Thermoelectric Mini Fridge & Warmer

8/2/2019 Thermoelectric Mini Fridge & Warmer

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A Project By:

ARUN.A (16)DINU.PK (59)

SREEJITH.B (48)TOM THOMAS (50)

Guided By:

Dr. RAG R L

Prof. ABDUL JALEEL

DEPARTMENT OF MECHANICAL ENGINEERING

TRAVANCORE ENGINEERING COLLEGE



INTRODUCTION

Thermo electric effect

Seebeck effect

Thermo power

Peltier effect

Figure of merit

Device efficiency





PRINCIPLE OF THERMO ELETRICREFRIGERATION



THERMO ELECTRICMODULE



WORKING OF T E M





MATERIALS FOR T E R

Bismuth chalcogenides

Lead telluride

Inorganic clathrates

Magnesium group 4 compounds

Silicides

Oxide thermo electrics Electrically conducting organic materials



DESIGN PROCEDURE

Code Qmax Imax Vmax A B C D

ISATIB8 L

33 3.8 14.4 40 40 40 2.2

SPECIFICATION OF MODULE



CONSTRUCTION OF MODULE



Design improvements













CALCULATION OF MASS

Q = m Cp ΔT

WhereQ = Maximum amount of heat that can be absorbed

m = Mass to be cooled or heated

Cp = Specific heat at constant pressure

ΔT = Difference in temperature



CALCULATION OF MASS ( Cont.)

M = Q / Cp ΔTFrom steam table Cp = 4.18 KJ / Kg K

ΔT = 30 – 15 = 15 K

Q From the specification = 33 WThen M = 0.5263 Kg



CALCULATION OF VOLUME

We haveV= m × Vf

Where Vf =Specific volume in M^3 / Kg

SoV = 0.5261 × 0.0010009

= 5.2657× 10^-4 M^3



ADVANTAGES OF TER

No Moving Parts: A TE module works electrically without anymoving parts so they are virtually maintenance free.

Small Size and Weight: The overall thermoelectric cooling systemis much smaller and lighter than a comparable mechanical system.In addition, a variety of standard and special sizes and

configurations are available to meet strict application requirements.

Ability to Cool Below Ambient: Unlike a conventional heat sinkwhose temperature necessarily must rise above ambient, a TEcooler attached to that same heat sink has the ability to reduce thetemperature below the ambient value.

Ability to Heat and Cool With the Same module: Thermoelectriccoolers will either heat or cool depending upon the polarity of theapplied DC power. This feature eliminates the necessity ofproviding separate heating and cooling functions within a givensystem.



ADVANTAGES(Cont.)

Precise Temperature Control: With an appropriate closed-looptemperature control circuit, TE coolers can control temperatures tobetter than +/- 0.1°C.

High Reliability: Thermoelectric modules exhibit very highreliability due to their solid state construction. Although reliability is

somewhat application dependent, the life of typical TE coolers isgreater than 200,000 hours.

Electrically "Quiet" Operation: Unlike a mechanical refrigerationsystem, TE modules generate virtually no electrical noise and canbe used in conjunction with sensitive electronic sensors. They arealso acoustically silent.

Operation in any Orientation: TEs can be used in any orientationand in zero gravity environments. Thus they are popular in manyaerospace applications.



ADVANTAGES(Cont.)

Convenient Power Supply: TE modules operate directly from aDC power source. Modules having a wide range of input voltagesand currents are available. Pulse Width Modulation (PWM) may beused in many applications

Spot Cooling: With a TE cooler it is possible to cool one specific

component or area only, thereby often making it unnecessary tocool an entire package or enclosure.

Ability to Generate Electrical Power: When used "in reverse" byapplying a temperature differential across the faces of a TE cooler,it is possible to generate a small amount of DC power.

Environmentally Friendly: Conventional refrigeration systems cannot be fabricated without using chlorofluorocarbons or otherchemicals that may be harmful to the environment. Thermoelectricdevices do not use or generate gases of any kind.



DISADVANTAGES

Able to dissipate limited amount of heatflux.

Lower coefficient of performance than

vapor-compression systems.

Relegated to low heat flux applications.

More total heat to remove than without a

TEC.



VARIOUS INDUSTRIES USING TECOOLING

Electronic

Medical

Aerospace

Telecommunications



APPLICATIONS OF TER

Electronic enclosures

Laser diodes

Laboratory instruments Temperature baths

Refrigerators



APPLICATIONS(Cont.)

Telecommunications equipment

Temperature control in missiles andspace systems

Heat transport ranges vary from afew milliwatts to several thousandwatts, however, since the efficiency

of TE devices are low, smaller heattransfer applications are morepractical.



Improving performance….

More exotic TE devices are beingresearched that could result in betterperformance such as, superlattice

structures, quantum wires and quantumwells, thin films using SiGe/Si, andthermionic cooling. However, research inthese are preliminary and are not inwidespread use.



Improvingperformance(cont.) Various methods have been used to improve

the performance of TE coolers which are itsmajor drawback.

Examples: thin film coolers or multistage(bulk) coolers.



T E COOLING OFELECTRONICS

Typical TE cooling schemes have a TEdevice attached to a heat source (thecold side) that transports heat to a heat

sink (the warm side).



ASSEMBLY



ASSEMBLY(Cont.)



ASSEMBLY(Cont.)



COMPARISON OF FEATURES OFREFRIGERATION SYSTEMS

Compactness

Weight

Portability

Price

Safety

Reliability

Ease of service and maintanance



REFERENCES

Bar-Cohen, A., Solbrekken G. L., and Yazawa, K. (2005).Thermoelectric Powered Convective Cooling of Microprocessors. IEEE Transactions of Advanced Packaging, 28(2).

Chein, R. and Huang, G. (2004). Thermoelectric cooler application inelectronic cooling. Applied Thermal Engineering , 24 (14-15), pp. 2207-2217.

Goldsmid H. (1986). Electronic Refrigeration.London:Pion. Goldsmid H.(1964). Thermoelectric Refrigeration. New York:Plenum. Lasance, C.J.M., and Simmons, R.E. (2005) Advances In High-

Performance Cooling For Electronics. Electronics Cooling. RetrievedMay2006. http://www.electronics-cooling.com/ html/2005_nov_article2.html

Mollar(2003). Themoelectric Cooler Selection Procedure. RetievedJune 2006.http://www.marlow.com/TechnicalInfo/themoelectric_cooler_selection_p.htm

Nagy, J. (1997). The Effectiveness of Water Vapor Sealing AgentsWhen Used in Application With Thermoelectric Cooling Modules. 16 th International Conference on Thermoelectrics.

Nolas, G.S. Goldsmid H., and Sharp J. (2001). Thermoelectrics : basic principles and new materials developments. New York: Springer.

http://www.electronics-cooling.com/html/2005_nov_article2.html





http://www.marlow.com/TechnicalInfo/themoelectric_cooler_selection_p.htm











REFERENCES(Cont.)

Rowe, D.M. (1995). CRC Handbook of Thermoelectrics. Boca Raton,FL: CRC Press.

Sales, Brian. (February 2002). Thermoelectric Materials: Smaller isCooler.. Science (Vol. 295. no. 5558, pp. 1248 – 1249). Retrieved April2006. http://www.sciencemag.org/cgi/content/full/295/5558/1248 .

Simons, R. E. and Chu, R. C. (2000) Application of thermoelectriccooling to electronic equipment: A review and analysis. Annual IEEE Semiconductor Thermal Measurement and Management Symposium,

pp1-9. Snyder, J. The Science and Materials behind Thermoelectrics. Caltech-

JPL Thermoelectrics Website. Retrieved April 2006. Tellurex. (2002). Retrieved May 2006. http://www.tellurex.com Tellurex. (2002). The 12 Most Frequently Asked Questions About

Themoelectric Cooling. Retrieved May 2006.http://www.tellurex.com/12most.html

TE Technology, Inc. (2005) Cold Plate/Solid. Free Design Service.Retrieved June 2006. http://www.tetech.com/design/3081.shtml

TE Technology, Inc. Retrieved May 2006.http://www.tetech.com/techinfo/

E Technology, Inc. (2005). Thermoelectric Modules. Retrieved April2006. Thttp://www.tetech.com/module

http://www.sciencemag.org/cgi/content/full/295/5558/1248




http://www.tellurex.com/

http://www.tellurex.com/12most.html


http://www.tetech.com/design/3081.shtml


http://www.tetech.com/techinfo/





http://www.tellurex.com/




QUESTIONS ????



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Thermoelectric Mini Fridge & Warmer