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THINKING The components of power The Preferred High Reliability Packaging and Wafer Processing BIG

THINKING The components of power The Preferred High Reliability Packaging and Wafer Processing Company BIG

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Page 1: THINKING The components of power The Preferred High Reliability Packaging and Wafer Processing Company BIG

THINKING THINKING

The components of power

The Preferred High Reliability Packaging and Wafer Processing Company

BIGBIG

Page 2: THINKING The components of power The Preferred High Reliability Packaging and Wafer Processing Company BIG

Founded in 1981 Servicing Military, Space, Industrial, Medical, Rail Transportation, DMS,

& Commercial Avionics Markets Several focused Product Segments Broad range of Standard Products Internationally franchised Sales Channel for Honeywell Rad Hard

Microelectronics, HI-REL/High Temperature Integrated Circuits, and Emulation Solutions

Operational Six Sigma System QML Certified Manufacturing ISO 9001-2000 AS9100 Certified Oct ‘08 Large range of ATE and Environmental Capability DMS and Obsolescence Support Services Die Processing & Die Banking Technical Sales Channel well represented in over 30 Countries

Minco the Company

Page 3: THINKING The components of power The Preferred High Reliability Packaging and Wafer Processing Company BIG

Solution Strategy

As the demand in customer requirements change, Minco with its market understanding will be fully supportive with new solutions committed to servicing the high reliability market with its standard product, die processing and obsolescence capability.

Minco Technology Labs, Inc. is a DSCC Certified Microcircuit manufacturer providing aftermarket solutions for custom or discontinued intergraded circuit applications, including (HI-REL) memory products.

Markets serviced

Space Military Aerospace Medical Commercial Avionics Rail Transportation Down-hole Drilling

Page 4: THINKING The components of power The Preferred High Reliability Packaging and Wafer Processing Company BIG

Obsolescence Management

Long-Term Storage

Record Retention

Qualification

Ship-On-Demand

Product Procurement

Page 5: THINKING The components of power The Preferred High Reliability Packaging and Wafer Processing Company BIG

Services

Standard/HI-REL Product Line RadHard Space/HI-TEMP Products Custom Packaging and Test Electrical Test Environmental Test Mechanical Test Kitting Wafer & Die Processing Die Banking Inventory Management

Page 6: THINKING The components of power The Preferred High Reliability Packaging and Wafer Processing Company BIG

Products

Discrete Semiconductors Diodes and Transistors

Integrated Circuits CMOS, ECL, Linear, Mixed Signal, TTL

Memory SRAM, Memory Modules

Passive Products Capacitors and Resistors

Page 7: THINKING The components of power The Preferred High Reliability Packaging and Wafer Processing Company BIG

Package Types

Leadless Chip Carriers Dual In-Line Flat Pack Quad Flat Pack Pin-Grid-Array “J” Lead LCC Chip-On-Board Metal Cans Ball-Grid-Array Chip Scale Land-Grid-Array Flip Chip

Page 8: THINKING The components of power The Preferred High Reliability Packaging and Wafer Processing Company BIG

Quality Assurance/Objectives

DSCC QML MIL-PRF-38535, Class Q Laboratory Suitability

SMD, QD Level MIL-STD-883 paragraph 1.2.1 Class S manufacturing capabilities V-Level Certification in Process ISO9001-2000 Customer Specific (SCD) AS9100 Certified Oct ‘08

Quality Engineers covering Audits Certifications Component qualifications Data packs Specifications Control documents

The Quality System requirements are also extended to all our subcontract manufacturing suppliers, service suppliers and part suppliers.

Both Internal and External, all operations are conducted with Quality checkpoints in place.

Page 9: THINKING The components of power The Preferred High Reliability Packaging and Wafer Processing Company BIG

Die Banking

Experienced Inventory Personnel M1 Enterprise Resource Planning

(ERP) software Lot and wafer traceability Safe-Site off-site data storage

Controlled Environment Storage Nitrogen purged storage cabinets Nitrogen generated on-site to manage

cost Back-up cryogenic nitrogen system in

case of power loss

Bonded Storage Material Consignment Vendor Managed Inventory

Secure Storage Facilities

Page 10: THINKING The components of power The Preferred High Reliability Packaging and Wafer Processing Company BIG

Military & Aerospace Product Sales Group

A team of professionals, all with 25+ years of experience in Sales, Sales Management, Tactical & Strategic Marketing and Technical Engineering support, the majority of which are in the following disciplines: Hardware Digital, Hardware Analog, ASIC, Microwave Design, & Physicist.

Worldwide Pan American Military/Aerospace Technical Field Sales Channel operating in over 30 Countries

The team’s Sales Management experience includes all aspects of territory/regionalized Sales and Sales support both direct and through Representatives and Distribution.

A team, driven and dedicated to the Customer and Customer’s Program requirements.

A skilled team in World-Wide negotiation and closure of business at all levels of management.

A team fluent in abilities to ascertain and analyze current as well as emerging trends in our Markets served.

A team which continually monitors technology and trends and its use by all Military and Aerospace OEM’s.

Page 11: THINKING The components of power The Preferred High Reliability Packaging and Wafer Processing Company BIG

Military & Aerospace Product Sales Group

Ability to immediately introduce a World-Wide theatre of tier 1 & 2 accounts and their program management.

Ability to manage the communication with this Account base and their sub-contractors.

Market Share growth through Identification of existing and emerging Programs.

Maximization of revenue growth via Program Driven Design strategies.

Continual Program monitoring and validation for optimization of Strategies as it relates to Product roadmaps and Product / Service positioning.

Continual development and refinement of new and existing Sales tools.

Page 12: THINKING The components of power The Preferred High Reliability Packaging and Wafer Processing Company BIG

Hi-Rel Business UnitHi-Rel Business UnitBusiness ModelBusiness Model

Test Services

MaterialManagement

Distribution

Hi-RelPackaging

SpaceMilitary

Down-HoleIndustrialMedical

CU

RR

EN

TC

UR

RE

NT

TE

CH

NO

LO

GY

TE

CH

NO

LO

GY

OB

SO

LE

SE

NC

EO

BS

OL

ES

EN

CE

Page 13: THINKING The components of power The Preferred High Reliability Packaging and Wafer Processing Company BIG

Hi-Rel Business UnitHi-Rel Business UnitUS Sales RepresentativesUS Sales Representatives

UT

MT

WY

ID

ND

SD

NE

OK

KS

AR

LA

MO

IA

MN

WA

OR

NV

CA

AZ

TX

TN

AL GA

FL

SC

NC

IL

INOH

MI

VA

MD DE

PA NJ

CT RI

MAWI

KY

MS

WV

ME

VT

NH

CO

NM

ILIN

OH

MI

ConvergentChesapeakeDeslauriers SalesTX SalesLogixW HowardCompassCBR Associates

W. PA

NY

Page 14: THINKING The components of power The Preferred High Reliability Packaging and Wafer Processing Company BIG

UNITEDKINGDOM

SOUTHGERMANY

SWITZ.

AUSTRIA

ITALY

RUSSIA

FINLANDSWEDEN

NORWAY

LITHUANIA

LATVIA

ESTONIA

SPAINPORTUGAL

FRANCE

UKRAINE

SLOVENIACROATIA

LUX.

DEN.

NETHER.

NORTH GERMAN

Y

BELGIUM

ElcosDimac RedAPCEBEIsotopeProtecAltaix

Hi-Rel Business UnitHi-Rel Business UnitEuropean AgentsEuropean Agents

Page 15: THINKING The components of power The Preferred High Reliability Packaging and Wafer Processing Company BIG

ONTARIO

QUEBEC

INDIA

CHINA

THAILAND

MALAYSIA

JAPAN

TAIWAN

SINGAPORE

ISRAEL

Hi-Rel Business UnitHi-Rel Business UnitCanada, Asia, Israel AgentsCanada, Asia, Israel Agents

One TechnologyJepicoOdem TechnologiesAll-Tech ElectronicsSilBraemac

Page 16: THINKING The components of power The Preferred High Reliability Packaging and Wafer Processing Company BIG

Target Markets & Applications

Aerospace Markets Commercial Satellite Programs Military Radiation Harden Programs Communications & Surveillance Satellites Scientific Space Programs Interplanetary Probes International Missile Defense & Theater Missile

Defense Ground Communication Systems requiring radiation

harness

Military & Aerospace Product Sales Group

Page 17: THINKING The components of power The Preferred High Reliability Packaging and Wafer Processing Company BIG

Initial European Space Growth Pursuit Funnel

IPDSProduct Program Identify Review Pursue RFQ Bid Select Neg. Award Book Comments

1M SRAM TAS LABEN (OB Data Handling) Q108 First Order Thru MincotechAltaix Spain Multiple Programs Various Sole SourceTAS Alenia Multiple Programs Various Sole Source

256K SRAM EADS Astrium M51 Program Q208 Sole SourceAltaix BEPI Columbo Program Q408 Sole SourceCarlo Gavazzi Italy 2009 Sole Source

16M SRAM EADS Astrium France 2009 Active Pursuit

Processor TAS LABEN PPC Visited March 2008

ASIC TESAT Mixed Signal ASIC 2009 NSS Meeting Resulted In New PursuitEADS Astrium England HX5000 2009 Architecture Trade StudyTAS HX2000 2009 Active PursuitAlcatel France HX5000 2009 Active PursuitEADS Astrium England HX9100 Q408 Bid includes NRE to update masksSurrey Systems 2009 New pursuit TAS Italy Goblastar MS ASIC 2009 Visited March 2008 Selex Galileo Italy FPGA Repl. 2009 Visited March 2008 TAS Alenia Iridium ASICs 2009 Identified April 2008

ROM AWE (England) HX6656 Q308 Awaiting customer funding

Foundry Russian Space Institute 2009 IPDS Review May 2008

Page 18: THINKING The components of power The Preferred High Reliability Packaging and Wafer Processing Company BIG

Military & Aerospace Product Sales Group “Re-Cap”

Ability to track business from design at OEMs to procurement at Contract Manufacturers, as well as 2nd & 3rd Tier sub-contractors.

Help ensure that design work pays off at point of procurement

EOL/DMS coverage

Over 60 Military/Aerospace Dedicated Field Technical Sales Specialists

Customer program level focus on a global basis

Page 19: THINKING The components of power The Preferred High Reliability Packaging and Wafer Processing Company BIG

Summary

Recognized leader for the past 28 years in the HI-REL & Custom Packaging Industry

Providing continuing SMD P/N support for discontinued Linear Technology SMD Devices

Experienced in Designing & Producing Advanced Test Solutions

Wafer and Die Processing Services International Sales Channel for Honeywell RADHARD

Space & Down-Hole Products ISO 9001-2000 compliant manufacturing including

Certification under MIL-PRF-38535 and DSCC AS9100 Certified Oct ’08 V-Level Certification in Process Capability to manufacturer to customer specific SCDs Wide range of package types Products manufactured from industrial / military up to

space level

For further information and/or for a full version of this presentation, contact:

[email protected] call in the U.S. 1.512.339.3443