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Technical NoteLand Pad Design for NOR Flash Memories
IntroductionThis document provides high-level information on Micron's NOR Flash memory pack-ages and their suggested PCB land patterns. For additional information and assistancefor any manufacturability issues, contact your Micron representative or log on towww.micron.com.
Package Outlines and Suggested Land Pattern Designs
The following sections contain detailed mechanical descriptions of Micron's NOR Flashpackages and the related suggested PCB land pattern designs. The suggested land pat-tern (mm) designs were developed using Mentor's PCB Matrix Calculator software,which is based on the IPC-7351B standard. For additional information refer to the NORFlash section of Micron's website.
Figure 1: Key Land Pattern Sizes Definitions (from IPC-7351B)
L
T
L
G
Z
S
S = L - 2 T
0.05“N” places
Manufacturer's dimensions andtolerances converted to profiledimensions, with S at maximummaterial condition.
If S is not provided by the componentmanufacturer, it may be determined bysubtracting T terminal dimensionsfrom the length.
Manufacturing dimensions of SOICs.
MMC
MMC MMC LMC
Fabrication toleranceequals 0.1mm.
There are many options available to determine the tolerances for each component. TheIPC-7351B formulas for calculating the ZMAX distance are shown below (based on theRMS method).
TN-12-25: NOR Land Pad DesignIntroduction
PDF: 09005aef8503ed82tn1225_land_pad_design.pdf - Rev. A 10/13 EN 1 Micron Technology, Inc. reserves the right to change products or specifications without notice.
© 2012 Micron Technology, Inc. All rights reserved.
Products and specifications discussed herein are for evaluation and reference purposes only and are subject to change byMicron without notice. Products are only warranted by Micron to meet Micron's production data sheet specifications. All
information discussed herein is provided on an "as is" basis, without warranties of any kind.
ZMAX = LMIN + 2JT + CL2 + F2 + P2
GMIN = SMAX - 2JH - CS2 + F2 + P2
XMAX = WMIN + 2JS + CW2 + F2 + P2
Where:
ZMAX = overall length of land patternGMIN = minimum distance between land of the patternXMAX = maximum width of the patternSMAX = maximum distance among component terminationWMIN = minimum width of the leadLMIN = minimum distance of the component lengthJT = toe joint dimensionCL = tolerance for component lengthF = fabrication toleranceP = positioning toleranceJH = solder fillet or land protrusion at heelCS = tolerance on distance between component terminationsCW = tolerance on the lead width
Table 1: Tolerance Definitions (from IPC-7351b)
Tolerance Element Description
Compound tolerance The difference of maximum material condition (MMC) and least material condition (LMC) ofeach component dimension length, width, and distance between terminations or leads. Thisnumber is the "C" tolerance in the equations.
Printed board tolerance The difference of MMC and LMC of each land pattern dimension length. This number is the"F" tolerance in the equations.
Positional accuracy The diameter of true position (DTP). This is the variation of the part centroid related to theland pattern theoretical center (includes feature location tolerance from Table 2.
All tolerances for lands are intended to provide a projected land pattern with individuallands at maximum size, while unilateral tolerance will result in a smaller area for solderjoint formation. Land patterns are within these outer and inner extremities.
The LPW tool uses the distance between pin centers ("C" as shown in the land patternfigures) instead of the distance between the pin ends (Z). This is the way most of toolsused in the industry manage that dimension.
Some rounding off of values occurs, which is controlled by the calculator settings tab.These settings should be reviewed and set to meet the user's fabrication and assemblybest practices for their industry and their fabrication/assembly technology. The toleran-ces shown below have been used in all of the land pattern calculations that follow inthis document.
Table 2: Applied Tolerances
Tolerance Element Tolerance (mm)
Land-to-land MIN 0.20
TN-12-25: NOR Land Pad DesignIntroduction
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Table 2: Applied Tolerances (Continued)
Tolerance Element Tolerance (mm)
Silkscreen to Land MIN 0.25
Solder mask web MIN 0.075
Fabrication 0.05
Placement 0.05
Land place round-off (C) 0.10
Land size round-off 0.05
Definitions of the areas and dimensions provided in this document:
• Land pattern: The combinations of lands used for the mounting of a particular com-ponent.
• Courtyard: The smallest rectangular area that provides a minimum electrical and me-chanical clearance around the combined component body and land pattern bounda-ries.
• Silkscreen: The printed area of the position where the component body will beplaced, in relation to the orientation indicator.
• Assembly area: Maximum area allowed for component body mounting on the PCB.
TN-12-25: NOR Land Pad DesignIntroduction
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© 2012 Micron Technology, Inc. All rights reserved.
SO Packages
Figure 2: Calculated SO Parameters
Silkscreen
R1
Land pattern
C
Y
1
2
3
4
8
7
6
5
X
R2
Courtyard
V1
Assembly
V2
ANOM
BNOM
Table 3: SO Packages and Parameter Values
Package Type Pins Width (mm) Length (mm)
MaxThickness
(mm) Pitch (mm)
SOP2-8 150 mils body width (SO8N) 8 4.9 6 1.75 1.27
SOP2-8 208 mils body width (SO8W) 8 5.28 7.9 2.5 1.27
SOP2-16 300 mils body width (SO16W) 16 10.3 10.3 2.65 1.27
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© 2012 Micron Technology, Inc. All rights reserved.
SO8N
Figure 3: SO8N Package Outline
8
1
0.25 mmGAUGE PLANE
0.10 MIN/0.25 MAX
0.40 MIN/1.27 MAX
0o MIN/8o MAX
0.28 MIN/0.48 MAX
0.17 MIN/0.23 MAX
x 45°0.25 MIN/0.50 MAX
0.10 MAX
1.75 MAX/
1.27 TYP
1.04 TYP
1.25 MIN
3.90 ±0.10
6.00 ±0.20
4.90 ±0.10
Note: 1. All dimensions are in millimeters.
Table 4: SO8N Suggested Land Pattern Dimensions
Reference
Land Pattern (mm) Silkscreen (mm) Assembly (mm) Courtyard (mm)
C Y X R1 R2 ANOM BNOM V1 V2
Typical dimension 5.2 1.35 0.55 4.9 3.9 3.9 4.9 6.8 5.2
Note: 1. See Figure 2 (page 4) for suggested land pattern.
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© 2012 Micron Technology, Inc. All rights reserved.
SO8W
Figure 4: SO8W Package Outline
8
1 0.00 MIN/0.25 MAX
1.51 MIN/2.00 MAX
5.02 MIN/6.22 MAX
7.62 MIN/8.89 MAX
0º MIN/10° MAX
0.10 MIN/0.35 MAX
0.50 MIN/0.80 MAX
2.50 MAX
6.05 MAX
1.27 TYP
0.40 -0.05+0.11 0.10 MAX
Note: 1. All dimensions are in millimeters.
Table 5: SO8W Suggested Land Pattern Dimensions
Reference
Land Pattern (mm) Silkscreen (mm) Assembly (mm) Courtyard (mm)
C Y X R1 R2 ANOM BNOM V1 V2
Typical dimension 7.5 1.7 0.6 5.15 6 5.62 5.95 9.4 6.3
Note: 1. See Figure 2 (page 4) for suggested land pattern.
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© 2012 Micron Technology, Inc. All rights reserved.
SO16W
Figure 5: SO16W Package Outline
16
0.23 MIN/0.32 MAX
1 8
9
0.40 MIN/1.27 MAX
0.20 ±0.12.5 ±0.15
10.30 ±0.20
7.50 ±0.10
10.00 MIN/10.65 MAX
0.33 MIN/0.51 MAX
0.1 Z
0° MIN/8° MAX
1.27 TYP
h x 45°
Z
Note: 1. All dimensions are in millimeters.
Table 6: SO16W Suggested Land Pattern Dimensions
Reference
Land Pattern (mm) Silkscreen (mm) Assembly (mm)Courtyard
(mm)
C Y X R1 R2 ANOM BNOM V1
Typical dimension 9.2 1.75 0.6 6.8 10.3 7.5 10.3 10.7
Note: 1. See Figure 2 (page 4) for suggested land pattern.
TN-12-25: NOR Land Pad DesignSO Packages
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© 2012 Micron Technology, Inc. All rights reserved.
DFN Packages
Figure 6: Calculated DFN Parameters
Silkscreen
R1
R2 Y2
Land pattern
C
Y1 X2
2
3
4
X1 1
79
6
5
8
Courtyard
V1
Assembly
V2
ANOM
BNOM
Table 7: DFN Packages and Parameter Values
Package Type Pins Width (mm) Length (mm)
MaxThickness
(mm) Pitch (mm)
U-PDFN-8 2 x 3mm (MLPA8) 8 2 3 0.6 0.5
U-PDFN-8 4 x 3mm (MLPA8) 8 4 3 0.6 0.8
V-PDFN-8 6 x 5mm (MLP8) 8 5 6 1 1.27
V-PDFN-8 6 x 5mm Sawn (MLP8) 8 5 6 0.9 1.27
VPDFN-8 8 x 6mm (MLP8) 8 6 8 1 1.27
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DFN-8 2mm x 3mm
Figure 7: DFN-8 2mm x 3mm Package Outline
0.55 -0.10+0.05
0.25 -0.05+0.05
0.02 -0.02+0.03
0.50 TYP
0.15 MAX0.30 MIN
0.08 MAX
2.00 -0.10+0.10
1.60 -0.10+0.10
3.00 -0.10+0.10 0.20 -0.10
+0.10
0.45 -0.05+0.05
Note: 1. All dimensions are in millimeters.
Table 8: DFN-8 2mm x 3mm Suggested Land Pattern Dimensions
Reference
Land Pattern (mm) Silkscreen (mm) Assembly (mm) Courtyard (mm)
C X1 Y1 X2 Y2 R1 R2 ANOM BNOM V1 V2
Typical dimension 2.8 0.3 0.75 0.3 1.7 1.3 2 3 2 3.8 2.3
Note: 1. See Figure 6 (page 8) for suggested land pattern.
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© 2012 Micron Technology, Inc. All rights reserved.
DFN-8 4mm x 3mm
Figure 8: DFN-8 4mm x 3mm Package Outline
Top View
B
A
0.10 C
0.10 C
2X
2X
Bottom View
Side View
C
0.05 C
0.10 C
Seating Plane
0.20 DIA TYP
0.10 C A B
0.05 C
M
M
Datum A
Datum B
See detail A
Even Terminal/Side
Datum A or B
Detail A
Terminal Tip
1 2
0.127 MIN/0.15 MAX
0.80 TYP
0.80 TYP
0.40 TYP
0.02 -0.02+0.03
0.55 -0.10+0.05
//
0.60 ±0.05
8 x (0.30 ±0.05)
0.20 ±0.10
4.00 ±0.10
0.80 ±0.10
8 x (0.60 ±0.05)
3.00 ±0.10
2 3 41
5678
(See note 1)
Note: 1. All dimensions are in millimeters.
Table 9: DFN-8 4mm x 3mm Suggested Land Pattern Dimensions
Reference
Land Pattern (mm)2 Silkscreen (mm) Assembly (mm) Courtyard (mm)
C X1 Y1 X 2 Y2 R1 R2 ANOM BNOM V1 V2
Typical dimension 2.6 0.35 0.95 0.3 2.4 3 4 3 4 3.8 4.3
Notes: 1. See Figure 6 (page 8) for suggested land pattern.2. The software used to generate the land pattern dimensions, does not have the capabili-
ty to split the thermal tab in two as shown in the drawing above. Please consider doingone of the following:1) Screen print such that the part is not lifted excessively by the solder, or2) Break the thermal tab in two with .05mm clearance around the pad, similar to dimen-sion X2.
TN-12-25: NOR Land Pad DesignDFN Packages
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DFN-8 6mm x 5mm
Figure 9: DFN-8 6mm x 5mm Package Outline
0.20 TYP
Seating planeLeads coplanarity
Pin 1 IDlaser marking
1.27TYP
3.00 ±0.20
0.6 +0.15
-0.1
0.02 +0.03-0.02
0.40 +0.08-0.053.00 ±0.20
0.90 ±0.10
C
6 TYP
Pin 1 IDPin 1 IDoption
5 TYP
0.08 C
0.1 C
Note: 1. All dimensions are in millimeters.
Table 10: DFN-8 6mm x 5mm Suggested Land Pattern Dimensions
Reference
Land Pattern (mm) Silkscreen (mm) Assembly (mm) Courtyard (mm)
C X1 Y1 X2 Y2 R1 R2 ANOM BNOM V1 V2
Typical dimension 5.5 0.45 1.05 3.2 3.2 3.7 5 6 5 6.8 5.4
Note: 1. See Figure 6 (page 8) for suggested land pattern.
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DFN 5mm x 6mm (Not Sawn)
Figure 10: DFN 5mm x 6mm (Not Sawn) Package Outline
12°
0.20 TYP0 MIN/
0.05 MAX
5.75 TYP
Pin oneindicator 1.27
TYP4 +0.30-0.20
0.60 +0.15-0.10
0.85 +0.15-0.05
0.40 +0.08-0.053.40 ±0.20
θ
0.10 MAX/0 MIN
C
A
B
M
2x
6 TYP
4.75 TYP
0.05
5 TYP
0.65 TYP
0.10 C B
0.10 C A
0.15
CB
0.10
CA
B
0.15 C A
Note: 1. All dimensions are in millimeters.
Table 11: DFN 5mm x 6mm (Not Sawn) Suggested Land Pattern Dimensions
Reference
Land Pattern (mm) Silkscreen (mm) Assembly (mm) Courtyard (mm)
C X1 Y1 X2 Y2 R1 R2 ANOM BNOM V1 V2
Typical dimension 5.5 0.45 1.05 3.6 4.3 3.8 5 6 5 6.8 5.4
Note: 1. See Figure 6 (page 8) for suggested land pattern.
TN-12-25: NOR Land Pad DesignDFN Packages
PDF: 09005aef8503ed82tn1225_land_pad_design.pdf - Rev. A 10/13 EN 12 Micron Technology, Inc. reserves the right to change products or specifications without notice.
© 2012 Micron Technology, Inc. All rights reserved.
DFN-8 8mm x 6mm
Figure 11: DFN-8 8mm x 6mm Package Outline
8.00 TYP
6.00 TYP 4.80 TYP
5.16 TYP0.2MIN
0.50 -0.05+0.10
(NE
- 1)
× 1
.27
TYP
Pin 1 IDØ0.3
1.27TYP
8
7
6
5
1
2
3
4
0.05 MAX
0.40 +0.08-0.05
0.85 TYP/1 MAX
Pin 1 ID R 0.20
ddd C
bbb C
Mee
eC
AB
aaa CA
B
aaa
C
Mff
fC
Note: 1. All dimensions are in millimeters.
Table 12: DFN-8 8mm x 6mm Suggested Land Pattern Dimensions
Reference
Land Pattern (mm) Silkscreen (mm) Assembly (mm) Courtyard (mm)
C X1 Y1 X2 Y2 R1 R2 ANOM BNOM V1 V2
Typical dimension 7.7 0.45 0.9 5.15 4.8 8 6 8 6 8.8 6.4
Note: 1. See Figure 6 (page 8) for suggested land pattern.
TN-12-25: NOR Land Pad DesignDFN Packages
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© 2012 Micron Technology, Inc. All rights reserved.
TSOP Packages
Figure 12: Calculated TSOP Parameters
Land pattern
Assembly
ANOM
BNOM
R2
Y
X
V2
C
123456789101112131415161718192021222324
484746454443424140393837363534333231302928272625
Silkscreen
Courtyard
V1
R1
Table 13: TSOP Packages and Parameter Values
Package Type Pins Width (mm) Length (mm)
MaxThickness
(mm) Pitch (mm)
TSOP48: 12mm x 20mm 48 12 20 1.2 0.5
TSOP56: 14mm x 20mm 56 14 20 1.2 0.5
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TSOP-I 48 12mm x 20mm
Figure 13: TSOP-I 48 12mm x 20mm Package Outline
DIE
1
24
48
25
0.50 TYP
0.10 MAX
0.10 MIN/0.21 MAX
0.60 +0.10
+3o 2o
3o
0.22 +0.05
0.10 +0.05
1.20 MAX1.00 +0.05
0.80 TYP
20.00+0.20
18.40+0.10
12.00+0.10
Note: 1. All dimensions are in millimeters.
Table 14: TSOP-I 48 12mm x 20mm Suggested Land Pattern Dimensions
Reference
Land Pattern (mm) Silkscreen (mm) Assembly (mm) Courtyard (mm)
C X Y R1 R2 ANOM BNOM V1 V2
Typical dimension 19.5 0.25 1.1 17.75 12 18.4 12 20.7 12.3
Note: 1. See Figure 12 (page 14) for suggested land pattern.
TN-12-25: NOR Land Pad DesignTSOP Packages
PDF: 09005aef8503ed82tn1225_land_pad_design.pdf - Rev. A 10/13 EN 15 Micron Technology, Inc. reserves the right to change products or specifications without notice.
© 2012 Micron Technology, Inc. All rights reserved.
TSOP-I 56 14mm x 20mm
Figure 14: TSOP-I 56 14mm x 20mm Package Outline
DIE
28
1 56
29
0.50 TYP
0.10 MAX
0.10 MIN/0.21 MAX
0.60 +0.10
0.22 +0.05
0.10 +0.05 +3o 2o
3o
1.20 MAX1.00 +0.05
20.00+0.20
18.40+0.10
14.00+0.10
0.80 TYP
Note: 1. All dimensions are in millimeters.
Table 15: TSOP-I 56 14mm x 20mm Suggested Land Pattern Dimensions
Reference
Land Pattern (mm) Silkscreen (mm) Assembly (mm) Courtyard (mm)
C X Y R1 R2 ANOM BNOM V1 V2
Typical dimension 19.4 0.25 1.1 17.65 14 18.4 14 20.7 14.3
Note: 1. See Figure 12 (page 14) for suggested land pattern.
TN-12-25: NOR Land Pad DesignTSOP Packages
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QFP Packages
Figure 15: Calculated QFP Parameters
Land pattern
R2
Y
X
C1
123456789101112131415161718192021222324
25 27 29 31 33 35 37 39
80 78 76 74 72 70 68 66
26 28 30 32 34 36 38 40
79 77 75 73 71 69 67 65
646362616059585756555453525150494847464544434241
Silkscreen
R1
BNOM
Assembly
ANOM
C2 V2
Courtyard
V1
QFP 48 12mm x 20mm
QFP assumptions:
• Toe (outside) goal = 0.15• Toe MIN = 0.17• Toe MAX goal = 0.43• Heal (in side) goal = 0.25• Heal MIN = 0.23• Heal MAX = 0.57• Side goal = 0.25• Side MIN = 0.23• Side MAX = 0.57
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Figure 16: PQFP80 Package Outline
801
+ 0.2517.20
+ 0.1014.00
+ 0.252.80
+ 0.150.800.25 MIN
3.40 MAX
0.10 MAX
12.00 TYP
0.80 TYP
1.60 TYP
0.30 MIN/0.45 MAX
0.13 MIN/0.23 MAX
+0.25
23.20
+0.10
20.00
16
24
18.40 TYP
MIN0oMAX7
o
Note: 1. All dimensions are in millimeters.
Table 16: PQFP80 Suggested Land Pattern Dimensions
Reference
Land Pattern (mm) Silkscreen (mm) Assembly (mm) Courtyard (mm)
C X Y C2 R1 R2 ANOM BNOM V1 V2
Typical dimension 16.3 0.55 1.5 14.1 14.1 20.1 14 20 18 27
Note: 1. See Figure 15 (page 17) for suggested land pattern.
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BGA PackagesBGA land pattern calculations are mainly based on ball size, but other features are alsoconsidered. Variations that affect BGA land patterns include pitch, ball diameter, thepositional accuracy of the balls vs. the true position of the component on the PCB, andthe manufacturing allowance that can be held for the land on the substrate that mountsthe ball. Basically, the land pattern of the component (where the ball is attached) andthe land pattern of the substrate mounting structure (PCB) should be as close in size aspossible. Reducing the PCB land size by some percentage of the ball diameter is accept-able as well. The IPC-7351 table below show the parameters that may cause variationsof land pattern needed to describe variations in the system. This data is usually descri-bed at the MMC for NSMD lands.
Table 17: BGA Tolerances (Reproduced from the IPC-7351B Standard)
Tolerance values are in millimetersLand Size
LocationAllowance
BallVariation
PCBFabricationAllowance Nominal
Ball Size% Reduction
from NominalVariation
AllowanceMMC LMC MMC LMC
0.60 0.50 0.10 0.25 0.10 0.75 0.90 0.65 25% 0.29
0.50 0.40 0.10 0.20 0.10 0.60 0.70 0.50 25% 0.24
0.45 0.35 0.10 0.15 0.10 0.55 0.65 0.45 25% 0.20
0.45 0.35 0.10 0.10 0.10 0.50 0.55 0.45 20% 0.17
0.40 0.30 0.10 0.10 0.10 0.45 0.50 0.40 20% 0.17
0.35 0.25 0.10 0.10 0.10 0.40 0.45 0.35 20% 0.17
0.25 0.20 0.05 0.10 0.05 0.30 0.35 0.25 20% 0.15
0.20 0.17 0.05 0.06 0.03 0.25 0.28 0.22 20% 0.08
0.20 0.14 0.05 0.04 0.03 0.20 0.22 0.18 15% 0.07
0.20 0.14 0.05 0.04 0.02 0.17 0.17 0.13 15% 0.07
0.18 0.12 0.05 0.04 0.02 0.15 0.15 0.10 15% 0.07
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BGA Calculated Land Pattern Parameters
Figure 17: BGA Calculated Land Pattern Parameters
24-Ball TBGA land pattern
C2
X
C1
A1
B1
C1
D1
E1
A2
B2
C2
D2
E2
A3
B3
C3
D3
E3
A4
B4
C4
D4
E4
A5
B5
C5
D5
E5
Easy BGA64 land pattern
C2
X
C1
A1
B1
C1
D1
E1
F1
G1
H1
A2
B2
C2
D2
E2
F2
G2
H2
A3
B3
C3
D3
E3
F3
G3
H3
A4
B4
C4
D4
E4
F4
G4
H4
A5
B5
C5
D5
E5
F5
G5
H5
A6
B6
C6
D6
E6
F6
G6
H6
A7
B7
C7
D7
E7
F7
G7
H7
A8
B8
C8
D8
E8
F8
G8
H8
VFBGA56 land pattern
C2
X
C1
A1
B1
C1
D1
E1
F1
G1
A2
B2
C2
D2
E2
F2
G2
A3
B3
C3
D3
E3
F3
G3
A4
B4
C4
D4
E4
F4
G4
A5
B5
C5
D5
E5
F5
G5
A6
B6
C6
D6
E6
F6
G6
A7
B7
C7
D7
E7
F7
G7
A8
B8
C8
D8
E8
F8
G8
TFBGA88 land pattern
C2
X
C1
A1
B1
C1
D1
E1
F1
G1
J1
K1
L1
M1
A2
B2
C2
D2
E2
F2
G2
J2
K2
L2
M2
A3
B3
C3
D3
E3
F3
G3
J3
K3
L3
M3
A4
B4
C4
D4
E4
F4
G4
J4
K4
L4
M4
A5
B5
C5
D5
E5
F5
G5
J5
K5
L5
M5
A6
B6
C6
D6
E6
F6
G6
J6
K6
L6
M6
A7
B7
C7
D7
E7
F7
G7
J7
K7
L7
M7
A8
B8
C8
D8
E8
F8
G8
J8
K8
L8
M8
lBGA80 land pattern
C2
X
C1
A1
B1
C1
D1
E1
F1
G1
J1
K1
A2
B2
C2
D2
E2
F2
G2
J2
K2
A3
B3
C3
D3
E3
F3
G3
J3
K3
A4
B4
C4
D4
E4
F4
G4
J4
K4
A5
B5
C5
D5
E5
F5
G5
J5
K5
A6
B6
C6
D6
E6
F6
G6
J6
K6
A7
B7
C7
D7
E7
F7
G7
J7
K7
A8
B8
C8
D8
E8
F8
G8
J8
K8
TFBGA48 land pattern
C2
X
C1
A1
B1
C1
D1
E1
F1
G1
H1
A2
B2
C2
D2
E2
F2
G2
H2
A3
B3
C3
D3
E3
F3
G3
H3
A4
B4
C4
D4
E4
F4
G4
H4
A5
B5
C5
D5
E5
F5
G5
H5
A6
B6
C6
D6
E6
F6
G6
H6
Table 18: BGA Packages and Parameter Values
Package Type Balls Width (mm) Length (mm)
MaxThickness
(mm) Pitch (mm)
Easy BGA64 10 x 13 x 1.2mm 64 10 13 1.2 1
TBGA24 6 x 8 x 1mm 24 6 8 1 1
LBGA80 10 x 12 x 1.4mm 80 10 12 1.4 0.6
TFBGA88 8 x 10 x 1.2mm 88 8 10 1.2 0.8
TFBGA48 6 x 9 x 1.2mm 48 6 9 1.2 0.8
VFBGA56 7.7 x 9 x 1mm 56 7.7 9 1 0.75
TN-12-25: NOR Land Pad DesignBGA Packages
PDF: 09005aef8503ed82tn1225_land_pad_design.pdf - Rev. A 10/13 EN 20 Micron Technology, Inc. reserves the right to change products or specifications without notice.
© 2012 Micron Technology, Inc. All rights reserved.
24-Ball TBGA
Figure 18: 24-Ball TBGA Package Outline
Ball A1 ID
1.20 MAX
6 ±0.10
0.20 MIN
1.00 TYP
1.00 TYP
8 ±0.104.00
Ball A1 ID
4.00
0.79 TYP
Seatingplane
0.1 A
A
24X Ø0.40 ±0.055 4 3 2 1
A
B
C
D
E
Note: 1. All dimensions are in millimeters.
Table 19: 24-Ball TBGA Suggested Land Pattern Dimensions
Reference
Land Pattern (mm)
C1 C2 X
Typical dimension 4 4 0.35
Note: 1. See Figure 17 (page 20) for suggested land pattern.
TN-12-25: NOR Land Pad DesignBGA Packages
PDF: 09005aef8503ed82tn1225_land_pad_design.pdf - Rev. A 10/13 EN 21 Micron Technology, Inc. reserves the right to change products or specifications without notice.
© 2012 Micron Technology, Inc. All rights reserved.
Easy BGA64
Figure 19: Easy BGA64 Package Outline
Ball A1 ID
0.78 TYP
Seatingplane
0.1
1.20 MAX
1.00 TYP
A
B
C
D
E
F
G
H
8 7 6 5 4 3 2 1
0.5 ±0.1
10 ±0.1
64X Ø0.43 ±0.1
1.00 TYP
8 ±0.1
1.5 ±0.1 Ball A1 ID
Note: 1. All dimensions are in millimeters.
Table 20: Easy BGA64 Suggested Land Pattern Dimensions
Reference
Land Pattern (mm)
C1 C2 X
Typical dimension 7 7 0.4
Note: 1. See Figure 17 (page 20) for suggested land pattern.
TN-12-25: NOR Land Pad DesignBGA Packages
PDF: 09005aef8503ed82tn1225_land_pad_design.pdf - Rev. A 10/13 EN 22 Micron Technology, Inc. reserves the right to change products or specifications without notice.
© 2012 Micron Technology, Inc. All rights reserved.
TFBGA48
Figure 20: TFBGA48 Package Outline
Ball A1
5.60 TYP
1.20 MAX
1.00 MAX
0.10 MAX
0.20 MIN
1.00 TYP0.40 TYP
4.00 TYP
0.40 TYP
1.70 TYP
0.80 TYP
0.80 TYP
9.00 + 0.10
0.40 + 0.05
6.00 + 0.10
Note: 1. All dimensions are in millimeters.
Table 21: TFBGA48 Suggested Land Pattern Dimensions
Reference
Land Pattern (mm)
C1 C2 X
Typical dimension 4 5.6 0.35
Note: 1. See Figure 17 (page 20) for suggested land pattern.
TN-12-25: NOR Land Pad DesignBGA Packages
PDF: 09005aef8503ed82tn1225_land_pad_design.pdf - Rev. A 10/13 EN 23 Micron Technology, Inc. reserves the right to change products or specifications without notice.
© 2012 Micron Technology, Inc. All rights reserved.
VFBGA56
Figure 21: VFBGA56 Package Outline
A
B
C
D
E
F
G
13572468
Ball A1 IDBall A1 ID
1 MAX
0.2 MIN
56X Ø0.35 ±0.05
7.7 ±0.1
0.75TYP
0.75 TYP
4.5 CTR
9 ±0.1
Seating plane
0.08 A
5.25 CTR
A
Note: 1. All dimensions are in millimeters.
Table 22: VFBGA56 Suggested Land Pattern Dimensions
Reference
Land Pattern (mm)
C1 C2 X
Typical dimension 5.3 4.5 0.35
Note: 1. See Figure 17 (page 20) for suggested land pattern.
TN-12-25: NOR Land Pad DesignBGA Packages
PDF: 09005aef8503ed82tn1225_land_pad_design.pdf - Rev. A 10/13 EN 24 Micron Technology, Inc. reserves the right to change products or specifications without notice.
© 2012 Micron Technology, Inc. All rights reserved.
TFBGA88
Figure 22: TFBGA88 Package Outline
13572468
A
B
C
D
E
F
G
H
J
K
L
M
Ball A1 ID88X Ø0.35 ±0.05 Ball A1 ID
1.2 MAX
0.2 MIN8 ±0.1
0.8 TYP
5.6 CTR
0.8 TYP
8.8 CTR
10 ±0.1
Seating plane
0.1 AA
Note: 1. All dimensions are in millimeters.
Table 23: TFBGA88 Suggested Land Pattern Dimensions
Reference
Land Pattern (mm)
C1 C2 X
Typical dimension 5.6 8.8 0.35
Note: 1. See Figure 17 (page 20) for suggested land pattern.
TN-12-25: NOR Land Pad DesignBGA Packages
PDF: 09005aef8503ed82tn1225_land_pad_design.pdf - Rev. A 10/13 EN 25 Micron Technology, Inc. reserves the right to change products or specifications without notice.
© 2012 Micron Technology, Inc. All rights reserved.
LBGA80
Figure 23: LBGA80 Package Outline
BALL A1
1.60 MAX
0.40 MIN
0.15 MAX
1.05 MAX
10.00 TYP
12.00 TYP
7.00 TYP
9.00 TYP
0.60 TYP
1.50 TYP
1.50 TYP
1.00 TYP
1.00 TYP
0.50 TYP
0.50 TYP
Note: 1. All dimensions are in millimeters.
Table 24: LBGA80 Suggested Land Pattern Dimensions
Reference
Land Pattern (mm)
C1 C2 X
Typical dimension 7 9 0.5
Note: 1. See Figure 17 (page 20) for suggested land pattern.
TN-12-25: NOR Land Pad DesignBGA Packages
PDF: 09005aef8503ed82tn1225_land_pad_design.pdf - Rev. A 10/13 EN 26 Micron Technology, Inc. reserves the right to change products or specifications without notice.
© 2012 Micron Technology, Inc. All rights reserved.
Land Pattern CompatibilitySome small outline (SO) and dual flat no-lead (DFn) packages can use the same landpattern on a PCB. SO8W and DFN8L 6 x 8mm packages have a very similar overall foot-print; both packages fit the same area on the PCB. The shaded areas in the picture be-low indicate the areas that match between the DFN8L 6 x 8mm and the SO8W packages.All of the dimensions for the DFN 6 x 8mm, particularly pads, are smaller than the cor-responding maximum dimensions for the SO8W packages.
Figure 24: SO8W and DFN 6 x 8mm Land Pattern Compatibility
SO8W DFN 6 x 8
Another difference between the packages is the DFN's central conductive pad, whichdoes not require a solder connection. Micron recommends that no PCB traces run be-low the DFN package, because they could short-circuit to the central pad. A recommen-ded trace routing in the PCB specifically for DFN packages is shown in the figure below.
TN-12-25: NOR Land Pad DesignLand Pattern Compatibility
PDF: 09005aef8503ed82tn1225_land_pad_design.pdf - Rev. A 10/13 EN 27 Micron Technology, Inc. reserves the right to change products or specifications without notice.
© 2012 Micron Technology, Inc. All rights reserved.
Figure 25: Recommended Trace Routing for DFN and SO Packages
Land pads
Traces
No Yes
The same recommendations apply for SO8N and DFN 8L 5 x 6mm package compatibili-ty. A complete analysis and verification of the design and requirements regarding thevariations between the packages should be made before attempting to match the PCBland pad.
TN-12-25: NOR Land Pad DesignLand Pattern Compatibility
PDF: 09005aef8503ed82tn1225_land_pad_design.pdf - Rev. A 10/13 EN 28 Micron Technology, Inc. reserves the right to change products or specifications without notice.
© 2012 Micron Technology, Inc. All rights reserved.
Revision History
Rev. A – 10/13
• Initial release
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Micron and the Micron logo are trademarks of Micron Technology, Inc.All other trademarks are the property of their respective owners.
TN-12-25: NOR Land Pad DesignRevision History
PDF: 09005aef8503ed82tn1225_land_pad_design.pdf - Rev. A 10/13 EN 29 Micron Technology, Inc. reserves the right to change products or specifications without notice.
© 2012 Micron Technology, Inc. All rights reserved.