Upload
others
View
3
Download
0
Embed Size (px)
Citation preview
© 2015 Toshiba Corporation
January, 2015
Toshiba Corporation Semiconductor & Storage Products company Wireless IC Marketing and Engineering Group
Toshiba Confidential Information
Toshiba
Bluetooth®
IC
Slide No. 2 Toshiba confidential
Cloud computing
Smart Grid Medical & Health care ICT
NFC
EV/Car Enta
BT
Mobile Communication(2G/3G/4G)
LAN
Smart Life Cloud Computing & M2M wireless
BIG
DATA
Bluetooth / BLE ETC/RKE
FlashAir(SD)
TransferJet
Various Devices are
built-in Wireless
function.
WiFi
Slide No. 3 Toshiba confidential
Billions
Devices
PC Peripheral
Bluetooth Application
Mobile Accessory
Smart Home
Heath Care
Automotive
Audio
Remote Control Wearable
In-Door Position
Slide No. 4 Toshiba confidential
Bluetooth Products with Toshiba IC
Wrist band
Smart watch
Car Audio
Health care monitor
Mobile
POS
Bluetooth PHS
Jacket
Heart Rate monitor
Movement monitor
DSC
BT mouse
Body
Temperature
Monitor
Wearable
Accessory
DSC
Healthcare
Medical
Automotive
Beacon
Key Fog
Slide No. 5 Toshiba confidential
Toshiba Bluetooth IC Advantages
• Stable performance, based on 15 years BT experience.
• All-in-One solution, with High Quality&Reliable BT profile - HCI, SPP, HID, GATT, SPP+GATT dual
• Low power consumption for real BT low energy
• Full support for BLE stand alone with 128KB Flash ROM inside
• Both Line-ups of BLE MaskROM&Flash ROM with Low Power Solution
NEW
Slide No. 6 Toshiba confidential
TC35667FT
G
TC35670FT
G
-005 V4.0(LE)
Peak Current=5.9mA
BLE Single+GATT
Under MP
2014
TC35667FTG-006
V4.1(LE) & OTA supported
BLE Single+GATT
Peak Current=5.9mA
ES: Apr.’15 MP:Q2.’15
Bluetooth LE
solution
2015
BLE + NVM
solution
BLE,+GATT
V4.0/OTA supported 128KB Flash ROM
QFN40, 6mm□
ES M/Mar.’15 MP:Q3.’15
BLE+Tag+ NVM
solution
TC35675XBG
BLE+GATT, NFC-Tag V4.0/OTA supported
128KB Flash ROM
FBGA52 4.5x4.5mm, 0.5mm pitch
ES M/Mar.’15 MP:Q3.’15
TC3567x
V4.1(LE)
BLE Single+GATT
3mA Peak Target
QFN, WCSP
ES: Q4.’15 MP:Q2.’16
BLE Ultra Low
Power solution
BLE + NVM
Ultra Low Power
TC3567y
BLE+GATT
128KB Flash ROM
3mA Peak Target
ES Q4.’15 MP:Q2.’16
BLE+Tag + NVM
Ultra Low Power
TC3567z
BLE+GATT, NFC-Tag
128KB Flash ROM
3mA Peak Target
ES Q4.’15 MP:Q2.’16
BTv4.0+DSP
solution
TC35668 BTv4.0 WBS ECNR
Audio CODEC
ES available, MP:Aug.’15
TC35676FTG
TC35670FTG-006
V4.1(LE) & OTA supported
BLE Single+GATT
Peak Current=5.9mA
ES: Apr. ’15 MP:Q2.’15
TC35667FSG-005 (Small package)
QFN40, 5mm□ 0.4mm pitch
ES: B/Mar.’15 CS: E/Jul.’15
WCSP41 3mm □ EV board E/Apr
ES E/May
BLE,+GATT
V4.0/OTA supported 128KB Flash ROM
QFN40, 5mm□ 0.4mm pitch
ES E/Mar. ’15 MP:Q3.’15
TC35676FSG (Small package)
Toshiba BT/BLE IC Roadmap
BLE v4.0
NVM
BLE + NVM
solution
BLE,+GATT
V4.1/OTA supported 128KB Flash ROM
676:QFN40, 6mm□
ES Jun.’15 MP:Q3.’15
BLE+Tag+ NVM
solution
TC35675XBG
BLE+GATT, NFC-Tag V4.1/OTA supported
128KB Flash ROM
FBGA52 4.5x4.5mm, 0.5mm pitch
ES Jun.’15 MP:Q3.’15
TC35676FTG
BLE,+GATT
V4.1/OTA supported 128KB Flash ROM
QFN40, 5mm□ 0.4mm pitch
ES Jun. ’15 MP:Q3.’15
TC35676FSG (Small package)
BLE v4.1
NBM Low Power
BLE+Tag
solution
Slide No. 7 Toshiba confidential
BLE TC35667FTG-005 TC35667FSG-005
TC35667WCSP-005
BLE TC35667FTG-xxx TC35667FSG-xxx
BLE+NVM TC35676FTG TC35676FSG
BLEv2 TC3567x
BLEv2+NVM TC3567y
BT Spec. V4.0 BLE V4.1 BLE(Apr) V4.0 BLE V4.1(June)
V4.1 BLE V4.1 BLE
CPU/Clock frequency ARM7/13MHz ARM7/13MHz ARM7/13MHz M0 (TBD)/13MHz
M0 (TBD)/ 13MHz
Mask ROM 384KB 384KB 256KB 384KB 256KB
SRAM 128KB 128KB 224KB (96KB for App. & Profile)
128KB 224KB
Flash ROM Size --- --- 128KB (User Area=96KB est.)
--- 128KB (User Area=96KB)
Access time --- --- 0.5MHz --- < 13MHz
Erase /Write time
--- --- Write: 20usec@256B Erase: 150msec@64KB
--- TBD
Read time --- --- 4msec@8KB --- TBD
OTA update Under Development Supported Supported Supported Supported
Current Consumption
Operating Peak
5.9mA(Rx) 5.9mA(Rx) 6.0mA 3.0mA (Target)
3.0mA (Target)
Deep Sleep < 0.1uA < 0.1uA < 0.1uA < 0.1uA < 0.1uA
Erase /Write Flash ROM
--- --- 20mA@256B --- <10mA
Package FTG:QFN40, 6x6mm 0.5mm pitch
FSG:QFN40, 5x5mm 0.4mm pitch
WCSP: 3x3mm 0.4mm pitch
FTG:QFN40, 6x6mm 0.5mm pitch
FSG:QFN40, 5x5mm 0.4mm pitch
FTG:QFN40, 6x6mm 0.5mm pitch
FSG:QFN40, 5x5mm 0.4mm pitch
QFN, WCSP (TBD)
QFN
Status FTG: MP FSG: Jul. 2015
WCSP: Under plan’g
ES: Mar. 2015 ES:Mar.2015 ES:Q4.2015 ES:Q4.2015
Toshiba BLE IC Comparison Table
Slide No. 8 Toshiba confidential
SmartPhone
Coupon
Web Site
Start BT communication
Reference Model
Touch! 1.Touch with Smart Phone, which supports BLE & NFC
2.BD address is transferred by NFC Tag. 3.Automatically BT paring is completed. 4.BT communication is started. ★ Easy to use Bluetooth !!
Coupon
Web Site
表示
SmartPhone
BD address by NFC Tag
Demo: Auto BT connection by NFC tag
Reference Model
Automatic BT paring
TC35670: Bluetooth® SMART + NFC Tag
Slide No. 9 Toshiba confidential
Products Introduction
- TC35667
- TC35670
- TC35661
- TC35675
- TC35676
- TC35668
Slide No. 10 Toshiba confidential
Low Power Consumption
BLE Single IC
TC35667
Slide No. 11 Toshiba confidential
TC35667 Product Brief
TC35667 Block Diagram Ultra Low Power Consumption Peak Power Consumption 5.9 mA (Tx-4dBm)5.7mA(Rx)
Deep Sleep Power Consumption 0.1 μA
Interface Functions (16 GPIOs) UART: 2ch, I2C: 1 ch, SPI: 1 ch (Selectable)
10-bit ADC: 3 ch for Input pins, 1 ch for VDD monitor PWM : 3 ch for Buzzer, LED, or etc.
32Kbyte User Program Area Provide Not only GATT protocol&profile but also 32KByte user Program area for user application.
Realizes "Stand-alone" operation. Release Software development Kit(SDK).
RF Block
LE
Modem
ARM Processor
Mask ROM
SRAM
CLK
ADC
UART1
I2C
GPIO
PWM DCDC
Under MP
On-Chip DC-DC with 1.8 to 3.6 V Input Provides wide range of operation voltage
Simplifies external power supply circuit
Bluetooth Smart Compliant and Ultra Low Power Consumption
SPI
Small Package: QFN40, 6 mm□, 0.5 mm pitch Supports 2-layer PCB and reduces BOM cost
Temperature: -40℃ to 85℃
UART2
Slide No. 12 Toshiba confidential
BLE IC TC35667FTG
BLE IC TC35667-xxx
BT Spec. V4.0 BLE V4.1 BLE
CPU/Clock frequency 13MHz 13MHz
Mask ROM 384KB 384KB
SRAM 128KB 128KB
OTA (Over The Air) Not Supported Supported
Current Consumption
Operating Peak 5.9mA(Rx) 5.9mA(Rx)
Deep Sleep 0.1uA 0.1uA
Input Voltage 1.8 – 3.6V 1.8 – 3.6V
Package QFN40, 6mm□ QFN40, 6mm□
Status MP ES:Nov.2014 MP:Q1.2015
TC35667 BLE IC Comparison Table
Slide No. 13 Toshiba confidential
TC35667 Advantages
Standalone System (for Sensors, etc)
TC35667
EEPROM (eg.256kbit)
User Program RAM (32KByte)
I2C
GPIO
Mask ROM
Bluetooth LE
GATT
Host MCU + Bluetooth System
TC35667
EEPROM (eg.256kbit)
User Program RAM (32KByte)
I2C
GPIO
Mask ROM
Bluetooth LE
GATT
UART
Host MCU
Application Program
Peripherals
GATT Client/Server Supported GATT roles: Client and Server GAP roles: Central and Peripheral
GATT Server Database Embedded Simplifies operation on Host MCU for service search, etc.
Sleep Function Supported Realizes low power consumption during connecting, advertising, and idle state. Wake up signal for Host MCU Wake up signal from Host MCU
User Program RAM Area User Program download from EEPROM on power-up Host-less system ("Stand-alone")
EEPROM is optional.
Wakeup
Slide No. 14 Toshiba confidential
TC35667 Software structure for external MCU
TC35667 Low energy Stack & Profile
L2CAP
ATT
GAP
GATT
SMP Con_update
Service database
Application interface
Bluetooth Low Energy RF-PHY, Link Layer, 4.0HCI
Application / Profile (in case of external MCU use)
UART
Build-in stack
Sample source code
for application and
Profile can be
provided by
TOSHIBA
Slide No. 15 Toshiba confidential
TC35667FTG Module board Size: 20×15mm□ 2layer PCB Pattern Antenna EEPROM(512kbit)
TMPM395FWAXBG
TMPM395FWAXBG as HostMCU (FlashROM:128kByte/RAM:8kByte)
Temperature sensor/Accelerator/Buzzer USB power supply/button battery Software development tool (IDE) KEIL and IAR
The following materials are available. Circuit BOM list Operation manual Antenna characteristics Sample source code
TC35667 & TMPM395FWAXBG Starter Kit
MCU+BLE Software starter Kit
Slide No. 16 Toshiba confidential
TC35667 SDK for Stand alone
TC356667 Software
development kit
PC UART for debug data
- Development tool - ARM Thumb C Compiler and ARM Thumb linker
- RVDS2.1 or IAR
JTAG for software debug
RealView debugger
Slide No. 17 Toshiba confidential
Low Power Consumption
BLE Single + NFC Tag Combo IC
TC35670
Slide No. 18 Toshiba confidential
TC35670 Block Diagram
Smooth Handover from NFC to BLE Support NFC pairing for easy connection setup
BLE Communication with NFC Pairing to Easy Connection Setup
Compliant with NFC forum Tag Specification NFC Typ3 TAG
212k/424kbps automatically selected
On-Chip EEPROM (1.5 KB) Data Storage Storing data, data transfer without host is available
Low Power NFC Tag Function Wait state current < 1 uA, Operation current < 1 mA
Wake Up from Zero-Current Standby Internal power supply realizes wake-up from zero-current standby at connection request from remote: battery-less operation
Peak Power Consumption: 5.9mA(Tx-4dBm)/5.7mA(Rx) Deep Sleep Current: 0. 1 uA
Under MP
BLE Single + NFC Tag IC: TC35670 Product Brief
Small Package: QFN40, 6 mm□, 0.5 mm Pitch Compatible with TC35667 (BLE single IC, no NFC tag)
Easy design shift to tag-less application available
BLE RF Block
LE Modem
ARM Processor
MaskROM
SRAM CLK Gen.
ADC
UART
I2C
DCDC
SPI
PWM
NFC Tag Logic
SRAM
I2C
NFC Tag Analog Block
EEPROM
GPIO
JTAG
Smartphone Tablet
Touch!
NFC Pairing
Accessories
Bluetooth®
NFC
Slide No. 19 Toshiba confidential
Execute command response from TAG
Polling (Including anti-collision), Authentication (Using 3DES),
Write EEPROM
Read EEPROM • Read the data written to the EEPROM in this mode
• Read the data written to the EEPROM in the mode (2)
To notify the host that is during communication. • RFDET and WAKE_UP
• Connection destination and Operation of the MPU is controlled
by the MPU side.
Communicate with a wired terminal (make external memory for the
HOST)
The start-up of this mode: PONB H → L
Write EEPROM
Read EEPROM • Read the data written to the EEPROM in this mode
• Read the data written to the EEPROM in the mode (1)
Communicate by using setting IF
The communication is performed through to MPU
Start communication is start from the Polling of (1).
Communicate via the RAM • The TAG completion of reception: READYB output H → L to the
HOST.
• Output data from the TAG
• Reply via the RF from the TAG at the time of the end of the reply
from the Host.
Logic
RFID
Block
MPU
EE
PROM
I/O
RA
M
Logic
RFID
Block
MPU
EE
PROM
I/O
RA
M
Logic
RFID
Block
MPU
EE
PROM
I/O
RA
M
TC35670 TAG Functions
(1) RF communication mode
(2) Wired communication mode
(3) Through mode
RFDET
PON
WAKEUP
RFDET
WAKEUP
Slide No. 20 Toshiba confidential
TC35670 & TMPM395FWAXBG Starter Kit
TC35670FTG Module board Pattern Antenna for BLE Size: 20×15mm□ 2layer PCB EEPROM(512kbit) Antenna for TAG
TMPM395FWAXBG
TMPM395FWAXBG as HostMCU (FlashROM:128kByte/RAM:8kByte)
Temperature sensor/Accelerator/Buzzer USB power supply/button battery Software development tool (IDE)
KEIL and IAR
The following materials are available. Circuit BOM list Operation manual Antenna characteristics Sample source code
Slide No. 21 Toshiba confidential
TC35670 SDK for Stand alone
TC35670 Software
development kit
PC UART for debug data
- Development tool - ARM Thumb C Compiler and ARM Thumb linker
- RVDS2.1 or IAR
JTAG for software debug
RealView debugger
TAG Board
BLE Board
Slide No. 22 Toshiba confidential
Bluetooth® SMART + NFC Tag
TC35670 Reference Model 1
※Bluetooth®SMARTおよびBluetooth®は、Bluetooth SIG Inc.の登録商標です。 ※ARM®はARM社のEUおよびその他の国における登録商標です。
※FeliCaは、ソニー株式会社の登録商標です。 ※FeliCaは、ソニー株式会社が開発した非接触ICカードの技術方式です。
※本製品は、ソニー株式会社からのFeliCa Lite-S技術ライセンスに基づいて製品化しています。
Stand alone 6 axis sensor EEPROM (512kbit) Coin battery (CR2032/2025) Case size: Φ30mm PCB size: Φ25mm, 4layers BLE chip antenna & NFC antenna
Slide No. 23 Toshiba confidential
TC35670 Reference Model 2 ~ Beacon~
TC35670FTG Beacon Reference Model Built-In MPU-6550(6axis-Sensor) Coin Battery(CR2032) Power Supply Case Size: 35mm(W) x 12mm(H) x 75mm(D) Built-In EEPROM(512kbit) Antenna for Bluetooth® and NFC-TAG
Beacon Reference Model Function Custom software implemented in EEPROM Wake up from NFC-TAG or 6axis-Sensor Modify Bluetooth® Parameter(e.g. Advertising Interval/Tx-Power) and Beacon ID(UUID/
Major/Minor/RSSI) from NFC-TAG Demonstration Summary
Stamp Rally Demo for Digital Singage Modify Beacon ID(UUID/Major/Minor/RSSI)
from Smart Phone
Coin
Battery TC35670
Module
NFC
Anntena
PCB Image(45.0mm x 28.9mm)
Figure of Case “FRISK case”
Main Board
Slide No. 24 Toshiba confidential
Bluetooth v4.0 Profile Supported IC
TC35661-xxx
TFBGA64-0505-0.5
Slide No. 25 Toshiba confidential
Bluetooth Core Spec. V4.0 compliant, EDR & LE supported
RF Block Class2 supported World wide Top level Sensitivity (-91dBm) On-chip Balun, ANT SW, LNA, etc
Baseband Block On-chip MaskROM, PatchRAM
Interface UART, SPI, I2C, I2S/PCM Support IEEE802.15.2 2/3/4 wire Coexistence
Low Power Consumption Data Transfer(DH5, UART=2Mbps): 30mA(typ.) Sleep: 30uA(max)
Input Frequency, Power Supply 13 to 52MHz(5points)/1.8V or 3.3V
Package FBGA64 5mm body, 0.5mm ball pitch FBGA64 7mm body, 0.8mm ball pitch
Bluetooth v4.0 IC:TC35661(Chiron) Product Brief
BT HCI:TC35661 Block Diagram
RF Block
EDR/LE Modem
FlashROM IF
ARM7 Processor
MaskROM
SRAM CLK Gen.
UART
PCM/I2S
I2C/SPI
GPIO
JTAG
WiFi Coex
Total Solution Provider
Toshiba provides Bluetooth IC and proven protocol stack&profiles
with various engineering service&support
Slide No. 26 Toshiba confidential
BT Processor
USB 2.0
EDR+LE
Modem
SRAM
RF Analog
for v4.0,EDR&LE
Host Processor
TMPM367FD (MCU) High-Performance, Low Power,
USB enabled MCU
TC35661 (Chiron)
1.2V LDO
ARM7TDMI
MaskROM I2S/PCM
I2C/SPI
SPI
UART
JTAG
Sleep CLK
UART
TX03 MCU+BT HCI(TC35661) Application Example
BT_WKUP
HP_WKUP Patch RAM
Bluetooth Module
26MHz OSC
1.8V
or 3.3V
ARM
Cortex-M3
I2C
SPI
UART
16bit Timer
USB 2.0
FS Device
GPIO
MPT
On-chip
Regulator
Flash ROM
SRAM
DMAC
RTC
ADC/DAC
8M
Hz
32
KH
z
2.7
V~
3.6
V
BT Stack/Profile
EEPROM
Provide BT+MCU kit solution with a few ext. components
Slide No. 27 Toshiba confidential
Bluetooth v4.0 compliant EDR & LE support
Class2 support RF Characteristics
Tx: +4dBm (@IC) Rx: -91dBm (typ.)
Antenna Pattern Antenna Chip Antenna
Others Provide various materials
Circuit diagram and Gerber data BOM list Antenna characteristics PC Application Software
Bluetooth v4.0:TC35661 2layer Reference PCB
Slide No. 28 Toshiba confidential
SBC
MP3
HCI ( Host Controller Interface)
L2CAP
AVDTP AVCTP
PBAP
Application
AVRCP
v1.4 GAVDP
A2DPv1.2
GOEP
RFCOMM
DUN
SIM
EC/NR
SRC
OPP
Bluetooth V3.0: TC35661 Stack & Profile
Sync
ML MAP
BNEP
PAN SPP
HFPv1.6
With AT cmd
Bluetooth Profile/Protocol
DID1.3
SDAP
HSP
SDP
HID
GAP
voice/Audio Middleware
Application
Slide No. 29 Toshiba confidential
UART Driver
Internal HCI
L2CAP
ATT
GAP
GATT
SMP Conn_update
Service database
Profile API or Profile Management Task
Bluetooth V4.0: TC35661 LE Stack & Profile
Bluetooth Profile/Protocol TOSHIBA can provide
Application/Profile Customer implement layer
Slide No. 30 Toshiba confidential
SPP (Serial Port Profile)
BR / EDR Low Energy
HID standalone (Human Interface Device)
GATT (Generic attribute Profile)
HCI (Host Controller interface)
HID+GATT (BR/LE dual support)
SPP standalone (Serial Port Profile)
TC35661SBG-007
MP: Jan/2013
TC35667
TC35661-102
ES: Available
TC35661-203
MP: Mar/2013
TC35661-xxx (Profile type): Software lineup
SPP+GATT (BR/LE dual support)
TC35661-700
ES: Available
TC35661-501
TC35661-6xx
Planning
SPP+HSP (Serial Port +
Head Set Profile(AG))
TC35661-800
Planning
Slide No. 31 Toshiba confidential
Under MP
System Example
TC35661-203
GPIO(Max. 15pin)
Mask ROM
Bluetooth Baseband
Profile(SPP)
UART
Host MCU
Application Program
LED
Host
Wake Up
Built-in Serial Port Profile(SPP) Easy development to Bluetooth products.
Supported High Throughput SPP data transfer bit rate >1.5Mbps
(@UART=3Mbps)
Supported GPIO interface for Host Host can control all GPIO.
Supported pulse out put for LED A variable periodic setup is possible.
Host Wake Up Function Host can go to sleep mode in Bluetooth Sniff mode.
Deep Sleep Function This device can use deep sleep function at long time interval connection like a sniff
mode. It realizes low power consumption.
SPP(Serial Port Profile) is connectable with the application of a smart phone. iPhone/Android phone etc.
Bluetooth Built-in SPP :TC35661-203
Slide No. 32 Toshiba confidential
Standalone System Built-in Serial Port Profile(SPP)
Easy development to Bluetooth products.
User RAM for custom program(13kByte) The system without a host MUC is realized.
Custom program is downloaded from
EEPROM(I2C) at the time of boot.
The UART command is customizable by
custom program.
Deep Sleep Function This device can use deep sleep function at long time interval connection like a sniff
mode. It realizes low power consumption.
ES Available
TC35661-700
EEPROM (128kbit)
Custom Program RAM (13kByte)
I2C
GPIO (Max.16pin)
Mask ROM
Bluetooth Baseband
Profile(SPP)
Host MCU + Bluetooth System
TC35661-700
EEPROM (128kbit)
Custom Program RAM (13kByte)
I2C
GPIO(Max. 12pin)
Mask ROM
Bluetooth Baseband
Profile(SPP)
UART
Host MCU
Application Program
Peripherals
Bluetooth Built-in SPP(Stand alone) :TC35661-700
Slide No. 33 Toshiba confidential
Standalone System(Mouse, Keyboard, …)
ES Available
TC35661-102
EEPROM (128kbit)
Custom Program RAM (12kByte)
I2C
GPIO (Max.16pin)
Mask ROM
Bluetooth Baseband
Profile(HID)
Host MCU + Bluetooth System
TC35661-102
EEPROM (128kbit)
Custom Program RAM (12kByte)
I2C
GPIO(Max. 12pin)
Mask ROM
Bluetooth Baseband
Profile(HID)
UART
Host MCU
Application Program
Peripherals
Bluetooth Built-in HID(Stand alone) :TC35661-102
Built-in HID(Human interface Device ) Profile
Easy development to Bluetooth products.
User RAM for custom program(12kByte) The system without a host MUC is realized.
Custom program is downloaded from EEPROM(I2C) at the time of boot.
The UART command is customizable by custom program.
Deep Sleep Function This device can use deep sleep function
at long time interval connection like a sniff
mode. It realizes low power consumption.
Slide No. 34 Toshiba confidential
Supported both BR and Low Energy(LE) Built-in both SPP(Serial Port Profile)for BR and GATT (Generic Attribute Profile) for
Low Energy.
Standby for BR/LE Connection Request Simultaneously
Host MCU can request both page scan and
advertising for connection establishment.
Supported GATT Client/Server function This device does not support “Central” role.
However this device supported both GATT Client and Server function.
Built-in GATT Server Database Supported auto reply function for service discovery request from remote device.
Deep Sleep Function This device can use deep sleep function at long time interval connection like a sniff
mode. It realizes low power consumption.
Bluetooth Built-in SPP+GATT :TC35661-501
System Example
TC35661-501
GPIO(Max. 15pin)
Mask ROM
Bluetooth Baseband
Profile(SPP)
UART
Host MCU
Application Program
Profile(GATT)
Under MP
Slide No. 35 Toshiba confidential
Low Power Consumption
BLE+NVM+Tag Combo IC
TC35675XBG
Slide No. 36 Toshiba confidential
TC35675 Block Diagram Ultra Low Power Consumption ・Peak current=6.0mA(Rx, SRAM code fetch) ・Deep Sleep current<0.1uA
Various Interfaces ・UART 1ch, SPI/I2C 1ch(selectable) ・10bit ADC: 3ch for ext. / 1ch for int.(VDD monitor) ・PWM 3ch(Beep, LED etc.) ・Ext. interrupt 12ch
Built-in 128KB Flash ROM For GATT protocol, BLE profile and User Application SW. Other information data can be also stored.
RF Block
LE Modem
ARM7TDMI
MaskROM
SRAM CLK Gen.
ADC
UART
I2C
GPIO
JTAG DCDC
SPI
PWM
Built-in DC-DC converter (1.8-3.6V input) Simplifies power supply circuit by wide range of input voltage.
Bluetooth Smart with internal Flash ROM and Ultra Low Power
Package: FBGA52, 4.5mm□, 0.5mm pitch Supports 2-layer PCB and reduces BOM cost.
Built-in NFC standard Tag Analog performance is improved compared with TC35670.
BLE+NVM+Tag IC:TC35675 Product Brief
Flash ROM
BLE Single LSI
TC3567xBLE
GATT Profile
Application SW
EEPROM
L
E
D
I2C
Keys
GPIO
(12pin max)
2
1
Display
26MHz
Battery
1 buzzer
Filter
NFC Tag Logic
SRAM
UART/SPI/I2C
NFC Tag
Analog
Block EEPROM
RF & Peripheral blocks are same as TC35670 BLE+NVM+Tag TC35675XBG
ES:Mar.2015, MP:Q2.2015
Slide No. 37 Toshiba confidential
Low Power Consumption
BLE+NVM IC
TC35676FTG/FSG
Slide No. 38 Toshiba confidential
TC35676/7 Block Diagram Ultra Low Power Consumption ・Peak current=6.0mA(Rx, SRAM code fetch) ・Deep Sleep current<0.1uA
Various Interfaces ・UART 1ch, SPI/I2C 1ch(selectable) ・10bit ADC: 3ch for ext. / 1ch for int.(VDD monitor) ・PWM 3ch(Beep, LED etc.) ・Ext. interrupt 12ch(676), 4ch(677)
Built-in 128KB Flash ROM For GATT protocol, BLE profile and User Application SW. Other information data can be also stored.
RF Block
LE Modem
ARM7TDMI
MaskROM
SRAM CLK Gen.
ADC
UART
I2C
GPIO
JTAG DCDC
SPI
PWM
Built-in DC-DC converter (1.8-3.6V input) Simplifies power supply circuit by wide range of input voltage.
Bluetooth Smart with internal Flash ROM and Ultra Low Power
Package: TC35676: QFN40, 6mm□, 0.5mm pitch
TC35677: QFN40, 5mm□, 0.4mm pitch Supports 2-layer PCB and reduces BOM cost.
BLE+NVM IC:TC35676FTG/FSG Product Brief
Flash ROM
BLE Single LSI
TC3567xBLE
GATT Profile
Application SW
EEPROM
L
E
D
I2C
Keys
GPIO
(12pin max)
2
1
Display
26MHz
Battery
1 buzzer
Filter
RF & Peripheral blocks are same as TC35667 BLE+NVM
TC35676FTG/FSG
ES:Feb.2015, MP:Q2.2015
Slide No. 39 Toshiba confidential
Bluetooth +DSP
TC35668IXBG
ES:available
Slide No. 40 Toshiba confidential
block diagram Bluetooth v4.0, EDR+LE support
All in one (Complete model) Support profile for Classic and low energy Variety of profile and Middleware Multipoint and Multi profile support
Built-in external parts Integrated ANT-SW, Balun, PA, LNA ES: available
MP: Aug/2015
Built in high-performance DSP. WBS (Wide Band Speech) +ECNR support SBC, MP3, AAC Codec support
Compact package PVFBGA97pin, 6mm□, 0.5mm Ball pitch
TC35668 (BTDSP) : Product Description
BT core (ARM7)
RF
EDR/LE Modem
ARM7
Mask ROM
SRAM
SYSTEM core (Cortex-M3)
UART/ I2C/SPI
I2S/PCM
SRAM
Cortex -M3
AUDIO core (DSP)
TeakLite-Ⅲ
SRAM
Trace UART
Boot ROM
AEC-Q100 Compliant by July
EV-board:
available
Slide No. 41 Toshiba confidential
BT+DSP
Audio core
BT core (ARM7)
ARM7
EDR/BLE
Modem
SRAM
RF Analog
UART
TeakLite-Ⅲ
GPIO
Quad Serial FlashROM
PLL
SPI
TraceUART
(RTS/CTS)
MROM
Trace UART
Debug IF PLL for I2S
UART
GPIO
32kHz
Filter
3.3V
PCM
CoEx
I2S/PCM
Wi-Fi Co-ex
SYSTEM core (Cortex-M3)
Cortex
-M3 SRAM
UART High Speed
SPI
I2C/SPI
UART
Data
Comm.
Wi-Fi Coex
I2S/PCM
SRAM
I2S/PCM (3ch)
1.2 V
Boot ROM
PLL for DSP & System
TC35668 (BTDSP) : Block diagram
HostCPU
XTAL
26MHz etc.
Slide No. 42 Toshiba confidential
HCI (Host Controller Interface)
L2CAP
AVCTP
P
B
A
P
Application and Profile for BLE
AVRCP
v1.5
GAVDP
A2DP
GOEP
D
U
N
S
I
M
O
P
P
TC35668 (BTDSP) : Supported Profile/Protocol
Syn
c M
L
M
A
P
BNEP
PAN SPP
×
2ch
HFPv1.6 With AT cmd
×2ch
mSBC
DID
SDAP
H
S
P
SDP
H
I
D
GAP
AVDTP RFCOMM
GATT
ATT
Serv
ice
Data
base
Co
nn
ectio
n
up
date
SMP
EC/NR
SRC
SBC
MP3
AAC
Classic BLE
2015/2Q
Phone Book
parser
File task
Slide No. 43 Toshiba confidential
Echo canceller by TOSHIBA
Slide No. 44 Toshiba confidential
TOSHIBA ECNR “TEKAPO”
Cellular Network
Far-end Near-end (vehicle side)
TEKAPO
Bluetooth
NAVI/Audio
Road Noise Echo from Speaker
Clear Voice
Echo Cancelling, Noise Reduction and Voice Enhancement
1. Natural Voice Quality, based on Accurate Algorithm Design.
2. High Performance Echo Reduction, Over 60dB.
3. Superior Noise Reduction, passed 3-QUEST test.
4. High Duplexity, Category 2a.
5. Low Algorithm Latency, 10ms in Narrowband and 24ms in Wideband.
Technical Features
TEKAPO – TEKAPO is an Software Echo Cancellation and Noise Reduction (ECNR) C library for Car Hands Free Terminal (HFT).
– Tested with VDA & ITU-T Car HFT specification. Available in both Narrowband(8kHz) and Wideband(16kHz) mode.
– TEKAPO originated in the Mobile ECNR deployed with Android Tablets and Laptop PC of Toshiba.
speaker microphone
Slide No. 45 Toshiba confidential
Continuous Brash-up iterations
Noise Reduction for Speech Recognition
ECNR for Hands Free Talk
TOSHIBA ECNR “TEKAPO”
2014 2015 2016 2017 2018
MP
1mic Solution
Multi-mic
Solution
Under Planning. 2015
Under Planning. 2016
Under Planning. 2016
Wide Band
Multi -mic
Narrow Band
NR for Server SR
NR for Standalone SR
End 2014
Roadmap
Library Specification – Fixed-point C callable library with API of ECNR frame processing.
– OS independent.
– Supported Core : ARM Cortex-A9 (w/NEON), CEVA TeakLite3(TC35668IXBG)
SWB 24k
32k
Early 2015 Under Planning. Mid 2016
Slide No. 46 Toshiba confidential
RESTRICTIONS ON PRODUCT USE
Toshiba Corporation, and its subsidiaries and affiliates (collectively “TOSHIBA”), reserve the right to make changes to the information in this document, and related hardware, software and systems (collectively “Product”) without notice.
This document and any information herein may not be reproduced without prior written permission from TOSHIBA. Even with TOSHIBA’s written permission, reproduction is permissible only if reproduction is without alteration/omission.
Though TOSHIBA works continually to improve Product’s quality and reliability, Product can malfunction or fail. Customers are responsible for complying with safety standards and for providing adequate designs and safeguards for their hardware, software and systems which minimize risk and avoid situations in which a malfunction or failure of Product could cause loss of human life, bodily injury or damage to property, including data loss or corruption. Before creating and producing designs and using, customers must also refer to and comply with (a) the latest versions of all relevant TOSHIBA information, including without limitation, this document, the specifications, the data sheets and application notes for Product and the precautions and conditions set forth in the “TOSHIBA Semiconductor Reliability Handbook” and (b) the instructions for the application that Product will be used with or for. Customers are solely responsible for all aspects of their own product design or applications, including but not limited to (a) determining the appropriateness of the use of this Product in such design or applications; (b) evaluating and determining the applicability of any information contained in this document, or in charts, diagrams, programs, algorithms, sample application circuits, or any other referenced documents; and (c) validating all operating parameters for such designs and applications. TOSHIBA ASSUMES NO LIABILITY FOR CUSTOMERS’ PRODUCT DESIGN OR APPLICATIONS.
Product is intended for use in general electronics applications (e.g., computers, personal equipment, office equipment, measuring equipment, industrial robots and home electronics appliances) or for specific applications as expressly stated in this document. Product is neither intended nor warranted for use in equipment or systems that require extraordinarily high levels of quality and/or reliability and/or a malfunction or failure of which may cause loss of human li fe, bodily injury, serious property damage or serious public impact (“Unintended Use”). Unintended Use includes, without limitation, equipment used in nuclear facilities, equipment used in the aerospace industry, medical equipment, equipment used for automobiles, trains, ships and other transportation, traffic signaling equipment, equipment used to control combustions or explosions, safety devices, elevators and escalators, devices related to electric power, and equipment used in finance-related fields. Do not use Product for Unintended Use unless specifically permitted in this document.
Do not disassemble, analyze, reverse-engineer, alter, modify, translate or copy Product, whether in whole or in part.
Product shall not be used for or incorporated into any products or systems whose manufacture, use, or sale is prohibited under any applicable laws or regulations.
The information contained herein is presented only as guidance for Product use. No responsibility is assumed by TOSHIBA for any infringement of patents or any other intellectual property rights of third parties that may result from the use of Product. No license to any intellectual property right is granted by this document, whether express or implied, by estoppel or otherwise.
ABSENT A WRITTEN SIGNED AGREEMENT, EXCEPT AS PROVIDED IN THE RELEVANT TERMS AND CONDITIONS OF SALE FOR PRODUCT, AND TO THE MAXIMUM EXTENT ALLOWABLE BY LAW, TOSHIBA (1) ASSUMES NO LIABILITY WHATSOEVER, INCLUDING WITHOUT LIMITATION, INDIRECT, CONSEQUENTIAL, SPECIAL, OR INCIDENTAL DAMAGES OR LOSS, INCLUDING WITHOUT LIMITATION, LOSS OF PROFITS, LOSS OF OPPORTUNITIES, BUSINESS INTERRUPTION AND LOSS OF DATA, AND (2) DISCLAIMS ANY AND ALL EXPRESS OR IMPLIED WARRANTIES AND CONDITIONS RELATED TO SALE, USE OF PRODUCT, OR INFORMATION, INCLUDING WARRANTIES OR CONDITIONS OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE, ACCURACY OF INFORMATION, OR NONINFRINGEMENT.
Do not use or otherwise make available Product or related software or technology for any military purposes, including without limitation, for the design, development, use, stockpiling or manufacturing of nuclear, chemical, or biological weapons or missile technology products (mass destruction weapons). Product and related software and technology may be controlled under the Japanese Foreign Exchange and Foreign Trade Law and the U.S. Export Administration Regulations. Export and re-export of Product or related software or technology are strictly prohibited except in compliance with all applicable export laws and regulations.
Please contact your TOSHIBA sales representative for details as to environmental matters such as the RoHS compatibility of Product. Please use Product in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances, including without limitation, the EU RoHS Directive. TOSHIBA assumes no liability for damages or losses occurring as a result of noncompliance with applicable laws and regulations.
Slide No. 47 Toshiba confidential