4
1. GATE 2. DRAIN 3. SOURCE GENERAL DESCRIPTION The CJP50P06S uses advanced trench technology and design to provide excellent R DS(on) with low gate charge. It can be used in a wide variety of applications. FEATURE Advanced trench process technology Reliable and rugged High density cell design for ultra low On-Resistance APPLICATION Power management in notebook computer Portable equipment and battery powered systems EQUIVALENT CIRCUIT V (BR)DSS R DS(on) TYP I D -60V -50A 25mΩ@-10V 1 Rev. - 1.0 www.jscj-elec.com MARKING P50P06S = Device code Solid dot = Green molding compound device, if none, the normal device XXXX = Code MAXIMUM RATINGS ( T a =25unless otherwise noted ) Parameter Symbol Limit Unit Drain-Source Voltage VDS -60 V Gate-Source Voltage VGS ±20 V Continuous Drain Current ID -50 A Pulsed Drain Current IDM -200 A Single Pulsed Avalanche Energy EAS 196 mJ Power Dissipation PD W Thermal Resistance from Junction to Ambient RθJA 62.5 /W Thermal Resistance from Junction to Case RθJC /W Operating Junction and Storage Temperature Range -55~+150 TJ ,Tstg 95 1.31 3 1 2 TO-220-3L-C P50P06S XXXX 1 2 3 TO-220-3L-C Plastic-Encapsulate MOSFETS CJP50P06S P-Channel Power MOSFET JIANGSU CHANGJING ELECTRONICS TECHNOLOGY CO., LTD

TO-220-3L-C Plastic-Encapsulate MOSFETS 50P06S

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Page 1: TO-220-3L-C Plastic-Encapsulate MOSFETS 50P06S

1. GATE2. DRAIN3. SOURCE

GENERAL DESCRIPTION The CJP50P06S uses advanced trench technology and design to provide excellent RDS(on) with low gate charge. It can be used in a wide variety of applications.

FEATURE Advanced trench process technology

Reliable and rugged

High density cell design for ultra low On-Resistance

APPLICATION Power management in notebook computer

Portable equipment and battery powered systems

EQUIVALENT CIRCUIT

V(BR)DSS RDS(on)TYP ID -60V -50A25mΩ@-10V

1 Rev. - 1.0www.jscj-elec.com

MARKING

P50P06S = Device code Solid dot = Green molding compound device, if none, the normal deviceXXXX = Code

MAXIMUM RATINGS ( Ta=25 unless otherwise noted )

Parameter Symbol Limit Unit Drain-Source Voltage VDS -60 V

Gate-Source Voltage VGS ±20 V

Continuous Drain Current ID -50 A

Pulsed Drain Current IDM -200 A

Single Pulsed Avalanche Energy EAS 196 mJ

Power Dissipation PD W

Thermal Resistance from Junction to Ambient RθJA 62.5 /W

Thermal Resistance from Junction to Case RθJC /W

Operating Junction and Storage Temperature Range

②③

-55~+150TJ ,Tstg

95

1.31

31 2

TO-220-3L-C

P50P06SXXXX

1 2 3

TO-220-3L-C Plastic-Encapsulate MOSFETS

CJP50P06S P-Channel Power MOSFET

JIANGSU CHANGJING ELECTRONICS TECHNOLOGY CO., LTD

Page 2: TO-220-3L-C Plastic-Encapsulate MOSFETS 50P06S

2www.jscj-elec.com Rev. - 1.0

Parameter Symbol Test Condition Min Typ Max Unit

Off characteristics

Drain-source breakdown voltage V(BR) DSS VGS = 0V, ID =-250µA -60 V

Zero gate voltage drain current IDSS VDS =-48V,VGS =0V

1.0

Gate-body leakage current IGSS VDS =0V, VGS =±20V ±100 nA

On characteristics

Gate-threshold voltage VGS(th) VDS =VGS, ID =-250µA -1.0 -2.2 -3.0 V

VGS =-10V, ID =-20A 25 mΩStatic drain-source on-sate resistance RDS(on)

Dynamic characteristics

Input capacitance Ciss 4500

Output capacitance Coss 705

Reverse transfer capacitance Crss

VDS =-25V,VGS =0V,

f =1MHz pF

Switching characteristics

Total gate charge Qg

Gate-source charge Qgs

Gate-drain charge Qgd

VGS=-10V,

VDS=-30V, ID=-20A nC

Turn-on delay time td(on)

Turn-on rise time tr

Turn-off delay time td(off)

Turn-off fall time tf

ns

Drain-Source Diode Characteristics

Drain-source diode forward voltage VSD VGS =0V, IS=-20A -1.2 V

Continuous drain-source diode forward

current IS -50 A

Pulsed drain-source diode forward current ISM -200 A

Notes:

MOSFET ELECTRICAL CHARACTERISTICS aT =25 unless otherwise specified

30

100 µA

TJ =25

TJ =125

④⑤

④⑤

VDD=-30V,RG=3Ω

RL=1.5Ω,VGS=-10V,

Rg f =1MHz Ω Gate resistance 5.7

515

72

15

17

16

18

39

44

7500

980

760

130

29

32

30

35

78

87

1.TC=25 Limited only by maximum temperature allowed.2.PW≤10μs, Duty cycle≤1%.3.EAS condition: VDD=-15V,VGS=-10V, L=0.5mH, Rg=25Ω Starting TJ = 25°.4.Pulse Test : Pulse Width≤300µs, duty cycle ≤2%.5.Guaranteed by design, not subject to production.

Page 3: TO-220-3L-C Plastic-Encapsulate MOSFETS 50P06S

0 -1 -2 -3 -4 -5 -6 -7 -80

-10

-20

-30

-40

-50

25 50 75 100 1250

-1

-2

-3

-4

0 -2 -4 -6 -8 -10 -12 -140

20

40

60

80

100

-5 -10 -15 -205

10

15

20

25

30

35

40

0 -1 -2 -3 -4 -50

-10

-20

-30

-40

-50

TJ=25

DR

AIN

CU

RR

ENT

I D

(A

)

GATE TO SOURCE VOLTAGE VGS (V)

Transfer Characteristics

VDS=-15VPulsed

Threshold Voltage

THR

ESH

OLD

VO

LTAG

E

V TH

(V)

JUNCTION TEMPERATURE TJ ( )

TJ=25Pulsed

TJ=125

TJ=25

RDS(ON)

—— VGS

ON

-RES

ISTA

NC

E

RD

S(O

N)

(m

)

GATE TO SOURCE VOLTAGE VGS (V)

PulsedID=-20ATJ=25

Pulsed

ON

-RES

ISTA

NC

E

RD

S(O

N)

(m

)

DRAIN CURRENT ID (A)

ID

——RDS(ON)

VGS= -10V

VGS=-10V,-8V,-6V

VGS=-4V

VGS=-3.5V

Output Characteristics

DR

AIN

CU

RR

ENT

I D

(A

)

DRAIN TO SOURCE VOLTAGE VDS (V)

TJ=25Pulsed

TJ=125

-3

TJ=25

Pulsed

-10

-1

-0.1

-50

-1 -2

-15

-0.1

VSD

SOU

RC

E C

UR

REN

T

I S (A

)

SOURCE TO DRAIN VOLTAGE VSD (V)

IS ——

Typical Characteristics

3www.jscj-elec.com Rev. - 1.0

Page 4: TO-220-3L-C Plastic-Encapsulate MOSFETS 50P06S

4 Rev. - 1.0www.jscj-elec.com

TO-220-3L-C Package Outline Dimensions

Min. Max. Min. Max.A 4.400 4.600 0.173 0.181

A1 2.250 2.550 0.089 0.100b 0.710 0.910 0.028 0.036

b1 1.170 1.370 0.046 0.054c 0.330 0.650 0.013 0.026c1 1.200 1.400 0.047 0.055D 9.910 10.250 0.390 0.404E 8.950 9.750 0.352 0.384

E1 12.650 12.950 0.498 0.510e

e1 4.980 5.180 0.196 0.204F 2.650 2.950 0.104 0.116H 7.900 8.100 0.311 0.319h 0.000 0.300 0.000 0.012L 12.900 13.400 0.508 0.528

L1 2.850 3.250 0.112 0.128VΦ 3.400 3.800 0.134 0.150

7.500 REF. 0.295 REF.

Symbol Dimensions In Millimeters Dimensions In Inches

0.100 TYP.2.540 TYP.