s) Time (s)
Scale
0 0.1 0.2 0.3 0.4 0.5
17
15
13
11
9
7
0
0.5
1
0.1 0.2 0.3 0.4 0.5
Fig. 5. Saturated sampling signal from unbond interface and corresponding time-scale amplitude: (a) saturated sampling signal and (b) time-scale amplitude.
Time (s)
Scale
0 0.1 0.2 0.3 0.4 0.5
17
15
13
11
9
7-1
-0.5
0
0.5
1
Time (s)
Scale
0 0.1 0.2 0.3 0.4 0.5
17
15
13
11
9
7-1
-0.5
0
0.5
1
Time (s)
Scale
0 0.1 0.2 0.3 0.4 0.5
17
15
13
11
9
7
-1
-0.5
0
0.5
1
Fig. 6. Time-scale phase of signals from TiAl and 40Cr diffusion bonding interface: (a) perfectly bonded interface, (b) kissing bond, and (c) unbond.
Y.L. Luan et al. / NDT&E International 44 (2011) 789796794
8/13/2019 Ultrasonic Evaluation of TiAl And40 Cr Diffusion Bonding Quality Based on Time-scale Characteristics Extraction
7/8
paper differs from conventional ultrasonic evaluation for it
utilizes the scale-dependent amplitude instead of the amplitude
of the reflected signal. Another difference of the algorithm is the
application of the phase information. From the above study we
arrive at the conclusion that the kissing bond can be detected by
the scale-dependent amplitude combined with phase variation
and the unbond can be measured by the opposite phase. The
kissing bonds and the unbonds exist not only in diffusion
bondings but also in other solid-state welding methods, such as
high-frequency induction brazing and friction welding. The algo-
rithm shall be applied in other solid-state welding methods toanalyze its universaliability in our further study.
Acknowledgment
The authors are grateful to all the members of non-destructive
testing research team of the State Key Lab of Advanced Welding
Production Technology in the Harbin Institute of Technology for
their help.
References
[1] Tuppen SJ, Bache MR, Voice WE. Structural integrity of diffusion bonds in
Ti6Al4V processed via low cost route. Mater Sci Tech 2006;22:142330.
[2] Kurt B, Orhan N, Kaya M. Interface characterisation of diffusion bondedTi6Al4V alloy and austenitic stainless steel couple. Mater Sci Tech2009;25:55660.
[3] Wang ZC, Ridley N, Lorimer GW, Knauss D, Briggs G. Evaluation of diffusionbonds formed between superplastic sheet materials. J Mater Sci 1996;33:5199206.
[4] Achenbach JD, Xu Y. Reflection by defective diffusion bonds. In: Proceedingsof IEEE Ultrasound Symposium, Montreal; 1989.
[5] Xuan FZ, Zhang B, Tu ST. Interfacial resistance method for quality evaluationof diffusion bonded joints. Key Eng Mater 2007;353358:19447.
[6] Tuppen SJ, Bache MR, Voice. WE. A fatigue assessment of dissimilar titaniumalloy diffusion bonds. Int J Fatigue 2005;27:6518.
[7] Nagy PB, Adler L. Ultrasonic NDE of solid-state bonds: inertia and friction
welds. J Nondestr Eval 1988;7:199215.[8] Hutchins DA, Saleh C, Moles M, Farahbahkhsh B. Ultrasonic NDE using a
concentric laser/EMAT system. J Nondestr Eval 1990;9:24761.[9] Rose JL, Zhu WH, Zaidi M. Ultrasonic NDT of titanium diffusion bonding with
guided waves. Mater Eval 1998;56:5359.[10] Rose JL. Guided wave nuances for ultrasonic nondestructive evaluation. IEEE
Trans Ultrason Ferrelectr Freq Control 2000;47:57582.[11] Lee BC, Palacz M, Krawczuk M, Ostachowicz W, Staszewski WJ. Wave
propagation in a sensor/actuator diffusion bond model. J Sound Vibr2004;276:67187.
[12] Ulrich TJ, Sutin AM, Guyer RA, Johnson PA. Time reversal and non-linearelastic wave spectroscopy (TR NEWS) techniques. Int J Nonlinear Mech2008;43:20916.
[13] Kawashima K, Murase M, Yamada R, Matsushima M, Uematsu M, Fujita F.Nonlinear ultrasonic imaging of imperfectly bonded interfaces. Ultrasonics2006;44:132933.
[14] Ryuzo Y, Koichiro K, Morimasa M. Application of nonlinear ultrasonicmeasurement for quality assurance of diffusion bonds of gamma titanium
aluminum alloy and steel. Res Nondestr Eval 2006;17:22339.
-10
-5
0
5
10
-1
-0.5
0
0.5
1
[%]
100
50
0
Fig. 7. Characteristics extraction of TiAl and 40Cr diffusion bonding specimen: (a) Ultrasonic C-scan image, (b) shear strength of specimen, (c) reconstructed image of
amplitude characteristics, and (d) reconstructed image of phase characteristics.
Fig. 8. Microstructures of TiAl and 40Cr diffusion bonding specimen: (a) kissing bond and (b) unbond.
Y.L. Luan et al. / NDT&E International 44 (2011) 789796 795
8/13/2019 Ultrasonic Evaluation of TiAl And40 Cr Diffusion Bonding Quality Based on Time-scale Characteristics Extraction
8/8
[15] Palmer DD, Rehbein DK, Smith JF, Buck O. Nondestructive characterization ofthe mechanical strength of diffusion bonds. I. Experimental results. J Non-destr Eval 1988;7:15366.
[16] Kato H, Abe S. Ultrasonic evaluation of the bonding strength of dissimilarmetal bonds. NDT&E Int 1996;29:35561.
[17] Greenberg Y, Itzhak D, Kohn G. Ultrasonic monitoring of a low temperaturediffusion bonding process. J Test Eval 2000;28:8895.
[18] Katoh M, Nishio K, Yamaguchi T. Materials evaluation of diffusion bondedsteel bar and its impact characteristics. NDT&E Int 2002;35:26371.
[19] Cao ZJ, Chen HD, Xue J, Wang Y. Evaluation of mechanical quality of eield-assisted diffusion bonding by ultrasonic nondestructive method. SensorActuat APhys 2005;118:448.
[20] Oosterkamp A, Oosterkamp LD, Nordeide A. Kissing bond phenomena insolid-state welds of aluminum alloys. Weld J 2004;83:225S31S.
[21] Tattersall HG. The ultrasonic pulse-echo technique as applied to adhesiontesting. J Phys D (Appl Phys) 1973;6:81932.
[22] Lavrentyev AI, Beals JT. Ultrasonic measurement of the diffusion bondstrength. Ultrasonic 2000;38:5136.
Y.L. Luan et al. / NDT&E International 44 (2011) 789796796