TLMI Technical Conference - Gamota Finalstatic.webfulfillment.com/tlmi/blogs.dir/31/files/2012/...(Nanomarkets, IDTechEx) Smart TLMI Technical Conference Industry Technology Development

2009 TLMI Technical Conference2009 TLMI Technical Conference2009 TLMI Technical Conference

SmartTLMI Technical Conference


Printed Circuit Applications

Daniel GamotaPrintovate, [email protected]

mailto:[email protected]


Fabrication Techniques Used for Printed ElectronicsFabrication Techniques Used for Printed Electronics

§Thin Film Deposition– Physical Vapor Deposition (sputtering, pulsed laser, etc.)– Chemical Vapor Deposition (PECVD)– Molecular Beam Epitaxy (MBE)– Atomic Layer Deposition (ALD)– Spin coating

§Pattern Transfer– Photolithography– Nanolithography– Soft Lithography– Liquid Imaging

§Implantation– Ion Implantation– Diffusion Furnace

§Removal– Reactive Ion Etch– Dry Etch, Wet Etch– Plasma Ashing– Chemical Mechanical Planarization

An all-printed or a hybrid manufacturing platform may be optimal for a particular process flow (cost, yield, scalability, product design flexibility).

§Gravure

§Flexography

§Screen

§Jetting

§Embossing

Traditional Electronics Processes Emerging Electronics Processes


Intel 4044 Processor Intel 4044 Processor –– Silicon Integrated Circuit HistorySilicon Integrated Circuit History

Image courtesy: Intel website

• Introduced in Nov, 1971 • 2300 transistors• 10µm channel length• Composed of 5 layers• Four-bit microprocessor

• Four-bit adder for doing additions• An accumulator for keeping track of partial sums• 16 registers for temporary storage.

Image courtesy: Technologyevalngelist.com

Image courtesy: Intel website


Evolution Evolution -- IP LandscapeIP Landscape

Source: USPTO

0

200

400

600

800

1000

1200

1400

1991 1992 1993 1994 1995 1996 1997 1998 1999 2000 2001 2002 2003 2004 2005 2006 2007 2008

Filed and Granted Granted

Increasing IP Trend Fueled by• Startups• Increased activities in Asia • Focused efforts in Europe


Industry ParticipantsIndustry Participants


Commercial High Volume ProductionCommercial High Volume Production

Printed Traces on Flex

Solder Interconnects

Encapsulation and Fluxing

§ Printed Conductive Traces– Screen– Stencil

§ Printed Electrical Interconnects– Screen– Stencil– Micro-dispensing– Jetting

§ Printed RFID Antenna – Screen– Flexo

§ Microelectronics Encapsulation and Flux Dispensing– Micro-dispensing– Jetting

Printed RFID Antenna


““NearNear”” Commercial High Volume ProductionCommercial High Volume Production

Printed Photovoltaics§ Printed Energy

- Screen - Flexo - Litho

§ Printed Displays- Screen - Inkjet- Laser induced forward transfer

§ Printed Lighting- Screen- Inkjet

Printed Lighting

Printed Displays

Printed Batteries


Printed Electronics Key Attributes & OpportunitiesPrinted Electronics Key Attributes & Opportunities

§Conformal

§ Large area

§Distributed

§ Low cost

§ Low profile

§Drop resistant

§Easy integrationLogic

Sensors

PowerDisplays

SignageLighting

$300B opportunity by 2025. (Nanomarkets, IDTechEx)


Industry Technology Development EffortsIndustry Technology Development Efforts

• Etched Channel Gap

• Channel

Gap

Oversized

Undersize

d

Tolerance Limitation±5 um

0

10

20

30

40

50

60

0 10 20 30 40 50 60

Etch

ed G

ap[u

m]

Designed Gap [um]

Gravure CylindersNanoscale Inorganic Materials

Grasshopper Test Vehicle

RFID Circuit Design

Higher Performance Inks

Finer Printed Channels

Increased Circuit Density


AllAll--Printed Field Effect Transistor Structure Printed Field Effect Transistor Structure ––Building Block for Printed Integrated CircuitBuilding Block for Printed Integrated Circuit

Flexible Substrate• Plastic• Paper

G

Conductors• PTF conductors• Conductive polymers• Organo-metallics• Nanoparticle inks• Metal foils

Dielectrics• PTF dielectrics• Polymer• Oxides

S D

Actives• Polymers• Oligomers• Inorganics

Active

SubstrateDielectric

Conductor


Large Area Printed Electronic SystemsLarge Area Printed Electronic Systems

§ System Elements (Devices and Components)– Power§ Solar/PV§ Primary/Secondary batteries§ Wireless charging - Inductive coupling

– Energy Storage§ Super capacitors

– Input/Output§ Displays§ Keyboard, touchpanel

– Memory§ ROM

– Computation and Processing§ Integrated circuits§ Passive components (resistors, capacitors, inductors)


Cost ModelCost Model

Equipment• Number of cells / line balancing

• Custom tooling• Testing• Scribing• Integration• Reclamation cells

• Static assist• Tool life

Planarize Electrode Dielectric Electrode Active Test

Facilities• Area• Power• Plumbing• Environmental control (O2, RH, temperature)

Labor• Cycle time• Number of workers

Design• Usable image carrier size

• Layer-layer registration• Design rules• Interconnect structures

Process flow• Set-up time• Processing time • Clean-out time• Materials replenishment• Scrap rate

Product• Quantity• Production volume

Materials• Active materials

• Consumables• Pot life• Shelf life• Storage


Roadmap Roadmap –– Working Group (> 100 Participants)Working Group (> 100 Participants)

• Engaged printers, printing equipment, electronic equipment, and materials suppliers to build a supply chain based roadmap for Large Area Flexible Electronics

• Completed 2nd Large Area Printed Electronics Roadmap September ‘08

• Released Roadmap January ‘09 (http://www.inemi.org/)

http://www.inemi.org/


Next Cycle of Roadmap Next Cycle of Roadmap –– 33rdrd Release of RoadmapRelease of Roadmap

• Join the iNEMI Large Area Electronics Working Group – requesting individual contributors and new leaders

• Working Group will explore the need/likelihood of creating collaborative projects in this emerging space e.g. printing displays, printing PV, printing lighting

• For more information contact: Jim McElroy - [email protected] Gamota - [email protected]






Convergence of Two Worlds Convergence of Two Worlds -- Birth of a New IndustryBirth of a New Industry


AcknowledgementsAcknowledgements

• Printovate Team

Documents

TLMI Technical Conference - Gamota Finalstatic.webfulfillment.com/tlmi/blogs.dir/31/files/2012/...(Nanomarkets, IDTechEx) Smart TLMI Technical Conference Industry Technology Development