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Tools for MEMS Simulation David Bindel UC Berkeley, CS Division Tools for MEMS Simulation – p.1/34

Tools for MEMS Simulation - Cornell Universitybindel/present/2005-03-citris.pdf · 2009. 1. 8. · Volume changes induce temperature change Diffusion of heat leads to mechanical loss

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Page 1: Tools for MEMS Simulation - Cornell Universitybindel/present/2005-03-citris.pdf · 2009. 1. 8. · Volume changes induce temperature change Diffusion of heat leads to mechanical loss

Tools for MEMS SimulationDavid Bindel

UC Berkeley, CS Division

Tools for MEMS Simulation – p.1/34

Page 2: Tools for MEMS Simulation - Cornell Universitybindel/present/2005-03-citris.pdf · 2009. 1. 8. · Volume changes induce temperature change Diffusion of heat leads to mechanical loss

Outline

Basic MEMS applications and ideas

The many roles of computation

Detailed examples: RF elementsCheckerboard filterDisk resonator

Conclusions

Tools for MEMS Simulation – p.2/34

Page 3: Tools for MEMS Simulation - Cornell Universitybindel/present/2005-03-citris.pdf · 2009. 1. 8. · Volume changes induce temperature change Diffusion of heat leads to mechanical loss

What are MEMS?

Tools for MEMS Simulation – p.3/34

Page 4: Tools for MEMS Simulation - Cornell Universitybindel/present/2005-03-citris.pdf · 2009. 1. 8. · Volume changes induce temperature change Diffusion of heat leads to mechanical loss

MEMS Basics

Micro-electro-mechanical systemsChemical, fluid, thermal, optical (MECFTOMS?)

Applications:Sensors (inertial, chemical, pressure)Ink jet printers, biolab chipsRF devices: cell phones, inventory tags, pico radio“Smart dust”

Use integrated circuit (IC) fabrication technology

Large surface area / volume ratio

Still mostly classical (vs. nanosystems)

Tools for MEMS Simulation – p.4/34

Page 5: Tools for MEMS Simulation - Cornell Universitybindel/present/2005-03-citris.pdf · 2009. 1. 8. · Volume changes induce temperature change Diffusion of heat leads to mechanical loss

Fabrication outline

300 um

1. Si wafer

Tools for MEMS Simulation – p.5/34

Page 6: Tools for MEMS Simulation - Cornell Universitybindel/present/2005-03-citris.pdf · 2009. 1. 8. · Volume changes induce temperature change Diffusion of heat leads to mechanical loss

Fabrication outline

300 um

2 um

1. Si wafer

2. Deposit 2 microns SiO2

Tools for MEMS Simulation – p.5/34

Page 7: Tools for MEMS Simulation - Cornell Universitybindel/present/2005-03-citris.pdf · 2009. 1. 8. · Volume changes induce temperature change Diffusion of heat leads to mechanical loss

Fabrication outline

300 um

2 um

1. Si wafer

2. Deposit 2 microns SiO2

3. Pattern and etch SiO2 layer

Tools for MEMS Simulation – p.5/34

Page 8: Tools for MEMS Simulation - Cornell Universitybindel/present/2005-03-citris.pdf · 2009. 1. 8. · Volume changes induce temperature change Diffusion of heat leads to mechanical loss

Fabrication outline

300 um

2 um

2 um

1. Si wafer

2. Deposit 2 microns SiO2

3. Pattern and etch SiO2 layer

4. Deposit 2 microns polycrystalline Si

Tools for MEMS Simulation – p.5/34

Page 9: Tools for MEMS Simulation - Cornell Universitybindel/present/2005-03-citris.pdf · 2009. 1. 8. · Volume changes induce temperature change Diffusion of heat leads to mechanical loss

Fabrication outline

300 um

2 um

2 um

1. Si wafer

2. Deposit 2 microns SiO2

3. Pattern and etch SiO2 layer

4. Deposit 2 microns polycrystalline Si

5. Pattern and etch Si layer

Tools for MEMS Simulation – p.5/34

Page 10: Tools for MEMS Simulation - Cornell Universitybindel/present/2005-03-citris.pdf · 2009. 1. 8. · Volume changes induce temperature change Diffusion of heat leads to mechanical loss

Fabrication outline

300 um

2 um

2 um

1. Si wafer

2. Deposit 2 microns SiO2

3. Pattern and etch SiO2 layer

4. Deposit 2 microns polycrystalline Si

5. Pattern and etch Si layer

6. Release etch remaining SiO2

Tools for MEMS Simulation – p.5/34

Page 11: Tools for MEMS Simulation - Cornell Universitybindel/present/2005-03-citris.pdf · 2009. 1. 8. · Volume changes induce temperature change Diffusion of heat leads to mechanical loss

Fabrication result

300 um

2 um

2 um

(C. Nguyen, iMEMS 01)

Tools for MEMS Simulation – p.6/34

Page 12: Tools for MEMS Simulation - Cornell Universitybindel/present/2005-03-citris.pdf · 2009. 1. 8. · Volume changes induce temperature change Diffusion of heat leads to mechanical loss

Fabrication characteristics

300 um

2 um

2 um

Characteristic dimensions: microns

Geometry is “2.5” dimensional

Relatively loose fabrication tolerances

Difficult to characterize

Tools for MEMS Simulation – p.7/34

Page 13: Tools for MEMS Simulation - Cornell Universitybindel/present/2005-03-citris.pdf · 2009. 1. 8. · Volume changes induce temperature change Diffusion of heat leads to mechanical loss

Why simulate?

“Build and break” is too expensiveWafer processing costs months, thousands of dollarsFabrication is impreciseDays or weeks to take good measurements

Good experiments need good hypotheses

Even when device behavior is understood, still need tounderstand system behavior

Tools for MEMS Simulation – p.8/34

Page 14: Tools for MEMS Simulation - Cornell Universitybindel/present/2005-03-citris.pdf · 2009. 1. 8. · Volume changes induce temperature change Diffusion of heat leads to mechanical loss

From simulation to synthesis

Computer can assist at many levels:

Fundamental physics

Detailed device models

System-level models and macromodels

Metrology

Design optimization

Design synthesis

Tools for MEMS Simulation – p.9/34

Page 15: Tools for MEMS Simulation - Cornell Universitybindel/present/2005-03-citris.pdf · 2009. 1. 8. · Volume changes induce temperature change Diffusion of heat leads to mechanical loss

Research thrusts

Model development (e.g. new finite elements)

Numerical algorithms (e.g. model reduction)

Numerical software engineering (SUGAR, HiQLab)

Metrology and comparison to measurement

Optimization and design synthesis

Tools for MEMS Simulation – p.10/34

Page 16: Tools for MEMS Simulation - Cornell Universitybindel/present/2005-03-citris.pdf · 2009. 1. 8. · Volume changes induce temperature change Diffusion of heat leads to mechanical loss

Research group

Faculty Students

A. Agogino (ME) D. Bindel (CS)Z. Bai (Math,CS,UCD) J.V. Clark (AS&T)J. Demmel (Math,CS) C. Cobb (ME)S. Govindjee (CEE) D. Garmire (CS)R. Howe (EE,ME) T. Koyama (CEE)K.S.J. Pister (EE) J. Nie (Math)C. Sequin (CS) H. Wei (CEE)

Y. Zhang (CEE)

Tools for MEMS Simulation – p.11/34

Page 17: Tools for MEMS Simulation - Cornell Universitybindel/present/2005-03-citris.pdf · 2009. 1. 8. · Volume changes induce temperature change Diffusion of heat leads to mechanical loss

SUGAR

Goal: “Be SPICE to the MEMS world”

Fast enough for early design stages

Simple enough to attract users

Support design, analysis, optimization, synthesis

Verify models by comparison to measurement

System assembly

Models

Solvers

Matlab Web Library

Sensitivity analysis

Static analysis

Steady−state analysis

Transient analysis

Results

Netlist

Interfaces

Tools for MEMS Simulation – p.12/34

Page 18: Tools for MEMS Simulation - Cornell Universitybindel/present/2005-03-citris.pdf · 2009. 1. 8. · Volume changes induce temperature change Diffusion of heat leads to mechanical loss

SUGAR: Analysis of a micromirror

(Mirror design by M. Last)

Tools for MEMS Simulation – p.13/34

Page 19: Tools for MEMS Simulation - Cornell Universitybindel/present/2005-03-citris.pdf · 2009. 1. 8. · Volume changes induce temperature change Diffusion of heat leads to mechanical loss

SUGAR: Design synthesis

Tools for MEMS Simulation – p.14/34

Page 20: Tools for MEMS Simulation - Cornell Universitybindel/present/2005-03-citris.pdf · 2009. 1. 8. · Volume changes induce temperature change Diffusion of heat leads to mechanical loss

SUGAR: Comparison to measurement

Tools for MEMS Simulation – p.15/34

Page 21: Tools for MEMS Simulation - Cornell Universitybindel/present/2005-03-citris.pdf · 2009. 1. 8. · Volume changes induce temperature change Diffusion of heat leads to mechanical loss

RF resonators

Microguitars from Cornell University (1997 and 2003)

Frequency references

Sensing elements

Filter elements

Neural networks

Really high-pitch guitars

Tools for MEMS Simulation – p.16/34

Page 22: Tools for MEMS Simulation - Cornell Universitybindel/present/2005-03-citris.pdf · 2009. 1. 8. · Volume changes induce temperature change Diffusion of heat leads to mechanical loss

Micromechanical filters

Mechanical filter

Capacitive senseCapacitive drive

Radio signal

Filtered signal

Mechanical high-frequency (high MHz-GHz) filter

Saves power and cost over electronic filters

Advantage over piezo-actuated quartz SAW filtersIntegrated into chipLow power

Tools for MEMS Simulation – p.17/34

Page 23: Tools for MEMS Simulation - Cornell Universitybindel/present/2005-03-citris.pdf · 2009. 1. 8. · Volume changes induce temperature change Diffusion of heat leads to mechanical loss

Governing equations

Time domain:

Mu′′ + Cu′ + Ku = Pφ

y = V T u

Frequency domain:

H(ω) = V T (−ω2M + iωC + K)−1P

y = Hφ

0.5 0.6 0.7 0.8 0.9 1 1.1 1.2 1.3 1.4 1.510

−4

10−2

100

102

104

106

108

Tools for MEMS Simulation – p.18/34

Page 24: Tools for MEMS Simulation - Cornell Universitybindel/present/2005-03-citris.pdf · 2009. 1. 8. · Volume changes induce temperature change Diffusion of heat leads to mechanical loss

First proposed design: Checkerboard

� � � � � � � � � � � � � � �� � � � � � � � � � � � � � �� � � � � � � � � � � � � � �� � � � � � � � � � � � � � �� � � � � � � � � � � � � � �� � � � � � � � � � � � � � �� � � � � � � � � � � � � � �� � � � � � � � � � � � � � �� � � � � � � � � � � � � � �� � � � � � � � � � � � � � �� � � � � � � � � � � � � � �� � � � � � � � � � � � � � �� � � � � � � � � � � � � � �� � � � � � � � � � � � � � �� � � � � � � � � � � � � � �� � � � � � � � � � � � � � �� � � � � � � � � � � � � � �� � � � � � � � � � � � � � �� � � � � � � � � � � � � � �� � � � � � � � � � � � � � �� � � � � � � � � � � � � � �� � � � � � � � � � � � � � �� � � � � � � � � � � � � � �� � � � � � � � � � � � � � �� � � � � � � � � � � � � � �� � � � � � � � � � � � � � �� � � � � � � � � � � � � � �� � � � � � � � � � � � � � �� � � � � � � � � � � � � � �

� � � � � � � � � � � � � �� � � � � � � � � � � � � �� � � � � � � � � � � � � �� � � � � � � � � � � � � �� � � � � � � � � � � � � �� � � � � � � � � � � � � �� � � � � � � � � � � � � �� � � � � � � � � � � � � �� � � � � � � � � � � � � �� � � � � � � � � � � � � �� � � � � � � � � � � � � �� � � � � � � � � � � � � �� � � � � � � � � � � � � �� � � � � � � � � � � � � �� � � � � � � � � � � � � �� � � � � � � � � � � � � �� � � � � � � � � � � � � �� � � � � � � � � � � � � �� � � � � � � � � � � � � �� � � � � � � � � � � � � �� � � � � � � � � � � � � �� � � � � � � � � � � � � �� � � � � � � � � � � � � �� � � � � � � � � � � � � �� � � � � � � � � � � � � �� � � � � � � � � � � � � �� � � � � � � � � � � � � �� � � � � � � � � � � � � �� � � � � � � � � � � � � �

����

����

� �� �� �� ����

� �� �� �

�����

� �� � � �� �� �� �� �� �� �� �� �

� �� � � �� �

D+

D−

D+

D−

S+ S+

S−

S−

Array of loosely coupled resonators

Anchored at outside corners

Excited at northwest corner

Sensed at southeast corner

Surfaces move only a few nanometers

Tools for MEMS Simulation – p.19/34

Page 25: Tools for MEMS Simulation - Cornell Universitybindel/present/2005-03-citris.pdf · 2009. 1. 8. · Volume changes induce temperature change Diffusion of heat leads to mechanical loss

Design questions

−8 −6 −4 −2 0 2 4 6 8

x 10−5

−8

−6

−4

−2

0

2

4

6

8x 10−5

−8 −6 −4 −2 0 2 4 6 8

x 10−5

−8

−6

−4

−2

0

2

4

6

8x 10−5

Where should drive and sense be placed?

How should the individual resonators be connected?

How should the system be anchored?

How many components? What topology?

Tools for MEMS Simulation – p.20/34

Page 26: Tools for MEMS Simulation - Cornell Universitybindel/present/2005-03-citris.pdf · 2009. 1. 8. · Volume changes induce temperature change Diffusion of heat leads to mechanical loss

Checkerboard response

95 MHz 100 MHz

Tools for MEMS Simulation – p.21/34

Page 27: Tools for MEMS Simulation - Cornell Universitybindel/present/2005-03-citris.pdf · 2009. 1. 8. · Volume changes induce temperature change Diffusion of heat leads to mechanical loss

Interactive visualization

0 2 4 6 8 10

x 10−5

0

2

4

6

8

10

12

x 10

9 9.2 9.4 9.6 9.8

x 107

−200

−180

−160

−140

−120

−100

Frequency (Hz)

Am

plitu

de (

dB)

9 9.2 9.4 9.6 9.8

x 107

0

1

2

3

4

Frequency (Hz)

Pha

se (

rad)

Tools for MEMS Simulation – p.22/34

Page 28: Tools for MEMS Simulation - Cornell Universitybindel/present/2005-03-citris.pdf · 2009. 1. 8. · Volume changes induce temperature change Diffusion of heat leads to mechanical loss

Disk resonator model

� � � � � � � � � � � � �� � � � � � � � � � � � �� � � � � � � � � � � � �� � � � � � � � � � � � �� � � � � � � � � � � � �� � � � � � � � � � � � �� � � � � � � � � � � � �

� � � � � � � � � � � � �� � � � � � � � � � � � �� � � � � � � � � � � � �� � � � � � � � � � � � �� � � � � � � � � � � � �� � � � � � � � � � � � �

WaferV−

V+V+

PML region

DiskElectrode

SiGe disk resonators built by E. Quévy

Tools for MEMS Simulation – p.23/34

Page 29: Tools for MEMS Simulation - Cornell Universitybindel/present/2005-03-citris.pdf · 2009. 1. 8. · Volume changes induce temperature change Diffusion of heat leads to mechanical loss

Sources of damping

Fluid dampingAir is a viscous fluid (Re � 1)Can operate in a vacuumShown not to dominate in many RF designs

Anchor lossElastic waves radiate from structure

Thermoelastic dampingVolume changes induce temperature changeDiffusion of heat leads to mechanical loss

Material losses (catch-all)Low intrinsic losses in silicon, diamond, germaniumTerrible material losses in metals

Tools for MEMS Simulation – p.24/34

Page 30: Tools for MEMS Simulation - Cornell Universitybindel/present/2005-03-citris.pdf · 2009. 1. 8. · Volume changes induce temperature change Diffusion of heat leads to mechanical loss

Sources of damping

Fluid dampingAir is a viscous fluid (Re � 1)Can operate in a vacuumShown not to dominate in many RF designs

Anchor lossElastic waves radiate from structure

Thermoelastic dampingVolume changes induce temperature changeDiffusion of heat leads to mechanical loss

Material losses (catch-all)Low intrinsic losses in silicon, diamond, germaniumTerrible material losses in metals

Tools for MEMS Simulation – p.24/34

Page 31: Tools for MEMS Simulation - Cornell Universitybindel/present/2005-03-citris.pdf · 2009. 1. 8. · Volume changes induce temperature change Diffusion of heat leads to mechanical loss

Substrate model

Goal: Understand energy loss in this resonator

Dominant loss is elastic radiation from anchor.

Disk resonator is much smaller than substrate

Very little energy leaving the post is reflected backSubstrate is semi-infinite from disk’s perspective

Possible semi-infinite modelsMatched asymptotic modesDirichlet-to-Neumann mapsBoundary dampersPerfectly matched layers

Tools for MEMS Simulation – p.25/34

Page 32: Tools for MEMS Simulation - Cornell Universitybindel/present/2005-03-citris.pdf · 2009. 1. 8. · Volume changes induce temperature change Diffusion of heat leads to mechanical loss

Perfectly matched layers

Apply a complex coordinate transformation

Generates a non-physical absorbing layer

No impedance mismatch between the computationaldomain and the absorbing layer

Idea works with general linear wave equationsFirst applied to Maxwell’s equations (Berengér 95)Similar idea introduced earlier in quantummechanics (exterior complex scaling, Simon 79)

Tools for MEMS Simulation – p.26/34

Page 33: Tools for MEMS Simulation - Cornell Universitybindel/present/2005-03-citris.pdf · 2009. 1. 8. · Volume changes induce temperature change Diffusion of heat leads to mechanical loss

Scalar wave example

0 5 10 15 20−1

−0.5

0

0.5

1Outgoing wave exp(−iz)

0 5 10 15 20−1

−0.5

0

0.5

1Incoming wave exp(iz)

0 2 4 6 8 10 12 14 16 18−5

−4

−3

−2

−1

0Transformed coordinate z = x + iy

Tools for MEMS Simulation – p.27/34

Page 34: Tools for MEMS Simulation - Cornell Universitybindel/present/2005-03-citris.pdf · 2009. 1. 8. · Volume changes induce temperature change Diffusion of heat leads to mechanical loss

Scalar wave example

0 5 10 15 20−1

−0.5

0

0.5

1Outgoing wave exp(−iz)

0 5 10 15 20−2

−1

0

1

2

3Incoming wave exp(iz)

0 2 4 6 8 10 12 14 16 18−5

−4

−3

−2

−1

0Transformed coordinate z = x + iy

Tools for MEMS Simulation – p.27/34

Page 35: Tools for MEMS Simulation - Cornell Universitybindel/present/2005-03-citris.pdf · 2009. 1. 8. · Volume changes induce temperature change Diffusion of heat leads to mechanical loss

Scalar wave example

0 5 10 15 20−1

−0.5

0

0.5

1Outgoing wave exp(−iz)

0 5 10 15 20−4

−2

0

2

4

6Incoming wave exp(iz)

0 2 4 6 8 10 12 14 16 18−5

−4

−3

−2

−1

0Transformed coordinate z = x + iy

Tools for MEMS Simulation – p.27/34

Page 36: Tools for MEMS Simulation - Cornell Universitybindel/present/2005-03-citris.pdf · 2009. 1. 8. · Volume changes induce temperature change Diffusion of heat leads to mechanical loss

Scalar wave example

0 5 10 15 20−1

−0.5

0

0.5

1Outgoing wave exp(−iz)

0 5 10 15 20−10

−5

0

5

10

15Incoming wave exp(iz)

0 2 4 6 8 10 12 14 16 18−5

−4

−3

−2

−1

0Transformed coordinate z = x + iy

Tools for MEMS Simulation – p.27/34

Page 37: Tools for MEMS Simulation - Cornell Universitybindel/present/2005-03-citris.pdf · 2009. 1. 8. · Volume changes induce temperature change Diffusion of heat leads to mechanical loss

Scalar wave example

0 5 10 15 20−1

−0.5

0

0.5

1Outgoing wave exp(−iz)

0 5 10 15 20−20

−10

0

10

20

30

40Incoming wave exp(iz)

0 2 4 6 8 10 12 14 16 18−5

−4

−3

−2

−1

0Transformed coordinate z = x + iy

Tools for MEMS Simulation – p.27/34

Page 38: Tools for MEMS Simulation - Cornell Universitybindel/present/2005-03-citris.pdf · 2009. 1. 8. · Volume changes induce temperature change Diffusion of heat leads to mechanical loss

Scalar wave example

0 5 10 15 20−1

−0.5

0

0.5

1Outgoing wave exp(−iz)

0 5 10 15 20−40

−20

0

20

40

60

80

100Incoming wave exp(iz)

0 2 4 6 8 10 12 14 16 18−5

−4

−3

−2

−1

0Transformed coordinate z = x + iy

Clamp solution at transformed end to isolate outgoing wave.

Tools for MEMS Simulation – p.27/34

Page 39: Tools for MEMS Simulation - Cornell Universitybindel/present/2005-03-citris.pdf · 2009. 1. 8. · Volume changes induce temperature change Diffusion of heat leads to mechanical loss

Disk resonator mesh

� � � � � � � � � � � � �� � � � � � � � � � � � �� � � � � � � � � � � � �� � � � � � � � � � � � �� � � � � � � � � � � � �� � � � � � � � � � � � �� � � � � � � � � � � � �

� � � � � � � � � � � � �� � � � � � � � � � � � �� � � � � � � � � � � � �� � � � � � � � � � � � �� � � � � � � � � � � � �� � � � � � � � � � � � �

WaferV−

V+V+

PML region

DiskElectrode

0 1 2 3 4

x 10−5

−4

−2

0

2x 10

−6

Axisymmetric model with bicubic mesh

About 10K nodal points in converged calculation

Tools for MEMS Simulation – p.28/34

Page 40: Tools for MEMS Simulation - Cornell Universitybindel/present/2005-03-citris.pdf · 2009. 1. 8. · Volume changes induce temperature change Diffusion of heat leads to mechanical loss

Response of the disk resonator

Tools for MEMS Simulation – p.29/34

Page 41: Tools for MEMS Simulation - Cornell Universitybindel/present/2005-03-citris.pdf · 2009. 1. 8. · Volume changes induce temperature change Diffusion of heat leads to mechanical loss

Time-averaged energy flux

0 0.5 1 1.5 2 2.5 3 3.5

x 10−5

−2

0

2

x 10−6

0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5

x 10−6

−1

−0.5

0

0.5

1

1.5

2

2.5x 10

−6

Tools for MEMS Simulation – p.30/34

Page 42: Tools for MEMS Simulation - Cornell Universitybindel/present/2005-03-citris.pdf · 2009. 1. 8. · Volume changes induce temperature change Diffusion of heat leads to mechanical loss

Q variation

1.2 1.3 1.4 1.5 1.6 1.7 1.810

0

102

104

106

108

Film thickness (µm)

Q

Compute complex frequencies by shift-and-invertArnoldi with an analytically determined shift

Surprising variation – experimentally observed – in Q

as film thickness changes!

Tools for MEMS Simulation – p.31/34

Page 43: Tools for MEMS Simulation - Cornell Universitybindel/present/2005-03-citris.pdf · 2009. 1. 8. · Volume changes induce temperature change Diffusion of heat leads to mechanical loss

Effect of varying film thickness

46 46.5 47 47.5 480

0.05

0.1

0.15

0.2

0.25

Real frequency (MHz)

Imag

inar

y fr

eque

ncy

(MH

z)

ab

cd

e

a bc

d

e

a = 1.51µmb = 1.52µmc = 1.53µmd = 1.54µmd = 1.55µm

Sudden dip in Q comes from an interaction between a(mostly) bending mode and a (mostly) radial mode

Non-normal interaction between the modes

Tools for MEMS Simulation – p.32/34

Page 44: Tools for MEMS Simulation - Cornell Universitybindel/present/2005-03-citris.pdf · 2009. 1. 8. · Volume changes induce temperature change Diffusion of heat leads to mechanical loss

Truth in advertising

1.2 1.3 1.4 1.5 1.6 1.7 1.810

0

102

104

106

108

1010

Film thickness (µm)

Q

Data from a set of 30µm radius disks.

Tools for MEMS Simulation – p.33/34

Page 45: Tools for MEMS Simulation - Cornell Universitybindel/present/2005-03-citris.pdf · 2009. 1. 8. · Volume changes induce temperature change Diffusion of heat leads to mechanical loss

Conclusions

Simulation tools are good for MEMS designersReduce expensive “build-and-break” designReveal behavior that is hard to measure directly

MEMS problems are good for tool designersInteresting physics (and not altogether understood)Interesting numerical mathematics

Tools for MEMS Simulation – p.34/34