INFN-Pisa

Tracker construction in Italy

SSD testingLadder qualification

Luca LatronicoItalian collaboration Meeting - Pisa 18/02/2002

INFN-Pisa

Cable PlantUCSC

Tower Structure (walls, fasteners)Engineering: SLAC, HytecProcurement: SLAC

SSD Procurement, TestingJapan, Italy, SLAC

Electronics Design, Fabrication & TestUCSC, SLAC

Tower Assembly and TestSLAC (2) Italy (16)

Tray Assembly and TestItaly

SSD Ladder AssemblyItaly

Composite Panel & ConvertersEngineering: SLAC, Hytec, and ItalyProcurement: Italy

2592

10,368

342

648

18

Tracker construction roadmap

INFN-Pisa

HPK provides:

• at batch level - from an SSD taken at sample in the batch, min, max,

avg

values of the following:

strip bias resistor strip coupling capacitance strip resistance

• at single SSD level:

IV scan 0-200V (Ileak is I measured at 150V) CV scan 0-200V (Cbulk is C at 150V) Vdep – defined as V where F(V) - F(V-5) < 0.0039, with F=1/C2[nF] bad strips ID and defect type

1903 SSDs (>18% of total) received so far from HPK

SSD in the house

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Leakage current (nA) at 150V

0

20

40

60

80

100

120

140

160

0

30 60 90

120

150

180

210

240

270

300

330

360

390

420

450

480

510

I (nA)

I leakage

evt 1903avg 186nAstdev 63nAmin 80nAmax 619nA

HPK data statistics

Ileak specs:I < 600nA single SSDI < 200nA averaged on 100 SSD

all within specification

Stdev(Cbulk) ~ 2 m

Bulk capacitance (pF) at 150V

0

50

100

150

200

250

1800

1805

1809

1814

1818

1823

1828

1832

1837

1841

1846

1851

1855

1860

1864

1869

1874

1878

1883

1887

1892

1897

1901

1906

1910

1915

C (pF)

C_bulk

evt 1903avg 1849pFstdev 12pFmin 1749pFmax 2006pF

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Depletion voltage (V) at HPK

0

50

100

150

200

250

3000 10 20 30 40 50 60 70 80 90 100

110

120

130

140

150

160

170

180

190

200

Vdep (V)

V_dep

evt 1903avg 75Vstdev 20V min 40Vmax 135V

HPK data statistics

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Bad strips distribution vs batch

0

1

2

3

4

5

6

7

SW

X60

375

SW

X60

562

SW

X60

569

SW

X60

572

SW

X60

700

SW

X60

709

SW

X60

736

SW

X60

745

SW

X60

769

SW

X60

771

SW

X60

773

SW

X60

777

SW

X60

822

SW

X60

835

SW

X60

923

SW

X60

925

batch #

#

nb. bad strips

nb. bad SSD

72 / 730752 bad strips (0.01%)52 / 1903 SSD with defects (2.7%)31 / 65 batches with defects (48%)ave. 1.4 bad-strips/SSDmax 3 bad strips/SSD

HPK data statistics: defects analysis

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Position of defects along SSD - all 1903 detectors

0

0.5

1

1.5

2

2.5

3

3.5

4

4.5

1

14

27

40

53

66

79

92

10

5

11

8

13

1

14

4

15

7

17

0

18

3

19

6

20

9

22

2

23

5

24

8

26

1

27

4

28

7

30

0

31

3

32

6

33

9

35

2

36

5

37

8

strip number

nu

mb

er o

f d

efe

cts

HPK data statistics: defects analysis

Strip defects types

32

21

7

2

7

1

1

1

coupling short

strip isolation

poly-si resistor

implant short

ac-al open

implant open

strip open

leaky strip

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Laboratory measurements – tests rate

Integral test rate

0

100

200

300

400

500

600

700

9/16

/01

9/23

/01

9/30

/01

10/7

/01

10/1

4/01

10/2

1/01

10/2

8/01

11/4

/01

11/1

1/01

11/1

8/01

11/2

5/01

12/2

/01

12/9

/01

12/1

6/01

12/2

3/01

12/3

0/01

1/6/

02

1/13

/02

1/20

/02

1/27

/02

2/3/

02

2/10

/02

2/17

/02

Date

Nb.

SSD

test

ed

iv tests rate

dimensional tests rate

~1.5 months stop for clean room failure

Weekly test rate - last month

0

20

40

60

80

100

120

140

160

1/27

/02

2/3/

02

2/10

/02

2/17

/02

Date

Nb

. SS

D t

este

d

iv tests rate

dimensional tests rate

extrapolated avg month ratesiv 256dimensional 434

maximum speed reached last month:

16min/SSD for IV-CV scan 6min/SSD for dimensional test but we keep the pace only with training!

dimensional 590electrical 390partially test 637fully tested 341

updated friday 15/02 … but we had some activity during the week-end

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Laboratory measurements

enthusiastic students at work

took dimensional test as video game

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SSD Pisa clean room measurements

Electrical • strips (p+) grounded / back plane (n) at variable V(+)• use calibrated instrumentations (Vsource,p-ammeter,LCR)• read through GPIB/LabView• data can upload DB automatically

IV scan 0-200VIleak at 150V

CV scan 0-200V Cbulk at 150VVdep with:2 fit intersectionHPK definition

see www.pi.infn.it/glast/lattd/ssd_insp_proc.doc (LAT-TD-00454)

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Leakage current (nA) at 150V

0

10

20

30

40

50

60

70

80

901

0

40

70

10

0

13

0

16

0

19

0

22

0

25

0

28

0

31

0

34

0

37

0

40

0

43

0

46

0

49

0

I (nA)

in lab

at HPK

eventsaverage stdevminmax

78.0

34.8

42.3

350.2

lab hpk

174.6

387

52.9

95.2

413.5

387

Laboratory vs HPK data

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Bulk capacitance at 150V

0

10

20

30

40

50

60

70

80

90

100

1800

1810

1820

1830

1840

1850

1860

1870

1880

1890

1900

1910

1920

1930

1940

1950

1960

1970

1980

1990

2000

C (pF)

in lab

at HPK

eventsaverage stdevminmax

1836.68.7

1817.6

1867.2

lab hpk

1850.0

387

9.11828

1891

387

Laboratory vs HPK data

INFN-Pisa

Laboratory vs HPK data

Depletion voltage

0

10

20

30

40

50

60

70

80

90

1000 10 20 30 40 50 60 70 80 90 100

110

120

130

140

150

Vdep (V)

in lab - double fit intersection

in lab with HPK algo.

at HPK

eventsaverage stdevminmax

55.818.4

-20.097.3

lab hpk

68.2387

19.35.0110.

387

lab2

38769.918.6

40.0

110.0

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Shift= (DyA+DyD)/2Rotation=DyA-DyD

A

BC

D

305m

200m

300m

• pixel/mm calibration on reference cross• measure distance of reference cross centre to X and Y edge (all corners, DXA,DYA,DXB…)• cut alignment evaluated with:

Geometrical

see www.pi.infn.it/glast/lattd/ssd_insp_proc.doc (LAT-TD-00454)

SSD dimensional tests

INFN-Pisa

Shift and rotation

0

20

40

60

80

100

120

140

160

180

-10 -9 -8 -7 -6 -5 -4 -3 -2 -1 0 1 2 3 4 5 6 7 8 9 10

micron

shift

rotation

569 5690.5 1.41.7 2.5

-10.2 -7.87.4 9.0

shift rotation

events

averagestdev

min

max

SSD dimensional tests

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42 non-conformancies so far - 28 left after review25(7%) warning - 3(<1%) failures

SSD non-conformancies analysis

• assign acceptance flag after each test (soon LAT-TD doc)• periodic review • failure to be published within 24 hrs

OKwarningfailure

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Alignment Glueing

Ladders qualificationsee www.pi.infn.it/glast/lattd/lad_ass_meas.doc (soon LAT-TD … )

Currently qualifying two suppliers G&A Engineering MIPOTLadders assembled with flight sensors and final tools

INFN-Pisa

Ladder alignment

-8

-6

-4

-2

0

2

4

6

8

10

0 50 100 150 200 250 300 350

Position along the ladder (mm)

Resid

ula

s (m

)

LG0001

LG0002

Minimum -5.59Maximum 8.41Standard deviation 3.89

SSD alignment check (G&A)

Ladders qualification: mechanics

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• bonding pull strength between 6-9 gr. (measured at Mipot)

• bonding encapsulation (at G&A and Mipot):

pure epoxy(3M Scotchweld 2216 A/B)

dam (3M Scotchweld 2216 A/B )+ fill (General Electric 615 )

both good but dam&fill chosen as more reliable

Ladders qualification: mechanics

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G&A ladder vs SSDs-sum leakage current comparison

-50

0

50

100

150

200

250

300

350

400

450

500

voltage (V)

curr

ent

(nA

)

LG001_ssd

LG002_ssd

LG001_enc

LG002_enc

LG001_bare

LG002_bare

Ladders qualification: leakage current

Mipot ladder #1 leakage current

0

100

200

300

400

500

600

0 25 50 75 100 125 150 175 200

Volt

nA sum of SSD currents

ladder current

G&A

Mipot (Dam&Fill encapsulation)

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Mipot ladder #2 leakage current

0

50

100

150

200

250

300

350

400

0 25 50 75 100 125 150 175 200

Volt

nA sum of SSD currents

ladder current

Mipot ladder #1 current stability

0

100

200

300

400

500

600

0 10 20 30 40 50

time (hours)

curr

ent

(nA

)

good stability (2 days)

Ladders qualification: leakage current

little current increase after ladder assembly and microbonding encapsulation

Mipot (Dam&Fill encapsulation)

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Mipot ladder bulk capacity

0.00E+00

1.00E+01

2.00E+01

3.00E+01

4.00E+01

5.00E+01

0 25 50 75 100 125 150 175 200

Volt

nF

ladder #1

ladder #2

Mipot ladder 1/C2 plots

0.00E+00

4.00E-03

8.00E-03

1.20E-02

1.60E-02

2.00E-02

0 25 50 75 100 125 150 175 200

Volt

nF

-2 ladder #1

ladder #2

• ladder bulk capacitance = 7.34nF

equivalent to sum Cbulk of 4 SSDs

• depletion voltage = 55Volt same as 4 SSDs

Ladders qualification: bulk capacitnace

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Conclusions

• Flight sensors testing proceeds at full speed : goes on everyday for 8 hrs. (electrical) + 4 hrs. (geometrical) primary activity of the whole italian collaboration contributions from people belonging to other italian institutions other test centre are now warming up around Italy will increase contacts need to improve DB in order to share data with new test centres and suppliers

• Ladder qualification: two manufacturers involved in the process both were qualified basic tests/choices done ready to start mass production