Upload
voxuyen
View
222
Download
0
Embed Size (px)
Citation preview
www.ti.com
FEATURES
1
2
3
4
5
6
7
8
16
15
14
13
12
11
10
9
CTRT
Error 1IN+Amplifier 1 1IN−
1FEEDBACK1DTC1OUTGND
REFSCP2IN+ Error2IN− Amplifier 22FEEDBACK2DTC2OUTVCC
D PACKAGE(TOP VIEW)
DESCRIPTION/ORDERING INFORMATION
TL1451A-EPDUAL PULSE-WIDTH-MODULATION CONTROL CIRCUITS
SLVS614–DECEMBER 2005
• Controlled Baseline • Variable Dead Time Provides Control OverTotal Range– One Assembly/Test Site, One Fabrication
Site • Internal Regulator Provides a Stable 2.5-VReference Supply• Enhanced Diminishing Manufacturing
Sources (DMS) Support• Enhanced Product-Change Notification• Qualification Pedigree (1)
• Complete Pulse-Width Modulation (PWM)Power-Control Circuitry
• Completely Synchronized Operation• Internal Undervoltage Lockout Protection• Wide Supply-Voltage Range• Internal Short-Circuit Protection• Oscillator Frequency . . . 500 kHz Max(1) Component qualification in accordance with JEDEC and
industry standards to ensure reliable operation over anextended temperature range. This includes, but is not limitedto, Highly Accelerated Stress Test (HAST) or biased 85/85,temperature cycle, autoclave or unbiased HAST,electromigration, bond intermetallic life, and mold compoundlife. Such qualification testing should not be viewed asjustifying use of this component beyond specifiedperformance and environmental limits.
The TL1451A-EP incorporates on a single monolithic chip all the functions required in the construction of twopulse-width modulation (PWM) control circuits. Designed primarily for power-supply control, the TL1451A-EPcontains an on-chip 2.5-V regulator, two error amplifiers, an adjustable oscillator, two dead-time comparators,undervoltage lockout circuitry, and dual common-emitter output transistor circuits.
The uncommitted output transistors provide common-emitter output capability for each controller. The internalamplifiers exhibit a common-mode voltage range from 1.04 V to 1.45 V. The dead-time control (DTC) comparatorhas no offset unless externally altered and can provide 0% to 100% dead time. The on-chip oscillator can beoperated by terminating RT and CT. During low VCC conditions, the undervoltage lockout control circuit featurelocks the outputs off until the internal circuitry is operational.
The TL1451A-EP is characterized for operation from –55°C to 125°C.
ORDERING INFORMATION
TA PACKAGE (1) ORDERABLE PART NUMBER TOP-SIDE MARKING
–55°C to 125°C SOIC – D Tape and reel TL1451AMDREP TL1451EPG4
(1) Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available atwww.ti.com/sc/package.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of TexasInstruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date. Copyright © 2005, Texas Instruments IncorporatedProducts conform to specifications per the terms of the Texas On products compliant to MIL-PRF-38535, all parameters areInstruments standard warranty. Production processing does not tested unless otherwise noted. On all other products, productionnecessarily include testing of all parameters. processing does not necessarily include testing of all parameters.
www.ti.com
+
−
+
−
Oscillator
ReferenceVoltage
1/2 Vref
R
S
170 kΩ UVLO
R
9 2 1
VCC RT CT
10
16
7
8
REF
GND
PWMCOMP
PWMComparator
12 kΩ
11
14
13
12
5
15
3
4
6
2DTC
2IN+
2IN−
2 FEEDBACK
1 FEEDBACK
SCP
1IN+
1IN−
1DTC
ErrorAmplifier 2
ErrorAmplifier 1 1OUT
2OUT
COMPONENT COUNT
Resistors
Capacitors
TransistorsJFETs
65
8
10518
Absolute Maximum Ratings (1)
TL1451A-EPDUAL PULSE-WIDTH-MODULATION CONTROL CIRCUITSSLVS614–DECEMBER 2005
FUNCTIONAL BLOCK DIAGRAM
over operating free-air temperature range
MIN MAX UNIT
VCC Supply voltage 51 V
VI Amplifier input voltage 20 V
VO Collector output voltage 51 V
IO Collector output current 21 mA
Continuous power total dissipation See Dissipation Rating Table
TA Operating free-air temperature range M suffix –55 125 °C
Tstg Storage temperature range –65 150 °C
Lead temperature 1,6 mm (1/16 in) from case for 10 s 260 °C
(1) Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratingsonly, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operatingconditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
2
www.ti.com
Recommended Operating Conditions
Reference Section Electrical Characteristics
TL1451A-EPDUAL PULSE-WIDTH-MODULATION CONTROL CIRCUITS
SLVS614–DECEMBER 2005
Dissipation Ratings
TA ≤ 25°C DERATING FACTOR TA = 70°C TA = 85°C TA = 125°CPACKAGE POWER RATING ABOVE TA = 25°C POWER RATING POWER RATING POWER RATING
D 1088 mW 8.7 mW/°C 696 mW 566 mW 218 mW
MIN MAX UNIT
VCC Supply voltage 3.6 50 V
VI Amplifier input voltage 1.05 1.45 V
VO Collector output voltage 50 V
IO Collector output current 20 mA
Current into feedback terminal 45 µA
RF Feedback resistor 100 kΩ
CT Timing capacitor 150 15000 pF
RT Timing resistor 5.1 100 kΩ
Oscillator frequency 1 500 kHz
TA Operating free-air temperature M suffix –55 125 °C
over recommended operating free-air temperature range, VCC = 6 V, f = 200 kHz (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP (1) MAX UNIT
TA = 25°C 2.4 2.5 2.6Output voltage (pin 16) IO = 1 mA V
TA = MIN and 125°C 2.35 2.46 2.65
Output voltage change with temperature –0.63% ±4% (2)
TA = 25°C 2 12.5
Input voltage regulation VCC = 3.6 V to 40 V TA = 125°C 0.7 15 mV
TA = MIN 0.3 30
TA = 25°C 1 7.5
Output voltage regulation IO = 0.1 mA to 1 mA TA = 125°C 0.3 14 mV
TA = MIN 0.3 20
Short-circuit output current VO = 0 3 10 30 mA
(1) All typical values are at TA = 25°C, unless otherwise indicated.(2) These parameters are not production tested.
3
www.ti.com
Undervoltage Lockout Section Electrical Characteristics
Short-Circuit Protection Control Section Electrical Characteristics
Oscillator Section Electrical Characteristics
TL1451A-EPDUAL PULSE-WIDTH-MODULATION CONTROL CIRCUITSSLVS614–DECEMBER 2005
over recommended operating free-air temperature range, VCC = 6 V, f = 200 kHz (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP (1) MAX UNIT
TA = 25°C 2.72
Upper threshold voltage (VCC) TA = 125°C 1.7 V
TA = MIN 3.15
TA = 25°C 2.6
Lower threshold voltage (VCC) TA = 125°C 1.65 V
TA = MIN 3.09
TA = 25°C 80 120
Hysteresis (VCC) TA = 125°C 10 50 mV
TA = MIN 10 60
TA = 25°C 1.5
Reset threshold voltage (VCC) TA = 125°C 0.95 V
TA = MIN 1.5
(1) All typical values are at TA = 25°C, unless otherwise indicated.
over recommended operating free-air temperature range, VCC = 6 V, f = 200 kHz (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP (1) MAX UNIT
TA = 25°C 650 700 750
Input threshold voltage (SCP) TA = 125°C 400 478 650 mV
TA = MIN 800 880 950
Standby voltage (SCP) 140 185 230 mV
TA = 25°C 60 120
Latched input voltage (SCP) TA = 125°C 70 120 mV
TA = MIN 60 120
Equivalent timing resistance 170 kΩ
Comparator threshold voltage (FEEDBACK) 1.18 V
(1) All typical values are at TA = 25°C, unless otherwise indicated.
over recommended operating free-air temperature range, VCC = 6 V, f = 200 kHz (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP (1) MAX UNIT
TA = 25°C 200CT = 330 pF,Frequency TA = 125°C 195 kHzRT = 10 kΩ
TA = MIN 193
Standard deviation of frequency CT = 330 pF, RT = 10 kΩ 2%
TA = 25°C 1%
Frequency change with voltage VCC = 3.6 V to 40 V TA = 125°C 1%
TA = MIN 3%
Frequency change with temperature 1.37% ±10% (2)
(1) All typical values are at TA = 25°C, unless otherwise indicated.(2) These parameters are not production tested.
4
www.ti.com
Dead-Time Control Section Electrical Characteristics
Error-Amplifier Section Electrical Characteristics
TL1451A-EPDUAL PULSE-WIDTH-MODULATION CONTROL CIRCUITS
SLVS614–DECEMBER 2005
over recommended operating free-air temperature range, VCC = 6 V, f = 200 kHz (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP (1) MAX UNIT
TA = 25°C 1Input bias current (DTC) µA
TA = MIN and 125°C 3
Latch mode (source) current (DTC) –80 –145 µA
TA = 25°C 2.3
Latched input voltage (DTC) TA = 125°C 2.22 2.32 V
TA = MIN 2.28 2.4
Zero duty cycle 2.05 2.25 (2)
Input threshold voltage at f = 10 kHz (DTC) VMaximum duty cycle 1.2 (2) 1.45
(1) All typical values are at TA = 25°C, unless otherwise indicated.(2) These parameters are not production tested.
over recommended operating free-air temperature range, VCC = 6 V, f = 200 kHz (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP (1) MAX UNIT
TA = 25°C ±7
Input offset voltage VO (FEEDBACK) = 1.25 V TA = 125°C ±10 mV
TA = MIN ±12
TA = 25°C ±100
Input offset current VO (FEEDBACK) = 1.25 V TA = 125°C ±100 nA
TA = MIN ±200
TA = 25°C 160 500
Input bias current VO (FEEDBACK) = 1.25 V TA = 125°C 100 500 nA
TA = MIN 142 700
Common-mode input voltage range VCC = 3.6 V to 40 V 1.05 to 1.45 V
TA = 25°C 70 80
Open-loop voltage amplification RF = 200 kΩ TA = 125°C 70 80 dB
TA = MIN 64 80
Unity-gain bandwidth 1.5 MHz
Common-mode rejection ratio 60 80 dB
Positive output voltage swing 2 V
Negative output voltage swing 1 V
TA = 25°C 0.5 1.6
Output (sink) current (FEEDBACK) VID = –0.1 V, VO = 1.25 V TA = 125°C 0.4 1.8 mA
TA = MIN 0.3 1.7
TA = 25°C –45 –70
Output (source) current (FEEDBACK) VID = 0.1 V, VO = 1.25 V TA = 125°C –25 –50 µA
TA = MIN –15 –70
(1) All typical values are at TA = 25°C, unless otherwise indicated.
5
www.ti.com
Output Section Electrical Characteristics
PWM Comparator Section Electrical Characteristics
Total Device Electrical Characteristics
TL1451A-EPDUAL PULSE-WIDTH-MODULATION CONTROL CIRCUITSSLVS614–DECEMBER 2005
over recommended operating free-air temperature range, VCC = 6 V, f = 200 kHz (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP (1) MAX UNIT
Collector off-state current VO = 50 V 10 µA
TA = 25°C 1.2 2
Output saturation voltage TA = 125°C 1.6 2.4 V
TA = MIN 1.36 2.2
Short-circuit output current VO = 6 V 90 mA
(1) All typical values are at TA = 25°C, unless otherwise indicated.
over recommended operating free-air temperature range, VCC = 6 V, f = 200 kHz (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP (1) MAX UNIT
Zero duty cycle 2.05 2.25 (2)
Input threshold voltage at f = 10 kHz (FEEDBACK) VMaximum duty cycle 1.2 (2) 1.45
(1) All typical values are at TA = 25°C, unless otherwise indicated.(2) These parameters are not production tested.
over recommended operating free-air temperature range, VCC = 6 V, f = 200 kHz (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP (1) MAX UNIT
Standby supply current Off-state 1.3 1.8 mA
Average supply current RT = 10 kΩ 1.7 2.4 mA
(1) All typical values are at TA = 25°C, unless otherwise indicated.
6
www.ti.com
PARAMETER MEASUREMENT INFORMATION
87654321
910111213141516
S1
CPE 0.47 µF
TestInput VCC = 5 V
RL
4.7 kΩ
4.7 kΩ
RL
OUT1
OUT2
CT330 pF
RT10 kΩ
TestInput
TL1451A-EP
Dead Time 100%
tpe(1)
2.0 V1.6 V1.4 V1.25 VH
L
H
L
0.6 V
0 V
H
L
3.6 V
0 V
Oscillator Triangle Waveform
Error-Amplifier OutputDead-Time Input VoltageShort-Circuit Protection
Comparator Input VoltagePWM Comparator Output Voltage
Output Transistor CollectorWaveform
Protection EnableTerminal Waveform
Short-Circuit ProtectionComparator Output
Power-Supply Voltage
(1) Protection enable time, tpe = (0.051 x 106 x Cpe) in seconds
2.8 V TYP
TL1451A-EPDUAL PULSE-WIDTH-MODULATION CONTROL CIRCUITS
SLVS614–DECEMBER 2005
Figure 1. Test Circuit
Figure 2. TL1451A-EP Timing
7
www.ti.com
TYPICAL CHARACTERISTICS
0
10
20
30
40
50
60
70
105 115 125 135 145
Continous Tj – °C
Yea
rs E
stim
ated
Life
100 k
10 k
1 k
1 M
1 k 4 k 10 k 40 k 100 k 400 k 1 M
CT = 150 pF
CT = 1500 pF
CT = 15000 pF
VCC = 5 VTA = 25°C
RT − Timing Resistance − Ω
fosc
− T
rian
gle
Osc
illat
or
Fre
qu
ency
− H
zo
scf
0
−1
−2
−3−25 0 25 50
afo
sc −
Osc
illat
or
Fre
qu
ency
Var
iatio
n −
%
1
2
3
75 100
VCC = 3.6 VRT = 10 kΩCT = 330 pFfosc = 200 kHz
TA − Free-Air Temperature − °C
osc
f ∆
TL1451A-EPDUAL PULSE-WIDTH-MODULATION CONTROL CIRCUITSSLVS614–DECEMBER 2005
Figure 3. Estimated Deviced Life at Elevated Temperatures for Wirebond Voiding Fail Mode
Figure 4. Triangle Oscillator Frequency Figure 5. Oscillator Frequency Variationvs Timing Resistance vs Free-Air Temperature
8
www.ti.com
Tria
ng
le W
avef
orm
Per
iod
− u
S
VCC = 5 VRT = 5.1 kΩTA = 25°C
sµ
102
101
100
10−1
101 102 103 104 105
CT − Timing Capacitance − pF
2.2
2
1.6
1.4
0.8
2.6
1.8
Tria
ng
le W
avef
orm
Sw
ing
Vo
ltag
e −
V
2.4
1.2
1
VCC = 5 VRT = 5.1 kΩTA = 25°C
CT − Timing Capacitance − pF101 102 103 104 105
0
−10
− 20
− 30− 25 0 25 50
10
20
30
75 100
VCC = 3.6 VII(ref) = 1 mA
TA − Free-Air Temperature − °C
avre
f − R
efer
ence
Ou
tpu
t Vo
ltag
e V
aria
tion
− m
V
V O
(ref
)∆
0
−10
− 20
− 30− 25 0 25 50
10
20
30
75 100
VCC = 40 VII(ref) = 1 mA
TA − Free-Air Temperature − °C
avre
f − R
efer
ence
Ou
tpu
t Vo
ltag
e V
aria
tion
− m
V
V O
(ref
)∆
TL1451A-EPDUAL PULSE-WIDTH-MODULATION CONTROL CIRCUITS
SLVS614–DECEMBER 2005
TYPICAL CHARACTERISTICS (continued)
Figure 6. Trangle Waveform Swing Voltage Figure 7. Triangle Waveform Periodvs Timing Capacitance vs Timing Capacitance
Figure 8. Reference Output Voltage Variation Figure 9. Reference Output Voltage Variationvs Free-Air Temperature vs Free-Air Temperature
9
www.ti.com
1.5
1
0.5
00 5 10 15 20 25
2
2.5
3
30 35 40
TA = 25°C
VCC − Supply Voltage − V
Vre
f − R
efer
ence
Ou
tpu
t Vo
ltag
e −
V
VO
(ref
)
0.8
0.7
0.6
− 25 0 25 50
Dro
po
ut
Vo
ltag
e V
aria
tion
− V
0.9
1
1.1
75 100TA − Free-Air Temperature − °C
II(ref) = 1 mA
2
−25 0 25 50
Un
der
volta
ge
Lo
cko
ut T
hre
sho
ld V
olta
ge
− V
2.5
3
3.5
75 100
Threshold Voltage −VTH(Left Scale)
Threshold Voltage −VTL(Left Scale)
Hysteresis Voltage(Right Scale)
300
200
100
0
Un
der
volta
ge
Lo
cko
ut H
yste
rsis
Vo
ltag
e −
mV
TA − Free-Air Temperature − °C
3.25
2.75
2.25 50
150
250
3
2
1
00 1 2 3
VC
E −
Ou
tpu
t Co
llect
or
Vo
ltag
e −
V
4
5
6
4 5
TA = 25°CTA = −20°C
IO = 10 mA
7,10
8
RL
5 V
I = IOVDE
TA = 85°C
VCC − Supply Voltage − V
VC
E
TL1451A-EPDUAL PULSE-WIDTH-MODULATION CONTROL CIRCUITSSLVS614–DECEMBER 2005
TYPICAL CHARACTERISTICS (continued)
Figure 10. Reference Output Voltage Figure 11. Dropout Voltage Variationvs Supply Voltage vs Free-air Temperature
Figure 12. Undervoltage Lockout Hysteresis Figure 13. Undervoltage Lockout CharacteristicsCharacteristics
10
www.ti.com
1.20
1.15
1.10− 25 0 25
Co
mp
arat
or
Th
resh
old
Vo
ltag
e −
V
1.25
1.30
50 75 100
Short-Circuit ProtectionLatch Reset Supply Voltage(Right Scale)
Short-Circuit ProtectionComparator Threshold Voltage(Left Scale)
3
2.5
2
1.5
1
RS
− L
atch
Res
et S
up
ply
Vo
ltag
e −
V
TA − Free-Air Temperature − °C
9
6
3
00 50 100 150
tpe
− P
rote
ctio
n E
nab
le T
ime
− s
12
15
18
200 250
t pe
CPE − Protection Enable Capacitance − µF
+
−
ProtectionLatch
S RCPE U.V.L.O.ERROR AMP 1
ERROR AMP 2
1.25 V
Short-circuitProtection
Comparator12 kΩ
15 16
SCP Vref
170 kΩ Vref Vref
TL1451A-EPDUAL PULSE-WIDTH-MODULATION CONTROL CIRCUITS
SLVS614–DECEMBER 2005
TYPICAL CHARACTERISTICS (continued)
Figure 14. Short-Circuit Protection Characteristics
Figure 15. Protection Enable Time vs Protection Enable Capacitance
11
www.ti.com
1.75
1.5
1
0.75
0
2.25
1.25
1 k 10 k 100 k 1 M 10 M
Err
or
Am
p M
axim
um
Ou
tpu
t Vo
ltag
e S
win
g −
V
2
f − Frequency − Hz
0.5
0.25
VCC = 5 VTA = 25°C
70
60
40
30
0
90
50
100 1 k 10 k 100 k 1 M 2 M
Op
en-L
oo
p V
olta
ge
Am
plif
icat
ion
− d
B
80
f − Frequency − Hz
20
10
VCC = 5 VTA = 25°C
−5
−201 k 10 k 100 k
G −
Gai
n −
dB
f − Frequency − Hz
10
1 M 10 M
5
0
−10
−15
VCC = 5 VTA = 25°C
TL1451A-EPDUAL PULSE-WIDTH-MODULATION CONTROL CIRCUITSSLVS614–DECEMBER 2005
TYPICAL CHARACTERISTICS (continued)
Figure 16. Error Amplifier Maximum Output Voltage Figure 17. Open-Loop Voltage AmplificationSwing vs Frequency vs Frequency
Figure 18. Gain(Amplifier in Unity-Gain Configuration vs Frequency)
12
www.ti.com
47 pF470 pF4700 pF
CX:
Phase Shift(Right Scale)
Closed-Loop Gain(Left Scale)
VCC = 5 VRref = 150 ΩCref = 470 pFTA = 25°C
50
30
20
0
70
40
100 1 k 10 k 100 k 1 M
Clo
sed
-Lo
op
Gai
n −
dB
60
f − Frequency − Hz
10
0°
−10°−20°
−30°−40°
−50°
−60°
−70°
−80°−90°
Ph
ase
Sh
ift
Cx Rref
Cref
Vref
39 kΩ
39 kΩ
+
−
Test Circuit
TL1451A-EPDUAL PULSE-WIDTH-MODULATION CONTROL CIRCUITS
SLVS614–DECEMBER 2005
TYPICAL CHARACTERISTICS (continued)
Figure 19. Closed-Loop Gain and Phase Shift vs Frequency
13
www.ti.com
47 pF470 pF4700 pF
CX:
Phase Shift(Right Scale)
Closed-Loop Gain(Left Scale)
VCC = 5 VRref = 15 ΩCref = 470 pFTA = 25°C
50
30
20
0
70
40
100 1 k 10 k 100 k 1 M
Clo
sed
-Lo
op
Gai
n −
dB
60
f − Frequency − Hz
10
0°
−10°−20°
−30°−40°
−50°
−60°
−70°
−80°−90°
Ph
ase
Sh
ift
Cx Rref
Cref
Vref
39 kΩ
39 kΩ
+
−
Test Circuit
TL1451A-EPDUAL PULSE-WIDTH-MODULATION CONTROL CIRCUITSSLVS614–DECEMBER 2005
TYPICAL CHARACTERISTICS (continued)
Figure 20. Closed-Loop Gain and Phase Shift vs Freqency
14
www.ti.com
47 pF470 pF4700 pF
CX:
Phase Shift(Right Scale)Closed-Loop Gain
(Left Scale)
VCC = 5 VRref = 15 ΩCref = 470 pFTA = 25°C
50
30
20
0
70
40
100 1 k 10 k 100 k 1 M
Clo
sed
-Lo
op
Gai
n −
dB
60
f − Frequency − Hz
10
0°
−10°−20°
−30°−40°
−50°
−60°
−70°
−80°−90°
Ph
ase
Sh
ift
Cx Rref
Cref
Vref
39 kΩ
39 kΩ
+
−
Test Circuit
TL1451A-EPDUAL PULSE-WIDTH-MODULATION CONTROL CIRCUITS
SLVS614–DECEMBER 2005
TYPICAL CHARACTERISTICS (continued)
Figure 21. Closed-Loop Gain and Phase Shift vs Frequency
15
www.ti.com
Phase Shift(Right Scale)
Closed-Loop Gain(Left Scale)
VCC = 5 VCref = 470 pFTA = 25°C
50
30
20
0
70
40
100 1 k 10 k 100 k 1 M
Clo
sed
-Lo
op
Gai
n −
dB
60
f − Frequency − Hz
10
0°
−10°−20°
−30°−40°
−50°
−60°
−70°
−80°−90°
Ph
ase
Sh
ift
Cref
Vref
39 kΩ
39 kΩ
+
−
Test Circuit
60
40
20
00 5 10
Ou
tpu
t Sin
k C
urr
ent −
mA
80
100
Collector Output Saturation Voltage − V
120
15 20
110
90
70
50
30
10
TA = −20°C
TA = 25°C
VCC = 3.6 V
TA = 85°C
TL1451A-EPDUAL PULSE-WIDTH-MODULATION CONTROL CIRCUITSSLVS614–DECEMBER 2005
TYPICAL CHARACTERISTICS (continued)
Figure 22. Closed-Loop Gain and Phase Shift vs Frequency
Figure 23. Output Sink Current vs Collector Output Saturation Voltage
16
www.ti.com
VO(ref) −0.01
VO(ref) −0.02
VO(ref) −0.03
VO(ref) −0.04
VO(ref) −0.05
VO(ref) −0.06
VO(ref) −0.07
1
0.9
0.8
0.7
0.6
0.5
−25 0 25 50 75 100TA − Free-Air Temperature − °C
Maximum Output VoltageSwing (Right Scale)
Maximum OutputVoltage Swing (Right Scale)
+
−RL
100 kΩVvom − 1
33 kΩ
33 kΩ
VCC = 3.6 VRL = 100 kΩVOM+1 = 1.25 VVOM −1 = 1.15 V (Right Scale)VOM −1 = 1.35 V (Left Scale)
Vref
TEST CIRCUIT
− M
axim
um
Ou
tpu
t Vo
ltag
e S
win
g −
VV
OM
− M
axim
um
Ou
tpu
t Vo
ltag
e S
win
g −
VV
OM
1
0.5
00 10 20
ICC
(Sta
nd
by)
− S
tan
db
y C
urr
ent −
mA
2
30 40
1.5
CC
I
VCC − Supply Voltage − V
TA = 25°C
1.75
1.25
0.75
0.25
50
60
90
1000 0.5 1 1.5 2 2.5 3
Ou
tpu
t Tr
ansi
sto
r O
n D
uty
Cyc
le −
%
30
10
Dead-Time Input Voltage − V
0
3.5 4
70
20
40
80
VCC = 3.6 VRT = 10kΩCT = 330 pF
TL1451A-EPDUAL PULSE-WIDTH-MODULATION CONTROL CIRCUITS
SLVS614–DECEMBER 2005
TYPICAL CHARACTERISTICS (continued)
Figure 24. Maximum Output Voltage Swing vs Free-Air Temperature
Figure 25. Output Transistor On Duty Cycle Figure 26. Standby Current vs Supply Voltagevs Dead-Time Input Voltage
17
www.ti.com
1
0.5
0−25 0 25 50
ICC
− S
up
ply
Cu
rren
t − m
A
1.5
2
75 100
C
CI
TA − Free-Air Temperature − °C
Average Supply CurrentVCC = 6 V, RT = 10 kΩ,CT = 330 pF
Stand-By Current, VCC = 40 V, No Load
Stand-By Current, VCC = 3.6 V, No Load
1.75
1.25
0.75
0.25
600
400
200
0−25 0 25 50
Max
imu
m C
on
tinu
ou
s P
ow
er D
issi
pat
ion
− m
W
800
1000
1200
75 100
1100
900
700
500
300
100
16-Pin N Plastic Dip
16-Pin NS Plastic SO
Thermal Resistance125°C/W
Thermal Resistance250°C/W
TA − Free-Air Temperature – C
TL1451A-EPDUAL PULSE-WIDTH-MODULATION CONTROL CIRCUITSSLVS614–DECEMBER 2005
TYPICAL CHARACTERISTICS (continued)
Figure 27. Sandby Current vs Free-Air Temperature Figure 28. Maximum Continuous Power Dissipationvs Free-Air Temperature
18
www.ti.com
APPLICATION INFORMATION
R7
R6C4
470 Ω
1 µF220 Ω
C2
R4
R3
33 kΩ
33 kΩ
470 Ω150 Ω220 kΩ
0.47 µF 50 kΩ
R1
500 pF
pF
C5 R5500
C1
87654321
910111213141516
330 pF
L1
R2
33 kΩ
33 kΩ
Vref
33 kΩ33 kΩ
470 Ω
470 Ω
L2
VCC
Step-UpOutput
Step-DownOutput
TL1451A
TL1451A-EPDUAL PULSE-WIDTH-MODULATION CONTROL CIRCUITS
SLVS614–DECEMBER 2005
Figure 29. High-Speed Dual Switching Regulator
19
PACKAGE OPTION ADDENDUM
www.ti.com 31-May-2014
Addendum-Page 1
PACKAGING INFORMATION
Orderable Device Status(1)
Package Type PackageDrawing
Pins PackageQty
Eco Plan(2)
Lead/Ball Finish(6)
MSL Peak Temp(3)
Op Temp (°C) Device Marking(4/5)
Samples
TL1451AMDREP ACTIVE SOIC D 16 2500 Green (RoHS& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM -55 to 125 TL1451EP
V62/06611-01XE ACTIVE SOIC D 16 2500 Green (RoHS& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM -55 to 125 TL1451EP
(1) The marketing status values are defined as follows:ACTIVE: Product device recommended for new designs.LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.PREVIEW: Device has been announced but is not in production. Samples may or may not be available.OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availabilityinformation and additional product content details.TBD: The Pb-Free/Green conversion plan has not been defined.Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement thatlead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used betweenthe die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weightin homogeneous material)
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuationof the previous line and the two combined represent the entire Device Marking for that device.
(6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finishvalue exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on informationprovided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken andcontinues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
PACKAGE OPTION ADDENDUM
www.ti.com 31-May-2014
Addendum-Page 2
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF TL1451A-EP :
• Catalog: TL1451A
• Automotive: TL1451A-Q1
• Military: TL1451AM
NOTE: Qualified Version Definitions:
• Catalog - TI's standard catalog product
• Automotive - Q100 devices qualified for high-reliability automotive applications targeting zero defects
• Military - QML certified for Military and Defense Applications
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device PackageType
PackageDrawing
Pins SPQ ReelDiameter
(mm)
ReelWidth
W1 (mm)
A0(mm)
B0(mm)
K0(mm)
P1(mm)
W(mm)
Pin1Quadrant
TL1451AMDREP SOIC D 16 2500 330.0 16.4 6.5 10.3 2.1 8.0 16.0 Q1
PACKAGE MATERIALS INFORMATION
www.ti.com 14-Jul-2012
Pack Materials-Page 1
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
TL1451AMDREP SOIC D 16 2500 367.0 367.0 38.0
PACKAGE MATERIALS INFORMATION
www.ti.com 14-Jul-2012
Pack Materials-Page 2
IMPORTANT NOTICETexas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and otherchanges to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latestissue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current andcomplete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of salesupplied at the time of order acknowledgment.TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s termsand conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessaryto support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarilyperformed.TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products andapplications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provideadequate design and operating safeguards.TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, orother intellectual property right relating to any combination, machine, or process in which TI components or services are used. Informationpublished by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty orendorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of thethird party, or a license from TI under the patents or other intellectual property of TI.Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alterationand is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altereddocumentation. Information of third parties may be subject to additional restrictions.Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or servicevoids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice.TI is not responsible or liable for any such statements.Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirementsconcerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or supportthat may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards whichanticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might causeharm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the useof any TI components in safety-critical applications.In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is tohelp enable customers to design and create their own end-product solutions that meet applicable functional safety standards andrequirements. Nonetheless, such components are subject to these terms.No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the partieshave executed a special agreement specifically governing such use.Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use inmilitary/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI componentswhich have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal andregulatory requirements in connection with such use.TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use ofnon-designated products, TI will not be responsible for any failure to meet ISO/TS16949.Products ApplicationsAudio www.ti.com/audio Automotive and Transportation www.ti.com/automotiveAmplifiers amplifier.ti.com Communications and Telecom www.ti.com/communicationsData Converters dataconverter.ti.com Computers and Peripherals www.ti.com/computersDLP® Products www.dlp.com Consumer Electronics www.ti.com/consumer-appsDSP dsp.ti.com Energy and Lighting www.ti.com/energyClocks and Timers www.ti.com/clocks Industrial www.ti.com/industrialInterface interface.ti.com Medical www.ti.com/medicalLogic logic.ti.com Security www.ti.com/securityPower Mgmt power.ti.com Space, Avionics and Defense www.ti.com/space-avionics-defenseMicrocontrollers microcontroller.ti.com Video and Imaging www.ti.com/videoRFID www.ti-rfid.comOMAP Applications Processors www.ti.com/omap TI E2E Community e2e.ti.comWireless Connectivity www.ti.com/wirelessconnectivity
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265Copyright © 2014, Texas Instruments Incorporated