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TOPIC: XXXXXXXXXX REPORTER: John Chen AFFILIATION: Department of Power Mechanical Engineering, TPCA Email: [email protected] Paper Code: TW001-1 Date: Wed, Oct 23, 2013 Logo of Affiliatio n

TOPIC: XXXXXXXXXX REPORTER: John Chen

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TOPIC: XXXXXXXXXX REPORTER: John Chen AFFILIATION: Department of Power Mechanical Engineering, TPCA Email: [email protected] Paper Code: TW001-1 Date: Wed, Oct 23, 2013. Logo of Affiliation. OUTLINE. Logo of Affiliation. Subtitle. Content. Q & A. Logo of Affiliation. The End - PowerPoint PPT Presentation

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Page 1: TOPIC:  XXXXXXXXXX REPORTER:  John Chen

TOPIC: XXXXXXXXXXREPORTER: John ChenAFFILIATION: Department of Power

Mechanical Engineering, TPCA

Email: [email protected] Paper Code: TW001-1

Date: Wed, Oct 23, 2013

Logo of Affiliation

Page 2: TOPIC:  XXXXXXXXXX REPORTER:  John Chen

OUTLINE

1 INTRODUCTION2 XXXXXXX3 XXXXXXX4 XXXXXXX5 CONCLUSION6 QUESTION & ANSWER

Logo of Affiliation 2

Page 3: TOPIC:  XXXXXXXXXX REPORTER:  John Chen

Subtitle

• Content

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Logo of Affiliation

4

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The EndThank you for your listening!

IMPACT 2013Oct 22 (Tues) – 25 (Fri)

Taipei Nangang Exhibition Hall

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Conference ProgramConference ProgramDay 1 - October 22 (Tuesday)

13:30-17:30 IAAC 2013 Opening & Meeting Day 2 - October 23 (Wednesday)

10:00-10:20 Opening of IMPACT 2013  10:20-11:10 Ricky Lee, President of the IEEE-CPMT Board, HK

Topic: From MOOREfication to LEDification  11:10-12:00 Dyi Chung Hu, Senior Vice President of Unimicron, Taiwan

Topic: The Challenges of IC Substrate in 3D Era  13:30-15:30 Panel Discussion- Sustainable Manufacture (b+c)

Topic: Designing Electronic Products for Sustainable ManufactureChair: Dr. Charles E. Bauer & Dr. Shen-Li Fu

 

15:30-15:45 Poster Session (PCB) / Coffee Break  15:45-18:00 【 1 】 Advanced

Packaging (SPIL)【 2 】 IAAC- Global Business Council

【 3 】 Advanced Packaging I

【 4 】 Advanced and Emerging Technology  

18:00-20:00 TPCA Show & IMPACT-IAAC 2013 Joint Reception & Award Ceremony (3F)  Day 3 - October 24 (Thursday)

09:30-10:20 Yasumitsu Orii, Senior Manager of IBM Japan, JPTopic: Next Generation Computer System for the Era of Big Data

10:30-12:30 【 5 】 ICEP Japan Session

【 6 】 3D Integration I 【 7 】 Thermal Management I

【 8 】 Modeling, Simulation & Design I

【 9 】 Green Materials & Process

13:30-14:20 K.W.Paik, Professor of Materials Sci. & Eng., KAIST, KRTopic: Recent Advances in Anisotropic Conductive Technology: Materials & Processing

14:30-17:30 【 10 】 3D IC Forum 【 11 】 Advanced Packaging II

【 12 】 Interconnections & Nanotechnology

【 13 】 Modeling, Simulation & Design II

【 14 】 Test & Quality

15:45-16:00 Poster Session (Packaging) / Coffee Break

18:30-20:30 IMPACT International Dinner (by invitations) @ Caesar Taipei Day 4 - October 25 (Friday)

09:30-10:20 Hamid R. Azimi, Director, Substrate & Die Embedding Technology Dept. of Intel, USATopic: Enabling Continuum Computing Thru Innovation in Packaging Substrate & Assembly

10:30-12:15 【 15 】 iNEMI Reliability Session

【 16 】 3D Integration II 【 17 】 LED & Thermal Management

【 18 】 Modeling, Simulation & Design III

【 19 】 HDI & Embedded

Oct. 4Oct. 4Early-Early-bird bird

DiscountDiscount

【 Registration 】 Jessie T:(03)3815659#406 E: [email protected] W:www.impact.org.tw

AppendixAppendix

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