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TOPIC: XXXXXXXXXX REPORTER: John Chen AFFILIATION: Department of Power Mechanical Engineering, TPCA Email: [email protected] Paper Code: TW001-1 Date: Wed, Oct 23, 2013. Logo of Affiliation. OUTLINE. Logo of Affiliation. Subtitle. Content. Q & A. Logo of Affiliation. The End - PowerPoint PPT Presentation
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TOPIC: XXXXXXXXXXREPORTER: John ChenAFFILIATION: Department of Power
Mechanical Engineering, TPCA
Email: [email protected] Paper Code: TW001-1
Date: Wed, Oct 23, 2013
Logo of Affiliation
OUTLINE
1 INTRODUCTION2 XXXXXXX3 XXXXXXX4 XXXXXXX5 CONCLUSION6 QUESTION & ANSWER
Logo of Affiliation 2
Subtitle
• Content
Logo of Affiliation
4
5
The EndThank you for your listening!
IMPACT 2013Oct 22 (Tues) – 25 (Fri)
Taipei Nangang Exhibition Hall
6
Conference ProgramConference ProgramDay 1 - October 22 (Tuesday)
13:30-17:30 IAAC 2013 Opening & Meeting Day 2 - October 23 (Wednesday)
10:00-10:20 Opening of IMPACT 2013 10:20-11:10 Ricky Lee, President of the IEEE-CPMT Board, HK
Topic: From MOOREfication to LEDification 11:10-12:00 Dyi Chung Hu, Senior Vice President of Unimicron, Taiwan
Topic: The Challenges of IC Substrate in 3D Era 13:30-15:30 Panel Discussion- Sustainable Manufacture (b+c)
Topic: Designing Electronic Products for Sustainable ManufactureChair: Dr. Charles E. Bauer & Dr. Shen-Li Fu
15:30-15:45 Poster Session (PCB) / Coffee Break 15:45-18:00 【 1 】 Advanced
Packaging (SPIL)【 2 】 IAAC- Global Business Council
【 3 】 Advanced Packaging I
【 4 】 Advanced and Emerging Technology
18:00-20:00 TPCA Show & IMPACT-IAAC 2013 Joint Reception & Award Ceremony (3F) Day 3 - October 24 (Thursday)
09:30-10:20 Yasumitsu Orii, Senior Manager of IBM Japan, JPTopic: Next Generation Computer System for the Era of Big Data
10:30-12:30 【 5 】 ICEP Japan Session
【 6 】 3D Integration I 【 7 】 Thermal Management I
【 8 】 Modeling, Simulation & Design I
【 9 】 Green Materials & Process
13:30-14:20 K.W.Paik, Professor of Materials Sci. & Eng., KAIST, KRTopic: Recent Advances in Anisotropic Conductive Technology: Materials & Processing
14:30-17:30 【 10 】 3D IC Forum 【 11 】 Advanced Packaging II
【 12 】 Interconnections & Nanotechnology
【 13 】 Modeling, Simulation & Design II
【 14 】 Test & Quality
15:45-16:00 Poster Session (Packaging) / Coffee Break
18:30-20:30 IMPACT International Dinner (by invitations) @ Caesar Taipei Day 4 - October 25 (Friday)
09:30-10:20 Hamid R. Azimi, Director, Substrate & Die Embedding Technology Dept. of Intel, USATopic: Enabling Continuum Computing Thru Innovation in Packaging Substrate & Assembly
10:30-12:15 【 15 】 iNEMI Reliability Session
【 16 】 3D Integration II 【 17 】 LED & Thermal Management
【 18 】 Modeling, Simulation & Design III
【 19 】 HDI & Embedded
Oct. 4Oct. 4Early-Early-bird bird
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【 Registration 】 Jessie T:(03)3815659#406 E: [email protected] W:www.impact.org.tw
AppendixAppendix