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© 2004 – 2010 9000 Virginia Manor Rd Ste. 290, Beltsville MD 20705 | 301-474-0607 | www.dfrsolutions.com
Tuesday, March 20
Agenda: Day 1
8:30 - 9:00 AM Breakfast
9:00 - 9:30 AM Introduction
Dr. Natalie Hernandez
Introduction
Dr. Nathan Blattau
9:30 - 9:45 AM Break
9:45 - 10:45 AM Solder Failure Analysis with Examples
Dr. Natalie Hernandez
IC Wearout Analysis
Ashok Alagappan
10:45 - 11:00 AM Break
11:00 AM - 12:00 PM Solder Failure Analysis with Examples
Dr. Natalie Hernandez
ICT Analysis
Josh Akman
12:00 - 1:15 PM Lunch
1:15 - 2:15 PM Thermal Mechanical Analysis with Examples
Dr. Nathan Blattau
Vibration and Shock Analysis
Dr. Gil Sharon
2:15 - 2:30 PM Break
2:30 - 3:30 PM Thermal Mechanical Analysis with Examples
Dr. Nathan Blattau
Vibration and Shock Analysis
Dr. Gil Sharon
3:30 - 5:00 PM Q&A
Introduction to Sherlock
What is Sherlock Automated Design AnalysisTM?
o Physics of Failure-based
design reliability analysis
tool
o Predicts product failure
early in design process,
quickly and accurately
o Electronics-focused –
used across all industries
o Mitigates thermal and mechanical risks
How Does Sherlock Provide Value to Electronics Community?
Evaluate design-reliability tradeoffs, even for off-the-shelf technology
o Rapidly produce intelligent 3D models
o Turn stress (thermal/ mechanical) into prediction
Quantitatively evaluate risk post-assembly
o Design relevant test conditions
o Confirm test success, before test
Design Mechanical
ManufactureTesting
Reliability
Typical ROI is 10:1 in Year 1
WHY CHANGE NOW?
o Most OEMs in Automotive and Aviation hatedemonstrating reliability through testing
o It takes too long
o It costs too much
o It is too late in the process
o Suppliers rarely fail
o Failures are not always relevant
o It stymies innovation and modification (no one wants to retest)
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SHERLOCK SOFTWARE CASE STUDY 1
o In 2013 American Auto Manufacturer begin utilizing Sherlock for electronic module analysis in parallel with its current testing plan.
o American Auto Manufacturer believed that Sherlock could accurately simulate power temperature cycling (PTC) tests and thereby eliminate certain tests, reduce valuable senior engineering time and correspondingly reduce reliability testing costs and time to market.
o Over the course of a twelve-month period, Sherlock identified 4 designs wherein the probability of failure during PTC exceeded the acceptable standard for American Auto Manufacturer.
o Had the design moved forward, 4 additional PTC tests would have had to be performed at a cost exceeding $346,000 each or $1,384,000 over the year
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American Auto Manufacturer saves over $1,384,000
in test costs
SHERLOCK SOFTWARE CASE STUDY 2
o Global Storage Manufacturer is using Sherlock to eliminate one (1) to two (2) physical tests for EACH PCBA Design
o Ten (10) PCBAs are designed annually
o Engineering labor and hard test costs (Chambers, Samples) are approximately $750,000 per test
o Results in an Annual Savings of $7,500,000
o Sherlock also eliminates two (2) design revs for EACH PCBA
o Time-to-Market Reduced by Six (6) Months
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Global Storage Manufacturer reduces
time-to-market by six (6) months
Getting Started
Installing Sherlock
o System requirements
✓ Windows 7 or newer
✓ Java 64-bit
✓ 8 GB of memory
o If available, the following are recommended PC specifications:
✓ Windows 10
✓ Java 64-bit
✓ Adobe Reader 8.x or higher
✓ Intel i7 processor with 4 cores and at least 16GB of memory. If you intend to complete larger models, it is recommended that you use an Intel i7 processor with 8 cores and 32GB or higher of memory.
✓ A considerable hard drive: 2TB, for saving data.
o Updates are on our website
http://update.dfrsolutions.com/o Launcher settings
o Sign up for the forum
Download and Install Sherlock
o Go to:
update.dfrsolutions.com
o Use the license file
o Download Installer
• Import the license
• Reconnect
What is an Intermediate User?
o Tutorials
o Completed the various tutorials
o Demonstration project
o Installation issues
o 3-4 boards
o Multiple iterations
o Life cycles
o Local library
What is an Intermediate User?
o Complicated Life Cycles
o Temperature maps
o Single project mode
o Manage projects
o Version control
o Assemblies
o Mezzanine cards
o Holes and standoffs
o Analysis Properties
o Standalone tools
Life Cycles
o User guide
o Webinar
o https://www.dfrsolutions.com/resources/defining-sherlock-
life-cycle-environments-webinar-lp
o Edit Properties:
o Define reliability metric
o Defining Phases
o Environment: MIL-217 TR-332
o Duration of Phase must cover all events
o Temperature cycle must begin and end at same temperature
Closer Look at Temp. Cycles
o Example of a generic temp cycle (-10 to 100°C)
o The whole board is changing temperature
o But the Min and Max temps of the board can be
different than (-10°C) od 100°C
Thermal Maps
o Sources:
o IR camera
o Thermal analysis
o Direct measurement
o Any Picture
o Align the board and
legend
o Legend orientation
o Apply thermal maps
o Board side
o MIN and MAX
o You can have 4 maps for
1 temp cycle
Assemblies
o Daughter cards
o Mezzanine
o Edge connected
o Height of standoffs must be the same for all of them
o Component interference
o Using assemblies to make interesting things
What’s new in Sherlock v.5.4?
NEW FEATURES INTRODUCED IN 2017
o Thermal Mechanical Analysis
o Semiconductor Wearout (per SAE ARP 6338)
o Column Grid Array and L-lead Packages
o New Solders (SN100C, 90Pb10Sn)
o More Details in BGA Model (Overmold/Laminate)
o Compatibility with NX Nastran
o Extended Ansys Workbench Compatibility
o Improved Error Checking
o Greater Traceability
o IPC 2581
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NEW FEATURES COMING IN 2018
o SolidWorkso Import external 3D objects (enclosure, stiffeners, etc.)
o Temperature-Based FEA o Ability to perform natural frequency, vibration, and mechanical shock predictions between -55C
and 125C
o Thermal Mechanical: Solder Fatigue Prediction
o Humidity Failure Modes
o Expansion of Manufacturability Assessmento Warpage prediction (PCB and BGA)
o Via (buried, blind, filled) failures during reflow
o ICT predictions based on strain rate effects
o New Solders
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SOLIDWORKS
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The Sherlock-SolidWorks plugin automatically includes all materials referenced by the
part/assembly in the INP file so that they can be imported into Sherlock.
TEMPERATURE-BASED FEA
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MATERIALS LIBRARY
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o Over 120 new materials
o New managers for laminates, materials, and solder alloys
o Temperature-dependent material effects are automatically incorporated
PREDICTING VIA FAILURE DURING REFLOW
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New Features Summary
o System-level effects are becoming more apparent
with the move to higher density and higher power
dissipation
o Bringing physics into manufacturability is essential
o Sherlock is the only software tool that provides a
complete life curve
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Questions?Additional Q&A at 3:30pm
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