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Thermo-Mechanical and Impact Reliability Analysis in Abaqus R2016

Thermo-Mechanical and Impact Reliability Analysis in Abaqus · Use Abaqus to model drop/impact of semiconductor packages Use Submodeling technique to efficiently reduce computational

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Page 1: Thermo-Mechanical and Impact Reliability Analysis in Abaqus · Use Abaqus to model drop/impact of semiconductor packages Use Submodeling technique to efficiently reduce computational

Thermo-Mechanical and Impact Reliability Analysis in Abaqus

R2016

Page 2: Thermo-Mechanical and Impact Reliability Analysis in Abaqus · Use Abaqus to model drop/impact of semiconductor packages Use Submodeling technique to efficiently reduce computational

Course objectivesUpon completion of this course you will be able to:

Use proper modeling techniques to predict thermo-mechanical reliability in semiconductor packages

Use Abaqus to model drop/impact of semiconductor packages

Use Submodeling technique to efficiently reduce computational time and resources

Understand the failure mechanism of IC packages during thermal cycling and drop/impact

Targeted audience

Semiconductor Packaging Engineers, Reliability Engineers, IC Reliability Modeling Engineers

PrerequisitesThis course is recommended for engineers with experience using Abaqus

About this Course

3 days

Page 3: Thermo-Mechanical and Impact Reliability Analysis in Abaqus · Use Abaqus to model drop/impact of semiconductor packages Use Submodeling technique to efficiently reduce computational

Day 1

Lecture 1 Basic Concepts of IC Packaging, 1st Level, 2nd Level, 3rd Level of Packaging : Leaded

Package, BGA, WCSP, Flip Chip, 3D Package

Lecture 2 Thermo-mechanical issues, thermal stresses in solder joint, reliability analysis,

Darveaux Methodology, plastic work estimation, critical solder joint identification

(Distance from neutral point)

Lecture 3 Submodeling technique, quarter symmetry Vs full model, boundary conditions

Workshop 1 Plastic Work estimation of a solder joint in a QFN package subjected to thermal cycling

Workshop 2 Plastic Work estimation of a solder joint in a WCSP package subjected to thermal cycling

Page 4: Thermo-Mechanical and Impact Reliability Analysis in Abaqus · Use Abaqus to model drop/impact of semiconductor packages Use Submodeling technique to efficiently reduce computational

Day 2

Lecture 4 Drop/impact issues in IC Packages, mechanical impact stresses in solder joint,

drop/impact reliability analysis, how to correlate peeling stress in solder joint with

experimental drop test data

Lecture 5 Explicit drop simulation and Implicit drop simulation, JEDEC Standards

Lecture 6 Submodeling technique, quarter symmetry Vs full model, boundary conditions

Workshop 3 Explicit Drop simulation QFN package

Workshop 4 Implicit drop simulation of a solder joint in a WCSP Package

Page 5: Thermo-Mechanical and Impact Reliability Analysis in Abaqus · Use Abaqus to model drop/impact of semiconductor packages Use Submodeling technique to efficiently reduce computational

SIMULIA

SIMULIA is the Dassault Systèmes brand for Realistic Simulation solutions

Portfolio of established, best-in-class products

Abaqus, Isight, Tosca, fe-safe

All using a common extended licensing pool

Page 6: Thermo-Mechanical and Impact Reliability Analysis in Abaqus · Use Abaqus to model drop/impact of semiconductor packages Use Submodeling technique to efficiently reduce computational

SIMULIA’s Power of the Portfolio

Safety FactorsCreep-Fatigue Interaction

Weld Fatigue

• Durability Simulation

• Low Cycle and High Cycle Fatigue

• Weld, High Temperature, Non-metallicsfe-safe

Material CalibrationWorkflow Automation

Design ExplorationIsight

• Process Integration

• Design Optimization

• Parametric Optimization

• Six Sigma and Design of Experiments

Realistic Human SimulationHigh Speed Crash & Impact

Noise & VibrationAbaqus

• Routine and Advanced Simulation

• Linear and Nonlinear, Static and Dynamic

• Fluid, Thermal, Electrical, Acoustics

• Extended Physics through Co-simulation

• Model Preparation and Visualization

Tosca• Non-Parametric Optimization

• Structural and Fluid Flow Optimization

• Topology, Sizing, Shape, Bead Optimization

Conceptual/Detailed Design

Weight, Stiffness, Stress

Pressure Loss Reduction

Page 7: Thermo-Mechanical and Impact Reliability Analysis in Abaqus · Use Abaqus to model drop/impact of semiconductor packages Use Submodeling technique to efficiently reduce computational

Join the Community!

How can you maximize the robust technology of the SIMULIA Portfolio ?

Go to www.3ds.com/slc

to log in or join!

Page 8: Thermo-Mechanical and Impact Reliability Analysis in Abaqus · Use Abaqus to model drop/impact of semiconductor packages Use Submodeling technique to efficiently reduce computational

SIMULIA Training

http://www.3ds.com/products-services/simulia/services/training-courses/

Page 9: Thermo-Mechanical and Impact Reliability Analysis in Abaqus · Use Abaqus to model drop/impact of semiconductor packages Use Submodeling technique to efficiently reduce computational

Legal Notices

The software described in this documentation is available only under license from Dassault Systèmes

or its subsidiaries and may be used or reproduced only in accordance with the terms of such license.

This documentation and the software described in this documentation are subject to change without

prior notice.

Dassault Systèmes and its subsidiaries shall not be responsible for the consequences of any errors or

omissions that may appear in this documentation.

No part of this documentation may be reproduced or distributed in any form without prior written

permission of Dassault Systèmes or its subsidiaries.

© Dassault Systèmes, 2015

Printed in the United States of America.

Abaqus, the 3DS logo, and SIMULIA are trademarks or registered trademarks of Dassault Systèmes or

its subsidiaries in the US and/or other countries.

Other company, product, and service names may be trademarks or service marks of their respective

owners. For additional information concerning trademarks, copyrights, and licenses, see the Legal

Notices in the Abaqus Installation and Licensing Guide.