TMS320C6201 Test and Evaluation Board Technical Reference' · Test and Evaluation Board Technical Reference ... Programming Atmel’s AT29 Flash Family, ... 2 Installing the TMS320C6201

TMS320C6201Test and Evaluation Board

Technical Reference

Literature Number: SPRU235ADecember 1997

Printed on Recycled Paper

IMPORTANT NOTICE

Texas Instruments (TI) reserves the right to make changes to its products or to discontinue anysemiconductor product or service without notice, and advises its customers to obtain the latestversion of relevant information to verify, before placing orders, that the information being reliedon is current.

TI warrants performance of its semiconductor products and related software to the specificationsapplicable at the time of sale in accordance with TI’s standard warranty. Testing and other qualitycontrol techniques are utilized to the extent TI deems necessary to support this warranty.Specific testing of all parameters of each device is not necessarily performed, except thosemandated by government requirements.

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TI SEMICONDUCTOR PRODUCTS ARE NOT DESIGNED, INTENDED, AUTHORIZED, ORWARRANTED TO BE SUITABLE FOR USE IN LIFE-SUPPORT APPLICATIONS, DEVICESOR SYSTEMS OR OTHER CRITICAL APPLICATIONS.

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TI assumes no liability for applications assistance, customer product design, softwareperformance, or infringement of patents or services described herein. Nor does TI warrant orrepresent that any license, either express or implied, is granted under any patent right, copyright,mask work right, or other intellectual property right of TI covering or relating to any combination,machine, or process in which such semiconductor products or services might be or are used.

Copyright 1997, Texas Instruments Incorporated

iii

Preface

Read This First

About This Manual

This manual describes the operation of the TMS320C6201 (’C6201) test andevaluation board (TEB). The ’C6201 TEB is a low-cost desktop card that helpsyou evaluate certain characteristics of the ’C6201 digital signal processor(DSP) to determine if the DSP meets your application requirements. You cancreate your software to run on the board and expand the system using theprototype area.

This manual tells you how to install and operate the ’C6201 TEB with yoursystem. It also describes key features of the TEB and helps you understandthe TEB’s key components.

How to Use This Manual

This book contains the following types of information:

Introductory material , consisting of Chapters 1 and 2. Chapter 1provides an overview of the ’C6201 TEB and its components. Chapter 2tells you how to install the TEB.

Topical material , consisting of Chapter 3, provides descriptions ofhardware functions.

Reference material , consisting of Appendixes A and B, provides PAL

code and schematics.

Notational Conventions

This document uses the following conventions.

Program listings, program examples, and interactive displays are shownin a special typeface.

Device names are abbreviated with a C, followed by the last two to fouralphanumeric characters in the name. For example, TMS320C6x iswritten as ’C6x and TMS320C6201 is written as ’C6201.

Information About Cautions / Related Documentation / Related Documentation From Texas Instruments

iv

Information About Cautions

This book contains cautions.

This is an example of a caution statement.

A caution statement describes a situation that could potentiallydamage your software or equipment.

The information in a caution is provided for your protection. Please read eachcaution carefully.

Related Documentation

You can use the following book to supplement this user’s guide:

Programming Atmel’s AT29 Flash Family, Flash Application Note (AN-3)(Atmel literature number 0518B)

Related Documentation From Texas Instruments

The following books describe the ’C6x devices and related support tools. Toobtain a copy of any of these TI documents, call the Texas InstrumentsLiterature Response Center at (800) 477-8924. When ordering, please identifythe book by its title and literature number.

XDS51x Emulator Installation Guide (literature number SPNU070)describes the installation of the XDS510 , XDS510PP , andXDS510WS emulator controllers. The installation of the XDS511emulator is also described.

JTAG/MPSD Emulation Technical Reference (literature number SPDU079)provides the design requirements of the XDS510 emulator controller,discusses JTAG designs (based on the IEEE 1149.1 standard), andmodular port scan device (MPSD) designs.

TMS320C6x C Source Debugger User’s Guide (literature numberSPRU188) tells you how to invoke the ’C6x simulator and emulatorversions of the C source debugger interface. This book discussesvarious aspects of the debugger, including command entry, codeexecution, data management, breakpoints, profiling, and analysis.

Related Documentation From Texas Instruments

v Read This First

TMS320C6x C Source Debugger User’s Guide (for SPARCstations)(literature number SPRU224) tells you how to invoke the ’C6x simulatorand emulator versions of the C source debugger interface forSPARCstations. This book discusses various aspects of the debugger,including command entry, code execution, data management,breakpoints, profiling, and analysis.

TMS320C62xx Technical Brief (literature number SPRU197) gives anintroduction to the ’C62xx digital signal processor, development tools,and third-party support.

TMS320C6201 Digital Signal Processor Data Sheet (literature numberSPRS051) describes the features of the TMS320C6xx and providespinouts, electrical specifications, and timings for the device.

TMS320C62xx Peripherals Reference Guide (literature number SPRU190)describes common peripherals available on the TMS320C62xx digitalsignal processors. This book includes information on the internal dataand program memories, the external memory interface (EMIF), the hostport, serial ports, direct memory access (DMA), clocking andphase-locked loop (PLL), and the power-down modes.

TMS320C62xx CPU and Instruction Set Reference Guide (literaturenumber SPRU189) describes the ’C62xx CPU architecture, instructionset, pipeline, and interrupts for the TMS320C62xx digital signalprocessors.

TMS320C62xx Programmer’s Guide (literature number SPRU198)describes ways to optimize C and assembly code and includesapplication program examples.

TMS320C6x Optimizing C Compiler User’s Guide (literature numberSPRU187) describes the ’C6x C compiler. This C compiler accepts ANSIstandard C source code and produces assembly language source codefor the ’C6x generation of devices. This book also describes theassembly optimizer, which helps you optimize your assembly code.

TMS320C6x Assembly Language Tools User’s Guide (literature numberSPRU186) describes the assembly language tools (assembler, linker,and other tools used to develop assembly language code), assemblerdirectives, macros, common object file format, and symbolic debuggingdirectives for the ’C6x generation of devices.

FCC Warning / Trademarks

vi

FCC Warning

This equipment is intended for use in a laboratory test environment only. Itgenerates, uses, and can radiate radio frequency energy and has not beentested for compliance with the limits of computing devices pursuant to subpartJ of part 15 of FCC rules, which are designed to provide reasonable protectionagainst radio frequency interference. Operation of this equipment in otherenvironments may cause interference with radio communications, in whichcase the user at his own expense will be required to take whatever measuresmay be required to correct this interference.

Trademarks

320 Hotline On-line, XDS510, and XDS510WS are trademarks of TexasInstruments Incorporated.

ABEL is a trademark of Data I/O.

AT and PC are trademarks of International Business Machines Corporation.

PAL is a registered trademark of Advanced Micro Devices, Inc.

Solaris and SunOS are trademarks of Sun Microsystems, Inc.

SPARC and SPARCstation are trademarks of SPARC International, Inc., butlicensed exclusively to Sun Microsystems, Inc.

UNIX is a registered trademark in the United States and other countries,licensed exclusively through X/Open Company Limited.

Windows and Windows NT are registered trademarks of MicrosoftCorporation.

If You Need Assistance

vii Read This First

If You Need Assistance . . .

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Note: When calling a Literature Response Center to order documentation, please specify the literature number of thebook.

If You Need Assistance ...

Contents

ix

Contents

1 Overview of the TMS320C6201 Test and Evaluation Board 1-1. . . . . . . . . . . . . . . . . . . . . . . . . . Provides an overview of the TMS320C6201 test and evaluation board, including its keyfeatures and major functions.

1.1 Key Features of the TMS320C6201 TEB 1-2. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.2 Functional Overview of the TMS320C6201 TEB 1-3. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

2 Installing the TMS320C6201 Test and Evaluation Board 2-1. . . . . . . . . . . . . . . . . . . . . . . . . . . . Describes the minimum hardware configuration required for the TMS320C6201 test andevaluation board.

2.1 The TMS320C6201 TEB 2-2. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2.2 Host Requirements 2-4. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2.3 TMS320C6201 TEB Kit Components 2-4. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2.4 TMS320C6201 TEB Connection 2-4. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2.5 TMS320C6201 TEB Installation 2-7. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

3 TMS320C6201 Test and Evaluation Board Operation 3-1. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Describes the TMS320C6201 test and evaluation board and its various interfaces and keycomponents.

3.1 Custom Power Supply 3-2. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3.2 Power Requirements 3-2. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3.3 Reset Generation 3-3. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3.4 Clock Generation 3-3. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3.5 Interrupt Generation 3-4. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3.6 External Memories 3-4. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3.7 Host Port Connection 3-5. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3.8 Serial Ports and Timers Connection 3-5. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3.9 Emulation Port Connection 3-5. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3.10 Prototyping Area 3-6. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3.11 Shunt Jumpers and DIP Switches 3-7. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

A TMS320C6201 TEB PAL Equations A-1. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Contains the programmable logic source for the TMS320C6201 TEB PAL equations.

B TMS320C6201 TEB Schematics B-1. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Contains the schematics for the TMS320C6201 TEB.

Tables

x

Figures

1–1 TMS320C6201 TEB Connectivity 1-4. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2–1 TMS320C6201 TEB 2-3. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2–2 Attaching AC Cord Into Power Supply 2-7. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2–3 Connecting the Power Supply to the TEB 2-8. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2–4 Connecting the Emulator to the TEB 2-9. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3–1 Power Supply DC Connector 3-2. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Tables

2–1 Default TEB Shunt Jumper Settings 2-5. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2–2 Default TEB DIP Switch Settings 2-6. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3–1 TEB Fuse Ratings 3-2. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3–2 TEB Memories 3-4. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3–3 TEB Shunt Jumpers 3-7. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3–4 TEB DIP Switches 3-8. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

1-1Overview of the TMS320C6201 Test and Evaluation Board

Overview of the TMS320C6201Test and Evaluation Board

The TMS320C6201 test and evaluation board (TEB) helps you evaluate cer-tain characteristics of the TMS320C6201 (’C6201) fixed-point digital signalprocessor (DSP) to ensure that it meets your application requirements. TheTEB is self-contained, only requiring connections to an AC power supply andto your own emulation hardware and software. The TEB is platform indepen-dent and uses either an XDS510 emulator controller for a PC or anXDS510WS emulator controller for a UNIX workstation.

The ’C6201 TEB carries a ’C6201 DSP on board to allow full-speed verificationof ’C6201 code. You can also use the TEB to design your own prototype sys-tems. The ’C6201 DSP has 128 Kbyte on-chip SRAM that consists of 64 Kbyteinternal program/cache and 64 Kbyte internal data memory. The TEB uses the’C6201’s 32-bit external memory interface to facilitate accesses to on-boardsynchronous and asynchronous memories. A PC or UNIX windows-orienteddebugger simplifies code development and debugging. For more informationabout the debugger, see the TMS320C6201 C Source Debugger User’s Guideor the TMS320C6x C Source Debugger User’s Guide for SPARCStation.

The TEB also has a ’C6201 16-bit host access port, a serial and timer accessport, an IEEE Standard 1149.1-compliant JTAG connector for accessing the’C6201’s scan-based emulation features, and a through-hole area for designprototyping. You can also use the TEB as a reference when designing yourown systems.

Topic Page

1.1 Key Features of the TMS320C6201 TEB 1-2. . . . . . . . . . . . . . . . . . . . . . . . .

1.2 Functional Overview of the TMS320C6201 TEB 1-3. . . . . . . . . . . . . . . . . .

Chapter 1

Key Features of the TMS320C6201 TEB

1-2

1.1 Key Features of the TMS320C6201 TEB

The ’C6201 TEB has the following features:

’C6201 capable of executing 1600 million instructions per second (MIPS)

Varied instruction cycle times of the ’C6201:

5-ns instruction cycle time when using the DSP’s internal memories

6-ns instruction cycle time when using synchronous dynamic RAM(SDRAM) and one-half rate external synchronous burst static RAM(SBSRAM)

6.7-ns instruction cycle time when using the TEB’s external SBSRAM,regardless of which other TEB memories are used

512K bytes 6.7-ns SBSRAM

8M bytes 12-ns SDRAM

256K bytes 12-ns asynchronous static RAM (ASRAM)

128K bytes 200-ns flash programmable erasable ROM (PEROM)

16-bit host port header

Access to the ’C6201’s serial ports and timers via a header

Emulator connector

Prototyping area

Functional Overview of the TMS320C6201 TEB

1-3Overview of the TMS320C6201 Test and Evaluation Board

1.2 Functional Overview of the TMS320C6201 TEB

Figure 1–1 shows the basic block diagram and interconnects of the ’C6201TEB. The interconnects include the external memory, host port, emulation in-terfaces, and serial ports and timers.

The ’C6201 DSP interfaces to the memories through a 32-bit data bus. Head-ers are situated between the synchronous and asynchronous memories to al-low easy examination of the external memory interface’s address, data, andcontrol signals. The TEB’s control signals are also available at these headers.Additional headers between the asynchronous memories and the prototypingarea allow for access to asynchronous control signals and the data bus, whichmay be used in the prototyping area.

Use the host port header to connect your host processor to the ’C6201’s hostport interface. This allows your host processor to access the ’C6201’s internalmemory. The serial ports and timers header allows access to the ’C6201’s seri-al ports and timers.

An emulation connector provides access to the IEEE Standard 1149.1 (JTAG)scan-based emulation port of the ’C6201. This port is a superset of the IEEE1149.1 standard and is used by either an XDS510 or an XDS510WS emulator.

Functional Overview of the TMS320C6201 TEB

1-4

Figure 1–1. TMS320C6201 TEB Connectivity

Host portinterfaceheader

BOOTMODEconfigurationDIP switches

BOOTMODE[4:0]

Host port dataHD[15:0]

Emulation port

Address EA[21:2]

Data ED[31:0]

Control

Buffering and prototypearea headers

PEROM128KB

JTAGemulatorconnector

’C6201

ASRAM256KB

SBSRAM512KB

Buffering andobservation headers

SDRAM8MB

Host control

Serial portsand timers

accessheader

Serial ports[1:0]

Timers[1:0]

2-1

Installing the TMS320C6201Test and Evaluation Board

This chapter provides installation instructions for the ’C6201 TEB.

Topic Page

2.1 The TMS320C6201 TEB 2-2. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

2.2 Host Requirements 2-4. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

2.3 TMS320C6201 TEB Kit Components 2-4. . . . . . . . . . . . . . . . . . . . . . . . . . . .

2.4 TMS320C6201 TEB Connection 2-4. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

2.5 TMS320C6201 TEB Installation 2-7. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Chapter 2

The TMS320C6201 TEB

2-2

2.1 The TMS320C6201 TEB

The ’C6201 TEB is 5 inches x 12 inches and is intended for desktop use. Itmeets the following specifications:

Instruction cycles of 7.5 ns (frequency equal to 133 MHz). This is accom-plished using a 33.25-MHz oscillator and operating the ’C6201’s phase-locked loop (PLL) clock in multiply-by-four mode.

Configuration of the ’C6201 boot process using the TEB’s on-board DIPswitches. These switches are set for the following:

Use of the ’C6201’s memory map 1 Memory at address 0 is ’C6201 internal RAM Boot-load startup process using 8-bit PEROM with default timing in

CE1 external address space

Use of the emulator’s TCLK signal

Figure 2–1 shows the layout of the ’C6201 TEB.

The T

MS

320C6201 T

EB

2-3Installing the T

MS

320C6201 Test and E

valuation Board

Figure 2–1. TMS320C6201 TEB

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Reset switch S5

Shunt jumpers JP3

Powerconnector

J10

OscillatorU3

Emulation connector J2

BOOTMODEconfigurationDIP switches S4

Host port header J4

Serial ports and timers access header J12

External emulator (TCLK)clock J3

External ’C6201clock J1

Host Requirements

2-4

2.2 Host Requirements

The TEB is platform independent and can be used with an XDS510 emulatorcontroller for a PC or an XDS510WS emulator controller for a UNIX worksta-tion. The XDS51x Emulator Installation Guide lists the minimum hardware re-quirements for your emulator. The installation instructions included with youremulator software lists the minimum software requirements for your emulator.

2.3 TMS320C6201 TEB Kit Components

The kit contains the following items:

’C6201 TEB

Custom power supply

TMS320C6201 Test and Evaluation Board Technical Reference (this doc-ument)

Diskette containing TEB-related files

2.4 TMS320C6201 TEB Connection

Before you apply power to the TEB or connect the TEB to your emulator, seeTable 2–1 and Table 2–2 to ensure that all shunt jumpers and DIP switchesare set to their default positions. Table 3–3 and Table 3–4 contain completedescriptions of all shunt jumpers and DIP switches used on the TEB. Seethese tables before you change any default settings.

Host Requirements / TMS320C6201 TEB Kit Components / TMS320C6201 TEB Connection

TMS320C6201 TEB Connection

2-5Installing the TMS320C6201 Test and Evaluation Board

Table 2–1. Default TEB Shunt Jumper Settings

A–B indicates HIGH (1), B–C indicates LOW (0)

Name Position Setting Description

ROM protect JP1 1–2 Flash PEROM write disabled

TCLK select JP2 2–3 Use XDS51x emulator’s TCLK signal

NMI JP3.1 B–C Nonmaskable interrupt inactive

EXT_INT4EXT_INT5EXT_INT6EXT_INT7

JP3.2JP3.3JP3.4JP3.5

B–CB–CB–CB–C

Interrupts EXT_INT4—EXT_INT7 in-active

PLLFREQ1PLLFREQ2PLLFREQ3

JP3.6JP3.7JP3.8

B–CB–CB–C

25 MHz < CLKOUT1 ≤ 135 MHz

CLKMODE0CLKMODE1

JP3.9JP3.10

A–BA–B

PLL multiply-by-four mode

RSV0RSV1RSV2RSV3RSV4

JP3.11JP3.12JP3.13JP3.14JP3.15

A–BA–BA–BA–BB–C

Reserved

EMU0EMU1

JP3.16JP3.17

A–BA–B

TI emulation support

LENDIAN JP3.18 A–B Little-endian mode addressing

ARDY JP3.19 A–B External controller ready (to avoid stall-ing)

HOLD– JP3.20 A–B Connects ’C6201 to the system

UnusedUnused

JP3.21JP3.22

No ShuntNo Shunt

TINP0TINP1

JP3.23JP3.24

A–BA–B

Timer inputs

TMS320C6201 TEB Connection

2-6

Table 2–2. Default TEB DIP Switch Settings

OFF indicates HIGH (1), ON indicates LOW (0)

Name Position Setting Description

BOOTMODE0BOOTMODE1BOOTMODE2BOOTMODE3BOOTMODE4

S4.1S4.2S4.3S4.4S4.5

OFFONOFFOFFON

Boot configuration settings for memory map1 with internal RAM at address 0 and 8-bitPEROM boot process

SWUSER S4.6 OFF User-defined input to U8 PAL

TMS320C6201 TEB Installation


2.5 TMS320C6201 TEB Installation

The ’C6201 TEB is connected to a power supply and an emulator. The follow-ing steps show how to connect the TEB to both.

Never disconnect or reconnect any cables or other hardwaredevices while power is applied to the emulator or TEB. Doing socan cause damage to your emulator and/or TEB.

Step 1: Install your emulation hardware and software.

Step 2: Ensure the emulator power is off. If you have an XDS510WS emula-tor controller (for a UNIX workstation), switch off the power. If youhave an XDS510 emulator controller (for a PC), power down theemulator by shutting down Windows and turning off your PC.

Step 3: Insert the female end of the AC line cord into the power supply.

Figure 2–2. Attaching AC Cord Into Power Supply

AC cord

Power supply


2-8

Step 4: Connect the power supply’s male 6-pin connector into J10 of theTEB.

Figure 2–3. Connecting the Power Supply to the TEB

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Reset S5Shunt jumpers JP3

Powerconnector

J10J3

J1

OscillatorU3


DIP switchesS4

Host port header J4


Power supply



Step 5: With moderate downward pressure, connect the 14-pin keyed con-nector from your emulator to J2 on the TEB.

Figure 2–4. Connecting the Emulator to the TEB

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Reset S5

Shunt jumpers JP3Power

connectorJ10

J3

J1

OscillatorU3


DIP switchesS4

Host port header J4


Emulator connector


2-10

Step 6: Turn on power to the emulator. If you have an XDS510WS emulatorcontroller (for a UNIX workstation), switch on the power. If you havean XDS510 emulator controller (for a PC), turn on your PC.

Step 7: Plug the male end of the power supply’s AC line cord into an AC out-let. This applies power to the TEB. An LED on the power supply andone on the TEB indicates that power is applied.

If you need to disconnect the TEB, unplug the TEB, then turn off power to theemulator (using the power switch if you have an XDS510WS or by shuttingdown Windows and turning off your PC if you have an XDS510).

3-1

TMS320C6201 Test and EvaluationBoard Operation

This chapter describes the ’C6201 TEB, its key components, and how they op-erate. It also provides additional information on the TEB’s various interfaces.

The ’C6201 TEB consists of the following components:

Custom power supply TMS320C6201 TEB

Memory control Power Reset generation Clock generation Interrupt generation ’C6201 external memory interface ’C6201 host port interface Serial ports and timers interface Emulation interface Prototyping area Shunt jumpers and DIP switches

3.5-in floppy diskette

Topic Page

3.1 Custom Power Supply 3-2. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

3.2 Power Requirements 3-2. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

3.3 Reset Generation 3-3. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

3.4 Clock Generation 3-3. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

3.5 Interrupt Generation 3-4. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

3.6 External Memories 3-4. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

3.7 Host Port Connection 3-5. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

3.8 Serial Ports and Timers Connection 3-5. . . . . . . . . . . . . . . . . . . . . . . . . . . .

3.9 Emulation Port Connection 3-5. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

3.10 Prototyping Area 3-6. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

3.11 Shunt Jumpers and DIP Switches 3-7. . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Chapter 3

Power Requirements

3-2

3.1 Custom Power Supply

A custom power supply provides 2.5-, 3.3-, and 5.0-VDC regulated supply volt-ages to the TEB when connected to an AC wall outlet. An LED on top of thepower supply illuminates when it has been properly connected to AC power.The LED blinks when the power supply is connected to a wall outlet where theDC outlet is not connected to the TEB. The TEB’s power supply must beloaded to regulate the voltages measured at its DC outlet. Voltages at the DCoutlet without the load of the TEB appear unstable.

Figure 3–1. Power Supply DC Connector

65

4

321

Front view

2.5 VGnd3.3 V

Gnd5.0 VGnd

3.2 Power Requirements

LED D1 (located next to the power jack on the TEB) illuminates when poweris applied to the 6-pin DC power jack J10. See Figure 2–4 for details about ap-plying power to the TEB. Table 3–1 lists the appropriate fuse current ratingsto protect the TEB components.

Table 3–1. TEB Fuse Ratings

Voltage Label

Schematicreference

designation Rating Purpose of Supply Voltage

2.5 VCC2 F2 7.0 A ’C6201 internals

3.3 VCC3 F1 4.0 A ’C6201 I/Os and TEB 3.3-V components

3.3 P_VCC3 F5 0.75 A Prototype area 3.3-V components

5.0 VCC5 F3 0.25 A TEB 5.0-V components

5.0 P_VCC5 F4 1.5 A Prototype area 5.0-V components

Custom Power Supply / Power Requirements

Reset Generation

3-3TMS320C6201 Test and Evaluation Board Operation

Use only fuses with ratings listed in Table 3–1 to avoid damage tothe TEB.

Do not draw more current than allowed by the fuses. This candamage the power supply and the TEB.

3.3 Reset Generation

At power up, power down, and during brownout conditions, a supply voltagesupervisory circuit forces the ’C6201 DSP into a reset condition. Pressing thepush-button switch S5 also forces a reset. In either case, the ’C6201’s resetline is active (low) for a period of at least 200 ms.

3.4 Clock Generation

The ’C6201 DSP operates at frequencies up to 200 MHz. Two options for gen-eration of the clock signal CLKIN are provided on the TEB.

A 68-Ω resistor installed in location R2 selects oscillator U3.

Removing R2 and installing it as R3 selects the SMA connector J1 as thesource for the CLKIN signal.

These options, combined with the ’C6201’s internal phase-locked loop (PLL),allow you to experiment with different clock frequencies. Use of the PLL in themultiply-by-four mode for a CLKOUT1 frequency other than 133 MHz requiresthe replacement of components R1, C2, and C3. See the TMS320C6201 Digi-tal Signal Processor Data Sheet for more information.

The factory default configuration of the TEB uses a 33.25-MHz oscillator toprovide input to the ’C6201’s PLL, which is set to operate in multiply-by-fourmode. R2 is installed to select U3 as the source for the ’C6201’s PLL. Shuntjumpers JP3.10 (CLKMODE1) and JP3.9 (CLKMODE0) select the clock multi-ply-by-four mode. Shunt jumpers JP3.8 (PLLFREQ3)–JP3.6 (PLLFREQ1) se-lect a CLKOUT1 frequency range of 25–135 MHz. The oscillator and the PLLprovide a CLKOUT1 signal that has a period of approximately 7.5 ns, a fre-quency of 133 MHz, and a duty cycle of approximately 50%.

Power Requirements / Reset Generation / Clock Generation

Interrupt Generation

3-4

You can operate the ’C6201 internally at frequencies up to 200 MHz by reconfi-guring shunt jumpers JP3.10–JP3.6 and replacing the CLKIN source. Youmust also replace oscillator U3 with a different frequency 5.0-V oscillator. Youcan use SMA connector J1 by removing and installing the 68 Ω resistor R2 inthe location of R3. When changing frequencies, see the TMS320C6201 DigitalSignal Processor Data Sheet to achieve optimal performance for your desiredconfiguration of the TEB.

3.5 Interrupt Generation

Pressing the push-button switch S5 generates a manual reset of the ’C6201.Shunt jumpers JP3.1 (NMI) and JP3.2 (EXT_INT4)–JP3.5 (EXT_INT7) pullthe ’C6201’s external interrupts up or down. The factory default shunt jumpersettings must be pulled low because these interrupts are rising-edge sensitive.

Figure 2–1, page 2-3, shows solder connections for the interrupts at the upperright of the prototype area, to the right of U26. You must remove the appropri-ate interrupt shunt jumper(s) to control these interrupts with non-TEB circuitry(for example, prototype circuitry).

3.6 External Memories

The TEB provides four different types of memory for program execution anddata storage. The TEB’s memory types, their speeds and organizations, andthe selected ’C6201 chip enable signal are listed in Table 3–2:

Table 3–2. TEB Memories

Memory Type Designation

Timing (ns) Organization Total

’C6201CE

SBSRAM U10 6.7 128KB x 32 bits 512KB CE2

SDRAM U11–U14 12 2MB x 8 bits 8MB CE0

ASRAM U20–U21 12 64KB x 16 bits 256KB CE3

ROM U22–U25 200 32KB x 8 bits 128KB CE1

See the TMS320C6201 Digital Signal Processor Data Sheet for a descriptionof the chip enable signals and the processor memory map.

Clock Generation / Interrupt Generation / External Memories

Host Port Connection


3.7 Host Port Connection

Header J4 connects to the TEB and an off-board (user supplied and pro-grammed) host. The header is an AMP 2–767004–2 and the mating connectorpart number is AMP 767003–9.

3.8 Serial Ports and Timers Connection

Header J12 allows access to the ’C6201’s serial ports and timers. The headeris an AMP 2–767004–2 and the mating connector part number is AMP767003–9.

Note:

Timer input 0 (TINP0) and timer input 1 (TINP1) are pulled high by the factorydefault configuration of shunt jumpers JP3.23 and JP3.24, respectively.

3.9 Emulation Port Connection

Emulation connector J2 connects the ’C6201’s emulation port and either theXDS510 or XDS510WS emulator. Shunt jumpers JP3.16 and JP3.17 pull theEMU0 and EMU1 signal up or down. The factory default configuration causesthese signals to be pulled up. For more information about emulation signals,see the JTAG/MPSD Emulation Technical Reference.

SMA connector J3 allows you to provide an alternative TCK signal. To use thealternative TCK signal, shunt jumper JP2 must be moved from its factory de-fault position to connect pins 1 and 2.

Host Port Connection / Serial Ports and Timers Connection / Emulation Port Connection

Prototyping Area

3-6

3.10 Prototyping Area

Figure 2–1 shows the through-hole area for prototyping located at the left endof the TEB. This area includes two sockets for user-programmable 3.3-Vdc22V10 PAL devices (U26 and U27). Fused 3.3-Vdc (PVCC3) and 5.0-Vdc(PVCC5) supply connections are provided at both the top and bottom edges ofthe prototyping area. Fuses protect against attempts to draw more currentthan is allowed by the power supply’s design. Ground connections are pro-vided at the extreme left end of the prototyping area.

Connectors J8 and J9 provide connectivity to the ’C6201’s external memoryinterface’s data, address, and control busses. These 32-bit connectors pro-vide a direct connection with the modern test equipment cables. (The headerpart number is AMP 2–767004–2 and the mating connector part number isAMP 767003–9.) All 32 bits of data are available at J8. Only 19 bits of addressare available at J9 because the TEB’s prototyping area shares the ’C6201’sexternal address space CE1 with the on-board PEROM. Consequently, onlyasynchronous devices may be interfaced to J8 and J9. PAL U8 logic equa-tions (Appendix A) control buffers between the asynchronous memory portionof the TEB and the TEB’s prototyping area.

The ’C6201’s external interrupts are available as test points NMI andEXT_INT4–EXT_INT7. See section 3.5, Interrupt Generation, for detailsabout the use of these test points.

Use only fuses with ratings given in Table 3–1 to avoid damage tothe TEB.

Do not draw more current than allowed by the fuses. This candamage the power supply and the TEB.

Shunt Jumpers and DIP Switches


3.11 Shunt Jumpers and DIP Switches

You can configure the on-board ’C6201 and TEB devices by changing the set-tings of shunt jumpers and DIP switches described in Table 3–3 andTable 3–4.

Table 3–3. TEB Shunt Jumpers

Name Position Description

ROM protect JP1 Write protects Flash PEROM1–2 Writes disabled2–3 Writes enabled

TCLK select JP2 Selects JTAG clock1–2 SMA connector (J3)2–3 Emulation connector (J2)

NMI JP3.1 Nonmaskable interruptA–B ActiveB–C InactiveNONE Controlled by other logic (prototyping area)


JP3.2JP3.3JP3.4JP3.5

External interrupts: edge-driven (rising edge)A–B ActiveB–C InactiveNONE Controlled by other logic (prototyping area)

PLLFREQ1PLLFREQ2PLLFREQ3

JP3.6JP3.7JP3.8

Selects one of three frequency ranges for the ’C6201 CLKOUT1 signal

JP3.8 JP3.7 JP3.6 Frequency Range

B–C B–C B–C 25–135 MHzB–C B–C A–B 35–160 MHzB–C A–B B–C 40–200 MHz

CLKMODE0CLKMODE1

JP3.9JP3.10

Clock mode select. Selects the multiplication factor of the input clock fre-quency. CLKOUT1 is 1x or 4x CLKIN:

JP3.10 JP3.9 Clock Mode

B–C B–C PLL multiply-by-one modeB–C A–B ReservedA–B B–C ReservedA–B A–B PLL multiply-by-four mode

Shunt Jumpers and DIP Switches

3-8

Table 3–3. TEB Shunt Jumpers (Continued)


RSV0RSV1RSV2RSV3RSV4

JP3.11JP3.12JP3.13JP3.14JP3.15

Reserved

EMU0EMU1

JP3.16JP3.17

TI emulation support

LENDIAN JP3.18 Selects endianess of addressingB–C Big endianA–B Little endian

ARDY JP3.19 Asynchronous memory ready signal

HOLD– JP3.20 Hold request from host (external memory interface bus arbitration)

UNUSEDUNUSED

JP3.21JP3.22

UnusedUnused

TINP0TINP1

JP3.23JP3.24

Timer input 0Timer input 1

Note: A–B indicates HIGH (1)B–C indicates LOW (0)

Table 3–4. TEB DIP Switches



S4.1S4.2S4.3S4.4S4.5

Boot mode configuration. See the TMS320C62xx PeripheralsReference Guide for a complete description.

SWUSER S4.6 User-defined input to U8 PAL

A-1

Appendix A

TMS320C6201 TEB PAL Equations

This appendix contains the programmable logic source for the TMS320C6201test and evaluation board PAL equations. These were compiled with DATAI/O ABEL version 4.0.

Appendix A

Running Title—Attribute Reference

A-2

module U8_MLATitle ’PAL NAME Memory Logic Block A (PAL MLA)PAL # U8, D600555–1741*DWG NAME TMS320C6201 Test & Evaluation BoardASSY # D600550–0001BCOMPANY Texas Instruments, Incorporated

SYNTHESIS TOOL: ABEL–4 Design Environment v1.0’

U8 device ’P22V10C’; ”The PALLV22V10 is a 28–pin PLCC

”NC pin 1; NO CONNECT clkout1 pin 2; ”Clock out 1 from C6201 ce1_ pin 3; ”Chip enable 1 from C6201 awe_ pin 4; ”Asynchronous write enable from C6201 aoe_ pin 5; ”Asynchronous output enable from C6201 ea21 pin 6; ”EMIF address bit 21 from C6201 ce3_ pin 7; ”Chip enable 3 from C6201 ”NC pin 8; NO CONNECT tp2 pin 9; ”Test point(2) input – undefined tp3 pin 10; ”Test point(3) input – undefined tp4 pin 11; ”Test point(4) input – undefined tp5 pin 12; ”Test point(5) input – undefined swuser pin 13; ”Switch input – user defined GND pin 14; ”Ground ”NC pin 15; NO CONNECT reset_ pin 16; ”Reset a_dir pin 17; ”Asynchronous direction a_oe_ pin 18; ”Asynchronous buffer output enable romce_ pin 19; ”ROM Chip Enable p_ce_ pin 20; ”Prototype chip enable p_dir pin 21; ”Prototype buffer direction ”NC pin 22; NO CONNECT p_dboe_ pin 23; ”Prototype data buffer output enable p_aboe_ pin 24; ”Prototype addr buffer output enable tp6 pin 25; ”Test point(6) output – undefined tp7 pin 26; ”Test point(7) output – undefined tp8 pin 27; ”Test point(8) output – undefined VCC pin 28; ”Power



A-3 Chapter Title—Attribute Reference

Equations

”Because the TMS320C6201 may be in part of a write cycle (i.e., setup or hold ”time) when awe_ is inactive, the aoe_ signal should be used to determine the ”direction of the access.

”axoez axwez Access”––––– ––––– –––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––” 0 0 Invalid combination with the DSP ” Should not happen so disable the buffers

” 0 1 Read from asynchronous type to the DSP ” Should cause buffers to output towards the DSP

” 1 0 Write (strobe) to asynchronous type from the DSP ” Should cause buffers to output towards async type

” 1 1 Could be part of a write cycle (i.e., write setup or hold time)” Should cause buffers to output towards async type

a_dir = aoe_; ”A–>B (i.e., DSP to external memories) when 1, ”B–>A (i.e., external memories to DSP) when 0 a_oe_ = (ce1_ & ce3_ & awe_ & aoe_) # (!awe_ & !aoe_);

romce_ = ce1_ # ea21; ”Select flash ROM when ea21 = 0 p_ce_ = ce1_ # !ea21; ”Select Prototype area when ea21 = 1 p_dir = !(!ce1_ & ea21) # aoe_; p_dboe_ = (awe_ & aoe_) # (!awe_ & !aoe_) # ce1_ # !ea21; p_aboe_ = 0;

Test_Vectors ([ ce1_, ce3_,aoe_, awe_] –> [a_dir, a_oe_]) [ 1 , 1 , 0 , 0 ] –> [ 0 , 1 ]; [ 1 , 1 , 0 , 1 ] –> [ 0 , 0 ]; [ 1 , 1 , 1 , 0 ] –> [ 1 , 0 ]; [ 1 , 0 , 1 , 1 ] –> [ 1 , 0 ]; [ 0 , 1 , 1 , 1 ] –> [ 1 , 0 ]; [ 1 , 1 , 1 , 1 ] –> [ 1 , 1 ];




A-4

Test_Vectors ([ce1_, ea21, aoe_, awe_] –> [romce_, p_ce_, p_dir, p_dboe_, p_aboe_]) [ 0 , 0 , 0 , 0 ] –> [ 0 , 1 , 1 , 1 , 0 ]; [ 0 , 0 , 0 , 1 ] –> [ 0 , 1 , 1 , 1 , 0 ]; [ 0 , 0 , 1 , 0 ] –> [ 0 , 1 , 1 , 1 , 0 ]; [ 0 , 0 , 1 , 1 ] –> [ 0 , 1 , 1 , 1 , 0 ]; [ 0 , 1 , 0 , 0 ] –> [ 1 , 0 , 0 , 1 , 0 ]; [ 0 , 1 , 0 , 1 ] –> [ 1 , 0 , 0 , 0 , 0 ]; [ 0 , 1 , 1 , 0 ] –> [ 1 , 0 , 1 , 0 , 0 ]; [ 0 , 1 , 1 , 1 ] –> [ 1 , 0 , 1 , 1 , 0 ];

[ 1 , 0 , 0 , 0 ] –> [ 1 , 1 , 1 , 1 , 0 ]; [ 1 , 0 , 0 , 1 ] –> [ 1 , 1 , 1 , 1 , 0 ]; [ 1 , 0 , 1 , 0 ] –> [ 1 , 1 , 1 , 1 , 0 ]; [ 1 , 0 , 1 , 1 ] –> [ 1 , 1 , 1 , 1 , 0 ]; [ 1 , 1 , 0 , 0 ] –> [ 1 , 1 , 1 , 1 , 0 ]; [ 1 , 1 , 0 , 1 ] –> [ 1 , 1 , 1 , 1 , 0 ]; [ 1 , 1 , 1 , 0 ] –> [ 1 , 1 , 1 , 1 , 0 ]; [ 1 , 1 , 1 , 1 ] –> [ 1 , 1 , 1 , 1 , 0 ];

end


B-1

Appendix A

TMS320C6201 TEB Schematics

This appendix contains the schematics for the TMS320C6201 TEB.

Appendix B

TM

S320C

6201 TE

B S

chematics

B-2

IC’S U2,U5,U6,U7,U9TEST POINTS TP1SWITCHES S1,S2,S3RESISTORS R4,R97

D.C.B.A.UNUSED REFERENCE DESIGNATORS:4.

C

ECNxxxxx(E) M. DAWKINSC

J. CLARK9–11–97ECN10289(B) M. DAWKINS 9–8–97

FORMAL RELEASE

B

8.BETWEEN REVISIONS OF THE SCHEMATICSPAGE ORDER AND NUMBERING MAY CHANGE

21

CC

201918

CC

WITH REV 2.X OF THE C6201 SILICONTHIS REVISION OF THE BOARD IS COMPATIBLE

TEST POINTS TP24K.

C

17

6–6–97

6–6–97

6–6–97

6–6–97

6–6–97

6–6–97

6–6–97

1–20–97

ECN970401(E) M. DAWKINS 4–3–97 J. CLARKA

7.

6.

2.

MUST CONNECT TO THE GROUND PLANE.ALL FOUR SHIELD CONNECTIONS OF J1 AND J3

OR DOWN(GND) FOR CONTROL OF THESE SIGNALS.APPROPRIATE, MUST NOT BE PULLED UP(VCC3)SHUNTS FOR NMI AND EXT_INT4–EXT_INT7, AS

CAPACITANCE VALUES ARE IN MICROFARADS.

IS TOO LARGE TO SHOW ON A SINGLE SHEET.THIS IS A 352–CONTACT BGA DEVICE THATU1A–U1I COMPRISE A SINGLE TMS320C6201.5.

TANTALUM CAPS CT11

G. CONNELLY

RESISTORS R108SWITCHES S5I.

H.G.F.E.D.C.B.A.

FILTER L1SHUNTS JP3CONNECTORS/HEADERS J12FUSES F5DIODES D1

CERAMIC CAPS C71

IC’S U32J.

M. DAVIS

G. CONNELLY

CC

CCCCCC

CCC

1615

141312111098

765

D600550

J. CLARK

M. JACKSON

J. WHISONANT

R. LERNER

C

4

ENGR–MGR

MFGC CC

321DATE

DATE

DATE

DATE

DATE

DATE

DATE

RLSE

QA

ENGR

CHK

DWN

USED ONNEXT ASSY

APPLICATIONSH

REV

SH

REV

SH

REV

REVISION STATUS OF SHEETS

1.

3.

RESISTANCE VALUES ARE IN OHMS.

HIGHEST REFERENCE DESIGNATOR USED:

NOTES, UNLESS OTHERWISE SPECIFIED: REVISIONS

APPROVEDDATEDESCRIPTIONREV

ofSheetDate:

RevDocument NumberSize

TitleHOUSTON, TEXAS

Wednesday, October 29, 1997 211

A

SEMICONDUCTOR GROUPSOFTWARE DEVELOPMENT SYSTEMS

TEXAS INSTRUMENTS

TMS320C6201 TEST & EVALUATION BOARD

CD600552

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chematics

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TM

S320C

6201 TE

B S

chematics

VCC3

CLOCKEXT. ’C6201

CLOCKEXT. JTAG

VCC3

GNDGND

GND

VCC5

GNDVCC3

GND

VCC2

(CP)

(CS)

(RS)

’C6201 CLOCK/CONTROL BLOCK

INUM2

RSV1

NMIINUM0

RSV2

EXT_INT4

INUM3

PD–

PLLFREQ2

EXT_INT7

PLLFREQ3

EXT_INT5

RSV4

EXT_INT6INUM1

RSV0

RESET–

CLKMODE0

RSV3

IACK

PLLFREQ1 CLKOUT1CLKOUT2

CLKMODE1

EMU1

EMU0

20KR108 20KR107 20KR106

A23RSV8

B22RSV7

C21RSV6

C8RSV5

A6RSV4

D3PD

B9RSV3

C11RSV2

G2RSV1

T2RSV0

C12PLLG

D12PLLV

W2TDO

AF20CLKOUT2

AF22CLKOUT1

AA1INUM3

W4INUM2

AA2INUM1

AB1INUM0

Y2IACK

Y1EMU1

W3EMU0

T1TRST

R3TCK

R4TDI

L3TMS

B10PLLFREQ1

A9PLLFREQ3

D11PLLFREQ2

A11PLLF

C6CLKMODE1

C5CLKMODE0

C10CLKIN

U3EXT_INT7

V2EXT_INT6

W1EXT_INT5

U4EXT_INT4

L2NMI

K2RESET

U1A

C6201_CLOCK_CONTROL

1E/D

8OUT

14VDD

7GND

OSC

U3

14

13

12

11

10

9

8

7

6

5

4

3

2

1

HDR 7X2

J2

2GND

3OUT

1IN

ACF153

L1

SMAJ1

SMAJ3

32

1

HDR 3X1

JP2

NO_POPR3

68R2

16R1

+10CT1

.0039C2

.22C3

.01C1

10GND

32Y4

52Y3

72Y2

92Y1

121Y4

141Y3

161Y2

181Y1

20VCC

192OE

11OE

172A4

152A3

132A2

112A1

81A4

61A3

41A2

21A1

74LVTH240

U4

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VCC3

GND

’C6201 BOOT CONTROL

BOOTMODE0

BOOTMODE4

BOOTMODE2BOOTMODE3

BOOTMODE1

SWUSER

TOUT0TOUT1

DMAC0DMAC1DMAC2DMAC3

TINP0TINP1

K4TINP0

K24TINP1

E2DMAC0

D1DMAC1

F4DMAC2

D2DMAC3

M4TOUT0

H24TOUT1

C4BOOTMODE0

D5BOOTMODE1

A3BOOTMODE2

B4BOOTMODE3

D8BOOTMODE4

U1B

C6201_BOOT_CONTROL

S4

10KR5

10KR10 10KR9 10KR8 10KR7 R6 10K

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VCC3VCC3

GND

’C6201 HPIF BLOCK

HD8

HD12

HD0HD1

HD9

HD14

HD0

HD2

HD4

HD6

HD11

HD10HD9

HD7HD8

HD3

HD13

HD12HD11

HD2

HD1

HD3

HD6

HD13HD14

HD5HD5HD4

HD15

HD7

HD10HCNTRL1HCNTRL0HHWILHBE1–HBE0–HR/W–HDS1–

HCS–HDS2–

HAS–

HINT–

HD15

HRDY–

HD[0..15]

C22HAS

B21HD0

B13HD15

B14HD14

C14HD13

B15HD12

D15HD11

B16HD10

A17HD9

B17HD8

D16HD7

B18HD6

A19HD5

C18HD4

B19HD3

C19HD2

B20HD1

F23HCNTRL1

D25HCNTRL0

C26HHWIL

E23HBE1–

D24HBE0–

C23HR/W

D22HDS1

A24HDS2

B23HCS

J24HRDY

H26HINT

U1E

C6201_HPIF

20

19

21

18

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17

23

16

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15

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26

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27

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28

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’C6201 SERIAL IF

GND

TOUT0

TOUT1


TINP1

TINP0

P3FSX0

P4FSR0

R1DX0

J1DR0

L1CLKX0

M2CLKR0

L4CLKS0

F25FSX1

E26FSR1

G23DX1

D26DR1

F26CLKX1

H23CLKR1

E25CLKS1

U1F

C6201_MCSP

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chematics

VCC3

’C6201 EBUS BLOCK

CE1–CE0–

CE2–CE3–

SSCLKSDCLK

EA[2..21]

ED[0..31]

HOLDA–

HOLD–

ARE–

LENDIAN

ARDY

SSWE–SSOE–SSADS–SDA10SDWE–SDCAS–SDRAS–

AWE–AOE–

BE3–BE2–BE1–BE0–

ED31ED30ED29ED28ED27ED26ED25ED24ED23ED22ED21ED20ED19ED18ED17ED16 EA21ED15 EA20ED14 EA19ED13 EA18ED12 EA17ED11 EA16ED10 EA15ED9 EA14ED8 EA13ED7 EA12ED6 EA11ED5 EA10ED4 EA9ED3 EA8ED2 EA7ED1 EA6ED0 EA5

EA4EA3EA2

AE20SDCLK

AD17SSCLK

AF24SDRAS AD22SDCAS AF23SDWE

AF21SSOE

AC24AOE AD23AWE

AD21SDA10 AC20SSADS

AD19SSWE

Y24ARE

A7HOLDA

AE22CE3

H3LENDIAN

AB2ED31

AC1ED30

AA4ED29

AD1ED28

AC3ED27

AD4ED26

AF3ED25

AE4ED24

AD5ED23

AF4ED22

AE5ED21

AD6ED20

AE6ED19

AD7ED18

AC8ED17

AF7ED16

AD9ED15

AD10ED14

AF9ED13

AC11ED12

AE10ED11

AE11ED10

AF11ED9

AE14ED8

AF15ED7

AE15ED6

AF16ED5

AC15ED4

AE17ED3

AF18ED2

AF19ED1

AC17ED0

AA25HOLD

W23ARDY

AD26CE2

AB24CE1

AC26CE0

AB25BE3

AA24BE2

Y23BE1

AA26BE0

J26EA21

K25EA20

L24EA19

K26EA18

M26EA17

M25EA16

P25EA15

P24EA14

R25EA13

T26EA12

R23EA11

U26EA10

U25EA9

T23EA8

V26EA7

V25EA6

W26EA5

V24EA4

W25EA3

Y26EA2

U1C

C6201_EMIF

33R37

33R40 33R39 33R38

10KR63 10KR62 10KR61 10KR60 10KR59 10KR58 10KR57 10KR56 10KR55 10KR54 10KR53 10KR52

33R51

33R43

33R50 33R49 33R48 33R47 33R46 33R45 33R44

33R42 33R41

33R36 33R35 33R34 33R33

33R32 33R31 33R30 33R29 33R28 33R27 33R26 33R25 33R24 33R23 33R22 33R21 33R20 33R19 33R18 33R17 33R16 33R15 33R14 33R13

ofSheetDate:


Title


A

TEXAS INSTRUMENTS


CD600552

11

22

33

44

E

E

D

D

C

C

B

B

A

A

TM

S320C

6201 TE

B S

chematics

B-8

GND

GND

VCC3

VCC3

SBSRAM

ED[0..31]

EA[2..21]

SSWE–SSADS–

SSOE–

SSCLKBE3–BE2–BE1–BE0–

CE2–

EA18EA17

ED31ED30ED29ED28ED27ED26ED25ED24ED23ED22ED21ED20ED19ED18ED17ED16ED15ED14EA16ED13EA15ED12EA14ED11EA13ED10EA12ED9EA11ED8EA10ED7EA9ED6EA8ED5EA7ED4EA6ED3EA5ED2EA4ED1EA3ED0EA2

64ZZ

66NC

16NC

43NC

42NC

39NC

38NC 30

DQP4

1DQP3

80DQP2

51DQP1

50A16

49A15

29DQ32

28DQ31

25DQ30

24DQ29

23DQ28

22DQ27

19DQ26

18DQ25

13DQ24

12DQ23

9DQ22

8DQ21

7DQ20

6DQ19

3DQ18

2DQ17

79DQ16

78DQ15

75DQ14

74DQ13

73DQ12

72DQ11

69DQ10

68DQ9

63DQ8

62DQ7

59DQ6

58DQ5

57DQ4

56DQ3

53DQ2

52DQ1

31MODE

88GW#

87BWE#

85ADSC#

84ADSP#

83ADV#

86OE#

97CE2

92CE2#

98CE#

89CLK

96BW4#

95BW3#

94BW2#

93BW1#

48A14

47A13

46A12

45A11

44A10

81A9

82A8

99A7

100A6

32A5

33A4

34A3

35A2

36A1

37A0

GVT71128G36T

U10

ofSheetDate:


Title


A

TEXAS INSTRUMENTS


CD600552

11

22

33

44

E

E

D

D

C

C

B

B

A

A

TM

S320C

6201 TE

B S

chematics

B-9

TM

S320C

6201 TE

B S

chematics

VCC3

VCC3 VCC3

VCC3

VCC3VCC3

VCC3 VCC3

GND GND

GNDGND

SDRAM

SDA10

CE0–

CE0–CE0–

SDCLK

SDCLKSDCLK

SDCLK

EA[2..21]

ED[0..31]

BE2–

SDWE–SDCAS–SDRAS–

BE3–

SDA10


BE1–

SDA10



BE0–

SDA10

CE0–

ED31ED23ED30ED22ED29EA13ED21EA13ED28ED20ED27ED19ED26EA11ED18EA11ED25EA10ED17EA10ED24EA9ED16EA9

EA8EA8EA7EA7EA6EA6EA5EA5EA4EA4EA3EA3EA2EA2

ED15ED7ED14ED6ED13EA13ED5EA13ED12ED4ED11ED3ED10EA11ED2EA11ED9EA10ED1EA10ED8EA9ED0EA9

EA8EA8EA7EA7EA6EA6EA5EA5EA4EA4EA3EA3EA2EA2

42VSSQ

38VSSQ

7VSSQ

3VSSQ

23VSS

44VSS

43DQ7

41DQ6

39DQ5

37DQ4

8DQ3

6DQ2

4DQ1

2DQ0

40VCCQ

36VCCQ

9VCCQ

5VCCQ

22VCC

1VCC

32CLK

31CKE

12W

13CAS

14RAS

15CS

33DQM

16A11

17A10

29A9

28A8

27A7

26A6

25A5

24A4

21A3

20A2

19A1

18A0

TMS626812DGE

U14

42VSSQ

38VSSQ

7VSSQ

3VSSQ

23VSS

44VSS

43DQ7

41DQ6

39DQ5

37DQ4

8DQ3

6DQ2

4DQ1

2DQ0

40VCCQ

36VCCQ

9VCCQ

5VCCQ

22VCC

1VCC

32CLK

31CKE

12W

13CAS

14RAS

15CS

33DQM

16A11

17A10

29A9

28A8

27A7

26A6

25A5

24A4

21A3

20A2

19A1

18A0

TMS626812DGE

U13

42VSSQ

38VSSQ

7VSSQ

3VSSQ

23VSS

44VSS

43DQ7

41DQ6

39DQ5

37DQ4

8DQ3

6DQ2

4DQ1

2DQ0

40VCCQ

36VCCQ

9VCCQ

5VCCQ

22VCC

1VCC

32CLK

31CKE

12W

13CAS

14RAS

15CS

33DQM

16A11

17A10

29A9

28A8

27A7

26A6

25A5

24A4

21A3

20A2

19A1

18A0

TMS626812DGE

U12

42VSSQ

38VSSQ

7VSSQ

3VSSQ

23VSS

44VSS

43DQ7

41DQ6

39DQ5

37DQ4

8DQ3

6DQ2

4DQ1

2DQ0

40VCCQ

36VCCQ

9VCCQ

5VCCQ

22VCC

1VCC

32CLK

31CKE

12W

13CAS

14RAS

15CS

33DQM

16A11

17A10

29A9

28A8

27A7

26A6

25A5

24A4

21A3

20A2

19A1

18A0

TMS626812DGE

U11

ofSheetDate:


Title


A

TEXAS INSTRUMENTS


CD600552

11

22

33

44

E

E

D

D

C

C

B

B

A

A

TM

S320C

6201 TE

B S

chematics

B-10

GND

MEMORY LOGIC

GND

VCC3

CE3–

P_ABOE–

ROMCE–

CE1–

P_DBOE–

EA21 P_CE–P_DIR

SWUSERRESET–

CLKOUT1

AOE–AWE– A_OE–

A_DIR

TPTP5

TP GND

TPTP2 TPTP3 TPTP4 TP TP6

TP TP7 TP TP8

22NC

15NC8

NC

1NC

14GND

27I/O9

26I/O8

25I/O7

24I/O6

23I/O5

21I/O4

20I/O3

19I/O2

18I/O1

17I/O0

28VCC

16I11

13I10

12I9

11I8

10I7

9I6

7I5

6I4

5I3

4I2

3I1

2CLK/I0

PALLV22V10–JC

U8

ofSheetDate:


Title


A

TEXAS INSTRUMENTS


CD600552

11

22

33

44

E

E

D

D

C

C

B

B

A

A

TM

S320C

6201 TE

B S

chematics

B-11

TM

S320C

6201 TE

B S

chematics

VCC3

GND GND

VCC3

DRIVEN EBUS – DATA

A_DIRA_OE–

B_ED[0..31]

ED[0..31]

B_ED4B_ED19

B_ED31

B_ED0

B_ED20

B_ED26

B_ED15

B_ED3

B_ED6B_ED23B_ED7

B_ED8

B_ED10

B_ED14

B_ED16B_ED1

B_ED18

B_ED27B_ED28B_ED29

B_ED17

B_ED9

B_ED11

B_ED2

B_ED13

B_ED5

B_ED12

B_ED30

B_ED21B_ED22

B_ED24B_ED25

ED16

ED14

ED27

ED1ED2

ED15

ED20

ED0

ED3

ED5ED6

ED4

ED7ED8

ED23ED24ED25

ED22

ED26ED9

ED17ED18

ED28ED29

ED10ED11

ED19

ED30ED31

ED12ED13

ED21

45GND

39GND

34GND

28GND

21GND

15GND

10GND

4GND

232B8

222B7

202B6

192B5

172B4

162B3

142B2

132B1

121B8

111B7

91B6

81B5

61B4

51B3

31B2

21B1

262A8

272A7

292A6

302A5

322A4

332A3

352A2

362A1

371A8

381A7

401A6

411A5

431A4

441A3

461A2

471A1

242DIR

252OE

11DIR

481OE

42VCC

31VCC

18VCC

7VCC

U16

SN74ALVCH16245

45GND

39GND

34GND

28GND

21GND

15GND

10GND

4GND

232B8

222B7

202B6

192B5

172B4

162B3

142B2

132B1

121B8

111B7

91B6

81B5

61B4

51B3

31B2

21B1

262A8

272A7

292A6

302A5

322A4

332A3

352A2

362A1

371A8

381A7

401A6

411A5

431A4

441A3

461A2

471A1

242DIR

252OE

11DIR

481OE

42VCC

31VCC

18VCC

7VCC

U15

SN74ALVCH16245

ofSheetDate:


Title


A

TEXAS INSTRUMENTS


CD600552

11

22

33

44

E

E

D

D

C

C

B

B

A

A

TM

S320C

6201 TE

B S

chematics

B-12

VCC3

GND

VCC3

GND GNDGND

DRIVEN EBUS – ADDR

B_DMAC3B_DMAC2B_DMAC1B_DMAC0

DMAC3DMAC2DMAC1DMAC0

B_CE3–B_CE2–B_CE1–B_CE0–

CE3–

CE0–CE1–CE2–

B_EA[2..21]

EA[2..21]

B_BE3–B_BE2–B_BE1–B_BE0–

BE3–BE2–BE1–BE0–

B_EA17EA17

B_EA19B_EA18

EA19EA18

B_EA21EA21B_EA20EA20

B_EA16EA16B_EA15EA15B_EA14EA14B_EA13EA13B_EA12EA12B_EA11EA11B_EA10EA10B_EA9EA9B_EA8EA8B_EA7EA7B_EA6EA6B_EA5EA5B_EA4EA4B_EA3EA3B_EA2EA2

45GND

39GND

10GND

4GND

34GND

28GND

21GND

15GND

244OE

253OE

482OE

11OE

234Y4

224Y3

204Y2

194Y1

173Y4

163Y3

143Y2

133Y1

122Y4

112Y3

92Y2

82Y1

61Y4

51Y3

31Y2

21Y1

264A4

274A3

294A2

304A1

323A4

333A3

353A2

363A1

372A4

382A3

402A2

412A1

431A4

441A3

461A2

471A1

42VCC

31VCC

18VCC

7VCC

U18

SN74ALVCH16244

45GND

39GND

10GND

4GND

34GND

28GND

21GND

15GND

244OE

253OE

482OE

11OE

234Y4

224Y3

204Y2

194Y1

173Y4

163Y3

143Y2

133Y1

122Y4

112Y3

92Y2

82Y1

61Y4

51Y3

31Y2

21Y1

264A4

274A3

294A2

304A1

323A4

333A3

353A2

363A1

372A4

382A3

402A2

412A1

431A4

441A3

461A2

471A1

42VCC

31VCC

18VCC

7VCC

U17

SN74ALVCH16244

ofSheetDate:


Title


A

TEXAS INSTRUMENTS


CD600552

11

22

33

44

E

E

D

D

C

C

B

B

A

A

TM

S320C

6201 TE

B S

chematics

B-13

TM

S320C

6201 TE

B S

chematics

VCC3

DRIVEN CONTROL

VCC3

GND GND

B_HOLDA–HOLDA–

SDCLKB_CLKOUT2

B_ARE–

B_SSWE–

B_CLKOUT1

B_SDCLK

AWE–

B_SSOE–

ARE–

SDWE–

CLKOUT2

B_SDWE–

B_AWE–

SSOE–

B_SSADS–SDA10 B_SDA10

CLKOUT1

SDRAS–

SSADS–

AOE– B_AOE–

B_SDRAS–B_SDCAS–SDCAS–

SSWE–

SSCLK B_SSCLK

10KR105

45GND

39GND

10GND

4GND

34GND

28GND

21GND

15GND

244OE

253OE

482OE

11OE

234Y4

224Y3

204Y2

194Y1

173Y4

163Y3

143Y2

133Y1

122Y4

112Y3

92Y2

82Y1

61Y4

51Y3

31Y2

21Y1

264A4

274A3

294A2

304A1

323A4

333A3

353A2

363A1

372A4

382A3

402A2

412A1

431A4

441A3

461A2

471A1

42VCC

31VCC

18VCC

7VCC

U19

SN74ALVCH16244

ofSheetDate:


Title


A

TEXAS INSTRUMENTS


CD600552

11

22

33

44

E

E

D

D

C

C

B

B

A

A

TM

S320C

6201 TE

B S

chematics

B-14

GND

GND

GND GND GNDVCC3

SHUNTS & OBSERVATION CONNECTORS

P_CE–ROMCE–

A_DIR

B_ARE–

B_CLKOUT1

HOLD–B_HOLDA–

B_CLKOUT2

B_DMAC3B_DMAC2B_DMAC1B_DMAC0

TINP1TINP0

B_EA[2..21]

B_CLKOUT1

PD–B_SSCLK

B_CE3– CE3–

CE2–CE1–CE0–

RSV4

B_SDCLK

B_ED[0..31]

AOE–

EMU1

HOLD–

ARDYB_BE3–B_BE2–B_BE1–B_BE0–

B_SSOE–B_SSWE–

B_SSADS–B_SDA10

B_SDWE–B_SDCAS–B_SDRAS–B_AWE–B_AOE–B_CE2–B_CE1–B_CE0–

RESET–

NMI

INUM3INUM2INUM1INUM0

IACK

ARDYLENDIAN

EMU0

RSV3

RSV0RSV1RSV2

CLKMODE1CLKMODE0

PLLFREQ2PLLFREQ1

PLLFREQ3


B_EA17B_EA16B_EA15B_EA14B_EA13B_EA12B_EA11B_EA10B_EA9B_EA8B_EA7B_EA6B_EA5B_EA4B_EA3B_EA2

B_EA21

B_EA19B_EA18

B_EA20

B_ED31B_ED15B_ED30B_ED14B_ED29B_ED13B_ED28B_ED12B_ED27B_ED11B_ED26B_ED10B_ED25B_ED9B_ED24B_ED8B_ED23B_ED7B_ED22B_ED6B_ED21B_ED5B_ED20B_ED4B_ED19B_ED3B_ED18B_ED2B_ED17B_ED1B_ED16B_ED0

20KR89

24

23

22

21

20

19

18

17

16

15

14

13

12

11

10

9

8

7

6

5

4

3

2

1

JP3C

24

23

22

21

20

19

18

17

16

15

14

13

12

11

10

9

8

7

6

5

4

3

2

1

JP3B

24

23

22

21

20

19

18

17

16

15

14

13

12

11

10

9

8

7

6

5

4

3

2

1

JP3A

20

19

21

18

22

17

23

16

24

15

25

14

26

13

27

12

28

11

29

10

30

9

31

8

32

7

33

6

34

5

35

4

36

3

37

2

38

1

MICTORJ5

20

19

21

18

22

17

23

16

24

15

25

14

26

13

27

12

28

11

29

10

30

9

31

8

32

7

33

6

34

5

35

4

36

3

37

2

38

1

MICTORJ6

20

19

21

18

22

17

23

16

24

15

25

14

26

13

27

12

28

11

29

10

30

9

31

8

32

7

33

6

34

5

35

4

36

3

37

2

38

1

MICTORJ7

20KR88

20KR78

10KR87 10KR86 NO_POPR85 NO_POPR84 10KR83 10KR82 10KR81 4.7KR80 4.7KR79

20KR77 20KR76 20KR75 20KR74 10KR73 10KR72 10KR71 10KR70 10KR69 10KR68 10KR67 10KR66 10KR65 10KR64

TP TP11

TP TP10

ofSheetDate:


Title


A

TEXAS INSTRUMENTS


CD600552

11

22

33

44

E

E

D

D

C

C

B

B

A

A

TM

S320C

6201 TE

B S

chematics

B-15

TM

S320C

6201 TE

B S

chematics

VCC3 VCC3

GNDGND

ASRAM

B_AOE–B_AWE–

B_CE3–

B_ED[0..31]

B_EA[2..21]

B_BE3–B_BE2–

B_AOE–B_AWE–B_BE1–B_BE0–B_CE3–

B_ED31B_ED15B_ED30B_ED14B_ED29B_ED13B_ED28B_EA17B_ED12B_EA17B_ED27B_EA16B_ED11B_EA16B_ED26B_EA15B_ED10B_EA15B_ED25B_EA14B_ED9B_EA14B_ED24B_EA13B_ED8B_EA13B_ED23B_EA12B_ED7B_EA12B_ED22B_EA11B_ED6B_EA11B_ED21B_EA10B_ED5B_EA10B_ED20B_EA9B_ED4B_EA9B_ED19B_EA8B_ED3B_EA8B_ED18B_EA7B_ED2B_EA7B_ED17B_EA6B_ED1B_EA6B_ED16B_EA5B_ED0B_EA5

B_EA4B_EA4B_EA3B_EA3B_EA2B_EA2

12GND

34GND

38I/O16

37I/O15

36I/O14

35I/O13

32I/O12

31I/O11

30I/O10

29I/O9

16I/O8

15I/O7

14I/O6

13I/O5

10I/O4

9I/O3

8I/O2

7I/O1

33VDD

11VDD

28NU

41OE

17WE

40UB

39LB

6CE

18A15

19A14

20A13

21A12

24A11

25A10

26A9

27A8

42A7

43A6

44A5

1A4

2A3

3A2

4A1

5A0

TC55V1664AJ

U21

12GND

34GND

38I/O16

37I/O15

36I/O14

35I/O13

32I/O12

31I/O11

30I/O10

29I/O9

16I/O8

15I/O7

14I/O6

13I/O5

10I/O4

9I/O3

8I/O2

7I/O1

33VDD

11VDD

28NU

41OE

17WE

40UB

39LB

6CE

18A15

19A14

20A13

21A12

24A11

25A10

26A9

27A8

42A7

43A6

44A5

1A4

2A3

3A2

4A1

5A0

TC55V1664AJ

U20

ofSheetDate:


Title


A

TEXAS INSTRUMENTS


CD600552

11

22

33

44

E

E

D

D

C

C

B

B

A

A

TM

S320C

6201 TE

B S

chematics

B-16

GND

GNDGND

GND

VCC3

VCC3VCC3

VCC3VCC3

FLASH ROM

B_AOE–

B_AOE–B_AOE–

ROM_WE–

ROMCE–

ROM_WE–

ROMCE–ROM_WE–

ROMCE–

ROM_WE–

B_ED[0..31]

B_EA[2..21]

B_AWE–

ROM_WE–B_AOE–

ROMCE–

B_EA16B_EA15B_EA16B_EA14B_EA15B_EA13B_EA14

B_ED31B_EA12B_EA13B_ED30B_EA11B_ED23B_EA12B_ED29B_EA10B_ED22B_EA11B_ED28B_EA9B_ED21B_EA10B_ED27B_EA8B_ED20B_EA9B_ED26B_EA7B_ED19B_EA8B_ED25B_EA6B_ED18B_EA7B_ED24B_EA5B_ED17B_EA6

B_EA4B_ED16B_EA5B_EA3B_EA4B_EA2B_EA3

B_EA2

B_EA16B_EA15B_EA16B_EA14B_EA15B_EA13B_EA14

B_ED15B_EA12B_EA13B_ED14B_EA11B_ED7B_EA12B_ED13B_EA10B_ED6B_EA11B_ED12B_EA9B_ED5B_EA10B_ED11B_EA8B_ED4B_EA9B_ED10B_EA7B_ED3B_EA8B_ED9B_EA6B_ED2B_EA7B_ED8B_EA5B_ED1B_EA6

B_EA4B_ED0B_EA5B_EA3B_EA4B_EA2B_EA3

B_EA2

32

1

HDR 3X1

JP1

16GND

22I/O7

21I/O6

20I/O5

19I/O4

18I/O3

15I/O2

14I/O1

13I/O0

32VCC

2WE

25OE

23CE

31A14

30A13

3A12

27A11

24A10

28A9

29A8

4A7

5A6

6A5

7A4

8A3

9A2

10A1

11A0

AT29LV256–JC

U25

16GND

22I/O7

21I/O6

20I/O5

19I/O4

18I/O3

15I/O2

14I/O1

13I/O0

32VCC

2WE

25OE

23CE

31A14

30A13

3A12

27A11

24A10

28A9

29A8

4A7

5A6

6A5

7A4

8A3

9A2

10A1

11A0

AT29LV256–JC

U24

16GND

22I/O7

21I/O6

20I/O5

19I/O4

18I/O3

15I/O2

14I/O1

13I/O0

32VCC

2WE

25OE

23CE

31A14

30A13

3A12

27A11

24A10

28A9

29A8

4A7

5A6

6A5

7A4

8A3

9A2

10A1

11A0

AT29LV256–JC

U23

16GND

22I/O7

21I/O6

20I/O5

19I/O4

18I/O3

15I/O2

14I/O1

13I/O0

32VCC

2WE

25OE

23CE

31A14

30A13

3A12

27A11

24A10

28A9

29A8

4A7

5A6

6A5

7A4

8A3

9A2

10A1

11A0

AT29LV256–JC

U22

10KR90

ofSheetDate:


Title


A

TEXAS INSTRUMENTS


CD600552

11

22

33

44

E

E

D

D

C

C

B

B

A

A

TM

S320C

6201 TE

B S

chematics

B-17

TM

S320C

6201 TE

B S

chematics

PROTOTYPE AREA DRIVEN EBUS – DATA

VCC3

GND GND

VCC3

B_ED[0..31]

PB_ED[0..31]

P_DIRP_DBOE–

B_ED20

B_ED22

B_ED27

B_ED9B_ED10

B_ED7

B_ED3 B_ED19

B_ED23

B_ED18B_ED1

B_ED25

B_ED29B_ED13

B_ED15

B_ED4

B_ED26

B_ED14

B_ED12

B_ED0

B_ED11

B_ED17

B_ED8

B_ED21B_ED5

B_ED24

B_ED30

B_ED28

B_ED2

B_ED31

B_ED6

B_ED16

PB_ED4PB_ED19

PB_ED31

PB_ED0

PB_ED20

PB_ED26

PB_ED15

PB_ED3

PB_ED6PB_ED23PB_ED7

PB_ED8

PB_ED10

PB_ED14

PB_ED16PB_ED1

PB_ED18

PB_ED27PB_ED28PB_ED29

PB_ED17

PB_ED9

PB_ED11

PB_ED2

PB_ED13

PB_ED5

PB_ED12

PB_ED30

PB_ED21PB_ED22

PB_ED24PB_ED25

45GND

39GND

34GND

28GND

21GND

15GND

10GND

4GND

232B8

222B7

202B6

192B5

172B4

162B3

142B2

132B1

121B8

111B7

91B6

81B5

61B4

51B3

31B2

21B1

262A8

272A7

292A6

302A5

322A4

332A3

352A2

362A1

371A8

381A7

401A6

411A5

431A4

441A3

461A2

471A1

242DIR

252OE

11DIR

481OE

42VCC

31VCC

18VCC

7VCC

U29

SN74ALVTH16245

45GND

39GND

34GND

28GND

21GND

15GND

10GND

4GND

232B8

222B7

202B6

192B5

172B4

162B3

142B2

132B1

121B8

111B7

91B6

81B5

61B4

51B3

31B2

21B1

262A8

272A7

292A6

302A5

322A4

332A3

352A2

362A1

371A8

381A7

401A6

411A5

431A4

441A3

461A2

471A1

242DIR

252OE

11DIR

481OE

42VCC

31VCC

18VCC

7VCC

U28

SN74ALVTH16245

ofSheetDate:


Title


A

Texas Instruments

TMS302C6201 TEST AND EVALUATION BOARD

CD600552

11

22

33

44

E

E

D

D

C

C

B

B

A

A

TM

S320C

6201 TE

B S

chematics

B-18

PROTOTYPE AREA DRIVEN EBUS – ADDR/CTRL

PAL BPAL A

VCC3

GND

VCC3

VCC3

GND

VCC3 VCC3

GNDGND

P_ABOE–

PB_ARE–B_ARE–

PB_EA[2..20]

PB_BE3–PB_BE2–PB_BE1–PB_BE0–

B_AOE–B_AWE–

PB_AOE–PB_AWE–

B_EA[2..21]

B_BE3–B_BE2–B_BE1–B_BE0–

PB_EA17B_EA17

PB_EA19PB_EA18

B_EA19B_EA18

PB_EA20B_EA20

PB_EA16B_EA16PB_EA15B_EA15PB_EA14B_EA14PB_EA13B_EA13PB_EA12B_EA12PB_EA11B_EA11PB_EA10B_EA10PB_EA9B_EA9PB_EA8B_EA8PB_EA7B_EA7PB_EA6B_EA6PB_EA5B_EA5PB_EA4B_EA4PB_EA3B_EA3PB_EA2B_EA2

22NC

15NC8

NC

1NC

14GND

27I/O9

26I/O8

25I/O7

24I/O6

23I/O5

21I/O4

20I/O3

19I/O2

18I/O1

17I/O0

28VCC

16I11

13I10

12I9

11I8

10I7

9I6

7I5

6I4

5I3

4I2

3I1

2CLK/I0

PALLV22V10–JC

U27

TPI11B

TPI10B

TPI9B

TPI8B

TPI7B

TPI6B

TPI5B

TPI4B

TPI3B

TPI2B

TPI1B

TPCLK/I0B

TP IO9B

TP IO8B

TP IO7B

TP IO6B

TP IO5B

TP IO4B

TP IO3B

TP IO2B

TP IO1B

TP IO0B

10KR96 10KR95 10KR94 10KR93 10KR92 10KR91

22NC

15NC8

NC

1NC

14GND

27I/O9

26I/O8

25I/O7

24I/O6

23I/O5

21I/O4

20I/O3

19I/O2

18I/O1

17I/O0

28VCC

16I11

13I10

12I9

11I8

10I7

9I6

7I5

6I4

5I3

4I2

3I1

2CLK/I0

PALLV22V10–JC

U26

TPI11A

TPI10A

TPI9A

TPI8A

TPI7A

TPI6A

TPI5A

TPI4A

TPI3A

TPI2A

TPI1A

TPCLK/I0A

TP IO9A

TP IO8A

TP IO7A

TP IO6A

TP IO5A

TP IO4A

TP IO3A

TP IO2A

TP IO1A

TP IO0A

45GND

39GND

10GND

4GND

34GND

28GND

21GND

15GND

244OE

253OE

482OE

11OE

234Y4

224Y3

204Y2

194Y1

173Y4

163Y3

143Y2

133Y1

122Y4

112Y3

92Y2

82Y1

61Y4

51Y3

31Y2

21Y1

264A4

274A3

294A2

304A1

323A4

333A3

353A2

363A1

372A4

382A3

402A2

412A1

431A4

441A3

461A2

471A1

42VCC

31VCC

18VCC

7VCC

U31

SN74ALVTH16244

45GND

39GND

10GND

4GND

34GND

28GND

21GND

15GND

244OE

253OE

482OE

11OE

234Y4

224Y3

204Y2

194Y1

173Y4

163Y3

143Y2

133Y1

122Y4

112Y3

92Y2

82Y1

61Y4

51Y3

31Y2

21Y1

264A4

274A3

294A2

304A1

323A4

333A3

353A2

363A1

372A4

382A3

402A2

412A1

431A4

441A3

461A2

471A1

42VCC

31VCC

18VCC

7VCC

U30

SN74ALVTH16244

ofSheetDate:


Title


A

TEXAS INSTRUMENTS


CD600552

11

22

33

44

E

E

D

D

C

C

B

B

A

A

TM

S320C

6201 TE

B S

chematics

B-19

TM

S320C

6201 TE

B S

chematics

P_VCC5P_VCC3

GND

PROTOTYPE AREA – CONNECTORS

GND

GND

EXT_INT4

EXT_INT7EXT_INT6EXT_INT5

NMI

PB_EA[2..20]

P_CE–

B_CLKOUT1

B_HOLDA–HOLD–

ARDYPB_ARE–

PB_BE3–PB_BE2–PB_BE1–PB_BE0–

PB_AOE–PB_AWE–

PB_ED[0..31]

B_HOLDA–HOLD–PB_ARE–ARDYP_CE–PB_AOE–PB_AWE–PB_BE3–PB_BE2–PB_BE1–PB_BE0–

PB_EA18PB_EA19PB_EA20

PB_EA17PB_EA16PB_EA15PB_EA14PB_EA13PB_EA12PB_EA11PB_EA10PB_EA9PB_EA8PB_EA7PB_EA6PB_EA5PB_EA4PB_EA3PB_EA2

PB_ED24

PB_ED28

PB_ED20

PB_ED17

PB_ED27

PB_ED9PB_ED8

PB_ED21

PB_ED10

PB_ED28

PB_ED19

PB_ED29

PB_ED31

PB_ED2

PB_ED15

PB_ED11

PB_ED3

PB_ED14 PB_ED30

PB_ED21PB_ED5PB_ED4

PB_ED17

PB_ED27

PB_ED6

PB_ED26

PB_ED15

PB_ED16

PB_ED12

PB_ED22

PB_ED18

PB_ED25

PB_ED1

PB_ED7PB_ED24

PB_ED19

PB_ED23

PB_ED0

PB_ED18

PB_ED30

PB_ED23PB_ED22

PB_ED25

PB_ED31

PB_ED20

PB_ED29

PB_ED26

PB_ED13

PB_ED16

PB_EA5PB_EA4

PB_EA11PB_EA10

PB_EA12

PB_EA17

PB_EA2

PB_EA7

PB_EA9

PB_EA3

PB_EA8

PB_EA6

PB_EA15PB_EA14

PB_EA16

PB_EA13

B_CLKOUT1PB_EA20PB_EA19PB_EA18

PB_ED9PB_ED10

PB_ED8

PB_ED2

PB_ED11

PB_ED3

PB_ED14

PB_ED4PB_ED5PB_ED6

PB_ED12

PB_ED1

PB_ED7

PB_ED0

PB_ED13

TP P_GND

TP P_VCC3

TP P_VCC5

20

19

21

18

22

17

23

16

24

15

25

14

26

13

27

12

28

11

29

10

30

9

31

8

32

7

33

6

34

5

35

4

36

3

37

2

38

1

MICTOR

J9

20

19

21

18

22

17

23

16

24

15

25

14

26

13

27

12

28

11

29

10

30

9

31

8

32

7

33

6

34

5

35

4

36

3

37

2

38

1

MICTOR

J8

TP TP12

TPEXT_INT7

TPEXT_INT6

TPEXT_INT5

TPEXT_INT4

TPNMI

TP PB_EA19

TP PB_EA18

TP PB_EA20

TPPB_EA17

TPPB_EA16

TPPB_EA15

TPPB_EA14

TPPB_EA13

TPPB_EA12

TPPB_EA11

TPPB_EA10

TPPB_EA9

TPPB_EA8

TPPB_EA7

TPPB_EA6

TPPB_EA5

TPPB_EA4

TPPB_EA3

TPPB_EA2

TP PB_AWE–

TP B_HOLDA–

TP PB_BE1–

TP PB_ARE–

TP B_CLKOUT1

TP P_CE–

TP PB_BE2–

TP PB_BE0–

TP HOLD–

TP ARDY

TP PB_AOE–

TP PB_BE3–

TP PB_ED24

TPPB_ED15

TPPB_ED14

TPPB_ED13

TPPB_ED12

TPPB_ED11

TPPB_ED10

TPPB_ED9

TPPB_ED8

TPPB_ED7

TPPB_ED6

TPPB_ED5

TPPB_ED4

TPPB_ED3

TPPB_ED2

TPPB_ED1

TPPB_ED0

TP PB_ED31

TP PB_ED30

TP PB_ED29

TP PB_ED28

TP PB_ED27

TP PB_ED26

TP PB_ED25

TP PB_ED23

TP PB_ED22

TP PB_ED21

TP PB_ED20

TP PB_ED19

TP PB_ED18

TP PB_ED17

TP PB_ED16

ofSheetDate:


Title


A

TEXAS INSTRUMENTS


CD600552

11

22

33

44

E

E

D

D

C

C

B

B

A

A

TM

S320C

6201 TE

B S

chematics

B-20

GNDPOWER SUPPLYLOAD FOR 5 VOLT

VCC3

GND

GND

VCC5

43

21

P_VCC3 P_VCC5

FUSED PROTOTYPE POWER

POWER_ON

GND

GND

VCC3

GND

GND

GND

VCC2

VCC2

VCC3

VCC5

VCC5

FUSED MAIN POWER

’C6201 POWER & GND BLOCKS

RESET–

LEDD1

AC18CVDD

AC13CVDD

AC9CVDD

V4CVDD

N4CVDD

J4CVDD

V23CVDD

P23CVDD

J23CVDD

D18CVDD

D14CVDD

D9CVDD

AE25CVDD

AD24CVDD

AC23CVDD

B25CVDD

C24CVDD

D23CVDD

AC4CVDD

C1DVDD

AD3CVDD

F3DVDD

M3DVDD

AE2CVDD

N3DVDD

Y4DVDD

D4CVDD

AB3DVDD

AB4DVDD

C3CVDD AC6

DVDD

AF5DVDD

B2CVDD

AF6DVDD

E1CVDD

AC10DVDD

H4CVDD

AD11DVDD

F1CVDD

AD13DVDD

K1CVDD

AD15DVDD

M1CVDD

AF17DVDD

P2CVDD

AE18DVDD

U1CVDD

AD18DVDD

T3CVDD

AC19DVDD

T4CVDD

AE21DVDD

AD8CVDD

AC21DVDD

AE8CVDD

AC22DVDD

AC12CVDD

AC25DVDD

AE12CVDD

AB26DVDD

AF12CVDD

W24DVDD

AD14CVDD

U24DVDD

N25CVDD

T24DVDD

M24CVDD

R26DVDD

K23CVDD

N23DVDD

D20CVDD

L25DVDD

C20CVDD

J25DVDD

A20CVDD

H25DVDD

A16CVDD

G25DVDD

C15CVDD

G24DVDD

A12CVDD

A22DVDD

B12CVDD

A21DVDD

B11CVDD

D17DVDD

D6CVDD

A18DVDD

A5CVDD

A15DVDDB6

CVDD

A10DVDD

D7CVDD

B7DVDD

U1H

C6201_POWER

B8NC

A8NC

C9NC

D10NC

D21NC

R2NC

E4NC

G1NC

H2NC

H1NC

J2NC

K3NC

U1G

C6201_NC

P26VSS

N26VSS

P1VSS

N1VSS

AF14VSS

AF13VSS

A14VSS

A13VSS

AD25VSS

AE26VSS

AE24VSS

AF26VSS

AF25VSS

B24VSS

C25VSS

B26VSS

A26VSS

A25VSS

AE3VSS

AF2VSS

AD2VSS

AF1VSS

AE1VSS

B3VSS

C2VSS

A2VSS

B1VSS

A1VSS

E3VSS

G4VSS

F2VSS

G3VSS

J3VSS

N2VSS

U2VSS

V1VSS

V3VSS

Y3VSS

AA3VSS

AC2VSS

AC5VSS

AC7VSS

AE7VSS

AF8VSS

AE9VSS

AF10VSS

AD12VSS

AE13VSS

AC14VSS

AE16VSS

AD16VSS

AC16VSS

AE19VSS

AD20VSS

AE23VSS

AB23VSS

AA23VSS

Y25VSS

U23VSS

T25VSS

R24VSS

N24VSS

L26VSS

M23VSS

L23VSS

G26VSS

F24VSS

E24VSS

D19VSS

C17VSS

C16VSS

C13VSS

D13VSS

C7VSS

B5VSS

A4VSS

U1D

C6201_GROUND

TP TP24

TP TP23

TP TP22

TP TP21

TP TP20

TP TP19

TPTP18 TPTP17 TPTP16 TPTP15 TPTP14 TPTP13

30 R104 30 R103 30 R102 30 R101

2

1

NO POP

J11

S5

55.0V

32.5V

13.3V

6GND

4GND

2GND

POWER

J10

8RESET 5

PFO

7RESET

3GND

1MR

4PFI

2VCC

ADM708TAR

U32

1.5AF5 0.5AF4

4.0AF1

0.25AF3 7.0AF2

20KR98

10KR99

1KR100

ofSheetDate:


Title


A

TEXAS INSTRUMENTS


CD600552

11

22

33

44

E

E

D

D

C

C

B

B

A

A

TM

S320C

6201 TE

B S

chematics

B-21

TM

S320C

6201 TE

B S

chematics

’C6201 THERMAL BALLS

GNDGND

V18THB

V17THB

V16THB

V15THB

V14THB

V13THB

V12THB

V11THB

V10THB

V9THB

U18THB

U17THB

U16THB

U15THB

U14THB

U13THB

U12THB

U11THB

U10THB

U9THB

T18THB

T17THB

T16THB

T15THB

T14THB

T13THB

T12THB

T11THB

T10THB

T9THB

R18THB

R17THB

R16THB

R15THB

R14THB

R13THB

R12THB

R11THB

R10THB

R9THB

P18THB

P17THB

P16THB

P15THB

P14THB

P13THB

P12THB

P11THB

P10THB

P9THB

N18THB

N17THB

N16THB

N15THB

N14THB

N13THB

N12THB

N11THB

N10THB

N9THB

M18THB

M17THB

M16THB

M15THB

M14THB

M13THB

M12THB

M11THB

M10THB

M9THB

L18THB

L17THB

L16THB

L15THB

L14THB

L13THB

L12THB

L11THB

L10THB

L9THB

K18THB

K17THB

K16THB

K15THB

K14THB

K13THB

K12THB

K11THB

K10THB

K9THB

J18THB

J17THB

J16THB

J15THB

J14THB

J13THB

J12THB

J11THB

J10THB

J9THB

C6201_THERMAL_BALLS

U1I

ofSheetDate:


Title


A

TEXAS INSTRUMENTS


CD600552

11

22

33

44

E

E

D

D

C

C

B

B

A

A

TM

S320C

6201 TE

B S

chematics

B-22

GND

GNDGND

GND

GND GND GND

VCC3

VCC3VCC5

VCC2

VCC2

VCC2

VCC3

DECOUPLING

+NO_POPCT11+

NO_POPCT10

+22CT9+

22CT8+

22CT7+

22CT6+

22CT5+

22CT4

+4.7CT3+

4.7CT2

.1

C66

.1

C65

.1

C64

.1

C63

.1

C62

.1

C71

.1

C70

.1

C69

.1

C68

.1

C67

.1

C53

.1

C52

.1

C51

.1

C50

.1

C49

.1

C61

.1

C60

.1

C59

.1

C58

.1

C57

.1

C56

.1

C55

.1

C54

.1

C38

.1

C37

.1

C36

.1

C35

.1

C34

.1

C48

.1

C47

.1

C46

.1

C45

.1

C44

.1

C43

.1

C42

.1

C41

.1

C40

.1

C39

.1

C23

.1

C22

.1

C21

.1

C20

.1

C19

.1

C33

.1

C32

.1

C31

.1

C30

.1

C29

.1

C28

.1

C27

.1

C26

.1

C25

.1

C24

.1

C8

.1

C7

.1

C6

.1

C5

.1

C4

.1

C18

.1

C17

.1

C16

.1

C15

.1

C14

.1

C13

.1

C12

.1

C11

.1

C10

.1

C9

ofSheetDate:


Title


A

TEXAS INSTRUMENTS


CD600552

11

22

33

44

E

E

D

D

C

C

B

B

A

A

Index

Index-1

Index

AASRAM 1-2, 1-4, 3-4

assistance from Texas Instruments vii

attachingAC cord to power supply 2-7emulator to TEB 2-9power supply to TEB 2-8

Bboot process 2-2, 2-6

BOOTMODE0–BOOTMODE4 DIP switches 1-4,2-6, 3-8

Ccautions iv, 2-7, 3-3, 3-6

changing default settings 2-4

CLKIN signal 3-3

clock 3-3

connectingAC cord to power supply 2-7emulator to TEB 2-9power supply to TEB 2-8

connectionsemulation port 3-5host port header 3-5required 1-1serial ports and timers access header 3-5

connectivity 1-4

conventions, notational iii

custom power supply 2-4, 3-2

Ddata bus 1-3

DC outlet 3-2

debugger 1-1

defaultschanging 2-4DIP switch 2-6oscillator 3-3shunt jumper 2-5

design prototyping 1-1

dimensions, TEB 2-2

DIP switchesBOOTMODE0–BOOTMODE4 1-4, 2-6, 3-8changing default settings 2-4default settings 2-2, 2-6descriptions 3-8on the TEB layout diagram 2-3SWUSER 2-6

disconnecting the TEB 2-10

documentationabout this manual iiihow to use this manual iiirelated iv to v

DSP, features 1-1

Eemulation signals 3-5

emulator 1-1, 2-2

emulator connector 1-2, 2-3, 3-5

external ’C6201 clock 2-3

external emulator (TCLK) clock 2-3

external memories 3-4

Index

Index-2

FFCC warning vi

flash memory 1-2, 2-5, 3-7

fuse ratings 3-2

Ggeneration

clock 3-3interrupt 3-4reset 3-3

ground connections 3-6

Hheaders 1-3

See also individual header names

host access port 1-1

host port headerdescription 1-3, 3-5in connectivity diagram 1-4on the TEB layout diagram 2-3size 1-2

host requirements 2-4

Iinformation about cautions iv

installationconnecting AC cord to power supply 2-7connecting emulator to TEB 2-9connecting power supply to TEB 2-8TEB 2-7 to 2-10

instruction cycle time 1-2, 2-2

interrupt generation 3-4

JJTAG connector 1-1

Kkit components 2-4

Llayout, TEB 2-3LEDs 2-10, 3-2

Mmanual reset 3-4memory

connectivity 1-4types 3-4

memory map 1 2-2, 2-6multiply-by-four mode 2-2, 3-3

Nnon-TEB circuitry 3-4notational conventions iii

Ooperation, TEB 3-1 to 3-8oscillator 2-3, 3-3

PPAL equations A-1 to A-4PEROM 1-2, 1-4, 2-2, 2-6PLL 2-2, 3-3power connector 2-3power requirements 3-2power supply 2-4, 3-2programmable devices 3-6prototyping area 1-2, 3-6

Rreconfiguring

on-board devices 3-7shunt jumpers 3-4

related documentation iv to vrequirements

host 2-4power 3-2

reset line 3-3reset switch 2-3resetting the ’C6201 DSP 3-3, 3-4ROM 3-4

Index

Index-3

SSBSRAM 1-2, 1-4, 3-4

scan-based emulation 1-1

schematics B-1 to B-14

SDRAM 1-2, 1-4, 3-4

serial ports and timers access headerdescription 1-3, 3-5in connectivity diagram 1-4on the TEB layout diagram 2-3

shunt jumperschanging default settings 2-4, 3-7default settings 2-5descriptions 3-7 to 3-8on the TEB layout diagram 2-3reconfiguring 3-4

SMA connector 3-3, 3-5

specifications, TEB 2-2

SWUSER DIP switch 2-6

TTCK signal 3-5

TCLK signal 2-2, 2-5

TEBcomponents 3-1connectivity diagram 1-4disconnecting 2-10functional overview 1-3 to 1-4fuse ratings 3-2headers 1-3 to 1-4installation 2-7 to 2-10interconnects 1-3 to 1-4key features 1-2kit components 2-4layout 2-3LEDs 2-10, 3-2memory 1-2, 3-4operation 3-1 to 3-8purpose iii, 1-1required connections 1-1schematics B-1 to B-14specifications 2-2

test points 3-6

Wwarning, FCC vi

XXDS510 1-1, 2-4, 3-5XDS510WS 1-1, 2-4, 3-5

Documents

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